JP2006285363A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card with durability to an impulsive load which produces a rapid stress, repeated bending stress and repeated local load or the like, and to improve the flatness of a card surface with a high level. <P>SOLUTION: An IC module 40 is provided with at least an antenna coil 41 and an IC chip 42, and the IC chip 42 is provided with a reinforcing board 43. When a distance from the center of gravity of the reinforcing board 43 to the furthest point is defined as d1, and a distance from the center of gravity of the IC chip 42 to the furthest point is defined as d2, relation of 6≥d1/d2≥1.3 is satisfied, and relation of 5≥d3/d4≥1.5 is satisfied between the maximum thickness d3 of the reinforcing board 43 and the maximum thickness d4 of the IC chip 42. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC card having a built-in IC module having a contact type or non-contact type IC chip and an antenna for storing personal information and the like that require safety (security) such as forgery and alteration prevention.

  For example, magnetic cards that record data by a conventional magnetic recording method have been widely used for identification cards (ID cards), credit cards, and the like. However, since data can be rewritten relatively easily in a magnetic card, data falsification is not sufficiently prevented, it is susceptible to external influences due to magnetism, data protection is insufficient, and recording capacity is small. There were problems such as.

  In recent years, IC cards incorporating IC chips have begun to spread. The IC card reads and writes data with an external device via an electrical contact provided on the surface or a loop antenna inside the card. The IC card has a larger storage capacity than the magnetic card and greatly improves security. In particular, a non-contact IC card that has an antenna for exchanging information between the IC chip and the outside inside the card and does not have an electrical contact outside the card is a contact IC card having an electrical contact on the card surface. Compared with an ID card, it is being used for applications that require high confidentiality of data and prevention of forgery and alteration.

  As such an IC card, for example, there is an IC card in which a first sheet member and a second sheet member are bonded via an adhesive, and an IC module having an IC chip and an antenna is enclosed in the adhesive layer.

  Since the IC card has high security, durability is important from the viewpoint of counterfeiting and alteration. In particular, since electrical components such as an antenna for exchanging information between the IC chip and the outside are built in the card, various attempts have been made to ensure its durability. However, higher durability has been required while being used and spread in various applications.

Due to the characteristics of the IC card, it is always required to be durable against repeated bending, dropping, coins, etc. in a trouser pocket. On the other hand, improvements such as providing a strong reinforcing structure on the IC chip have been proposed. For example, Japanese Unexamined Patent Publication No. Hei 6-199083 discloses durability due to breakage of an IC chip due to pressure, bending, or disconnection of an antenna. As a technique for solving such a problem, it is known to laminate a reinforcing plate made of metal or resin on a semiconductor chip (for example, Patent Document 1).
JP-A-9-156265 (pages 1 to 4, FIGS. 1 to 5)

  However, in these conventional technologies, a certain improvement in durability can be seen, but sufficient durability is not obtained in various situations, for example, durability against shocks that are subjected to sudden stress, and stress is repeatedly applied. For repeated bending durability, repeated local loads, etc., there have been problems such as the IC chip cracking or the IC card is damaged and pulled, making electrical operation impossible. In addition, in order to provide high-quality images and information such as names on the surface, it has also been required to improve the flatness of the surface.

  The present invention has been made in view of the above points, and has an durability against an impact load, a repeated bending stress, a repeated local load, and the like, which are subjected to abrupt stress, and improves the flatness of the card surface at a high level. The purpose is to provide.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

The invention according to claim 1 is an IC card incorporating an IC module in which a reinforcing plate is provided on an IC chip.
When the distance from the center of gravity of the reinforcing plate to the farthest point of the reinforcing plate is d1 and the distance from the center of gravity of the IC chip to the farthest point of the IC chip is d2 with respect to the center of gravity of the IC chip, The IC card is characterized in that the relationship of the formula B is satisfied, where d3 is the maximum thickness of the reinforcing plate and d4 is the maximum thickness of the IC chip.

Formula A) 6 ≧ d1 / d2 ≧ 1.3
Formula B) 5 ≧ d3 / d4 ≧ 1.5
Thus, when the distance from the center of gravity of the reinforcing plate to the farthest point is d1 and the distance from the center of gravity of the IC chip to the farthest point of the IC chip is d2 with respect to the IC chip center of gravity position, 6 ≧ d1 / d2 When the maximum thickness d3 of the reinforcing plate and the maximum thickness d4 of the IC chip are set in the relationship of ≧ 1.3, the relationship of 5 ≧ d3 / d4 ≧ 1.5 is set, and the IC chip and the reinforcing plate built in the IC card are bent greatly. When stress is applied, the reinforcing plate centroid and the IC chip centroid are separated from each other within the scope of the present invention, so that the reinforcing plate acts as a spring, and the stress applied to the IC chip is relieved to obtain high durability. Also, if the reinforcing plate is made larger than this invention, the support body will be destroyed when the IC card is bent, or conversely, stress will be easily transmitted to the IC chip, and the durability will be reduced. High durability performance against deformation and peeling of the IC card when repeated bending stress and repeated local load are applied.

The invention according to claim 2 is the IC card according to claim 1, wherein the reinforcing plate is arranged so that the maximum length direction thereof is parallel to the short side of the card.

  Thus, when the bending force is applied to the card long side direction by arranging the reinforcing plate so that the maximum length direction is parallel to the card short side, the stress on the card long side is small. It ’s easy to bend. For this reason, if the reinforcing plate, which is a highly elastic member inserted into the card, has the maximum length in the long side direction, a large amount of force is likely to be applied to the reinforcing plate and the IC chip. On the other hand, high strength reinforcement on the short side of the card, which is relatively difficult to bend with the same stress so that no great force is applied to the IC chip, ensures durability and improves durability against pressure and bending.

According to a third aspect of the present invention, the IC chip, the first reinforcing plate, and the second reinforcing plate are fixed through an adhesive having a 2% elastic modulus of 0.01 to 55 kg / mm ² . An IC card according to claim 1 or claim 2, characterized in that:

As described above, the IC chip, the first reinforcing plate, and the second reinforcing plate are fixed through the adhesive having a 2% elastic modulus of 0.01 or more and 55 kg / mm ² or less to relieve stress. High durability can be obtained.

  The invention according to claim 4 is the IC card according to claim 1, 2 or 3, further comprising an image receiving layer and a cushion layer on at least one side of the front and back of the IC card.

  Thus, by having the image receiving layer and the cushion layer on at least one side of the front and back of the IC card, the flatness of the card surface can be improved at a high level, and printing / printing can be carried out satisfactorily.

  Hereinafter, although the embodiment of the IC card of the present invention will be described, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the terminology of the present invention is not limited to this.

  An IC card including an IC module will be described with reference to FIGS. 1 is a plan view showing the configuration of the IC card, FIG. 2 is a cross-sectional view showing the configuration of the IC card, FIG. 3 is a cross-sectional view of the IC module, and FIG. 4 is a plan view of the IC chip portion.

  As shown in the cross-sectional view of FIG. 2, the IC card 1 according to this embodiment includes an IC module 40 sandwiched between a first sheet member 50 and a second sheet member 51 facing each other. 53 is integrated. Further, as shown in FIG. 1, the IC card 1 has an image receiving layer on one side of the first sheet member 50, character information C1 such as name by a thermal transfer method such as sublimation thermal transfer or fusion thermal transfer, or an inkjet method, face Personal identification information C3 including image information C2 such as an image is provided.

  The IC module 40 has at least an antenna coil 41 and an IC chip 42, and the IC chip 42 is provided with a reinforcing plate 43. The IC module 40 has a single wafer shape held by 30.

  In the IC module 40 shown in FIG. 3, the module supports 31 and 32 are nonwoven fabric sheets. In this IC module 40, an antenna coil 41 and an IC chip 42 bonded to a reinforcing plate 43 with an adhesive 60 are arranged between module supports 31 and 32, and the antenna coil 41 is connected to the IC chip 42. ing.

  As shown in FIG. 4, the IC chip 42 is reinforced by providing a reinforcing plate 43 larger than the IC chip 42 with an adhesive 60. Here, when the distance from the center of gravity 43G of the reinforcing plate 43 to the farthest point 43A of the reinforcing plate 43 is d1, and the distance from the center of gravity 42G of the IC chip 42 to the farthest point 42A of the IC chip 42 is d2, 6 ≧ The relationship d1 / d2 ≧ 1.3 is satisfied. Further, as shown in FIG. 3, the relationship of the formula 5 ≧ d3 / d4 ≧ 1.5 is satisfied between the maximum thickness d3 of the reinforcing plate 43 and the maximum thickness d4 of the IC chip 42.

  The IC module may use a reinforcing plate having a plurality of farthest points in a convex shape at four corners as shown in FIG. Also in this case, if the distance from the center of gravity 143G of the reinforcing plate 143 to the farthest point 143A is d1, and the distance from the center of gravity 42G of the IC chip 42 to the farthest point 42A of the IC chip 42 is d2, then 6 ≧ d1 / d2. The relationship of ≧ 1.3 is satisfied. Note that the relationship of 5 ≧ d3 / d4 ≧ 1.5 is also satisfied between the maximum thickness d3 of the reinforcing plate 143 and the maximum thickness d4 of the IC chip 42.

  In the IC module 140 shown in FIG. 6, the module support 130 is a PET sheet. In this IC module 140, a connection bump provided on the circuit surface of the IC chip 42 is electrically connected to an antenna foil 141 provided on a support 130 on which an antenna pattern is formed by etching, using a conductive adhesive. On the side opposite to the circuit surface of the IC chip 42, the reinforcing plate 243 is pressed and heated and adhered through the adhesive 60 to form the IC module 140.

  In the rectangular reinforcing plate 243, as shown in FIG. 7, when the distance from the center of gravity 243G to the farthest point 243A is d1, and the distance from the center of gravity 42G of the IC chip 42 to the farthest point 42A is d2, 6 The relationship of ≧ d1 / d2 ≧ 1.3 is satisfied.

Next, the first sheet member and the second sheet member of the IC card will be described.
<Support>
Examples of the support for the first sheet member and the second sheet member include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, Polyfluorinated ethylene resins such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate Copolymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable sex Biodegradable resins such as livinyl alcohol, biodegradable cellulose acetate and biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, polyethyl methacrylate, ethyl polyacrylate, Acrylic resins such as polybutyl acrylate, synthetic resin sheets such as polystyrene, polycarbonate, polyarylate, and polyimide, or paper such as fine paper, thin paper, glassine paper, and sulfuric acid paper, single layer such as metal foil, or these 2 A laminate having more than one layer is exemplified. The thickness of the support of the present invention is 30 to 300 μm, desirably 50 to 200 μm. When the thickness is 50 μm or less, there is a problem in that heat shrinkage or the like occurs when the first support and the second support are bonded.

  In this invention, the thermal contraction rate at 150 ° C./30 min obtained by adding a white pigment to improve the concealing property or by performing an annealing treatment to reduce the thermal contraction rate is vertical (MD It is preferable to use a support of 1.2% or less in the lateral direction and 0.5% or less in the lateral (TD). If the length (MD) is 1.2% or more and the width (TD) is 0.5% or more, an adhesive is applied or bonded from the surface side of both the first support and the second support. When produced, the support caused thermal contraction due to the temperature, and it was difficult to align in the subsequent cutting process and printing process. However, by using an adhesive that adheres at a low temperature and a support having a thermal shrinkage rate at 150 ° C./30 min of 1.2% or less in length (MD) and 0.5% or less in width (TD), the support shrinks. We were able to improve the conventional problems without getting up.

  Further, an easy contact treatment may be performed on the support for post-processing to improve adhesion, and an antistatic treatment may be performed for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

  In some cases, the first support may be provided with an image receiving layer and a cushion layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing is preferable.

<Image receiving layer>
For the image receiving layer, known resins can be used. For example, polyvinyl chloride resin, copolymer resin of vinyl chloride and other monomers (for example, isobutyl ether, vinyl propionate, etc.), polyester resin, poly (meta ) Copolymerization of acrylic acid ester, polyvinyl pyrrolidone, polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl alcohol, polycarbonate, cellulose triacetate, polystyrene, styrene and other monomers (eg acrylic acid ester, acrylonitrile, ethylene chloride, etc.) Examples include coalescence, vinyl toluene acrylate resin, polyurethane resin, polyamide resin, urea resin, epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, and modified products thereof. Preferred are polyvinyl chloride resin, copolymers of vinyl chloride and other monomers, polyester resins, polyvinyl acetal resins, polyvinyl butyral resins, copolymers of styrene and other monomers, epoxy Resin.
<Cushion layer>
The cushion layer referred to in the present invention means a soft resin layer that is located between the support and the image receiving layer that receives an image, and plays a role of alleviating the effects of unevenness caused by electronic parts such as an IC module. The cushion layer is not particularly limited as long as it has a cushion layer between the image receiving layer and the electronic component, but may be formed by being coated or bonded on one or both sides of the second support. Particularly preferred.

Examples of the material for forming the cushion layer of the present invention include polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, and styrene-isoprene-styrene block. Copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-hydrogenated isoprene-styrene block copolymer, polybutadiene, photocurable resin layer, etc., with low thermal conductivity Is suitable. Specifically, a cushion layer such as Japanese Patent Application No. 2001-16934 can be used.
<Writing layer>
In some cases, the second support may be provided with a writing layer capable of writing with a writing tool. This writing layer is a layer that allows writing on the back surface of the IC card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. The writing layer is formed on the surface of the second support on which the plurality of layers are not laminated.
<Adhesive>
As the adhesive used for the IC card of the present invention, a commonly used resin can be used without limitation. Preferably, a hot melt adhesive is used, and the main component of the hot melt adhesive is, for example, ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, polyolefin, etc. Is mentioned.

  However, if the card substrate is easily warped, or the card surface is provided with a layer vulnerable to high-temperature processing such as an image receiving layer for image formation by thermal transfer, the layer is damaged or the substrate is bonded to adhere at a high temperature. In the case of bonding via an adhesive due to problems such as thermal shrinkage and the deterioration of the position accuracy at the time of bonding and bonding, it is preferable to bond at 80 ° C. or lower, more preferably 10 to 80 ° C., more preferably Is preferably 20 to 80 ° C. Among the low temperature adhesives, specifically, a reactive hot melt adhesive is preferable.

  A reactive hot melt adhesive (hereinafter referred to as reactive adhesive) is a type of adhesive in which a resin is melted and bonded, and then the moisture is absorbed to cure the resin. Its characteristics are that it has a curing reaction compared to normal hot melt, has a long bonding time, and has a high softening temperature after bonding, so it has high durability and is suitable for processing at low temperatures. Is mentioned.

  Examples of reactive adhesives that can be used in this invention include TE030 and TE100 manufactured by Sumitomo 3M, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bond Master 170 series manufactured by Kanebo UESC, and Macroplast QR 3460 manufactured by Henkel.

  Moisture curable materials as reactive hot melt adhesives are disclosed in JP 2000-036026, JP 2000-219855, and the like. JP-A-10-316959, JP-A-11-5964 and the like are disclosed as photocurable adhesives. Any of these adhesives may be used, and it is preferable to use a material that is not limited in the present invention. The thickness of the adhesive is preferably 10 to 600 μm, more preferably 10 to 500 μm, and still more preferably 10 μ to 450 μm in terms of the thickness including the electronic component within the scope of the present invention.

In the present invention, the adhesive for bonding the support preferably has a 2% elastic modulus in the range of 0.01 to 100 kgf / mm ² , more preferably 0.1 to 55 kgmm ² , and a 2% elastic modulus of 0.01 to 100 kgf. / mm ² or less, high durability cannot be obtained, and if the 2% elastic modulus is 0.01 or more and 100 kgf / mm ² or less, stress cannot be relieved and the IC chip is fall into disrepair.
<Electronic components (IC modules)>
An electronic component (IC module) refers to an information recording member, specifically, an IC chip that electrically stores information of a user of the electronic card and a coiled antenna body connected to the IC chip. This is an IC module. The IC chip is a memory alone or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.

  The IC module has an antenna coil, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). It is known to use industrial anisol or the like) or to perform solder bonding, but any method may be used.

In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It can be used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven fabric sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used.
<Adhesive>
As long as it does not contradict the meaning of this invention, the resin material generally used can be used for the adhesive agent of this invention without a restriction | limiting. Adhesives such as epoxy, urethane, silicon, cyanoacrylate, nitrile rubber, etc., UV curable, hot melt, anaerobic, cellulose adhesive, vinyl acetate adhesive, etc. can be used. . These adhesives can be used alone or in combination. Preferably, an elastic epoxy adhesive is used.

  As an elastic epoxy resin, for example, an epoxy resin composition comprising a combination of an epoxy resin and a mercaptan curing agent as disclosed in JP-A-63-63716 in order to obtain curability at low temperatures, or a heterocyclic diamine An epoxy resin composition comprising a combination with a curing agent has been used. Moreover, in order to obtain high strength, an epoxy resin comprising a combination with an aromatic polyamine curing agent has been used. (C) Polyamidoamine as a bisphenol type epoxy resin and an amine curing agent as disclosed in JP-A-10-120764 for obtaining working environment characteristics, adhesion to a support, and adhesion stability, (D) An epoxy resin composition is used in combination with an aromatic modified amine and (E) an aliphatic modified polyamine. Japanese Patent Laid-Open No. 2000-229927 discloses an epoxy resin having a high curing rate, which is a combination of an epoxy resin and an amine imide compound type curing agent. JP-A-6-87190 and JP-A-5-295272 describe the use of a specially modified silicone prepolymer as a curing agent, and disclose a material with improved resin flexibility.

  Examples of the elastic epoxy adhesive that can be used in this invention include Cemedine Co., Ltd., Cemedine EP-001, Three Bond Co., Ltd., 3950 Series, 3950, 3951, 3952, Konishi Co., Ltd. Bond MOS Series, MOS07. It is preferable to use MOS10, Toho Kasei Kogyo Co., Ltd. ULTITE 1500 series, ULTITE 1540 lamp.

Examples of the adhesive polymer include silicones such as a mixture of silicone rubber such as polydimethylsiloxane and polydiphenylsiloxane and silicone resin such as polysiloxane having trimethylsilyl group or triphenylsilyl group; polyesters; polyurethanes; Ethers; Polycarbonates; Polyvinyl ethers; Polyvinyl chlorides; Polyvinyl acetates; Non-acrylic polymers such as polyisobutylenes, acrylic rubber, acrylonitrile / butadiene rubber (NBR), random styrene / butadiene rubber, Butyl rubber, isoprene rubber (IR), butadiene rubber (BR), ethylene / propylene rubber (EPM), ethylene / propylene / diene rubber (EPDM), urethane rubber, styrene / isoprene Styrene block rubber (SIS), styrene / ethylene / butadiene / styrene block rubber (SEBS), may be used synthetic rubber-based polymers such as styrene / butadiene block rubber. A resin having a low thermal softening point, for example, an acrylic polymer mainly composed of an alkyl acrylate having a low glass transition point, is preferably used because the polymer itself can exhibit an appropriate pressure-sensitive adhesive property.

  The thickness of the adhesive including the electronic component is preferably 100 to 500 μm, more preferably 150 to 500 μm, and still more preferably 200 μ to 400 μm. The adhesive in this invention is preferably an adhesive resin having a viscosity at 23 ° C. of 1000 to 35000 cps, and more preferably 3000 to 35000 cps. When the viscosity is 1000 cps or less, the viscosity is too low when the IC chip and the reinforcing structure are in close contact with each other, so that the provided liquid flows, causing film thickness control and film thickness unevenness. On the other hand, if the viscosity is 35000 or more, coating streaks and bubbles are generated during production, resulting in deterioration of adhesion.

The physical property after curing is preferably 0.01 to 60 (kgf / mm ² ) even when the resin physical property after curing of 500 μm used in the present invention is 2% elastic modulus (kgf / mm ² ). If it is less than 01 (kgf / mm ² ) or more than 60 (kgf / mm ² ), stress and deformation to the IC chip or the reinforcing structure are concentrated on the IC chip, resulting in lower durability and a problem. End up.

  Further, the adhesion agent can be provided on the reinforcing structure or the IC chip without particular limitation, such as potting, coating, spraying, printing, and sticking. When providing by potting, it is preferable to increase the number of potting nozzles. When providing by application | coating, providing smoothly is preferable. In any case, it is preferable that the adhesive is uniformly provided when the reinforcing structure is fixed to the IC chip. In the present invention, it is preferable that the area of the adhesive exceeds the area of the IC chip. If the adhesive is not filled between the chip / reinforcing structure, the durability is lowered.

  In the present invention, additives can be added unless it is contrary to the spirit of the present invention. In particular, the adhesive preferably contains particles, fibers, and a self-supporting resin. Materials that can be added to the adhesive include WAX, thermoplastic resins, inorganic fine particles, leveling agents, rubber elastic particles, thermoplastic elastomers, thermoplastic resins, adhesives, curing agents, curing catalysts, spreading agents, tabular particles Needle-like particles, other additives and the like can also be blended.

  By adding elastic particles, it is particularly preferable that the stress applied to the IC chip can be relieved in the manufacturing process for fixing the reinforcing structure, the strain does not remain, and the durability can be improved. Even after being carded, the stress applied to the IC chip can be relaxed and durability can be improved.

  As the tabular grains, for example, tabular substances such as mica, talc, layered silicate, and silver halide can be used. The flat silica compound that is a flat material refers to a layered silicate containing an alkali, an alkaline earth metal, aluminum, or the like, that is, a flat silicate, which includes a kaolin mineral, a mica clay mineral, Examples include smectite. Examples of kaolin minerals include kaolinite, dickite, nacrite, halloysite, serpentine and the like. Examples of the mica clay mineral include pyrophyllite, talc, muscovite, swellable synthetic fluorine mica, sericite, and chlorite.

  The preferred amount of tabular grains used in the present invention is from 0.10 to 0.90, particularly preferably from 0.2 to 0.8, in a dry weight ratio to the binder of the layer to be added. Examples of the acicular particles include hexagonal ferrites such as barium ferrite and strontium ferrite. Moreover, the fiber piece of high elastic modulus, such as an aramid fiber, may be sufficient. Further, if necessary, other fine particles may be used in combination. As other fine particles, various inorganic oxides, carbides, nitrides and borides are preferably used. For example, silica, alumina, titania, zirconia, barium titanate, aluminum titanate, strontium titanate, magnesium titanate, calcium titanate, zinc oxide, chromium oxide, cerium oxide, antimony oxide, tag-sten oxide, tin oxide, tellurium oxide Manganese oxide, boron oxide, silicon carbide, boron carbide, titanium carbide, silicon nitride, titanium nitride, boron nitride and the like.

  Examples of the self-supporting resin include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, poly Polyfluorinated ethylene resins such as ethylene tetrafluoride and ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer Polymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymers such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol, bio Biodegradable resins such as water-soluble cellulose acetate and biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, ethyl polymethacrylate, polyethyl acrylate, polybutyl acrylate, etc. Synthetic resin sheets such as acrylic resin, polystyrene, polycarbonate, polyarylate, polyimide, etc., or paper such as fine paper, thin paper, glassine paper, sulfate paper, a single layer of metal foil, or a laminate of two or more layers. Can be used.

  In the present invention, the reinforcing structure is fixed to the IC chip in order to improve the durability of the IC chip. The reinforcing structure of the present invention is preferably excellent in mechanical strength. If the reinforcing structure is made thicker to ensure strength, the card thickness becomes thicker and the surface printability and the like are lowered, so that the reinforcing structure is preferably a high-strength material.

Metals, ceramics, carbon fibers, glass fibers, aramid fibers, high elastic resins, etc. are raised. It may be a composite material composed of one or more selected from these. In particular, a material having a Young's modulus of 100 GPa or more is preferably used for the main structure. The thickness is 10 to 300 μm, preferably 20 to 200 μm, and more preferably 30 to 150 μm. The shape of the reinforcing structure can be used as appropriate as long as it does not contradict the gist of the present invention. In the present invention, the shape of the reinforcing structure is preferably a plurality of members, and is particularly formed of the first and second double structures.
[Method of including an electronic component having a predetermined thickness between the first sheet member and the second sheet member]
In order to provide a predetermined electronic component between the first sheet member and the second sheet member of the present invention, a heat bonding method, an adhesive bonding method, and an injection molding method are known as manufacturing methods. , Either method may be used. Further, the first sheet member and the second sheet member may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, It can be formed by any method such as an ink jet method, a sublimation transfer method, an electrophotographic method, and a heat melting method.

The method for producing an IC card according to the present invention includes a step of providing an adhesive member on a first support for a card, which is a solid or viscous body at a normal temperature and softens in a heated state, and an electronic component. A step of placing the first support on the first support, a step of placing the second support provided with an adhesive member so as to cover the electronic component on the first support, and a predetermined pressure and heating condition. And bonding the first support, the electronic component, and the second support to each other.

  It is preferable that the adhesive member softened in the heated state of the solid or viscous material is a method of forming the adhesive itself in a sheet form and the adhesive itself is heated or melted at room temperature and bonded by injection molding.

At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the base material and the adhesion of a predetermined electronic component between the first support and the second support. It is preferable to manufacture by a laminate method or the like. The heating is preferably 10 to 120 ° C, more preferably 30 to 100. The pressurization is preferably 0.1 to 300 kgf / cm ² , more preferably 0.1 to 100 kgf / cm ² . An IC chip having a higher pressure is damaged. The heating and pressurizing time is preferably from 0.1 to 180 seconds, more preferably from 0.1 to 120 seconds.

The laminated sheet member or continuous coated lamellar roll formed as a continuous sheet member by the adhesive bonding method or the resin injection method is allowed to stand for a predetermined curing time of the adhesive, and then the authentication identification image or bibliographic item. May be recorded and then molded into a predetermined card size. As a method of forming a predetermined card size, a punching method, a cutting method, or the like is mainly selected.
[Example]
EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, this invention is not limited by these Examples. In the following, “part” means “part by weight”.
<Creation of adhesive>
The adhesive is Macroplast QR3460 (moisture curable adhesive) manufactured by Henkel.
It was used.
<Production of IC module>
An IC module was prepared as follows.
IC module 1;
IC chip thickness (d4) 60 μm, distance from the center of gravity 42G of the IC chip 42 to the farthest point 42A of the IC chip (d2) 2.5 mm IC chip is joined, and the reinforcing plate thickness (d3) made of SUS301 is 120 μm, A rectangular reinforcing plate 43 having a distance (d1) from the center of gravity 43G of the reinforcing plate 43 to the farthest point 43A of 3.5 mm is placed on the side opposite to the circuit surface. Using a main agent and a curing agent using kg / mm ² ), a winding type antenna was formed and bonded to a bump formed on the IC chip 42. Subsequently, the IC module 1 was produced by sandwiching the IC module from both sides with a nonwoven fabric made of polyethylene terephthalate fiber. It shows in FIG. 3, FIG.
IC module 2;
IC chip thickness (d4) 60 μm, distance from the center of gravity 42G of the IC chip 42 to the farthest point 42G of the IC chip 42 (d2) 2 mm of the IC chip 42 is joined, and the thickness of the reinforcing plate (d3) made of SUS301 is 150 μm, The reinforcing plate 143 has a shape in which the distance (d1) from the center of gravity 143G of the reinforcing plate 143 to the farthest point 143A is a convex shape having a plurality of furthest points of 5 mm, and the reinforcing plate is provided with the following resin. Except for the above, it was the same as IC module 1. As shown in FIG.
・ Two-component curable elastic epoxy adhesive: Toho Kasei Kogyo Co., Ltd.
Urtite 1540 set 90 parts Silicone resin powder (Tospearl 150; manufactured by GE Toshiba Silicone) 10 parts The above ingredients were prepared by stirring with a homogenizer for 60 minutes. The curing agent was added immediately before use.
(2% elastic modulus 1kgf / mm ² )
IC module 3;
An antenna foil is provided on a support having a thickness of 38 μ by etching and an antenna foil of 30 μm, an IC chip thickness (d4) of 60 μm, a distance from the center of gravity 42G of the IC chip 42 to the farthest point 42A of the IC chip 42 (d2) Reinforcement plate thickness (d3) made of SUS301 is bonded to a 2mm IC chip 42, and the reinforcement plate 243 having a rectangular shape with a distance (d1) from the center of gravity 243G of the reinforcement plate 243 to the farthest point 243A is opposite to the circuit surface. The following resin was adhered to the side with a thickness of 10 μm to obtain an IC module 3. As shown in FIGS.
・ Two-component curable elastic epoxy adhesive: Toho Kasei Kogyo Co., Ltd.
Urtite 1540 set 90 parts Silicone resin powder (Tospearl 150; manufactured by GE Toshiba Silicone) 10 parts The above ingredients were prepared by stirring with a homogenizer for 60 minutes. The curing agent was added immediately before use. (2% elastic modulus 1kgf / mm ² )
IC module 4;
An antenna foil is provided on a support having a thickness of 38 μm formed by etching and an antenna foil is provided with a thickness of 30 μm, an IC chip thickness (d4) of 60 μm, and a distance from the center of gravity of the IC chip to the farthest point of the IC chip (d2) 2 mm. A rectangular alpha plate with a reinforcing plate thickness (d3) of 180 μm and a distance (d1) from the center of gravity of the reinforcing plate to the farthest point (10 mm) on the opposite side of the circuit surface is Aron Alpha GEL-10 (2 % Modulus of elasticity 60 kgf / mm ² , manufactured by Toagosei Co., Ltd.) was bonded to a thickness of 10 μm to obtain an IC module 4.
IC module 5;
An antenna foil is provided on a support having a thickness of 38 μm by etching and an antenna foil is provided with 30 μm, an IC chip thickness (d4) of 100 μm, and a distance from the center of gravity 42G of the IC chip 42 to the farthest point 42A of the IC chip 42 (d2) A circular reinforcing plate 343 having a thickness (d3) made of SUS301 of 150 μm and a distance (d1) from the center of gravity 343G of the reinforcing plate 343 to the farthest point 343A is joined to a 2.5 mm IC chip 42. The following resin was adhered to the side opposite to the circuit surface with a thickness of 10 μm to obtain an IC module 5. As shown in FIG.
・ Two-component curable elastic epoxy adhesive: Toho Kasei Kogyo Co., Ltd.
Urtite 1540 set 90 parts Silicone resin powder (Tospearl 150; manufactured by GE Toshiba Silicone) 10 parts The above ingredients were prepared by stirring with a homogenizer for 60 minutes. The curing agent was added immediately before use. (2% elastic modulus 1kgf / mm ² )
IC module 6;
An antenna foil is provided with 30 μm on a support having a thickness of 38 μm formed by etching and an IC chip thickness (d4) of 60 μm, and the distance from the center of gravity of the IC chip to the farthest point of the IC chip (d2) of 2 mm. The IC module 6 is formed in the same manner as the module 5 except that the chip is joined and the reinforcing plate thickness (d3) made of SUS301 is 350 μm, and the distance (d1) from the center of gravity of the reinforcing plate to the farthest point is 15 mm. Obtained.
<Example 1>
[Creation of IC card]
FIG. 9 shows an example of a laminated structure of the IC card and personal authentication card of the present invention. In Example 1, the IC module 1 was used.

  In the IC card, the IC module 40 is sandwiched between a support body that is the first sheet member 50 and a support body that is the second sheet member 51 facing each other, and is integrated by the front adhesive layer 52 and the back adhesive layer 53. It is a configuration. In addition, the IC card has an image receiving layer 54 on one side of the first support, and is provided with an authentication image C21 and attribute information C31 by a thermal transfer method such as sublimation thermal transfer or melt thermal transfer or an inkjet method, and attribute information C31. 55 protects.

  The IC module 40 includes an antenna coil 41 and an IC chip 42 bonded to a reinforcing plate 43 with an adhesive between module support members 31 and 32 made of a nonwoven fabric sheet. The antenna coil 41 is attached to the IC chip 42. Connected.

A white polyester sheet having a thickness of 188 μm was used for the first support and the second support.
[Creation of the first support]
The first support has a cushion layer, a first image-receiving layer-forming coating solution, a second image-receiving layer-forming coating solution, and a third image-receiving-layer-forming coating solution having the following composition on the sheet subjected to corona discharge treatment: Were coated and dried in this order, and were laminated so that their thicknesses were 10 μm, 0.2 μm, 2.5 μm, and 0.5 μm to form an image receiving layer.
(Create cushion layer)
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts A first sheet member was formed by sequentially coating and drying a cushion layer and an image receiving layer comprising the following composition on a first support 188 μm.
(Photo-curing cushion layer) Film thickness 10μm
Urethane acrylate oligomer (Shin-Nakamura Chemical Co., Ltd .: NK Orico UA512) 55 parts Polyester acrylate (Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Human cyclohexyl cyclohexyl phenyl ketone ( Chiba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts The applied actinic radiation curable compound was dried at 90 ° C./30 sec and then photocured with a mercury lamp (300 mJ / cm ² ).
<Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
4 parts of metal ion-containing compound (compound MS)

80 parts of methyl ethyl ketone 10 parts of butyl acetate <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose (manufactured by Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part water 90 parts (format printing)
The logo and OP varnish were sequentially printed by the resin letterpress printing method.
[Create second support]
(Create writing layer)
On the surface of the support subjected to corona discharge treatment, a first writing layer forming coating solution, a second writing layer forming coating solution and a third writing layer forming coating solution having the following composition were applied and dried in this order, The writing layer was formed by laminating each thickness to 5 μm, 15 μm, and 0.2 μm.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second writing layer forming coating solution>
4 parts of polyester resin [Toyobo Co., Ltd .: Bironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts [Creation of sheet member for IC card]
FIG. 10 is a diagram showing an example of an IC card manufacturing method. The IC card manufacturing apparatus 409 is provided with a feed shaft 410 that feeds the second sheet member 51, and the second sheet member 51 fed from the feed shaft 410 is stretched between a guide roller 411 and a drive roller 412. Supplied. A precator coater 413 is disposed between the delivery shaft 410 and the guide roller 411. The applicator coater 413 applies the adhesive layer 53 to the sheet with a predetermined thickness.

  Further, the IC card manufacturing apparatus 409 is provided with a feed shaft 414 for feeding the first sheet material portion 50, and the first sheet member 50 fed from the feed shaft 414 is hung on the guide roller 415 and the drive roller 416. Supplied delivered. An applicator coater 417 is disposed between the delivery shaft 414 and the guide roller 415. The applicator coater 417 applies the adhesive layer 52 to the sheet member with a predetermined thickness.

  The first sheet member coated with the adhesive and the second sheet member are brought into contact with each other from a state of being opposed to each other and conveyed along the conveying path 418. The IC module 40 is inserted into a position where the first sheet member and the second sheet member face each other at a distance.

The IC module 40 is supplied as a single unit or a plurality of sheets or rolls. In the conveyance path 418 of the IC card manufacturing apparatus 409, a heating laminate unit 419 and a cutting unit 420 are arranged along the conveyance direction of the first sheet member and the second sheet member. The heat laminate is preferably a vacuum heat laminate. Further, a protective film supply unit may be provided in front of the heating laminating unit 419, and is preferably disposed so as to be opposed to the upper and lower sides of the conveyance path 418. The heating laminate unit 419 includes a flat heating laminate upper mold 421 and a heating laminate lower mold 422 that are arranged to face the upper and lower sides of the conveyance path 418. The heating laminate upper mold 421 and the lower mold 422 are provided so as to be movable in the direction of coming into contact with and separating from each other. After passing through the heat laminating unit 419, the sheet member is cut into a predetermined size at the cutting unit.
[Creation of first sheet member 1 for IC card]
The IC card manufacturing apparatus 409 of FIG. 10 was used, and a support having an image receiving layer was used as a support for the first sheet member. An adhesive is applied to a support having an image receiving layer using a T die so that the thickness is 80 μm, and an adhesive is applied to the support of the second sheet member using a T die so that the thickness is 380 μm. So that it was coated. The IC module 40 was placed on the support with adhesive of the first sheet member so that the circuit surface was on the support side of the second sheet member, sandwiched between the upper and lower sheet members, and laminated at 70 ° C. for 1 minute. . The thickness of the IC card sheet member thus produced was 760 μm. After production, it was stored for 7 days in an environment of 25 ° C. and 50% RH.
[Punching]
The thus-prepared IC card sheet member was punched by the punching die apparatus shown in FIGS. FIG. 11 is an overall schematic perspective view of the punching die device, and FIG. 12 is a front end view of the main part of the punching die device. This punching die apparatus has a punching die having an upper blade 510 and a lower blade 520. The upper blade 510 includes a punching punch 511 provided with a relief 541 inside the outer extension, and the lower blade 520 includes a punching die 521. By dropping the punching punch 511 into the die hole 522 provided in the center of the punching die 521, an IC card having the same size as the die hole 522 is punched out. For this reason, the size of the punching punch 511 is slightly smaller than the size of the die hole 522.
[Method of describing personal information on personal authentication card and surface protection method]
A personal authentication card in which a face image, attribute information, and format printing were provided on the punched IC card was prepared as follows.
[Creation of ink sheet for sublimation thermal transfer recording]
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta, and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (Mitsui Toatsu Dye Co., Ltd. MS Yellow) 3 parts Polyvinyl acetal 5.5 parts [Electrochemical Industry Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [manufactured by Denki Kagaku Kogyo Co., Ltd .: Denka Butyral KY-24]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution>
Cyan dye (Kayaset Blue 136, manufactured by Nippon Kayaku Co., Ltd.) 3 parts Polyvinyl acetal 5.6 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts [Preparation of ink sheet for melt type thermal transfer recording]
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts [Formation of face image]
The image receiving layer and the ink side of the ink sheet for sublimation type thermal transfer recording are overlapped and the output from the ink sheet side is 0.23 W / dot, the pulse width is 0.3 to 4.5 ms, the dot density is 16 dots / A person image having gradation in the image was formed on the image receiving layer by heating under the condition of mm. In this image, the dye and the nickel of the image receiving layer form a complex.
[Formation of character information]
The OP varnish and the ink side of the melt-type thermal transfer recording ink sheet are overlapped and the thermal sheet is used from the ink sheet side to output 0.5 W / dot, pulse width 1.0 ms, and dot density 16 dots / mm. The character information was formed on the OP varnish by heating with.
"Surface protection method"
[Method for forming surface protective layer]
(Creation of actinic ray curable transfer foil 1)
The actinic ray curable transfer foil 1 was prepared by laminating the following composition on a release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a 0.1 μm fluororesin layer.
[Actinic ray curable compound]
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink surfactant F-179 0.25 part <intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [Sekisui Chemical Co., Ltd. product: ESREC BX-1]
3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After curing, the curing agent was cured at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industries, Ltd .: Hitech S6254B] 8 parts

Polyacrylic acid ester copolymer [Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol
Further, on the image receptor on which images and characters were recorded, the actinic ray curable transfer foil having the above structure was used to heat the surface temperature to 200 ° C., and a heat roller having a diameter of 5 cm and a rubber hardness of 85 was used at a pressure of 150 kg / cm 2. Transfer was performed by heating for 1.2 seconds.
<Example 2>
The procedure was the same as in Example 1 except that the module 2 was used.
<Example 3>
The procedure was the same as in Example 1 except that the module 3 was used.
<Example 4>
The same procedure as in Example 1 was performed except that a support without a cushion layer was used as the first support and the module 4 was used.
<Comparative Example 1>
The procedure was the same as in Example 1 except that the module 5 was used.
<Comparative Example 2>
The procedure was the same as in Example 1 except that the module 6 was used.

About these Examples 1-4 and Comparative Examples 1-2, evaluation as shown in Table 1 was performed.

[Evaluation methods]
<Repeated bending test>
Using a JIS K6404-6 sag test device, the chip is clamped and the amplitude is 50 mm.
Bending was repeated 100 times at a gap of 30 mm and 120 times / min. Post-test operation and deformation,
Damage was confirmed.
◎ ... No change without deformation / peeling ○ ... No problem with deformation / peeling but trace remains Δ ... No peeling damage but deformed × ... Deformation / peeling damage <Impact Test>
Using the falling impact tester of JIS K5600-5-3, firmly fix the IC card from the top and bottom so that the IC chip is centered on a cradle with a hole with an inner diameter of 27 mm, and the tip diameter is 2
A weight (S45C steel) having a weight of 0 mm and a weight of 100 g was freely dropped onto the IC chip at the center of the cradle from a height of 10 cm. Operation, deformation, and damage were confirmed after the test.
◎ ... No change without deformation / peeling ○ ... No problem with deformation / peeling but trace remains Δ ... No peeling damage but deformed × ... Deformation / peeling damage <Uneven Sex>
Sublimation images were printed on the cards created, and the degree of blur was evaluated.
◎ ・ ・ ・ Can print without problems ○ ・ ・ ・ Some levels can be discriminated, but can be discriminated △ ・ ・ ・ Partial density has fallen and cannot be discriminated ×× Color is completely missing There is a part to

The present invention can be applied to an IC card incorporating a contact type or non-contact type IC module that stores personal information or the like that requires safety (security) such as forgery or alteration prevention.

It is a top view which shows the structure of an IC card. It is sectional drawing which shows the structure of an IC card. It is sectional drawing of an IC module. It is a top view of an IC chip part. It is a top view of an IC chip part. It is sectional drawing of an IC module. It is a top view of an IC chip part. It is a top view of an IC chip part. It is sectional drawing which shows the laminated structure of an IC card. It is a block diagram which shows an IC card production apparatus. 1 is an overall schematic perspective view of a punching die device. It is a front end view of the principal part of a punching die apparatus.

Explanation of symbols

1 IC card 40 IC module 42 IC chip 43 Reinforcing plate

Claims (4)

In an IC card incorporating an IC module in which a reinforcing plate is provided on an IC chip,
The distance from the center of gravity of the reinforcing plate to the farthest point of the reinforcing plate with respect to the center of gravity of the IC chip is d1, I
When the distance from the center of gravity of the C chip to the farthest point of the IC chip is d2, the relationship of Formula A is as follows: When the maximum thickness of the reinforcing plate is d3 and the maximum thickness of the IC chip is d4, the relationship of Formula B is An IC card characterized by being.
Formula A) 6 ≧ d1 / d2 ≧ 1.3
Formula B) 5 ≧ d3 / d4 ≧ 1.5 2. The IC card according to claim 1, wherein the reinforcing plate is arranged so that a maximum length direction thereof is parallel to the short side of the card. The IC chip, the first reinforcing plate, and the second reinforcing plate have a 2% elastic modulus of 0.01 or more and 55 kg / m.
3. I according to claim 1 or 2, characterized in that it is fixed via an adhesive of m2 or less.
C card.   4. The IC card according to claim 1, further comprising an image receiving layer and a cushion layer on at least one side of the front and back sides of the IC card.