JP2005339429A - Ic cartridge, and packing method and manufacturing method for ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To promote curing of an IC card and to prevent adhesion of dust to the IC card when manufactured. <P>SOLUTION: An IC card cartridge is provided with: the IC card of multilayer structure which is manufactured by coating a part between a first sheet material 1 and a second sheet material 2 with an adhesive and enclosing an IC module having an IC chip 3a2 in adhesive layers 6 and 7; a cartridge main body 300 storing the IC cards in a stacked state; and a sealing member 301 sealing an opening part 300a into which the IC card of the cartridge main body 300 is inserted. A clearance 310 wherein gas can enter or exit into/from the inside of the cartridge main body 300 is disposed in a state where the opening part 300a of the cartridge main body 300 is sealed by the sealing member 301. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a non-contact type electronic card for storing personal information or the like that requires safety (security) such as forgery and tampering prevention, or an IC card cartridge and an IC for packaging an IC card suitable for application to a sheet. The present invention relates to a card packaging method and an IC card manufacturing method.

  Conventionally, magnetic cards for recording data by a magnetic recording method have been widely used for identification cards (ID cards) and credit cards. However, since data can be rewritten relatively easily in a magnetic card, data falsification is not sufficiently prevented, it is susceptible to external influences due to magnetism, data protection is insufficient, and recording capacity is small. There were problems such as. In recent years, IC cards incorporating IC chips have begun to spread.

  The IC card reads and writes data with an external device via an electrical contact provided on the surface or a loop antenna inside the card. The IC card has a larger storage capacity than the magnetic card and greatly improves security. In particular, a non-contact IC card that has an antenna for exchanging information between the IC chip and the outside inside the card and does not have an electrical contact outside the card is a contact IC card having an electrical contact on the card surface. Compared with an ID card, it is being used for applications that require high confidentiality of data and prevention of forgery and alteration.

As such an IC card, for example, there is an IC card in which a first sheet material and a second sheet material are bonded together with an adhesive, and an IC module having an IC chip and an antenna is enclosed in the adhesive layer (for example, Patent Documents). 1 and Patent Document 2).
Japanese Patent Laid-Open No. 10-171554 (pages 1 to 8, FIGS. 1 to 16) JP 2003-108958 A (page 1 to page 35, FIGS. 1 to 28)

  Such an IC card is generally produced by bonding using, for example, a moisture curable adhesive, a UV curable adhesive, a two-component mixed adhesive, or the like as an adhesive and punching it into a card after curing. Is. Among these adhesives, it is required to be bonded at 80 ° C. or lower when bonding via an adhesive from the viewpoint of card substrate transportability due to heat shrinkage, warpage, etc. of the bonded card substrates. Among these low temperature adhesives, moisture curable adhesives are preferably used.

  However, when a moisture curable adhesive is used, even if it is stored in an environment with an appropriate temperature and humidity, it takes about one month for the card substrate to be completely cured. Therefore, an IC card is produced before the adhesive is completely cured and in a state having a sufficient elastic modulus in cutting. In that case, the IC card cartridge is put in an uncured state, but the IC card generates CO2 gas as the curing progresses. Therefore, if the IC card cartridge for storing the IC card is completely sealed. There was a problem that the seal part was swollen. Furthermore, moisture is not supplied to the IC card inside the IC card cartridge, so that the curing of the moisture-curing adhesive is delayed, or when the IC card cartridge seal is opened, dust is mixed into the IC card and the printer There has been a serious problem that dust adheres when forming an image, and a solution has been strongly desired.

  The present invention has been made in view of such a situation, and is capable of accelerating curing of an IC card, and capable of preventing dust from adhering at the time of manufacturing the IC card, and an IC card packaging method. The purpose is to provide.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

The invention described in claim 1 is manufactured by applying an adhesive between the first sheet material and the second sheet material, and encapsulating an IC module having an IC chip in the adhesive layer. A multi-layer IC card;
A cartridge body for storing the IC cards in a stacked state;
A seal member that closes an opening for inserting the IC card of the cartridge body;
The IC card cartridge is characterized in that a gap through which gas can enter and exit is provided inside the cartridge body with the opening of the cartridge body closed by the seal member.

  The invention according to claim 2 is the IC card cartridge according to claim 1, wherein the gap is a hole provided in the cartridge body or the seal member.

  The invention according to claim 3 is the IC card cartridge according to claim 1 or 2, wherein the diameter of the hole is 2 mm or less.

  The invention according to claim 4 is the IC card cartridge according to claim 1, wherein the gap is formed by unbonding at least one portion of the seal member.

The invention according to claim 5 has a notch portion in at least a part of the cartridge body,
2. The IC card cartridge according to claim 1, wherein the gap is provided between the notch and the seal member.

The invention according to claim 6 is the IC card cartridge according to claim 5, wherein a cross-sectional area of the gap is 0.01 mm ² or more and 2 mm ² or less.

  The invention according to claim 7 is the IC card cartridge according to claim 5 or 6, wherein an adhesive is provided so as to form the gap in the notch.

The invention according to claim 8 has a hole in at least a part of the card magazine body,
2. The IC card cartridge according to claim 1, wherein the hole portion is covered with a sheet having a space through which gas can enter and exit.

  The invention according to claim 9 is the IC card cartridge according to claim 8, wherein the material of the sheet is made of fiber or paper.

  According to a tenth aspect of the present invention, in any one of the first to ninth aspects, the IC card has an unreacted portion in at least a part of the adhesive inside the card. It is an IC card cartridge of description.

  The invention according to claim 11 is characterized in that the bonded product is cut into a single sheet before the IC card is punched into a card. It is an IC card cartridge of description.

  The invention according to claim 12 is the IC card cartridge according to any one of claims 1 to 11, wherein the format printing is performed before the IC card is punched into a card shape. .

  According to a thirteenth aspect of the present invention, the IC card has an image receiving layer on which at least one side is provided with personal identification information including a name and a face image by a thermal transfer method or an ink jet method, and at least one side has a writable writing layer. 13. The IC card cartridge according to claim 1, wherein the IC card cartridge is any one of claims 1 to 12.

In the invention according to claim 14, a transparent protective layer is provided on an upper surface provided with personal identification information including the name and face image.
14. The IC card cartridge according to claim 13, wherein the transparent protective layer is made of an actinic ray curable resin.

  According to a fifteenth aspect of the present invention, in the IC card cartridge according to the thirteenth or fourteenth aspect, the IC chip is disposed at a position other than the position overlapping the face image portion.

  The invention according to claim 16 is the IC card cartridge according to any one of claims 1 to 15, wherein the IC card is a non-contact type.

  According to a seventeenth aspect of the present invention, in the IC card according to any one of the first to sixteenth aspects, the planar unevenness of a chip peripheral portion on the surface of the IC card is within ± 10 μm. IC card cartridge.

The invention according to claim 18 is manufactured by applying an adhesive between the first sheet material and the second sheet material, and encapsulating an IC module having an IC chip in the adhesive layer. A multi-layer IC card is inserted from the opening of the cartridge body and stacked,
In the state where the IC cards are stacked, the opening of the cartridge body is closed with a seal member,
The IC card cartridge according to any one of claims 1 to 17, wherein gas can enter and exit from the inside of the cartridge body in a state where the opening of the cartridge body is closed by the seal member. This is a characteristic IC card packaging method.

According to the nineteenth aspect of the present invention, an adhesive is applied between the first sheet material and the second sheet material, and an IC module having an IC chip is enclosed in the adhesive layer to form a multilayer structure. Creating a card substrate and cutting the card substrate into a single sheet,
A card substrate storage step for storing the card substrate cut into the sheet form,
A card substrate punching process for punching the card substrate cut into the sheet shape into a card shape;
An IC card manufacturing method comprising: a card packaging step of loading and packaging the IC card in the IC card cartridge according to any one of claims 1 to 17.

  With the above configuration, the present invention has the following effects.

According to the first aspect of the present invention, gas can enter and exit from the inside of the cartridge body while the opening of the cartridge body is closed by the sealing member, and the IC card is cured to generate CO ₂ gas. However, the sealing member does not swell, and moisture is supplied to the IC card to accelerate the curing of the IC card.

  According to the second aspect of the present invention, the air gap is a hole provided in the cartridge main body or the seal member, and has a simple gas entry / exit structure.

  According to invention of Claim 3, the diameter of a hole is 2 mm or less, and it prevents that dust etc. mix.

  According to invention of Claim 4, a space | gap can make at least one location of a sealing member non-bonded, and gas can enter / exit with a simple structure.

  According to the fifth aspect of the present invention, a simple gas entrance / exit structure having a gap between the cutout portion of the cartridge body and the seal member.

According to the invention of claim 6, the cross-sectional area of the voids is at 0.01 mm ² or more 2 mm ² or less, gas can enter and leave, and to prevent dust from entering.

  According to the seventh aspect of the present invention, it is possible to provide a gap by providing an adhesive material to the notch portion, and to allow gas to enter and exit with a simple structure.

  According to the eighth aspect of the present invention, the hole portion of the card magazine main body is covered with the sheet having a space through which gas can enter and exit, and the gas can enter and exit with a simple structure using the sheet having the space. .

  According to invention of Claim 9, the material of a sheet | seat is comprised with a fiber or paper, and it prevents that dust etc. mix.

According to the invention described in claim 10, at least a part of the adhesive inside the card has an unreacted portion, and the seal member is swollen even if the unreacted portion is cured and generates CO ₂ gas. In addition, moisture is supplied to accelerate the curing of the unreacted portion.

  According to the eleventh aspect of the present invention, the card base material is cut into a single sheet before being punched into a card, so that handling is easy and punching accuracy is improved.

  According to the twelfth aspect of the present invention, the card substrate is subjected to format printing before being punched into a card shape, whereby the handling is easy and the format printing accuracy is improved.

  According to the invention described in claim 13, a license, identification card, passport, alien registration card, library card, cash card, credit card, employee ID card, employee ID card, membership card, medical card and student It can be preferably used for evidence.

  According to the invention described in claim 14, personal identification information including name and face image is protected by the transparent protective layer, and durability is improved.

  According to the fifteenth aspect of the present invention, the IC chip is disposed at a position other than the position overlapping the face image portion, and the IC chip does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and printing. Improve.

  According to the invention described in claim 16, since the IC card is a non-contact type and excellent in safety, it can be used for applications that require high confidentiality of data and anti-counterfeiting.

  According to the invention described in claim 17, the planar unevenness of the chip peripheral portion on the surface of the IC card is within ± 10 μm, and the printability is improved.

According to the eighteenth aspect of the present invention, gas can enter and exit from the inside of the cartridge body while the opening of the cartridge body is closed with the seal member, and the curing of the IC card proceeds to generate CO ₂ gas. However, the sealing member does not swell, and moisture is supplied to the IC card to accelerate the curing of the IC card.

  According to the nineteenth aspect of the present invention, the IC card is loaded and packaged in the IC card cartridge according to any one of the first to seventeenth aspects, whereby the curing of the IC card is promoted and the inventory is increased. Production efficiency can be improved.

  Hereinafter, an IC card cartridge, an IC card packaging method, and an IC card manufacturing method according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  FIG. 1 is a schematic configuration diagram of an IC card manufacturing process. In the manufacturing process of the IC card of this embodiment, an adhesive is applied between the first sheet material and the second sheet material, and an IC module having an IC chip is enclosed in the adhesive layer. Creating a card substrate with a multi-layer structure and cutting it into a single sheet, creating a card base, storing a card base that cuts into a single sheet, and a single sheet A card base material punching process for punching the card base material cut into a card shape, and a card packaging process for loading the IC card cartridge for packaging.

  In this card base material production process, a long sheet-shaped first sheet material (back sheet) 1 is provided in the first sheet material supply section A, and a sheet-like second sheet material (front sheet) 2 is provided. Is arranged in the second sheet material supply unit B. An adhesive is supplied to the second sheet material 2 from the adhesive supply unit C <b> 1 and applied to the second sheet material 2. The sheet is sent to the inlet supply unit E by the second sheet conveying member D. The second sheet conveying member D includes a conveying roller d1 and a conveying belt d2, and the conveying belt d2 is supported by the platen roller c1 in the adhesive supply unit C1.

  In the inlet supply portion E, an inlet 3 of components including an IC chip and an IC module having an antenna is supplied and placed at a predetermined position of the second sheet material 2, and the second sheet material 2 is moved to the back roller portion F. Send to. The first sheet material 1 is supplied with an adhesive from the adhesive supply unit C <b> 2, coated, and sent to the back roller unit F.

  The back roller part F has a temperature-adjustable laminating roller f, and the first sheet material 1 and the second sheet material 2 are bonded together using the laminating roller f. The temperature difference between the laminating roller f and the rollers f1, f2 is 0 ° C. or higher and 100 ° C. or lower. In this embodiment, the second sheet material 2 has an image receiving layer, the first sheet material 1 has a writing layer, and the rollers f1 and f2 have a roller temperature on the image receiving layer side of the writing layer side. The temperature is lower than the temperature of the roller.

  A card base material transport member G is disposed downstream of the back roller portion F, and the card base material transport member G includes transport belts g1 and g2 and transport rollers g3 and g4 that face each other. A card substrate on which the first sheet material 1 and the second sheet material 2 are bonded is sandwiched between the conveying belts g1 and g2 facing the card substrate conveying member G. Send to cutting section H. In the cutting part H, the card base material of a bonded product is cut into a single sheet.

  Thereafter, the sheet is sent to the collection unit K, and the collection unit K places the flat plate k1 between the sheet-like card bases and sends it to the storage unit L. In this storage part L, it is stored for a predetermined time at a predetermined temperature, sent to the punching part M, and punched into a card shape.

  The punched IC card is accommodated in the cartridge main body 300 by the packaging unit N and packaged to be sealed by the seal member 301. This IC card cartridge has a gap 310 through which gas can enter and exit inside the cartridge body 300 in a state where the opening 300a of the cartridge body 300 is closed by the seal member 301.

This IC card cartridge allows gas to enter and exit from the inside of the cartridge body 300 with the opening 300a of the cartridge body 300 closed by the seal member 301, and the curing of the IC card proceeds to generate CO ₂ gas. However, the sealing member 301 is not swollen, and moisture is supplied to the IC card to accelerate the curing of the IC card.

  Before punching into a card shape at the punching portion M, format printing is performed on one of the first sheet material 1 and the second sheet material 2. Prior to punching into a card shape, the card base material of the bonded product is cut into a single sheet, so that handling is easy and punching accuracy is improved. Further, by performing format printing before punching into a card shape, handling is easy and the accuracy of format printing is improved.

  In this embodiment, an adhesive is interposed between the first sheet material 1 and the second sheet material 2, and an inlet 3 having an IC chip on an inlet base material is enclosed in the adhesive layer. A card substrate is created, and the card substrate is punched into a card shape to create an IC card. The card base material creation process is performed in the clean room 501, the card base material storage process is performed in the clean room 502, the card base material punching process and the card packaging process of the punched IC card are performed in the clean room 503, and the IC card is class 100. Created in an environment of 1,000 or less. In this way, by creating an IC card in an environment of class 100,000 or less, it is possible to prevent dust and other dust from entering during the manufacture of the IC card, and scratches during punching, printing, card transportation, etc. And the occurrence of dirt can be suppressed, and the yield of non-defective cards is improved.

  In the card base material production process, the inlet 3 stored in a class of 10,000 or less is used. As described above, by using the inlet 3 stored in a class of 10,000 or less, dust such as dust can be prevented from entering from the inlet 3, and the dustproofness can be further improved.

  In the card base material storage process, the card base material is stored in the form of being sandwiched and stacked between the flat plates k1 before punching, reducing the amount of dust and other dust mixed in during the production of the card base material. Can be made. The flat plate k1 is a metal plate such as stainless steel, and by putting a load between the card base material and applying a load, it is possible to further reduce the contamination of dust and the like.

  An IC card produced using the IC card manufacturing method of the present invention is shown in FIG. FIG. 2 is a cross-sectional view of an image forming body of an IC card bonded product.

  A card base material, which is an image forming body of an IC card bonded product, includes an electronic component 3 a having a predetermined thickness between a first sheet material 1 and a second sheet material 2. The electronic component 3a includes an antenna 3a1, an IC chip 3a2, and the like, and an IC module of the electronic component 3a is provided in the inlet 3. This is a laminated structure in which the inlet 3 is disposed between the first sheet material 1 and the second sheet material 2 and laminated with the adhesive layers 6 and 7 interposed therebetween. The IC chip 3a2 is covered with a reinforcing plate 3b, and the reinforcing plate 3b has a larger shape than the IC chip 3a2 and protects the IC chip 3a2.

  The first sheet material 1 or the second sheet material 2 has an image receiving layer 8a on at least one surface, in this embodiment, on one surface of the second sheet material 2, and the name and face by the thermal transfer method or the ink jet method. Personal identification information 8b including an image is provided. As the thermal transfer system, there are a sublimation thermal transfer system and a melt thermal transfer system.

  Further, a transparent protective layer 8c is provided on the upper surface on which personal identification information 8b including a name and a face image is provided by transfer of a transfer foil, and the transparent protective layer 8c is made of an actinic ray curable resin. By providing the transparent protective layer 8c on the upper surface on which the personal identification information 8b is provided, the personal identification information 8b is protected and durability is improved.

  In this embodiment, a writable writing layer 9 a is provided on one side of the first sheet material 1. Further, the IC chip 3a is disposed at a position other than the position overlapping the face image portion, and the IC chip 3a does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and improving the printability. An IC card can be obtained.

  As described above, the IC card has an IC module, is a non-contact card, and is excellent in safety. Therefore, the IC card can be used for applications that require high confidentiality of data and anti-counterfeiting.

  The IC card manufactured in this way can suppress the occurrence of scratches and dirt on the IC card. In this embodiment, the number of dust mixed or adhering inside or outside of one card is 100. It is as follows, and it is possible to suppress the occurrence of scratches and dirt on the IC card, and the good card yield is improved.

  Also, by providing personal identification information including name and face image by thermal transfer method or ink jet method on at least one image receiving layer of IC card, and providing a writable writing layer at least in part, licenses and identification It can be preferably used for certificate, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student card.

Next, the configuration of the present invention will be described in detail.
[IC card cartridge]
When a moisture-curing adhesive is used in the production of an IC card, if a large-sized card base is made to increase productivity, it takes about one week to one month for the adhesive to cure, and a large amount of storage space is required. Therefore, it is punched into a card form before it is completely cured, and stored in a form waiting for shipment in an IC card cartridge. If stored in this way, the adhesive is cured while time is required for writing to the IC chip and packing work, so that time is wasted.

However, if the IC card cartridge is completely sealed, moisture in the air will not be supplied to the adhesive inside the IC card. As a countermeasure, a gap through which gas can enter and exit is provided in the IC card cartridge. This gap is simple: 1) make a hole in the cartridge body, 2) make a hole in the seal member, 3) provide a gap between the cartridge body and the seal member, or leave a part of the seal unbonded Is preferable. The diameter of the hole is preferably 2 mm or less, more preferably 0.5 to 1.5 mm. The gap is preferably 0.01 mm ² or more and 2 mm ² or less. The number of gaps between the hole and the cartridge main body and the seal member is not particularly limited.

If the seal portion is completely opened, there is a high possibility that dust will be mixed in each process up to packing, and the dust will be printed together at the time of card printing, resulting in a defective card. Also, if a gap is created and stored in the seal part and an adhesive seal is provided above the seal gap part, if the CO ₂ gas is no longer discharged from the inside of the card, the gap part will naturally adhere due to gravity and carrying vibrations. Therefore, it becomes possible to seal completely automatically after curing the card. In addition, a method of making a hole in the cartridge body and attaching a breathable label (nonwoven fabric, mask, cloth, etc.) can also prevent contamination of dust, which is very effective as an embodiment of the present invention.
[Inlet base material]
Examples of the inlet base material used for the inlet include PET (polyethylene terephthalate), PET-G, PEN (polyethylene naphthalate), vinyl chloride, PC (polycarbonate), TAC (triacetylcellulose), acrylic, paper, and YUPO. Any of these may be used, but in the present invention, PET, PET-G, and PEN are preferable from the viewpoint of mechanical strength, dimensional stability, and solvent resistance, and more preferably, PET or PET- from the viewpoint of transparency, processability, and cost. G.
[Heat shrinkage]
When the heat shrinkage rate of the inlet base material is large, heat is applied at the time of bonding, and this heat shrinks the inlet base material to form wrinkles or bubbles, so that the adhesion of the IC card sheet material is improved. Decrease, durability of the IC card decreases. In this invention, the heat shrinkage when the inlet base material is held at 150 ° C. for 30 minutes is within ± 2.5%, so the amount of heat shrinkage applied at the time of bonding is small, so peeling between the sheet materials hardly occurs, Preferably used. A more preferable range is within ± 2.0%.
[Inlet with holes]
When a hole is provided in the inlet base, if the hole is simply provided at the center or end of the inlet base, a step is formed between the front and back sheet materials or the adhesive layer. Deteriorates. In order to compensate for this, it is preferable to provide a hole in the lower part of the projecting part such as an antenna and an IC chip. The convex portions of the antenna and IC chip and the concave portions with holes are made up to alleviate the occurrence of irregularities.
[Inlet size smaller than IC card size]
If the inlet size is larger than the IC card size, an inlet appears on the card cross section. Therefore, assuming that the IC card is generally used as an IC card, liquid or the like penetrates from the gap and deteriorates adhesion and durability. For this reason, as for the size of an inlet base material, it is preferable that the outer peripheral part of an inlet base material will be 0.1 mm or more inside from a card | curd cross section, and it is more preferable that it is 1.0 mm or more inside.
[Break elongation of adhesive]
The breaking elongation of the adhesive means that when the adhesive is continuously pulled at a constant speed, the adhesive is torn at a certain point and breaks. It is the elongation rate of the adhesive stretched up to that time. Generally, when the breaking elongation is small, it is easy to cut when cutting with a scissors-like blade, and when the breaking elongation is large, the elongation until the adhesive is cut is large, so it is difficult to cut when cutting with a scissors-like blade. . On the other hand, when an adhesive is used as a part of the card substrate, when the IC card is bent or folded, it is preferable that the value of the elongation at break is large and flexible.

In the case of card cutting, it is ideal that the breaking elongation is small and the breaking elongation at the completion of curing of the adhesive is large. The preferable range of the breaking elongation at the time of cutting is 5% or more and 500% or less, and more preferably 50% or more and 400% or less. The breaking elongation at the completion of complete curing is preferably 150% or more and 1500% or less, and more preferably 250% or more and 950% or less.
[Elastic modulus of adhesive]
When the adhesive is deformed by applying an external force, the stress generated by the external force and the strain generated by the deformation are proportional to each other in a range where the deformation is not so large (Hooke's law). The elastic modulus of the adhesive is obtained by using the proportional constant at this time as the elastic modulus. That is, the elastic modulus C is expressed by C = (stress) / (strain). If the elastic modulus is high, cutting with a blade such as scissors is easy to cut, but on the other hand, the adhesive becomes hard and the card durability is lowered. On the other hand, when the elastic modulus is low, the adhesive protrudes from the cross section during cutting, and when the card is formed, the cross sectional shape deteriorates and the appearance deteriorates. A preferred range of the elastic modulus of the adhesive is at 30 kgf / mm ² or more 100 kgf / mm ² or less, more preferably 40 kgf / mm ² or more 80 kgf / mm ² or less.
[Sheet storage environment after bonding]
The card substrate coated with the adhesive and bonded together is stored until the adhesive is cured. The storage environment for the card substrate is preferably a temperature of 20 ° C. or more and 50 ° C. or less and a humidity of 40% or more and 100% or less. If the temperature and humidity are below these values, curing of the adhesive will not proceed, and if the temperature is above this range, firing will occur in the adhesive and cause the card substrate to swell.

After about 3 days, the card substrate has a peel strength between the sheet materials of 1500 g / 2.5 cm or more, and even if the card substrate is carried or cut, the card substrate will not be distorted or bent. Thereafter, the adhesive is completely cured in about 4 weeks. The cutting process into a card form is preferably performed in about two weeks in consideration of cutting properties.
[Metal plate sandwiched between card substrates]
The card base that has been bonded together will be uneven when a circuit or IC chip is placed inside it, making it difficult to stack vertically. The unevenness on the surface of the base material can be canceled, and the card base material can be stacked vertically without bending. The interval between the metal plates is preferably 1 or more and 400 or less, more preferably 1 or more and 20 or less. .
[Punching method (punch die method and hollow blade method)]
In the present invention, punch die type blades and hollow blade type blades were used as the types of punching blades. The punch die method referred to here is a method in which a die having a pair of upper and lower sides is used, and the card base is cut at an angle of the upper and lower blades of about 90 degrees. The angle of the punch die type cutting blade is preferably from 80 ° to 100 °, more preferably from 85 ° to 95 °.

  The hollow blade method is a blade that punches a card substrate with a blade from above, and the angle of the blade when punching is about 30 degrees. The angle of the cutting blade of the hollow blade preventing group is preferably 20 ° or more and 40 ° or less, and more preferably 25 ° or more and 35 ° or less.

Since the punch die method has a simple blade structure, the punch die method is suitable for production in which a large amount of card base material is punched. Since it is difficult to punch a card base material having a high breaking elongation, it is preferable to use an adhesive having a breaking elongation of 500% or less.
[Judgment of complete curing]
After curing of the card base material using the moisture curable adhesive of the example is when the isocyanate group contained in the moisture curable adhesive is 95% or more reacted, and the card base prepared for confirmation of curing is used. Whether or not the reaction has been completed can be determined by whether or not the material is cut into a card shape and subjected to heat treatment at 90 ° C. or higher to cause swelling due to the generation of carbon dioxide gas. In order to know the progress of the reaction, it can be examined by measuring an infrared absorption spectrum and quantifying the amount of isocyanate group (NCO group) from the spectrum intensity.
[Coating viscosity of adhesive]
When the adhesive coating viscosity is less than 5000 mPs when creating the card base, a large number of bubbles are generated when the sheet material is laminated, the planar unevenness is deteriorated, and when it is larger than 40000 mPs, the adhesive application property As a result, the surface irregularity deteriorates. In addition to the planar unevenness, a problem that the card surface strength after curing is reduced occurs. Therefore, it is preferably 5000 mPs to 30000 mPs, and more preferably 7000 mPs to 20000 mPs. The coating temperature is preferably 140 ° C. or lower, more preferably 130 ° C. or lower.
[MDI (diphenylmethane diisocyanate)]
The amount of MDI is preferably less than 1%. MDI is the official name diphenylmethane diisocyanate. The shape is usually solid and has a boiling point of 190 ° C., a pseudo-solid point of 39 ° C., a flash point of 220 ° C., a vapor pressure of 160 ° C., and is less corrosive at room temperature.
[IC card base material adhesive]
As the adhesive of the bonding material of the present invention, it is preferable to use a hot melt adhesive, a thermoplastic resin, or the like. For example, as the hot melt adhesive, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, and polyolefin. However, in the present invention, a moisture curable adhesive is specifically preferable among the low temperature adhesives. As reactive hot-melt adhesives, moisture-curing materials are disclosed in JP-A Nos. 2000-036026, 2000-212278, and 2000-219855. Any of these adhesives may be used, and materials that are not particularly limited can be used as long as low-temperature bonding can be performed.

The thickness of the adhesive is preferably 100 to 600 μm, more preferably 150 to 500 μm, and still more preferably 150 μ to 450 μm in terms of the thickness including the electronic component. In addition, when the viscosity at 120 ° C. is less than 5000 mPs, many bubbles are generated when the cards are bonded to each other, and the planar unevenness deteriorates. When the viscosity is greater than 20000 mPs, the adhesive applicability deteriorates. Sex worsens. Since the problem that the card | curd surface intensity | strength after hardening falls, and problems, such as a burr | flash and a beard, generate | occur | produce, Preferably it is 7000 mPs or more and 20000 mPs or less.
[Electronic parts]
The electronic component refers to an information recording member, and specifically, an IC chip that electrically stores information of a user of the IC card and a coiled antenna body connected to the IC chip. The IC chip is only a memory or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.
The IC module has an antenna coil of an electronic component, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). It is known to use industrial anisol or the like) or to perform solder bonding, but any method may be used.

  Since the electronic parts including the IC chip are placed in a predetermined position in advance and the resin is filled, the joint is detached due to the shearing force due to the flow of the resin, or the surface is smooth due to the flow or cooling of the resin. In order to eliminate the loss of stability and damage to the electronic component, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film, It is preferably used in the form of a foamable resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven fabric sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used. Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

In the IC card, the planar unevenness of the chip peripheral part on the surface of the IC card is within ± 10 μm, and the printability is improved.
[Method of providing electronic component between first sheet material and second sheet material]
In this invention, in order to provide a predetermined electronic component between the first sheet material and the second sheet material, a heat bonding method, an adhesive bonding method, and an injection molding method are known as manufacturing methods. However, it may be bonded by any method. Further, the first sheet material and the second sheet material may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing. It can be formed by any method such as an inkjet method, a sublimation transfer method, an electrophotographic method, or a heat melting method.

  The manufacturing method of the IC-mounted card base material of the present invention is as follows: JP 2000-036026, JP 2000-21278, JP 2000-21855, JP 10-316959, JP 11-5964, etc. An installation method is disclosed. Any bonding method, coating method, and the like can be used, and the present invention is not particularly limited.

Moreover, as a method of arranging an adhesive at a specific position, it can be produced by applying an adhesive at a predetermined position by a screen printing method, a gravure printing method or the like. In addition, when a hot melt adhesive is used, it can be applied to each arrangement by applying the adhesive from the nozzle in a bead shape with a hand gun type hot melt applicator. Alternatively, the adhesive processed into a film shape can be cut to be placed in a predetermined arrangement, and after being placed in each arrangement, it can be bonded by heating and pressing.
[Card member sheet member]
Examples of card base sheet materials include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, and polyvinylidene fluoride. , Polyfluorinated ethylene resins such as polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, polyamide such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / Vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymers such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol , Biodegradable resins such as biodegradable cellulose acetate and biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, ethyl polymethacrylate, polyethyl acrylate, polyacryl Acrylic resin such as butyl acid, synthetic resin sheet such as polystyrene, polycarbonate, polyarylate, polyimide, or paper such as fine paper, thin paper, glassine paper, sulfuric acid paper, single layer of metal foil, or more than two layers The laminated body of this is mentioned.

  The thickness of the sheet material of this invention is 30 to 300 μm, desirably 50 to 200 μm. From the viewpoint of card base material transportability due to shrinkage and warpage of the sheet material, the thermal shrinkage rate at 150 ° C./30 min as a sheet member in addition to the low temperature adhesive is 1.2% or less in the vertical (MD), horizontal (TD ) Is preferably 0.5% or less. Further, easy contact processing may be performed on the sheet member for improving post-processing adhesion, and antistatic processing may be performed for chip protection.

  Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

The second sheet material of the present invention may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. It may be a card [Paste]
At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the card base and the adhesion of a predetermined electronic component between the first sheet material and the second sheet material, It is preferable to manufacture by a method, a laminate method, or the like. The heating is preferably 10 to 180 ° C, more preferably 30 to 150 ° C. The pressurization is preferably 1.0 to 300 kgf / cm ² , more preferably 1.0 to 200 kgf / cm ² . If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.001 to 90 seconds, more preferably 0.001 to 60 seconds. If the time is longer than this, the production efficiency is lowered.

The sheet for an IC card having an IC module having an IC chip and an antenna in the adhesive layer is stored under a predetermined condition. The first sheet material and the second sheet material are bonded together via an adhesive. Thereafter, the IC card sheet is supplied to the punching die, and the IC card is manufactured by punching the IC card from the IC card sheet with the punching die. In this case, an authentication identification image or a bibliographic item may be recorded before punching.
[Method of applying transfer foil onto IC card]
Transfer of the transfer foil to the transfer material is usually performed using a means capable of applying pressure while heating, such as a thermal head, a heat roller, or a hot stamp machine.
[Writing layer]
The writing layer is a layer that allows writing on the back surface of the ID card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. The writing layer is formed on the first sheet material in the support in which a plurality of layers are not laminated. Addition of a material that improves slipperiness, such as wax, to the writing layer is effective in preventing damage and wear when rubbed. As the additive, polyethylene wax is preferably used.
[IC card creation method]
Here, an example of the manufacturing method of the IC card of this invention using a hot melt adhesive will be given. In producing the IC card, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheets with an applicator. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. In the case of coating in the form of stripes in the present invention, there is a method of intermittently opening the T-die slit, but it is not limited thereto. After bonding with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. When a reactive adhesive is used as the adhesive, it is cut into a card shape after curing for a predetermined time. Another effective means is a method of opening holes for supplying moisture necessary for reaction around the card size of the sheet material bonded to accelerate the curing.

In this invention, when producing a card-sized card substrate, as a manufacturing method, for example, a first sheet material and a second sheet material are bonded together with an adhesive, and bonded sheets laminated after bonding The method of shaping the material to card size is selected. As a method for shaping the card size, a punching method or a cutting method is mainly selected.
[Example 1]
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. In the following, “part” means “part by weight”.
[Create adhesive]
The adhesive used was Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd. as an existing product.
<Creation of first sheet material (back sheet)>
U2L98W low heat yield grade 188 μm manufactured by Teijin DuPont Films Ltd. was used as the back sheet.
(Create writing layer)
A coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a coating liquid for forming a third writing layer having the following composition are applied and dried in this order on the back sheet 188 μm, and each thickness is 5 μm. , 15 μm and 0.2 μm were laminated to form a writing layer.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black
Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second writing layer forming coating solution>
4 parts of polyester resin [Toyobo Co., Ltd .: Bironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts The center line average roughness of the obtained writing layer was 1.34 μm.
(Form format printing layer on the writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
<Creation of second sheet material (front sheet)>
U2L98W low heat yield grade 188 μm manufactured by Teijin DuPont Films Ltd. was used as the front sheet.
(Create a table sheet)
A second sheet material (front sheet 1) formed by sequentially coating and drying a cushion layer and an image receiving layer composed of the following composition on the front sheet 188 μm was formed.
(Photo-curing cushion layer) Film thickness 10μm
Urethane acrylate oligomer (Shin Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (Toagosei Co., Ltd .: Aronix M6200)
15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts Actinic ray curable compound after application is 90 ° C / 30 sec, followed by photocuring with a mercury lamp (300 mJ / cm 2).
(Image receiving layer)
The first image-receiving layer forming coating solution, the second image-receiving layer forming coating solution and the third image-receiving layer forming coating solution having the following composition are applied and dried in this order on the cushion layer, and each thickness is 0. The image receiving layer was formed by laminating to 2 μm, 2.5 μm, and 0.5 μm.
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part Water 90 parts (formation of information carrier consisting of format printing layer)
Format printing (employee ID, name) was performed on the image receiving layer by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
(Transparent resin layer formation)
The printing ink which consists of the following composition was mixed with the roll mill, and printing ink was created. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
(Transparent resin layer composition 1)
Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts trimethylolpropane acrylate 10 parts (preparation of IC concealment layer)
By the resin convex printing method, watermark printing was performed on the outermost surface of the support opposite to the image receiving layer surface. The printing pattern was performed in either FIG. 3 or FIG. Printing ink was printed with UV black ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. The film thickness was 1.0 μm.
[Used inlet]
An aluminum foil having a thickness of 10 μm was vapor-deposited on an S series tetron film manufactured by Teijin DuPont Films Co., Ltd., and then etched as in the form of an antenna wire. An IC chip, a reinforcing plate, and the like were placed on the base sheet thus obtained to obtain an IC card inlet.
<Creation of IC card image recording material>
Using the first sheet material (back sheet) of FIG. 5 and the second sheet material (front sheet) of FIG. 6 created as described above, the IC-mounted card substrate and card base with image receiving layer shown in FIG. A card substrate was prepared using a material preparation device.

  The card base creation as an embodiment will be described. The first sheet material (back sheet) is installed in the first sheet supply unit, and the second sheet material (front sheet) is installed in the second sheet supply unit. An adhesive was charged into the hot melt agent supply section.

  In this way, the first sheet material (back sheet) in the form of a long sheet and the second sheet material (front sheet) of a single sheet are provided, and the second sheet material is under nitrogen at a specific temperature. An adhesive was supplied from a moisture curing type adhesive supply unit by a T-die coating method, and an electronic component composed of FIGS. 7 to 9 having a thickness of 270 μm was arranged. In order to prevent the temperature of the adhesive from decreasing, the heating member was heated and heated.

  FIG. 7 is a schematic diagram of an IC module made of an IC card material, which is an IC module of an electronic component 3a in which an IC chip 3a2 is joined to an antenna 3a1 of an antenna coil wound with a copper wire.

  The inlet structure in FIG. 8 is a nonwoven fabric type, and the nonwoven fabric 3a4 on which the printed pattern is formed and the IC chip 3a2 are joined by bonding or the like, and the reinforcing plate 3b covers the IC chip 3a2 by 50% or more on the IC chip 3a2. It is the schematic diagram which interposes. An IC card sheet “FT series” manufactured by Hitachi Maxell Co., Ltd. can also be used.

  FIG. 9 shows a printed circuit board type in which a printed circuit board 3a5 on which a printed pattern is formed and an IC chip 3a2 are joined by bonding or the like, and a reinforcing plate 3b is interposed in the IC chip 3a2 so as to cover 50% or more of the IC chip 3a2. FIG.

  The inlet used was heat-treated for various T series Tetron films manufactured by Teijin DuPont Films Co., Ltd. to adjust the heat shrinkage rate. Thereafter, both surfaces of the support were coated with various resins with a thickness of 1 μm. Further, an aluminum foil having a thickness of 10 μm was vapor-deposited thereon, and then subjected to an etching process like an antenna wire. On the base sheet support thus obtained, an IC chip, a reinforcing plate and the like were installed to form an IC card inlet.

An adhesive is supplied to the first sheet material by a T-die coating method from a moisture curable adhesive supply section under nitrogen at a specific temperature, and the moisture curable adhesive is applied to the first sheet material and the second sheet material. And a IC / fixing member of an IC module, and a card controlled by a heating and pressing roll and a film thickness control roll (pressure 3 kg / cm ² , roll surface temperature 70 ° C.) and controlled to 740 μm A substrate master was created. This card base plate is shown in FIGS. 10 shows an embodiment using the inlet shown in FIG. 8, and FIG. 11 shows an embodiment using the inlet shown in FIG.

  The target thicknesses of the adhesive applied to the first and second sheet materials were 30 to 40 μm and 330 to 350 μm, respectively. In this invention, by controlling the thickness distribution of each coating, the card thickness standard deviation, thickness variation range, and in-plane inclination values were adjusted, and an IC card having the values shown in the examples after punching was obtained.

  The cutting step is preferably performed after the initial curing of the adhesive and the adhesion to the support have been sufficiently performed. In consideration of cutting properties, the adhesive does not necessarily need to be completely cured. The produced card base material is laminated every 400 sheets, and stored for 14 days in an environment of 23 ° C. and 55%, and then, using the above-described punching machine, an image recording body for an IC card having a size of 5 mm × 85 mm is obtained. I was able to. In order to apply a format printing section to the front and back surfaces of the finished card substrate, a logo and OP varnish were sequentially printed by a resin letterpress printing method using a card printer.

[Card punching]
In this cutting process, a card punching machine shown in FIGS. 12 and 13 is used. In this embodiment, the card punching machine is constituted by a punching die device, FIG. 12 is an overall schematic perspective view of the punching die device, and FIG. 13 is a front end view of the main part of the punching die device. It is.

  This punching die apparatus includes a punching die having an upper blade 110 and a lower blade 120. The upper blade 110 includes a punching punch 111 provided with a relief 141 inside an outer edge. Has a punching die 121. An IC card having the same size as the die hole 122 is punched by lowering the punch 111 for punching into a die hole 122 provided at the center of the punching die 121. For this reason, the size of the punch 111 for punching is slightly smaller than the size of the die hole 122. A blade whose upper cutting blade has an angle close to a right angle is generally called a punch die, and a blade having an acute angle is called a hollow blade. The punch die method is usually a drop-off method, but a hollow blade is often provided with an underlay without being removed.

In the present invention, in consideration of productivity and maintainability, a punched die system having a blade angle of around 90 degrees was used to punch a bonded sheet base material into a card shape.
[Storage of IC card]
The IC cards obtained as described above were loaded on the IC card cartridge having the shape shown in FIGS. This IC card cartridge is configured to be mountable in the loading section of the card printer shown in FIG. After the IC card cartridges were sealed, these IC card cartridges were stored for 10 days in an environment of 23 ° C. and 55%.

  14 and 15 show a card packaging of a comparative example.

  In the comparative example of FIG. 14, a multi-layer IC card is inserted from the opening 300a of the cartridge body 300, and the opening 300a is not sealed.

  In the comparative example of FIG. 3, an IC card having a multilayer structure is inserted from the opening 300 a of the cartridge main body 300, and the opening 300 a is closed and sealed with the seal member 301.

  16 to 24 show the card packaging of the embodiment.

  In the embodiment of FIG. 16, a multi-layer IC card is inserted from the opening 300 a of the cartridge body 300, the opening 300 a is closed and sealed with the seal member 301, and one hole 320 is provided in the seal member 301. .

  The embodiment of FIG. 17 is configured in the same manner as the embodiment of FIG. 16, but a plurality of holes 320 are provided in the seal member 301.

  In the embodiment of FIG. 18, a notch portion 300 c communicating with the opening 300 a is formed in the flange portion 300 b of the cartridge main body 300, and the opening 300 a is closed and sealed by the seal member 301, whereby the notch portion 300 c and the seal are sealed. One gap is provided between the member 301 and the member 301.

  The embodiment of FIG. 19 is configured in the same manner as the embodiment of FIG. 18, but has a plurality of gaps between the notch portion 300 c and the seal member 301.

  The embodiment of FIG. 20 is configured in the same way as the embodiment of FIG. 18, but the embodiment of FIG. 18 has a square cross section, whereas the embodiment of FIG. 20 has a triangular cross section. It is a void.

  In the embodiment of FIG. 21, a hole 330 is provided in the side wall 300d of the cartridge main body 300, and the hole 330 is covered with a sheet 331 having a gap through which gas can enter and exit. The sheet | seat 331 which has a space | gap is comprised with fibers, such as a nonwoven fabric, or paper.

  The embodiment of FIG. 22 is configured in the same manner as the embodiment of FIG. 21, but has a plurality of holes 330 in the side wall 300d of the cartridge body 300, and the hole 330 has a gap through which gas can enter and exit. Covered with a sheet 331.

  In the embodiment of FIG. 23, the gap is formed by making at least one portion of the seal member 301 unbonded 340.

In the embodiment of FIG. 24, the gap is formed by providing the adhesive material 350 in the notched portion 300c.
[IC card image creation method]
[Method of describing authentication identification image and attribute information image on IC card]
(Creation of ink sheet for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (MSY Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution>
Cyan dye (Nippon Kayaku Co., Ltd. Kayaset Blue 136) 3 parts Polyvinyl acetal 5.6 parts [Electrochemical Industry Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
20 parts of methyl ethyl ketone (preparation of ink sheet for melt type thermal transfer recording)
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (formation of face image)
The image receiving layer or transparent resin portion, the information printing portion and the ink side of the ink sheet for sublimation type thermal transfer recording are overlapped, and the output is 0.23 W / dot and the pulse width is 0.3-4. A human image having gradation in the image was formed on the image receiving layer by heating under conditions of 5 ms and a dot density of 16 dots / mm. In this image, the dye and the nickel of the image receiving layer form a complex.
(Formation of character information)
The transparent resin part and the ink side of the melt type thermal transfer recording ink sheet are overlapped, and the condition of output 0.5 W / dot, pulse width 1.0 ms, dot density 16 dots / mm using the thermal head from the ink sheet side The character information was formed on the IC card image recording body by heating with.

The face image and attribute information are provided as described above.
[Synthesis of IC card surface protective layer added resin]
[Create IC card surface protection foil]
(Preparation of transfer foil 1)
A transfer foil 1 was prepared by laminating the following composition on a release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a 0.1 μm fluororesin layer.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink surfactant F-179 0.25 part <intermediate layer forming coating solution> film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industries, Ltd .: Hitech S6254B] 8 parts
Polyacrylic acid ester copolymer [Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts (preparation of transfer foil 2)
The following composition was laminated | stacked on the mold release layer of the 25-micrometer-thick polyethylene terephthalate film 2 which provided the mold release layer of the 0.1 micrometer fluororesin layer, and the actinic-light curable transfer foil 2 was produced.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink surfactant F-179 0.25 part <intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts after coating Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Barrier layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: ESREC BX-1] 1 part Toughtex M-1913 (Asahi Kasei) 8 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1 part Methyl ethyl ketone 90 parts <Adhesion layer forming coating Liquid> Film thickness 0.5μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts Image Using the transfer foil 1 and the transfer foil 2 having the above configuration on the image receptor on which characters were recorded, the surface temperature was heated to 200 ° C.,
Transfer was performed in the order of transfer foil 1 and transfer foil 2 by applying heat at a pressure of 150 kg / cm ² for 1.2 seconds using a heat roller having a diameter of 5 cm and a rubber hardness of 85. The transfer was performed using an IC card making apparatus shown in FIG.

  FIG. 25 shows a card printer as an IC card creation device. In the card printer, a card base material supply unit 10 and an information recording unit 20 are arranged at an upper position, and a transparent protective layer and / or optical are arranged at a lower position. A change element transfer layer application part / or resin layer application part 70 is arranged, and thereafter a transparent protective layer and / or an optical change element transfer layer application part / or resin layer application part 70 are arranged, and a card is used as an image recording body. create.

  The card base material supply unit 10 includes, for example, a plurality of card base materials 50 that have been cut into pieces in advance for writing the personal information of the card user created in FIG. The IC card cartridge is packaged and stored, and the IC card cartridge is loaded into the loading section. In the IC card cartridge, a card-like IC card substrate 50 is stocked with the face for recording a face photograph facing upward. In this example, the card substrate 50 includes a support and an image receiving layer, and the card substrate 50 is automatically supplied one by one from the card substrate supply unit 10 at a predetermined timing.

  In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged correspondingly. While the card substrate 50 is moved by thermal transfer using a thermal transfer sheet such as a yellow ribbon, magenta ribbon, or cyan ribbon, an image area having a gradation such as a photograph of the card user's face is recorded in a predetermined area of the image receiving layer. Is done.

Further, a character ribbon cassette 31 and a recording head 32 are arranged, and authentication identification information such as a name and a card issuance date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, and an image recording layer is formed. In this information recording unit 20, a gradation information image is formed on the image receiving layer by heating imagewise, and the recording head condition when forming the image is pressurized in the range of 0.01 to 0.3 kg / cm ² , The head is formed at a temperature of 50 to 500 ° C.

  In the transparent protective layer and / or the optical change element transfer layer applying unit / or the resin layer applying unit 70, a transfer foil cassette 71 is arranged, and a thermal transfer head 72 is arranged corresponding to the transfer foil cassette 71. The optical change element transfer foil 43 and / or the transparent protective transfer foil 64 and the curable transfer foil 66 are transferred, and an optical change element transfer layer and / or a transparent protective transfer layer and a curable protective layer-containing transfer layer are provided.

The evaluation of this example is shown below.
[Evaluation of printer dust generation rate]
When four weeks have passed since the IC cards stored in the IC card cartridge were pasted, 10,000 cards were continuously printed using the printer of FIG. The ratio of the number of cards in which dust is generated on the printed card face is shown in Table 1 as the dust generation rate. The dust generation rate is preferably 0.5% or less.
[Card heat resistance evaluation]
The obtained IC card was stored for 1 hour on the dashboard of a car under hot summer heat. Thermometer values on the dashboard ranged from 90 ° C to 100 ° C. The shape of the card at that time was evaluated in five stages.
5: No change from initial card 4: Slight warping of card
3: A large warp occurs on the card and the card rises.
2: Peeled off at the interface between the adhesive and the top sheet or back sheet.

Or the protective layer is peeled off.
1: The adhesive of the card base material is melted and peeled off.
4 and 5 are practical levels.
[Evaluation of water resistance]
The finished card was immersed in tap water with a water temperature of 25 ° C. for 3 days, and the surface of the card was observed. The evaluation was evaluated visually using the following evaluation items.
○: No change from the initial card.
Δ: Water bubbles appear on the cross section of the card, and a part is peeled off by hand.
X: The card bonding part is completely peeled off.
The results are shown in Table 1.

Table 1

  According to the results in Table 1, in the present invention, the results of the present invention show excellent effects in the printer dust generation rate evaluation, the card heat resistance evaluation, and the water resistance evaluation with respect to the comparative example, and the effects of the invention are recognized.

  The present invention has a cartridge main body that stores IC cards in a stacked state, and a seal member that closes an opening for inserting the IC card of the cartridge main body, and the cartridge with the opening of the cartridge main body closed by the seal member The IC card can be hardened by a gap through which gas can enter and exit the main body, and dust can be prevented from adhering at the time of manufacturing the IC card.

It is a schematic block diagram of the manufacturing process of an IC card. It is sectional drawing of the image forming body of the bonded product of an IC card. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows a 1st sheet material (back sheet). It is a figure which shows a 2nd sheet | seat material (front sheet | seat). It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is sectional drawing of a card base original plate. It is sectional drawing of a card base original plate. 1 is an overall schematic perspective view of a punching die device. It is a front end view of the principal part of a punching die apparatus. It is a figure which shows storage of the IC card of a comparative example. It is a figure which shows storage of the IC card of a comparative example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows storage of the IC card of an Example. It is a figure which shows the card printer as an IC card production apparatus.

Explanation of symbols

1 First sheet material (back sheet)
2 Second sheet material (front sheet)
DESCRIPTION OF SYMBOLS 3 Inlet 3a Electronic component 3a1 Antenna 3a2 IC chip 3b Reinforcement board 6,7 Adhesive layer 8a Image receiving layer 8b Personal identification information 8c Transparent protective layer 9a Writing layer 50 Card base material A 1st sheet material supply part B 2nd sheet Material supply part C1, C2 Adhesive supply part D 2nd sheet conveyance member E Inlet supply part F Back roller part G Card base material conveyance member H Cutting part K Collection part L Storage part M Punching part N Packaging part 300 Cartridge body 300a Opening 300b Gutter 300c Notch 300d Side wall 301 Seal member 320, 330 Hole 331 Sheet having gap 350 Adhesive material

Claims (19)

An IC card having a multilayer structure formed by applying an adhesive between the first sheet material and the second sheet material and enclosing an IC module having an IC chip in the adhesive layer;
A cartridge body for storing the IC cards in a stacked state;
A seal member that closes an opening for inserting the IC card of the cartridge body;
An IC card cartridge comprising a gap through which gas can enter and exit inside the cartridge body in a state where the opening of the cartridge body is closed by the seal member. 2. The IC card cartridge according to claim 1, wherein the gap is a hole provided in the cartridge body or the seal member. The IC card cartridge according to claim 1 or 2, wherein a diameter of the hole is 2 mm or less. The IC card cartridge according to claim 1, wherein the opening is formed by unbonding at least one portion of the seal member. Having a notch in at least a portion of the cartridge body;
The IC card cartridge according to claim 1, wherein the gap is provided between the cutout portion and the seal member. 6. The IC card cartridge according to claim 5, wherein a cross-sectional area of the gap is 0.01 mm ² or more and 2 mm ² or less. The IC card cartridge according to claim 5 or 6, wherein an adhesive material is provided so as to form the gap in the cutout portion. Having a hole in at least a portion of the card magazine body,
2. The IC card cartridge according to claim 1, wherein the hole portion is covered with a sheet having a space through which gas can enter and exit. 9. The IC card cartridge according to claim 8, wherein the material of the sheet is made of fiber or paper. The IC card cartridge according to any one of claims 1 to 9, wherein the IC card has an unreacted portion in at least a part of an adhesive inside the card. The IC card cartridge according to any one of claims 1 to 10, wherein the IC card is cut into a single sheet before being punched into a card. 12. The IC card cartridge according to claim 1, wherein the IC card is subjected to format printing before being punched into a card shape. 2. The IC card according to claim 1, wherein the IC card has an image receiving layer on which at least one side is provided with personal identification information including a name and a face image by a thermal transfer method or an ink jet method, and has a writing layer capable of writing on at least one side. The IC card cartridge according to claim 12. A transparent protective layer is provided on the top surface provided with personal identification information including the name and face image,
14. The IC card cartridge according to claim 13, wherein the transparent protective layer is made of an actinic ray curable resin. The IC card cartridge according to claim 13 or 14, wherein the IC chip is disposed at a position other than a position overlapping the face image portion. The IC card cartridge according to claim 1, wherein the IC card is a non-contact type. The IC card cartridge according to any one of claims 1 to 16, wherein the IC card has a planar unevenness of a chip peripheral portion on the surface of the IC card within ± 10 µm. An IC card having a multilayer structure formed by applying an adhesive between the first sheet material and the second sheet material and enclosing an IC module having an IC chip in the adhesive layer is formed into a cartridge body. Insert and stack from the opening of
In the state where the IC cards are stacked, the opening of the cartridge body is closed with a seal member,
The IC card cartridge according to any one of claims 1 to 17, wherein gas can enter and exit from the inside of the cartridge body in a state where the opening of the cartridge body is closed by the seal member. An IC card packaging method as a feature. An adhesive is applied between the first sheet material and the second sheet material, and an IC module having an IC chip is encapsulated in the adhesive layer to form a card substrate having a multilayer structure. A process for creating a card substrate to be cut into a sheet,
A card substrate storage process for storing the card substrate cut into the sheet form;
A card substrate punching process for punching the card substrate cut into the sheet shape into a card shape;
An IC card manufacturing method comprising: a card packaging step of loading and packaging the IC card in the IC card cartridge according to any one of claims 1 to 17.

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