JP2007072933A - Ic card and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the durability of an IC card and improve its surface property at a high level. <P>SOLUTION: The IC card has a component including an IC module composed of an IC chip 3a, a reinforcement structure 3b adjacent to the IC chip 3a, and an antenna 3c at a predetermined position between a first member 1 and a second member 2 opposing each other arranged via an IC card adhesive. In the IC card, a foam resin 20 is provided, having a density of 0.03-0.95 g/cm<SP>3</SP>according to a JISK-7222 measurement so that one member out of the reinforcement structure 3b and the IC chip 3a is adjacent thereto. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC card suitable for application to a non-contact type electronic card or sheet for storing personal information that requires safety (security) such as forgery and tampering prevention, and an IC card manufacturing method. It is.

Conventionally, improving the strength of an IC card by providing a reinforcing structure on an IC chip is disclosed in Japanese Patent Laid-Open No. 2000-182016. However, many attempts have been made because sufficient card durability cannot be obtained. For example, in Japanese Patent Application Laid-Open No. 2004-38449, the external force is stress-dispersed by defining the curvature radius of the IC chip adjacent to the IC chip, the shape of the reinforcing structure, the physical properties of the adhesive adjacent to the reinforcing structure, and the like. It is disclosed that the IC chip is protected from destruction, is very strong against point pressure, the unevenness of the IC card is improved, and the printability is improved. However, this technique does not satisfy the card durability.
JP 2000-182016 A JP 2004-38449 A

  In this invention, the structure of the adhesive between the reinforcing structure and the IC chip is effective for the strength (point pressure strength, impact, bending) of the IC card, rather than the conventional physical properties of the reinforcing structure and adhesive. Derived. Further, the present inventors have found that the structure is the most efficient structure for smoothing an IC card.

  Since the IC card has high security, durability is important from the viewpoint of counterfeiting and alteration. In particular, since electrical components such as an antenna for exchanging information between the IC chip and the outside are built in the IC card, various attempts have been made to ensure its durability. However, higher durability has been required while being used and spread in various applications. Due to the characteristics of an IC card, strong durability is required against pressure such as repeated bending, dropping, coins, etc., always carried in a pants pocket. On the other hand, improvements such as providing a strong reinforcing structure on the IC chip have been proposed. However, although a certain improvement in durability can be seen, sufficient durability has not been obtained for various situations. For example, durability against shocks that are subjected to sudden stress, repeated bending durability that is repeatedly stressed However, there have been problems such as the IC chip being cracked against repeated local loads and the like, and the IC card is damaged and pulled, making electrical operation impossible. In addition to improving the durability, in order to describe personal information and the like, a smooth card surface property is required so that there is no blurring without density fluctuation in sublimation printing, melt printing, and the like.

  The present invention has been made in view of this point, and an object of the present invention is to provide an IC card and an IC card manufacturing method that improve durability and improve surface properties at a high level.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

According to a first aspect of the present invention, there is provided an IC card including an IC chip, a reinforcing structure adjacent to the IC chip, and an IC module including an antenna at a predetermined position between the first sheet member and the second sheet member facing each other. In an IC card arranged with an adhesive interposed therebetween, the bulk density measured by JISK-7222 is 0.03 to 0.95 g / cm so as to be adjacent to any one member of the reinforcing structure and the IC chip. ^The IC card is characterized in that a foamed resin ³ is provided.

According to a second aspect of the present invention, there is provided an IC card including an IC chip, an IC module comprising an IC chip, a reinforcing structure adjacent to the IC chip, and an antenna at a predetermined position between the opposing first sheet member and second sheet member. In an IC card arranged with an adhesive interposed therebetween, the connecting adhesive for connecting the reinforcing structure and the IC chip has a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222. An IC card characterized by being a foamed resin.

The invention according to claim 3 is characterized in that the IC card adhesive has a 2% elastic modulus of 1 kg / mm ^{2 to} 90 kg / mm ² and an elongation at break of 200% to 1300%. The IC card according to claim 1 or claim 2.

Invention of Claim 4 comprises in order of the contact | adherence layer and the said reinforcement structure on the opposite side to the circuit surface of the said IC chip,
The circuit surface side of the IC chip is
A bump for electrically connecting the antenna formed on the module support;
It is made of a material satisfying either a resin component having a 2% elastic modulus of 0.05 to 80 kg / mm ² or a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222. The IC card according to any one of claims 1 to 3, wherein the IC card is an adhesive.

  The invention according to claim 5 is the IC card according to any one of claims 1 to 4, wherein the thickness of the IC chip is not less than 5 μm and not more than 120 μm.

  The invention according to claim 6 has an image receiving layer on at least one of the surfaces of the first sheet member and the second sheet member facing each other, and personal identification information including a name and a face image is provided on the image receiving layer, 6. The IC card according to claim 1, further comprising a writable layer that can be written on.

  The invention according to claim 7 is the IC card according to any one of claims 1 to 6, wherein the IC card adhesive is a reactive adhesive.

According to an eighth aspect of the present invention, there is provided an IC card including an IC chip, an IC module including an IC chip, a reinforcing structure adjacent to the IC chip, and an antenna at a predetermined position between the first sheet member and the second sheet member facing each other. The IC card manufacturing method according to any one of claims 1 to 7, wherein the IC card is disposed with an adhesive interposed therebetween.
For foaming, after forming a foamed resin having a bulk density of 0.03 to 0.95 g / cm ³ measured by JISK-7222 so as to be adjacent to any one member of the reinforcing structure and the IC chip It is the manufacturing method of the IC card characterized by making it foam with the energy of.

According to a ninth aspect of the present invention, there is provided an IC card including an IC chip, an IC module including an IC chip, a reinforcing structure adjacent to the IC chip, and an antenna at a predetermined position between the first sheet member and the second sheet member facing each other. The IC card manufacturing method according to any one of claims 1 to 7, wherein the IC card is disposed with an adhesive interposed therebetween.
For foaming, after forming a foamed resin having a bulk density of 0.03 to 0.95 g / cm ³ measured by JISK-7222 so as to be adjacent to any one member of the reinforcing structure and the IC chip This is a method for producing an IC card, which is foamed by the energy of, and further molded using a flat plate press or roll press.

  The invention according to claim 10 has an image receiving layer on at least one of the surfaces of the first sheet member and the second sheet member facing each other, and personal identification information including a name and a face image is provided on the image receiving layer, 10. The method for producing an IC card according to claim 8, further comprising a writable layer.

  The invention according to claim 11 is the IC card manufacturing method according to any one of claims 8 to 10, wherein the IC card adhesive is a reactive adhesive.

  With the above configuration, the present invention has the following effects.

In the first aspect of the invention, a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 so as to be adjacent to any one member of the reinforcing structure and the IC chip. By using a specific foamed resin, the cushioning property between the reinforcing structure and the IC chip is improved and the stress is dispersed, and the durability, that is, the point pressure strength, the bending, and the impact are improved. In addition, when information is recorded on an IC card, the printability (information recording property) is not deteriorated in a portion where the reinforcing structure and the IC chip exist, and a foamed resin is provided between the reinforcing structure and the IC chip. The cushioning property is improved, and thereby the printing property is improved.

In the invention described in claim 2, the connecting adhesive for connecting the reinforcing structure and the IC chip is a foamed resin having a bulk density of 0.03 to 0.95 g / cm ³ measured by JISK-7222, By using a specific foamed resin for the adhesive, the cushioning property between the reinforcing structure and the IC chip is improved and the stress is dispersed, and the durability, that is, the point pressure strength, the bending, and the impact are improved. In addition, when information is recorded on an IC card, the printability (information recording property) is not deteriorated in a portion where the reinforcing structure and the IC chip exist, and a foamed resin is provided between the reinforcing structure and the IC chip. The cushioning property is improved, and thereby the printing property is improved.

  In the invention described in claim 3, the IC module adhesive can be prevented from being damaged by the 2% elastic modulus and elongation at break of the IC card adhesive, and the point pressure strength, bending and impact are further improved. .

In the invention according to claim 4, an adhesion layer and a reinforcing structure are provided in this order on the side opposite to the circuit surface of the IC chip, and the circuit surface side of the IC chip has a bump that electrically connects the antenna, and a specific structure. By using an adhesive made of a resin material or a material satisfying any one of foamed resins having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222, the reinforcing structure and the IC chip As well as improving the cushioning property, the stress is dispersed, and durability, that is, point pressure strength, bending, and impact are improved.

  In the invention according to claim 5, if the IC chip is thick, the circuit of the chip is liable to be broken with respect to bending stress, and if it is too thin, the chip circuit is liable to be broken by local stress. Can improve sex.

  In the invention according to claim 6, the image receiving layer is provided on at least one of the surfaces of the first sheet member and the second sheet member facing each other, and personal identification information including a name and a face image is provided on the image receiving layer, By having a writing layer that can be written on, a license, identification card, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student For prints and the like, the printability and the writing property are good and can be preferably used.

  In the invention according to claim 7, the IC card adhesive is a reactive adhesive, and after smoothing, the reaction is promoted and the adhesive is bonded before the adhesive is cured, so that the adhesive strength is sufficient. If you try to forcibly peel it off without peeling off, destruction will occur and it will prevent falsification.

In the invention according to claim 8, a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 so as to be adjacent to any one member of the reinforcing structure and the IC chip. After forming on the IC chip, foaming is performed with the energy for foaming, so that the foamed resin can be manufactured while being controlled, so that production stability can be ensured.

In the invention according to claim 9, a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 so as to be adjacent to any one member of the reinforcing structure and the IC chip. After forming, by foaming with energy for foaming, the foamed resin can be produced while being controlled, so that production stability can be ensured. Furthermore, it can shape | mold using a flat plate press and a roll press, and after foaming, foaming can be controlled and the bulk density can be made uniform.

  In the invention described in claim 10, the image receiving layer is provided on at least one of the surfaces of the first sheet member and the second sheet member facing each other, and personal identification information including a name and a face image is provided on the image receiving layer, By having a writing layer that can be written on, licenses with good printability and writing property, identification card, passport, alien registration card, library card, cash card, credit card, employee ID card, employee ID card, Can produce membership cards, medical cards, student ID cards, etc.

  In the invention according to claim 11, the IC card adhesive is a reactive adhesive, and after smoothing, the reaction is promoted and bonded before the IC card adhesive is cured. Therefore, an IC card can be manufactured that prevents destruction and forgery and tampering if it is forcibly peeled off without peeling off.

  Hereinafter, embodiments of the IC card and the IC card manufacturing method of the present invention will be described. However, the embodiment of the present invention shows the most preferable embodiment of the present invention, and the present invention is not limited to this.

  First, the IC card of the present invention will be described. FIG. 1 shows an IC card, FIG. 1 (a) is a diagram showing a layer structure of the IC card, and FIG. 2 (b) is a plan view of an IC chip part. The IC card of this embodiment can be widely applied to an identification card, a credit card, etc., and an IC chip 3a, an IC is provided at a predetermined position between the first sheet member 1 and the second sheet member 2 facing each other. Parts including the reinforcing structure 3b adjacent to the chip 3a and the IC module 3 including the antenna 3c are arranged with adhesives 4a and 4b interposed therebetween. The first sheet member 1 is composed of a front support 1a and an image receiving layer 1b, and the second sheet member 2 is composed of a back support 2a and a writing layer 2b, and two front support 1a and back support 2a facing each other. In between, components including the IC module 3 are arranged with the IC card adhesives 4a and 4b interposed therebetween.

The IC card adhesives 4a and 4b have the same composition, and the adhesive has a 2% elastic modulus of 1 kg / mm ^{2 to} 90 kg / mm ² and an elongation at break of 200% to 1300%. When the 2% elastic modulus is 90 kg / mm ² or more, the stress cannot be absorbed, and the IC module 3 is damaged. When the 2% elastic modulus is 1 kg / mm ² or less, the self-supporting property is lowered and the integration with the IC module 3 is lowered. Although the IC module 3 is damaged, the IC module 3 can be prevented from being damaged by fixing it with an adhesive having a prescribed 2% elastic modulus. On the other hand, when the elongation at break is less than 200%, the impact property, the point pressure strength, and the bendability are deteriorated, which causes a problem. If it is larger than 1300%, it becomes a problem when it is molded into a card shape, and a 2% elastic modulus is preferably 1 kg / mm ² or more and 90 kg / mm ² or less, and an elongation at break of 200% or more and 1300% or less is preferable. However, more preferably, a reactive adhesive is preferable from the viewpoint of chemical resistance of the IC card after issuance.

  In the image receiving layer 1b, an authentication image 8a, which is personal identification information including a name and a face image, and attribute information 8b are recorded. The personal identification information consisting of the name and face image is provided by fusion thermal transfer or sublimation thermal transfer, and can record information without fluctuations in density and without blur.

  The image receiving layer 1b is provided with a protective layer 9 that protects the authentication image 8a and the attribute information 8b that are personal identification information. By providing this protective layer 9, it is possible to prevent wear, chemicals, etc. Durability is improved against pressure.

  The IC chip 3a and the antenna 3c are provided on the module support 3d, and the module support 3d is made of, for example, a film. If the thickness of the IC chip 3a is not less than 5 μm and not more than 120 μm, and the IC chip 3a is thick, the circuit of the chip is liable to be broken with respect to bending stress, and if it is too thin, it is liable to crack due to local stress.

An antenna 3c is formed on the module support 3d made of a film. The antenna 3c and the circuit surface side 3a1 of the IC chip 3a are electrically connected by a bump 3e, and a reinforcing structure 3b is provided adjacent to the circuit surface side 3a1 and the opposite side 3a2 of the IC chip 3a. Yes. A foamed resin 20 having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 is provided so as to surround the IC chip 3a, and adjacent to any member of the reinforcing structure 3b and the IC chip 3a. It is supposed to be. In the manufacture of this IC card, after the foamed resin 20 is formed, the foamed resin 20 is foamed by energy for foaming, and heat, light, pressure, etc. can be used as the energy for foaming. The IC card can be molded by foaming the foamed resin 20 and further using a flat plate press or a roll press. The connecting adhesive for connecting the reinforcing structure 3b and the IC chip 3a is a foamed resin 20 having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222.

  Thus, by using the specific foamed resin 20, the cushioning property between the reinforcing structure 3b and the IC chip 3a is improved and the stress is dispersed, and the durability, that is, the point pressure strength, the bending, and the impact are improved. Further, when information is recorded on the IC card, the foamed resin 20 is provided between the reinforcing structure 3b and the IC chip 3a without deteriorating printability (information recording property) in the portion where the reinforcing structure 3b and the IC chip 3a exist. By providing, the cushioning property is further improved, and thereby the printing property is improved.

In this embodiment, the reinforcing structure 3b is formed larger than the IC chip 3a, and the reinforcing structure 3b and the foamed resin 20 are formed in substantially the same size as viewed from above, but FIG. ), A resin component 21 having a 2% elastic modulus of 0.05 to 80 kg / mm ² or a foamed resin 22 having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222. By forming the resin component 21 or the foamed resin 22 larger than the IC chip 3a or the reinforcing structure 3b, the cushioning property between the reinforcing structure 3b and the IC chip 3a is improved and the stress is dispersed and the durability is improved. Properties, that is, point pressure strength, bending and impact are improved.

FIG. 2 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured similarly to the embodiment of FIG. 1, but the circuit surface side 3a1 of the IC chip 3a is electrically connected to the antenna 3c formed on the module support 3d. The bump 3e to be formed and the resin component 21 having a 2% elastic modulus of 0.05 to 80 kg / mm ² or the foamed resin 22 having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 It is an adhesive made of a material that satisfies either of them. The resin component 21 or the foamed resin 22 is provided so as to surround the bump 3e from around the side portion of the IC chip 3a, surrounds the resin component 21 or the foamed resin 22, and further surrounds the circuit surface side 3a1 and the opposite side 3a2. A foamed resin 20 is provided, and the foamed resin 20 and the reinforcing structure 3b are provided in this order on the side 3a2 opposite to the circuit surface 3a1 of the IC chip 3a. The foamed resin 20 constitutes an adhesion layer, and the foamed resin 20 adheres the IC chip 3a and the reinforcing structure 3b, thereby improving the cushioning property between the reinforcing structure 3b and the IC chip 3a and dispersing the stress for durability. Will improve.

FIG. 3 shows an IC card, FIG. 3 (a) is a diagram showing a layer structure of the IC card, and FIG. 3 (b) is a plan view of the IC chip portion. The IC card of this embodiment is configured similarly to the embodiment of FIG. 1, but the circuit surface side 3a1 of the IC chip 3a is electrically connected to the antenna 3c formed on the module support 3d. The bump 3e to be formed and the resin component 21 having a 2% elastic modulus of 0.05 to 80 kg / mm ² or the foamed resin 20 having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 It is an adhesive made of a material that satisfies either of them. The resin component 21 or the foamed resin 22 is provided so as to surround the circuit surface side 3a1 and the opposite side 3a2 of the IC chip 3a and further surround the bump 3e, and the resin component 21 or the foamed resin 22 is provided on the side 3a2 opposite to the circuit surface 3a1 of the IC chip 3a. The foamed resin 22 and the first reinforcing structure 3b1 are provided in this order. The resin component 21 or the foamed resin 22 constitutes an adhesive layer, and the resin component 21 or the foamed resin 22 bonds the IC chip 3a and the first reinforcing structure 3b1. A foamed resin 20 is provided so as to surround the resin component 21 or the foamed resin 22 and the first reinforcing structure 3b1, and a second reinforcing structure 3b2 is provided on the foamed resin 20. In this embodiment, the foamed resin 20 between the first reinforcing structure 3b1 and the second reinforcing structure 3b2 improves cushioning properties and disperses stress, thereby improving durability. As shown in FIG. 3A, the first reinforcing structure 3b1 and the second reinforcing structure 3b2 may be formed so that the second reinforcing structure 3b2 is larger than the first reinforcing structure 3b1. As shown in b), the first reinforcing structure 3b1 and the second reinforcing structure 3b2 may be formed in a circular shape with the same size.

FIG. 4 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 2, except that the foamed resin 20 and the reinforcing structure 3b are provided in this order on the side 3a2 opposite to the circuit surface 3a1 of the IC chip 3a. The foamed resin 23 having a bulk density measured by −7222 of 0.03 to 0.95 g / cm ³ is arranged so as to be in contact with the reinforcing structure 3b more greatly. In this embodiment, by disposing the foamed resin 23 so as to be in contact with the reinforcing structure 3b more greatly, the foamed resin 23 improves the cushioning property of the reinforcing structure 3b and also disperses the stress, thereby improving the durability. .

  FIG. 5 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured similarly to the embodiment of FIG. 1, but the resin component 21 or the foamed resin 20 is provided so as to surround the bump 3e from the IC chip 3a, and the circuit of the IC chip 3a. The resin component 21 or the foamed resin 20 and the reinforcing structure 3b are provided in this order on the side 3a2 opposite to the surface 3a1. The resin component 21 or the foamed resin 20 constitutes an adhesion layer, and the resin component 21 or the foamed resin 20 bonds the IC chip 3a and the reinforcing structure 3b, thereby improving the cushioning property between the reinforcing structure 3b and the IC chip 3a. In addition, the stress is dispersed and durability, that is, point pressure strength, bending and impact are improved. In this embodiment, the foamed resin 20 is made larger than the reinforcing structure 3b and arranged so as not to come into contact with the foamed resin 20, so that the cushioning property of the reinforcing structure 3b is improved by the foamed resin 20, and the stress is dispersed and the durability is improved. improves.

  FIG. 6 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured similarly to the embodiment of FIG. 5, but in this embodiment, the foamed resin 20 surrounds the resin component 21 or the foamed resin 22 and the reinforcing structure 3b, and further the IC card. It is formed to a thickness corresponding to the thickness of the card adhesive 4b, and the cushioning property is further improved by the foamed resin 20, and stress is dispersed to improve durability.

  FIG. 7 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 5, but in this embodiment, the foamed resin 20 is formed so as to contact the reinforcing structure 3b. A similar foamed resin 24 is provided on the module support 3d opposite to the IC chip 3a, and the foamed resin 20 and the foamed resin 24 improve cushioning and stress dispersion, thereby improving durability.

  FIG. 8 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 1, but in this embodiment, the resin component 21 or the foamed resin 22 surrounds the bump 3e from around the side of the IC chip 3a. The foamed resin 20 is used as the IC card adhesive 4b, and the foamed resin 20 improves the cushioning property and disperses the stress, thereby improving the durability.

  FIG. 9 is a diagram showing a layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 1, but in this embodiment, the module support 3d is formed of a non-woven fabric, and the reinforcing structure 3b on the module support 3d, The foamed resin 20 and the IC chip 3a are provided in this order, and the circuit surface 3a1 and the opposite side 3a2 of the IC chip 3a are adhered to the foamed resin 20. The foamed resin 20 improves the cushioning property and disperses the stress, thereby improving the durability. .

  FIG. 10 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 9, but in this embodiment, the resin component 21 or the foamed resin 22 surrounds the bump 3e from around the side of the IC chip 3a. The cushioning property is improved by the resin component 21 or the foamed resin 21 and the foamed resin 20, and the stress is dispersed and the durability is improved.

  FIG. 11 shows an IC card, FIG. 11 (a) is a diagram showing a layer structure of the IC card, and FIG. 11 (b) is a plan view of the IC chip portion. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 10, but has a first reinforcing structure 3b1 and a second reinforcing structure 3b2, and is second from the first reinforcing structure 3b1. The reinforcing structure 3b2 is formed large. A foamed resin 20 is provided so as to surround the first reinforcing structure 3b1 and the second reinforcing structure 3b2, and the foamed resin 20 improves cushioning properties, disperses stress, and improves durability. In this embodiment, the second reinforcement structure 3b2 is formed larger than the first reinforcement structure 3b1, but as shown in FIG. 11B, the first reinforcement structure 3b1 and the second reinforcement structure 3b2 are formed. And may be formed in the same size in a circle.

  FIG. 12 is a diagram showing a layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 9, but in this embodiment, the foamed resin 20 is provided so as to surround the bump 3e from around the side of the IC chip 3a. The foamed resin 20 improves the cushioning properties and disperses the stress, thereby improving the durability.

  FIG. 13 is a diagram showing a layer structure of the IC card. The IC card of this embodiment is configured in the same manner as in the embodiment of FIG. 12, but in this embodiment, foaming having the same configuration as the foamed resin 20 is provided between the module support 3d and the front support 1a. The resin 24 is provided, and the foamed resin 20 and the foamed resin 24 improve the cushioning property and disperse the stress, thereby improving the durability.

  FIG. 14 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 13, but in this embodiment, the foamed resin 20 surrounds the side from the circuit surface 3a1 of the IC chip 3a, and the IC chip. The side 3a2 opposite to the circuit surface 3a1 of 3a and the bump 3e are provided so as not to be surrounded. A foamed resin 24 having the same configuration as the foamed resin 20 is formed between the module support 3d and the front support 1a in substantially the same thickness as the IC card adhesive 4a. Further, a foamed resin 25 having the same configuration as the foamed resin 20 is provided on the side 3a2 opposite to the circuit surface 3a1 of the IC chip 3a so as not to contact the opposite side 3a2. In this embodiment, the foamed resin 20, the foamed resin 24, and the foamed resin 25 improve cushioning properties and disperse stress, thereby improving durability.

  FIG. 15 is a diagram showing a layer structure of the IC card. The IC card of this embodiment is configured similarly to the embodiment of FIG. 9, but in this embodiment, the foamed resin 20 is used as the IC card adhesive 4b, and the cushioning property is further improved by the foamed resin 20. In addition, stress is dispersed and durability is improved.

  FIG. 16 is a diagram showing a layer structure of the IC card. The IC card of this embodiment is configured in the same manner as the embodiment of FIG. 1, but in this embodiment, the module support 3d is configured by a PET-G sheet 3d1, and the PET-G sheet 3d1 The IC chip 3a is embedded, and the IC chip 3a and the antenna 3c are connected by wire bonding 3f. A foamed resin 20 is provided so as to surround the IC chip 3a. The foamed resin 20 is covered with a reinforcing structure 3b, and a lead frame 3b3 is used as the reinforcing structure 3b.

  FIG. 17 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured similarly to the embodiment of FIG. 16, but in this embodiment, the resin component 21 or the foamed resin 22 is provided so as to surround the IC chip 3a, and the IC chip 3a. The lead frame 3b3 is connected by the foamed resin 20.

  FIG. 18 is a diagram showing the layer structure of the IC card. The IC card of this embodiment is configured similarly to the embodiment of FIG. 16, but in this embodiment, a foamed resin 26 having the same configuration as the foamed resin 20 is provided on the second sheet member side of the lead frame 3b3. Is provided.

The IC card and the IC card manufacturing method of the present invention will be described in detail below.
[Definition of first sheet member and second sheet member]
The first sheet member (front sheet base material) and the second sheet member (back sheet member) of the present invention are defined as follows. Represents. In the present invention, the second sheet member represents a sheet member on the back side of the card to which a writing layer or the like is applied.
[First sheet member]
The 1st sheet member in this invention expresses the member located in the card ticket surface side, However, The image receiving layer, cushion layer, etc. which are located in a card ticket surface can be provided as needed. The image receiving layer refers to a layer in which bibliographic information and identification information can be formed by a thermal transfer method, an ink jet method, an electrophotographic method, or the like.

  Examples of methods for recording information by thermal transfer include generally known sublimation type thermal transfer methods and melt type thermal transfer methods. As a method for recording by the ink jet method, a generally known method can be used, and specifically, information recording as described in JP-A-2000-44857 and JP-A-9-71743 can be performed. . In the present invention, the image forming material is not particularly limited and can be used.

[IC card materials]
<Base material>
The first sheet member for the invention IC card, the support for the second sheet member, or the substrate is, for example, a polyester resin such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyethylene, polypropylene, Polyolefin resins such as polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, and other polyfluorinated ethylene resins, nylon 6, nylon 6.6, and other polyamides , Polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, vinyl polymers such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable Polycarbonate Biodegradable resins such as biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, polymethyl methacrylate, polymeta Acrylic resins such as ethyl acrylate, polyethyl acrylate, and polybutyl acrylate, synthetic resin sheets such as polystyrene, polycarbonate, polyarylate, and polyimide, or paper such as fine paper, thin paper, glassine paper, and sulfuric acid paper, metal A single layer body such as a foil or a laminate of two or more layers may be mentioned. The thickness of the support of the present invention is 30 to 300 μm, desirably 50 to 200 μm.

  When creating an IC card, the same or orientation angles may be matched, and in some cases, a plurality of substrates having different base materials or different thicknesses may be laminated and a card constituted by bonding or the like may be created.

  Further, the support may be subjected to an easy-to-contact treatment, and is formed from a resin layer such as a coupling agent, latex, hydrophilic resin, or antistatic resin. In some cases, the support may be subjected to easy contact treatment such as corona treatment or plasma treatment. In addition, annealing treatment or the like may be performed in order to reduce thermal shrinkage.

If necessary, the support may be embossed, signed, IC memory, optical memory, magnetic recording layer, falsification preventing printing layer (pearl pigment layer, watermark printing layer, micro characters, etc.), embossed printing layer, IC chip concealing layer Etc. can be provided.
[Materials that can be added to IC card materials]
The base material for an IC card described above may be provided with an image receiving layer, a cushion layer, a writing layer, a format printing layer, etc., as necessary, in accordance with the material configuration of the IC card. In addition, when providing a writing layer, it is preferable to provide in the card | curd surface on the opposite side to an image receiving layer.

<Image receiving layer>
An image-receiving layer described below can be provided on the substrate described above to provide a first sheet member or the like. Hereinafter, the components forming the image receiving layer that can be used in the present invention will be described in detail.

  As the binder for the image receiving layer in the present invention, a conventionally known binder can be appropriately used. For example, polyvinyl chloride resin, copolymer resin of vinyl chloride and other monomers (for example, isobutyl ether, vinyl propionate, etc.), polyester resin, poly (meth) acrylate ester, polyvinyl pyrrolidone, polyvinyl acetal resin, polyvinyl butyral Resin, polyvinyl alcohol, polycarbonate, cellulose triacetate, polystyrene, copolymer of styrene and other monomers (for example, acrylic ester, acrylonitrile, ethylene chloride, etc.), vinyl toluene acrylate resin, polyurethane resin, polyamide resin, urea resin , Epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, and modified products thereof, but preferably polyvinyl chloride resin, vinyl chloride Copolymers with other monomers, polyester resins, polyvinyl acetal resins, polyvinyl butyral resins, copolymers of styrene and other monomers, epoxy resins, photo-curing resins, thermosetting resins, etc. A binder can be used. As a specific example, there is a method in which the image receiving layer is formed by using multiple layers such as metal ion compounds, chelate compounds and releasing materials as described in JP-A-6-286350 and JP-A-5-64989. It is done. If necessary, dyes and pigments as base color toning agents, hardeners, cationic mordants, anti-fading agents, various anionic, cationic or nonionic surfactants, lubricants, preservatives to improve film strength Further, various known additives such as a thickener, an antistatic agent, and a matting agent can be contained.

  An image-receiving layer coating solution prepared by dispersing or dissolving a material formed as an image-receiving layer in this invention in a solvent or water is prepared, and the image-receiving layer coating solution is applied onto the substrate and dried. It can be manufactured by a coating method.

The thickness of the image receiving layer formed on the support is generally about 0.01 to 30 μm, preferably about 0.01 to 20 μm, more preferably about 0.03 to 20 μm.
<Cushion layer>
In the present invention, a cushion layer can be provided as necessary to improve the printability. Examples of the material constituting the cushion layer include urethane resin, acrylic resin, ethylene resin, polypropylene resin, butadiene rubber, epoxy resin, polyolefin, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene- Butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-hydrogenated isoprene-styrene block copolymer, polybutadiene, JP-A-2002-222403 A photo-curable resin or the like can be used. The thickness of the cushion layer is usually 1 to 50 μm, preferably 3 to 30 μm. The cushion layer referred to in the present invention is not particularly limited as long as it is in any form between the image-receiving layer prepared for the ID card and the base material, and between the writing layer and the support, and a plurality of layers may be combined. .
[Second sheet member]
Although the 2nd sheet member in this invention expresses the member located in the card back side, since it is located in the card back side, a writing layer, a cushion layer, etc. can be provided if needed.
<Writing layer>
An image receiving layer described below can be provided on the substrate described above to provide a second sheet member or the like. If necessary, the present invention may be provided with a writing layer for recording additional information on the card.

  The writing layer can be formed of a binder and various additives. The writing layer is a layer that allows writing on the back side of the IC card, and since this layer has writing properties, it is preferably composed of at least one layer, preferably 1 to 5 layers. Is preferred. As such a writing layer, an inorganic fine powder, a porous substance, etc. can be used, for example. As the porous material, for example, silica (sedimentable or gel type), talc, kaolin, clay, alumina white, diatomaceous earth, titanium oxide, calcium carbonate, barium sulfate and the like can be used. In addition, as said porous substance, you may make it use 1 type from the said compound etc., or 2 or more types in mixture. A porous material can be included and is not particularly limited.

  Other binders can be used, such as shellac, rosin and derivatives thereof, nitrified cotton and cellulose derivatives, polyamide resin, polyacrylate resin, polyvinyl chloride resin, polyvinyl acetate resin, polystyrene resin, petroleum resin, ring Rubberized rubber, chlorinated rubber, chlorinated polypropylene, urethane resin, epoxy resin, polyester resin, acrylic resin, vinyl chloride, vinyl chloride-vinyl acetate copolymer, butyral resin, vinylidene chloride resin, water-soluble resin, etc. can be used. . Further, a UV curable resin containing a prepolymer which is copolymerized and cured by ultraviolet rays may be used. Examples of the copolymerizable compound used therefor include polyol acrylate, polyester acrylate, epoxy acrylate, urethane acrylate, and alkyd acrylate. Among these, polyester resins, polyacrylate resins, polyvinyl chloride resins, polyvinyl acetate resins, polyamide resins, and polystyrene resins are preferably used. In addition, as said resin, you may make it use 1 type from the said compound etc., or 2 or more types in mixture. As the particle diameter of the porous material, those having a particle diameter of 1 to 10 μm can be used, and preferably the average particle diameter is 1 to 8 μm. The weight ratio of the porous material to the resin is preferably 20 to 100 parts by weight with respect to 100 parts by weight of the resin in terms of solid content. Other additives may include wax, surfactant, solvent and water, and are not particularly limited.

The thickness of the writing layer is preferably 5 to 40 μm, more preferably 5 to 30 μm. When the writing layer is formed, an adhesive layer may be provided in order to improve the adhesion to the support, or a cushion layer may be provided in order to improve the writing property. In the case of the present invention, the surface Ra of the finished writing layer is preferably 2.0 μm or less, more preferably 0.2 to 2.0 μm, still more preferably 0.3 to 1.8 μm. When the surface roughness is 0.2 μm or less, the writing property is deteriorated, which causes a problem. When the thickness is 2.0 μm or more, adhesion to the surface-protective material on the writable layer of the present invention is deteriorated, and the surface is rough, so that the writable layer is manually operated or sublimation heat transfer method, melt heat transfer method, inkjet When the personal identification information is described by sublimation heat transfer, melt heat transfer, ink jet, oil-based pen, water-based pen, seal stamp, or the like in the system, it becomes a problem that it is difficult to distinguish.
[Print layer]
In this invention, a printing layer can be provided on the first sheet member and the second sheet member. Specifically, an information carrier comprising format printing can be provided on the image receiving layer or the writing layer. The information carrier may be subjected to format printing or information recording either before or after the first sheet member and the second sheet member are bonded, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress It can be formed by any method such as printing, ink jet method, sublimation transfer method, electrophotographic method, heat melting method and the like. Although not particularly limited, in the present invention, it is preferably provided by offset printing or the like.

  Further, the IC card is provided with an information carrier made of format printing, and consists of an information carrier layer provided with a plurality of at least one selected from which identification information and book information are recorded. Specifically, ruled lines, company names, card names, notes, issuer telephone numbers, and the like are written.

  The format printing layer of the present invention may employ watermark printing, thin prints, etc. to prevent visual forgery, and the printed material, hologram, barcode, matte pattern, fine print, ground pattern, Appropriately selected for uneven pattern, visible light absorbing colorant, ultraviolet absorber, infrared absorber, fluorescent brightener, glass deposition layer, bead layer, optical change element layer, pearl ink layer, flake pigment layer, IC concealment It is also possible to provide a front sheet by printing or the like from a layer, a watermark printing layer, or the like.

  For the formation of an information carrier consisting of format printing, use the “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, “plate making / printing slightly understandable picture book” published by Japan Printing Technology Association, etc. It can be formed using the general inks described, and is formed of ink such as carbon in photocurable ink, oil-soluble ink, solvent-type ink, and the like.

In this invention, the print layer that can be used for the format print layer is, for example, an actinic ray curable resin, a polymethyl methacrylate acrylic resin, a styrene resin such as polystyrene, as a representative example of a binder resin, Vinyl chloride resin such as polyvinyl chloride, vinylidene chloride resin such as polyvinylidene chloride, polyester resin such as polyethylene terephthalate, cellulose resin such as cellulose acetate, polyvinyl acetal resin such as polyvinyl butyral, epoxy resin, amide Resin, urethane resin, melamine resin, alkyd resin, phenol resin, fluorine resin, silicone resin, polycarbonate, polyvinyl alcohol, casein, gelatin and the like. In the present invention, it is preferably a photocurable resin layer, more preferably (a) 25 to 95 parts by weight of a binder component composed of one or more monomers or oligomers having one or more unsaturated bonds, (b) initiation It is particularly preferable from the viewpoint of card surface strength to use a printing ink layer comprising a photocurable resin composition comprising a composition containing 1 to 20 parts by weight of an agent. When an actinic ray curable resin is used, it can be used after being cured with an exposure of 100 mj to 500 mj by a light source such as a mercury lamp, a UV lamp, or xenon.
[IC module materials]
<Electronic parts>
The IC card can be provided with electronic components of an IC module. The electronic component refers to an information recording member, and specifically, an IC chip that electrically stores information of a user of the electronic card and a coiled antenna connected to the IC chip. The IC chip is only a memory or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.
<IC chip>
Although there is no restriction | limiting in the magnitude | size of the IC chip which can be used by this invention, It is preferable that the thickness of an IC chip is 5 micrometers or more and 120 micrometers or less from the point of mechanical strength. Preferably, they are 10 micrometers-120 micrometers, More preferably, they are 20 micrometers-120 micrometers. When it is 120 μm or more, the strength of the IC chip itself is lowered, and the point pressure strength, impact property, and bendability are deteriorated. If the thickness is 5 μm or less, the current processing technology cannot uniformly reduce the film thickness and surface properties deteriorate, so that the point pressure strength, impact property, and bendability deteriorate.
<Reinforced structure>
In the present invention, the reinforcing structure is fixed to the IC chip in order to improve the durability of the IC chip. The reinforcing structure of the present invention is preferably excellent in mechanical strength. If the reinforcing structure is made thicker to ensure strength, the card thickness becomes thicker and the surface printability and the like are lowered, so that the reinforcing structure is preferably a high-strength material. Metals, ceramics, carbon fibers, glass fibers, aramid fibers, high elastic resins, etc. are raised. It is selected from these. It may be a composite material composed of one or more kinds. In particular, a material having a Young's modulus of 100 GPa or more is preferably used for the main structure. The thickness is 10 to 300 μm, preferably 20 to 200 μm, and more preferably 30 to 150 μm. The shape of the reinforcing structure can be used as appropriate as long as it does not contradict the gist of the present invention. In the present invention, there is no particular limitation as long as the shape of the reinforcing structure is one or more.
<Foamed resin with a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222>
An adhesive made of a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 is disclosed in JP 2004-189799 A,
Foamed resins as described in JP-A-2-16180, JP-A-2003-231875, JP-A-5-279508, JP-A-2001-239606, JP-A-2001-336104, and the like can be used.

  Polymer materials that can be used for the foamed resin include olefin resins such as polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-propylene-diene copolymer, ethylene-vinyl acetate copolymer, polymethyl acrylate, Acrylic resins such as polymethyl methacrylate, ethylene-ethyl acrylate copolymer, styrene resins such as butadiene-styrene, acrylonitrile-styrene, styrene, styrene-butadiene-styrene, styrene-isoprene-styrene, styrene-acrylic acid, Vinyl chloride resins such as acrylonitrile-polyvinyl chloride and polyvinyl chloride-ethylene, vinyl fluoride resins such as polyvinyl fluoride and polyvinylidene fluoride, amino acids such as 6-nylon, 6-6-nylon and 12-nylon Resin, saturated ester resins such as polyethylene terephthalate, polybutylene terephthalate, polycarbonate, polyphenylene oxide, polyacetal, polyphenylene sulfide, silicone resin, thermoplastic urethane resin, polyether ether ketone, polyether imide, various elastomers and cross-linked products thereof, Examples thereof include foams such as natural rubber or synthetic rubber, polyvinyl alcohol, cellulose, polyamide resin, phenol resin, urea resin, epoxy resin, acrylic resin, silicon resin, polyimide resin, and the like.

  In the case of the present invention, a material that is cross-linked by a trigger such as heat or light is preferable because of easy handling. Specifically, it is preferably a foamed resin made of a resin material such as a thermosetting type, a moisture curable type, or a photocurable type.

  The thermosetting resin material is not particularly limited as long as it is a resin that exhibits fluidity at room temperature and exhibits curability when heated. Examples thereof include polyurethane, unsaturated polyester, phenol resin, urea resin, epoxy resin, acrylic resin, polybutadiene, and silicone resin. In particular, polyurethane and epoxy resin which are easy to foam and have high impact resistance are preferable.

  As the photocurable resin material, a composition comprising a radical polymerizable component and a photo radical polymerization initiator, a cationic polymerizable component and a photo cationic polymerization initiator can be used. In the present invention, although there is no particular limitation, it is preferable to use a composition comprising a cationically polymerizable component and a photocationic polymerization initiator because the film after curing is flexible.

  As the cationic polymerizable component, for example, epoxy compounds such as bisphenol-epoxy resin, phenolic epoxy resin, halogenated phenol epoxy resin, polyalkylene glycol epoxy resin, butyl glycidyl ether, and phenyl glycidyl ether are preferably used. Furthermore, vinyl ether compounds such as isopropyl vinyl ether and cetyl vinyl ether, oxetane and the like can also be used. Specifically, Shinzo Yamashita, “Cross-linking agent handbook” (1981 Taiseisha); Kato Kiyomi, “UV / EB curing handbook (raw material)” (1985, Polymer publication society); Commercial editions described in the association edition, “Application and Market of UV / EB Curing Technology”, p. 79, (1989, CMC); Eiichiro Takiyama, “Polyester Resin Handbook”, (1988, Nikkan Kogyo Shimbun) Radically polymerizable, cationic polysynthetic or crosslinkable monomers, oligomers and polymers known in the art or in the industry can be used.

  The photocationic polymerization initiator is a polymerization initiator that generates cationic species by light, and onium salts are generally well known. As the onium salt, a diazonium salt of Lewis acid, an iodonium salt of Lewis acid, a sulfonium salt of Lewis acid, or the like is used. Specific examples of these compounds include, for example, boron tetrafluoride phenyldiazonium salt, phosphorus hexafluoride diphenyliodonium salt, antimony hexafluoride diphenyliodonium salt, arsenic hexafluoride tri-4-methylphenylsulfonium Salt, tri-4-methylphenylsulfonium salt of antimony tetrafluoride, and the like. The compound is not limited to these, and any compound that generates a cationic species by light irradiation can be used.

  Moisture curable resin materials are disclosed in JP-A-2-16180, JP-A-2000-036026, JP-A-2000-211985, JP-A-2000-211978, JP-A-2000-21985, and Japanese Patent Application No. 2000-369855. Specific examples include urethane resins and alkoxide group-containing silicone resins. As one example of the moisture-curing adhesive, there is one in which an isocyanate group-containing urethane polymer is a main component at a molecular end, and this isocyanate group reacts with moisture to form a crosslinked structure. Examples of the moisture curable adhesive include 9613N manufactured by Sekisui Chemical Co., Ltd., TE030 and TE100 manufactured by Sumitomo 3M Co., Ltd., Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bond Master 170 series manufactured by Kanebo UESC, Inc. It is done.

In order to achieve a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222, a foaming agent is required in the present invention. When the above-mentioned thermosetting, moisture curable, or photocurable resin is used, the foaming agent is crosslinked before the gas is generated from the foaming agent or is crosslinked after the gas is generated from the foaming agent. The gas generation from the foaming agent and the crosslinking of the resin may be performed at the same time, and there is no particular limitation.

  The foaming agent can be appropriately selected depending on the resin used. For example, physical foaming agents such as chlorofluorocarbon, carbon dioxide, pentane, etc., and gas generating agents described in JP-A-2003-231875 such as azo compounds, azide compounds, sodium bicarbonate (sodium bicarbonate), talc, calcium carbonate, citric acid, etc. Reaction-type foaming agents such as decomposition-type foaming agents, reactive foaming agents such as carbon dioxide generated by the reaction of isocyanate and water, photothermal conversion materials as disclosed in JP-A-11-38610, and crosslinking accelerators Can be mentioned. As the foaming agent used in the present invention, a gas generating agent, a decomposable foaming agent, and a reaction promoting foaming agent are preferable in terms of ease of production. The foamed resin material of the present invention can be prepared by adding various known additives as required. Examples thereof include bubble regulators, tackifiers, fillers, viscosity modifiers, dyes, pigments, antistatic agents, metal fine particles, flame retardants and the like.

  Moreover, the mixing method of a foaming agent etc. can employ | adopt a well-known mixing method timely, Specifically, well-known techniques, such as a ball mill, a mechanical stirrer, a homogenizer, an ultrasonic disperser, can be used.

When the above-described foamed resin composition is used, in this invention, the bulk density is preferably 0.03 to 0.95 g / cm ³ . More preferably, it is 0.03-0.90 g / cm < ³ >, More preferably, it is 0.03-0.80 g / cm < ³ >. When it is 0.03 g / cm ³ or less, cushioning properties are deteriorated, and impact properties, point pressure strength, bending strength, and printability are deteriorated. If it is 0.95 g / cm ³ or more, the number of voids increases, so that the degree of adhesion decreases, the degree of freedom of electronic parts and the like increases, and the bending strength and point pressure strength deteriorate. The bulk density was measured by the following procedure.
<Method for measuring bulk density>
It measured by the method of JISK7222 (foamed plastic and rubber-measurement of apparent density). That is, a physical property measurement specimen having a size of 10 cm × 10 cm × 5 cm was separately prepared, the test piece was cut so as not to change the cell structure of the sample, its mass was measured, and the following equation was calculated.

Bulk density (g / cm ³ ) = Test piece mass (g) / Test piece volume (cm ³ )
<Definition adjacent to any one member of IC chip and reinforcing structure>
In this invention, the adhesive made of a foamed resin having a bulk density of 0.03 to 0.95 g / cm ³ is used so as to be adjacent to any one member of the IC chip and the reinforcing structure. Is preferred. This adhesive is a material different from that used for the IC card adhesive in the card structure represented by the present invention. Use of an adhesive made of a foamed resin of 0.03 to 0.95 g / cm ³ on the end face of the card is likely to cause water and chemicals to penetrate from the foamed void layer, which is likely to cause card destruction, etc. Can not. Details of the adhesive used for the IC card will be described later.

  Providing in the adjacent part is preferably provided around the chip part and around the reinforcing plate. As described above, it is arranged so as to be located on the card end face. More preferably, between the reinforcing structure and the first sheet member, between the reinforcing structure and the second sheet member, between the IC chip and the antenna, between the chip antenna joint and the first sheet member, and between the chip antenna joint and the second sheet member. In the meantime, it is preferably provided at a portion connecting the reinforcing structure and the IC chip, more preferably provided at a portion connecting the reinforcing structure and the IC chip.

An adhesive made of a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 may be provided in contact or non-contact with the IC chip and the reinforcing structure. Although it is not, it is more preferable that it is contacting.
<Method for producing foamed resin having bulk density of 0.03 to 0.95 g / cm ³ >
After the mixture of the resin, foaming agent and the like described above, it can be applied either when the IC module is created or when the IC card is created. When forming at the time of IC module creation, the foamed resin of the present invention can be formed in an arbitrary size by potting, coating, spraying, printing, IJ formation, etc. on the IC chip or the reinforcing structure and in the vicinity of the bump.

  After the formation, the foamed resin can be foamed by a trigger such as heat, light, or pressure for foaming.

  As long as the heat can provide a temperature in the range of 20 to 500 ° C., specific means may be a known technique such as a laser, a halogen lamp, or an electric heating element.

  The light may be a light source of 300 to 1000 nm, and specific elements include, for example, lasers, light emitting diodes, xenon flash lamps, halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, mercury lamps, electrodeless light sources, and the like. I can give you. Preferably, a light source such as a xenon lamp, a halogen lamp, a carbon arc lamp, a metal halide lamp, a tungsten lamp, or a mercury lamp is used, but there is no particular limitation in the present invention.

  In order to control foaming and make the bulk density uniform after foaming, it is preferable to use a flat plate press, a roll press or the like after foaming in the present invention. A flat plate press and a roll press are used to apply pressure and a specific temperature. In this invention, a flat plate press and a roll press are used, but it is important in this invention to apply a pressure and a specific temperature.

The specific pressure, preferably 0.01~100kgf / cm ^2, more preferably 0.1~50kgf / cm ^2. The pressurization time is 0.01 to 180 seconds, more preferably 0.05 to 120 seconds. 10-500 degreeC is preferable for heating, More preferably, it is 30-300 degreeC.
<Antenna>
The IC module has an antenna coil as an antenna. However, when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. In some cases, it may be covered with a resin, an insulating layer or the like from the viewpoint of communication.

  The circuit pattern including the antenna coil is preferably a winding type, and can be electrically connected in a separate process so as not to be short-circuited with the coil pattern in the middle. The number of turns of the antenna coil is preferably 2 to 10 turns, but there is no particular limitation in the present invention. In the present invention, the bump formed on the circuit surface of the IC chip is electrically connected to the antenna and the bump so as to face the film support on which the antenna is formed.

In this invention, the circuit component side of the IC chip is connected in the vicinity of the bump for electrically connecting the antenna formed on the film support and the resin component having a 2% elastic modulus of 0.05 to 80 kg / mm ² or It is preferable to include a material satisfying any one of foamed resins having a “bulk density” measured by JISK-7222 of 0.03 to 0.95 g / cm ³ . In the present invention, it is preferable to arrange in the vicinity of the bump, but more preferably it is in contact with the bump.

A resin component having a 2% elastic modulus of 0.05 to 80 kg / mm ² used in the present invention represents a resin physical property at a thickness of 500 μm (in the case of a curable compound, a resin physical property after curing). In the present invention, it is preferably 0.05~80kg / mm ^2, more preferably 0.05~55kg / mm ^2. If it is lower than 0.05 kg / mm ² or larger than 80 kg / mm ² , stress and deformation to the reinforcing structure are concentrated on the IC chip, resulting in a decrease in durability and a problem. The 2% elastic modulus in this invention was measured by the following method.

<Measurement method of 2% elastic modulus>
An adhesive sheet after curing having a thickness of 500 μm was prepared from the adhesive, and the tensile modulus of the adhesive sheet was measured according to ASTM D638 using an Orientec Tensilon universal testing machine RTA-100.

Details of a resin component having a 2% elastic modulus of 0.05 to 80 kg / mm ² that can be used in the present invention are shown below.
<Resin whose 2% elastic modulus is 0.05 to 80 kg / mm ² >
As long as the material of this invention is not contrary to the meaning of this invention, the resin material generally used can be used without a restriction | limiting. Epoxy-based, urethane-based, silicone-based, cyanoacrylate-based, synthetic rubber-based nitrile rubber, UV curable, hot melt, anaerobic, cellulose-based adhesive, vinyl acetate-based adhesive, and the like can be used. These can be used alone or in combination. Preferably, an elastic epoxy material is used. As an elastic epoxy resin, for example, an epoxy resin composition comprising a combination of an epoxy resin and a mercaptan curing agent as disclosed in JP-A-63-63716 in order to obtain curability at low temperatures, or a heterocyclic diamine An epoxy resin composition comprising a combination with a curing agent has been used. Moreover, in order to obtain high strength, an epoxy resin comprising a combination with an aromatic polyamine curing agent has been used. (C) Polyamidoamine as amine-based curing agent and bisphenol-type epoxy resin as disclosed in JP-A No. 10-120964 in order to obtain working environment characteristics, adhesion to a support, and adhesion stability, (D) An epoxy resin composition is used in combination with an aromatic modified amine and (E) an aliphatic modified polyamine. Japanese Patent Laid-Open No. 2000-229927 discloses an epoxy resin having a high curing rate made of a combination of an epoxy resin and an amine imide compound-based curing agent. JP-A-6-87190 and JP-A-5-295272 describe the use of a specially modified silicone prepolymer as a curing agent, and disclose a material with improved resin flexibility.

  Examples of the elastic epoxy adhesive that can be used in this invention include Cemedine Co., Ltd., Cemedine EP-001, Three Bond Co., Ltd., 3950 Series, 3950, 3951, 3952, Konishi Co., Ltd. Bond MOS Series, MOS07. It is preferable to use MOS10, Toho Kasei Kogyo Co., Ltd. ULTITE 1500 series, ULTITE 1540 and the like.

  The resin in this invention preferably has a viscosity at 23 ° C. of 1000 to 35000 cps, more preferably 3000 to 35000 cps. When the viscosity is 1000 cps or less, the viscosity is too low when the IC chip and the reinforcing structure are in close contact with each other, so that the provided liquid flows and film thickness control and film thickness unevenness are caused. Further, when the viscosity is 35000 cps or more, coating streaks and bubbles are generated at the time of production, and the adhesion is deteriorated.

  Further, the material of the present invention can be provided on a reinforcing structure or an IC chip without particular limitation such as potting, coating, spraying, printing, IJ formation and the like.

In the present invention, additives can be added unless it is contrary to the spirit of the present invention. In particular, the adhesive preferably contains elastic particles. Materials that can be added to the adhesive include conductive materials, metal fine particles, WAX, thermoplastic resins, inorganic fine particles, leveling agents, rubber elastic particles, thermoplastic elastomers, thermoplastic resins, adhesives, curing agents, curing catalysts, It is also possible to blend a spreading agent, particles on a flat plate, acicular particles, and other additives.
<Foamed resin having a “bulk density” of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222>
The same materials as those described above are used, and the application method is also the same, so the module support is omitted.
In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It can be used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven fabric sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used.

  For example, as the antenna film support, polyethylene terephthalate, polybutylene terephthalate, polyimide, PET-G (Eastman Chemical Co., Ltd.), polyester resins such as polyethylene terephthalate / isophthalate copolymer, polyolefins such as polyethylene, polypropylene, polymethylpentene, etc. Resin, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, and other polyfluorinated ethylene resins, nylon 6, nylon 6.6, and other polyamides, polyvinyl chloride, chloride Vinyl / vinyl acetate copolymers, ethylene / vinyl acetate copolymers, ethylene / vinyl alcohol copolymers, vinyl polymers such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyesters, biodegradable polycarbonates Biodegradable resins such as nates, biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, polymethylmethacrylate, poly Acrylic resins such as ethyl methacrylate, polyethyl acrylate, polybutyl acrylate, synthetic resin sheets such as polystyrene, polycarbonate, polyarylate, polyimide, or paper such as fine paper, thin paper, glassine paper, sulfate paper, A single layer body such as a metal foil or a laminate of two or more layers can be used. As for the thickness of the support body of this invention, 10-50 micrometers is preferable. When the thickness is 10 μm or less, there is a problem in that heat shrinkage or the like is caused when the first support and the second support are bonded. If it is 50 μm or more, the cushioning effect is lowered, and the IC chip is easily damaged.

The total thickness of the IC module comprising the IC chip, antenna, reinforcing structure, module support and the like described above is preferably 10 to 500 μm, more preferably 10 to 450 μm, and still more preferably 10 to 350 μm.
[Method of providing electronic component of predetermined thickness between first sheet member and second sheet member]
A method for producing an IC card substrate, which includes a predetermined IC module via an adhesive between the first sheet member and the second sheet member of the present invention, includes a thermal bonding method, an adhesive bonding method, and an injection. Although a molding method is known, it may be bonded by any method.

  The manufacturing method of the IC card substrate is bonded as in JP 2000-036026, JP 2000-21855, JP 2000-2111278, JP 2000-21855, JP 10-316959, JP 11-5964, and the like. A coating method is disclosed.

  The method for producing an IC card according to the present invention includes a step of providing an adhesive member that is a solid or viscous body at a normal temperature and softens in a heated state on a card support, and an electronic component on the support. A step of arranging, a step of arranging a support provided with an adhesive member so as to cover the electronic component on the support, and a support for the support, the electronic component, and the surface under a predetermined pressure and heating condition And a step of bonding together.

Moreover, it is also possible to use the foamed resin whose "bulk density" of this invention is 0.03-0.95 g / cm < ³ > at this time. Specifically, a step of providing an adhesive member that softens in a heated state on a card support, a step of placing electronic components on the support, and a “bulk density” of 0.03 to 0.95 g / cm ^{3. A} step of providing the foamed resin ³ in the vicinity of the IC chip or the reinforcing structure by potting or the like, a step of foaming the IC module provided with the foamed resin by light or heat, and an adhesive member so as to cover the electronic component on the support And a step of attaching the support, the electronic component, and the support for the surface under a predetermined pressure and heating condition.

  The adhesive member that softens in the heated state of the solid or viscous material is preferably formed by bonding the adhesive itself by heating or melting at room temperature and injection molding.

  The adhesive member, which is a viscous material when the sheet member is applied, is preferably formed by forming the adhesive itself in a sheet form and bonding the adhesive itself by heating or melting at room temperature and then applying or injection molding.

At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the base material and the adhesion between the first sheet member and the second sheet member, such as a vertical press method, a laminate method, a caterpillar method, etc. It is preferable to manufacture by. The heating is preferably 10 to 120 ° C, more preferably 30 to 100 ° C. Pressure is preferably 0.05~300kgf / cm ^2, more preferably 0.05~100kgf / cm ^2. An IC chip having a higher pressure is damaged. The heating and pressurizing time is preferably 0.1 to 180 sec, more preferably 0.1 to 120 sec. If the time is longer than this, the production efficiency is lowered.

  The single-wafer sheet or continuous coating laminar bonded by the adhesive bonding method or the resin injection method may record the authentication identification image or bibliographic information after being allowed to stand within a time that matches the predetermined curing time of the adhesive. You may shape | mold to a predetermined card size. As a method of forming a predetermined card size, a punching method, a cutting method, or the like is mainly selected, and an IC card substrate can be created.

The IC card adhesive used for preparing the IC card base material is preferably a material having a 2% elastic modulus of 1 kg / mm ² or more and 90 kg / mm ² or less and an elongation at break of 200% or more and 1300% or less. When it is less than 1 kg / mm ² , it deteriorates when it is molded into a card shape. When it is larger than 90 kg / mm ² , impact properties, point pressure strength, and bendability are deteriorated. When the elongation at break is less than 200%, impact properties, point pressure strength, and bendability are deteriorated, which is a problem. If it is larger than 1300%, it deteriorates when it is molded into a card shape. In the present invention, the material is preferably a material having a 2% elastic modulus of 1 kg / mm ² or more and 90 kg / mm ² or less, and an elongation at break of 200% or more and 1300% or less, more preferably chemical resistance of the IC card after issuance. From the above, a reactive adhesive is preferable. Specifically, it is a light curable adhesive, a moisture curable adhesive, an epoxy adhesive, or the like. In the present invention, it is preferable to use a moisture curable adhesive. There are moisture curable materials as reactive hot melt adhesives, which are disclosed in Japanese Patent Application Laid-Open Nos. 2000-036026, 2000-2119855, 2000-2111278, and Japanese Patent Application No. 2000-369855. JP-A-10-316959 and JP-A-11-5964 are disclosed as photocurable adhesives. Any of these adhesives may be used, and it is preferable to use a material that is not limited in the present invention. The total film thickness of the adhesive depends on the finished card, but is preferably 800 to 300 μm, more preferably 800 to 400 μm, and more preferably 700 to 400 μm.
<Measurement method of 2% elastic modulus and elongation at break>
An adhesive sheet having a thickness of 500 μm was prepared as an adhesive, and this adhesive sheet was measured for tensile modulus and elongation at break according to ASTM D638 using Orientec Tensilon Universal Testing Machine RTA-100. It was measured.

One example of the configuration of the cross-sectional layer of the IC card that can be implemented in the present invention is shown in FIGS.
[Finished IC card thickness]
In the present invention, an IC card made of the materials described above can be produced. The IC card according to the present invention preferably has a thickness of 300 to 1200 μm, more preferably 400 to 1000 μm, and more preferably 400 to 1000 μm. The maximum film thickness was taken as the IC card thickness. The thickness was measured using a contact-type film thickness meter (Electric Micrometer Minicom M manufactured by Tokyo Seimitsu Co., Ltd.).
<Image Forming Method of Image Recorder>
An issued IC card in which at least one selected from an image element, that is, an authentication identification image such as a face image, an attribute information image, and format printing is provided on the created IC card is referred to as an image recording body. At least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided on either the first sheet member or the second sheet member, and is preferably provided on the first sheet member side. preferable.

  The face image is usually a full-color image having gradation, and is produced by, for example, a sublimation type thermal transfer recording system, a melt type thermal transfer recording system, an electrophotographic system, an ink jet system, or the like. In the present invention, it is preferable to record an authentication identification image such as a face image and an attribute information image by a sublimation type thermal transfer recording method.

  The attribute information includes name, address, date of birth, qualification, etc., and the attribute information is usually recorded as character information, and a melt type thermal transfer recording method is generally used. Format printing or information recording may be performed. By any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, heat melting method, etc. Can be formed.

Specific materials for the sublimation type thermal transfer material and formation method, and the melt type thermal transfer material and formation method that are specifically used are shown below. Further, for the purpose of preventing forgery and alteration, watermark printing, holograms, fine patterns, etc. may be provided. Specific anti-counterfeiting prevention layers are selected from printed materials, holograms, barcodes, matte patterns, fine patterns, ground patterns, uneven patterns, etc., visible light absorbing color materials, ultraviolet absorbing materials, infrared absorbing materials, fluorescent whitening Examples thereof include materials, metal vapor deposition layers, glass vapor deposition layers, bead layers, optical change element layers, pearl ink layers, and adjacent pigment layers.
<Sublimation image forming method>
The sublimation type thermal transfer recording ink sheet can be composed of a support and a sublimable dye-containing ink layer formed thereon.
(Support)
As the support, there is no particular limitation as long as it has good dimensional stability and can withstand the heat at the time of recording with a thermal head, and conventionally known ones can be used.
(Sublimation dye-containing ink layer)
The sublimable dye-containing ink layer basically contains a sublimable dye and a binder. Examples of the sublimable dye include a cyan dye, a magenta dye, and a yellow dye.

  Examples of cyan dyes include JP-A-59-78896, JP-A-59-227948, JP-A-60-24966, JP-A-60-53563, JP-A-60-130735, and JP-A-60-131292. 60-239289, 61-19396, 61-22993, 61-31292, 61-31467, 61-35994, 61-49893, 61 -148269, 62-191191, 63-91288, 63-91287, 63-290793, etc. Naphthoquinone dyes, anthraquinone dyes, azomethine dyes, etc. Is mentioned.

  As magenta dyes, JP-A-59-78896, JP-A-60-30392, JP-A-60-30394, JP-A-60-253595, JP-A-61-262190, JP-A-63-5992, Examples thereof include anthraquinone dyes, azo dyes, and azomethine dyes described in JP-A-63-205288, JP-A-64-159, and JP-A-64-63194.

  Examples of yellow dyes include those disclosed in JP-A-59-78896, JP-A-60-27594, JP-A-60-31560, JP-A-60-53565, JP-A-61-1394, and JP-A-63-1252594. Examples thereof include methine dyes, azo dyes, quinophthalone dyes, and antisothiazole dyes described in each publication.

  Also particularly preferred as the sublimable dye is an azomethine obtained by coupling a compound having an open chain or closed active methylene group with an oxidized form of a p-phenylenediamine derivative or an oxidized form of a p-aminophenol derivative. It is an indoaniline dye obtained by a coupling reaction between a dye and an oxidized form of a phenol or naphthol derivative or p-phenylenediamine derivative or an oxidized form of a p-aminophenol derivative.

  Further, when a metal ion-containing compound is blended in the image receiving layer, a sublimable dye that reacts with the metal ion-containing compound to form a chelate may be included in the sublimable dye-containing ink layer. Examples of such chelating sublimable dyes are described in JP-A-59-78893, JP-A-59-109349, JP-A-2-213303, JP-A-2-214719, and JP-A-2-203742. And cyan, magenta and yellow dyes capable of forming at least bidentate chelates.

  A preferred sublimable dye capable of forming a chelate can be represented by the following general formula.

X1-N = N-X2-G
In the formula, X1 represents an aromatic carbocyclic ring in which at least one ring is composed of 5 to 7 atoms, or a group of atoms necessary for completing a heterocyclic ring, and is a carbon bonded to an azo bond. At least one of the adjacent positions of the atom is a nitrogen atom or a carbon atom substituted with a chelating group. X2 represents an aromatic heterocycle or an aromatic carbocycle in which at least one ring is composed of 5 to 7 atoms. G represents a chelating group.

With regard to any sublimable dye, the sublimable dye contained in the sublimable dye-containing ink layer may be any of a yellow dye, a magenta dye, and a cyan dye if the image to be formed is a single color. In addition, depending on the color tone of the image to be formed, any two or more of the three kinds of dyes or other sublimable dyes may be included. The use amount of the sublimable dye is usually 0.1 to ²⁰ g, preferably 0.2 to 5 g, per 1 m ^{2 of} the support.

  The binder for the ink layer is not particularly limited, and conventionally known binders can be used. Furthermore, conventionally known various additives can be appropriately added to the ink layer. Further, the ink sheet support may have an undercoat layer for the purpose of improving adhesiveness with the binder and preventing the transfer and dyeing of the dye to the ink sheet support. Further, the back surface of the ink sheet support (opposite to the ink layer) is stuck for the purpose of preventing fusing and sticking of the head to the ink sheet support and wrinkles of the thermal sublimation type thermal transfer ink sheet. A prevention layer may be provided. The thickness of the overcoat layer, the undercoat layer, and the anti-sticking layer is usually 0.1 to 1 μm.

The ink sheet for sublimation type thermal transfer recording is prepared by dispersing or dissolving the various components for forming the ink layer in a solvent, and coating this on the surface of the support. It can be manufactured by drying. The film thickness of the ink layer thus formed is usually 0.2 to 10 μm, preferably 0.3 to 3 μm.
<Hot-melt image forming method>
(Hot-melting ink layer)
The ink sheet for hot melt transfer recording can be composed of a support and a hot melt-containing ink layer formed thereon. The heat-meltable ink layer is composed of a heat-meltable compound, a thermoplastic resin, a colorant, and the like. Further, like the sublimation type thermal transfer recording ink sheet, an anti-sticking layer may be provided for the purpose of preventing wrinkling of the hot melt type thermal transfer ink sheet. The overcoat layer, undercoat layer, and anti-sticking layer have a thickness of usually 0.1 to 1 μm.

  As the heat-meltable compound, those usually used for the heat-meltable ink layer of this kind of heat-melt type thermal transfer recording ink sheet can be arbitrarily used. Specifically, for example, polystyrene resin, Low molecular weight products of thermoplastic resins such as acrylic resins, styrene-acrylic resins, polyester resins, polyurethane resins, etc., from page 8, upper left column, line 8 to upper right column, line 12 of JP-A-63-193886. Illustrative substances can be mentioned, and besides these, rosin, hydrogenated rosin, polymerized rosin, rosin modified glycerin, rosin modified maleic resin, rosin modified polyester resin, rosin modified phenolic resin, ester gum and the like Rosin derivatives, phenolic resins, terpene resins, ketone resins, cyclopentadiene resins and aromatic hydrocarbon resins Etc. can be mentioned. These heat-meltable compounds preferably have a molecular weight of usually 10,000 or less, particularly 5,000 or less, and a melting point or softening point in the range of 50 to 150 ° C. The said heat-meltable compound may be used individually by 1 type, and may be used in combination of 2 or more type. As the thermoplastic resin used as a component of the heat-meltable ink layer, various materials such as those usually used for the heat-meltable ink layer of this kind of heat-melt type thermal transfer recording ink sheet can be used. For example, the substances exemplified in JP-A 63-193886, page 4, upper right column, page 5, upper left column, line 18, can be mentioned. As the colorant used as a component of the heat-meltable ink layer, those usually used for the heat-meltable ink layer of this kind of heat-melt type thermal transfer recording ink sheet can be used without limitation. Examples thereof include inorganic pigments, organic pigments and the like, and dyes such as organic dyes described in JP-A 63-193886, page 5, right upper column, lines 3 to 15.

These various colorants may be used alone or in combination of two or more as required. In the heat-meltable ink layer, other additive components other than those described above can be appropriately added as necessary within the range not impairing the object of the present invention. For example, this hot-melt ink layer may contain a fluorinated surfactant. By containing the fluorosurfactant, the blocking phenomenon of the hot-melt ink layer can be prevented. It is also effective to add organic fine particles, inorganic fine particles, and incompatible resins in order to improve the sharpness of the transferred character information-containing image, that is, the character boundary portion. The film thickness of the hot-melt ink layer is usually 0.6 to 5.0 μm, and preferably 1.0 to 4.0 μm. This heat-meltable ink layer is formed by dispersing or dissolving the forming components in an organic solvent (organic solvent method), or by applying a thermoplastic resin in a softened or molten state by heating (hot-melt coating method). However, it is preferably coated using an emulsion or solution in which the forming component is dispersed or dissolved in water or an organic solvent. The total content of the layer forming components in the coating liquid used for coating the heat-meltable ink layer is usually set in the range of 5 to 50% by weight. The coating method can be performed using a normal method. Examples of the coating method include a method using a wire bar, a squeeze coating method, and a gravure coating method. In addition, the heat-meltable ink layer needs to be provided in at least one layer. For example, the two layers differ in the type and content of the colorant or the blending ratio of the thermoplastic resin and the heat-meltable compound. The above heat-meltable ink layer may be laminated.
<Formation of authentication identification image>
In order to form an authentication identification image, the heat-diffusible dye-containing ink layer of the sublimation type thermal transfer recording ink sheet and the image-receiving layer on the substrate are overlapped, and the heat-diffusible dye-containing ink layer and the image-receiving layer are imagewise. Heat energy. Then, the heat diffusible dye in the heat diffusible dye-containing ink layer is vaporized or sublimated by an amount corresponding to the heat energy applied at the time of image formation, and moves to the image receiving layer side. A gradation information-containing image is formed.

  A thermal head is generally used as a heat source for applying thermal energy, but other known devices such as laser light, infrared flash, and thermal pen can be used. When a thermal head is used as a heat source for applying thermal energy, the applied thermal energy can be changed continuously or in multiple stages by modulating the voltage or pulse width applied to the thermal head. When laser light is used as a heat source for applying thermal energy, the thermal energy to be applied can be changed by changing the amount of light and the irradiation area of the laser light.

  In this case, in order to easily absorb the laser light, a laser light absorbing material (for example, in the case of a semiconductor laser, carbon black, a near-infrared absorbing substance, etc.) is preferably present in the ink layer or in the vicinity of the ink layer. When using laser light, the sublimation type thermal transfer recording ink sheet and the image receiving layer on the substrate are preferably adhered sufficiently.

  The heat energy may be applied from the sublimation type thermal transfer recording ink sheet side, from the thermal transfer recording image receiving sheet side, or from both sides, but priority is given to effective use of thermal energy. Then, it is desirable to perform from the ink sheet side for sublimation type thermal transfer recording. With the thermal transfer recording described above, a single color image can be recorded on the image receiving layer of the thermal transfer recording image receiving sheet. However, according to the following method, a color photographic tone color image composed of a combination of the respective colors can be obtained. For example, by sequentially replacing yellow, magenta, cyan and, if necessary, black thermal transfer recording thermal sheet and performing thermal transfer according to each color, it is also possible to obtain a color image of a color photographic tone consisting of a mixture of the respective colors. .

  Further, after the image is formed by the above method, the heat treatment may be performed by the method described above for the purpose of improving the image storage stability. For example, the entire surface of the image forming surface is heated using a portion of the ink sheet for sublimation type thermal transfer recording that is not provided with the heat diffusible dye-containing ink layer with a thermal head, or a new heating process such as a heat roll. May be performed. Further, when a near-infrared absorber is contained, the image forming surface may be exposed using an infrared flash lamp. In any case, any heating means may be used, but since the purpose is to further diffuse the dye inside the image receiving layer, it is effective to heat the heating direction from the support side of the image receiving layer. Is preferably used.

In the present invention, the image-receiving layer of the thermal transfer recording image-receiving sheet and the hot-melt type thermal transfer recording sheet are overlapped to form 0.3 kg / cm ^{2 to} 0 in accordance with the recording signal when an image is formed. It is preferable to form an image containing gradation information at a pressure of 0.01 and a head temperature of 50 to 500 ° C., preferably 100 to 500 ° C. and 100 to 400 ° C. More preferably, it is 0.25 kg / cm < ² > -0.01, More preferably, it is 0.25 kg / cm < ² > -0.02.
<Formation of attribute information>
The hot-melt transfer method using the hot-melt thermal transfer recording ink sheet is not different from the normal thermal transfer recording method in the same manner as that used when forming the authentication identification image layer described above. Can be formed.

  Specifically, the heat-meltable ink layer of the heat-melt type thermal transfer recording ink sheet and the image-receiving layer surface of the substrate are brought into close contact with each other, and if necessary, a heat pulse is applied to the heat-meltable ink layer by a thermal head, A hot-melt ink layer corresponding to a desired print or transfer pattern is locally heated.

  The temperature of the heated portion of the heat-meltable ink layer rises, quickly softens, and is transferred to the image receiving surface of the substrate. The formation of the non-gradation information-containing image that does not require gradation such as characters, figures, symbols, or ruled lines may be performed prior to the formation of the gradation information-containing image. The non-gradation information-containing image may be formed after the tone information-containing image is formed. The character information-containing image can also be formed by using the sublimation type thermal transfer recording ink sheet.

In this invention, the image-receiving layer of the thermal transfer recording image-receiving sheet and the hot-melt type thermal transfer recording sheet are overlapped to form a character information image at 0.3 kg / cm ² according to the recording signal. It is preferable to form a gradation information-containing image at a pressure in the range of -0.01, and at a head temperature of 50-500 ° C, preferably 100-500 ° C, 100-400 ° C. More preferably, it is 0.25 kg / cm < ² > -0.01, More preferably, it is 0.25 kg / cm < ² > -0.02.
<Card surface protection transfer foil>
In the IC card issuing device, a general transfer foil can be used to protect the surface for the purpose of improving the surface strength of the card. For example, the following materials can be used.
(Support for transfer foil)
Examples of the support include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, and polytetrafluoride. Polyethylene fluoride resin such as ethylene, ethylene-tetrafluoroethylene copolymer, polyamide such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer Polymer, ethylene / vinyl alcohol copolymer, vinyl polymer such as polyvinyl alcohol and vinylon, cellulose resin such as cellulose triacetate and cellophane, polymethyl methacrylate, polyethyl methacrylate, polyacrylate Acrylic resin such as ethyl acrylate, polybutyl acrylate, etc., synthetic resin sheet such as polystyrene, polycarbonate, polyarylate, polyimide, etc., or paper such as fine paper, thin paper, glassine paper, sulfuric acid paper, single layer such as metal foil Or the laminated body of these two or more layers is mentioned. The thickness of the support is 10 to 200 μm, preferably 15 to 80 μm. If the thickness is 10 μm or less, the support is broken during transfer, which is a problem. In the specific release layer of the present invention, polyethylene terephthalate is preferable. It can have irregularities as necessary. Examples of the unevenness creation means include matting agent kneading, sandblasting, hairline processing, mat coating, or chemical etching. In the case of mat coating, either organic or inorganic materials may be used. Examples of inorganic substances include silica described in Swiss Patent No. 330,158 and the like, glass powder described in French Patent No. 1,296,995 and the like, and alkali described in British Patent No. 1,173,181 and the like. Earth metals, carbonates such as cadmium and zinc, and the like can be used as the matting agent. Examples of organic substances include starch described in U.S. Pat. No. 2,322,037 and the like, starch derivatives described in Belgian Patent 625,451 and British Patent 981,198, and Japanese Patent Publication No. 44-3643. Polyvinyl alcohol described, polystyrene or polymethacrylate described in Swiss Patent No. 330,158, polyacrylonitrile described in US Pat. No. 3,079,257, US Pat. No. 3,022,169 etc. An organic matting agent such as a polycarbonate can be used. The method of attaching the matting agent may be a method in which the matting agent is dispersed and applied in advance, or a method of spraying the matting agent after the coating solution is applied and before the drying is completed may be used. When a plurality of types of matting agents are added, both methods may be used in combination. When uneven processing is performed in the present invention, it can be applied to one or more of the transfer surface and the back surface. Moreover, you may comprise the antistatic layer as needed.
(Transfer foil release layer)
As the release layer, resins such as acrylic resins having a high glass transition temperature, polyvinyl acetal resins, poly vinyl butyral resins, waxes, silicon oils, fluorine compounds, water-soluble polyvinyl pyrrolidone resins, polyvinyl alcohol resins, Si-modified Examples include polyvinyl alcohol, methyl cellulose resin, hydroxy cellulose resin, silicone resin, paraffin wax, acrylic modified silicone, polyethylene wax, ethylene vinyl acetate, and other resins, as well as polydimethylsiloxane and modified products thereof such as polyester modified silicone, acrylic modified. Oils and resins such as silicone, urethane modified silicone, alkyd modified silicone, amino modified silicone, epoxy modified silicone, polyether modified silicone, etc. The cured product, and the like. Other fluorinated compounds include fluorinated olefins and perfluorophosphate ester compounds. Preferred olefin compounds include dispersions such as polyethylene and polypropylene, and long-chain alkyl compounds such as polyethyleneimine octadecyl. These release agents having poor solubility can be used after being dispersed. The thickness of the release layer is not particularly limited, but is preferably 0.000 g / m ^{2 to} 3.00 g / m ² , more preferably 0.000005 g / m ^{2 to} 2.00 g / m. m ² , more preferably 0.00001 g / m ^{2 to} 2.00 g / m ² . When transferring two or more transfer foils, a thermoplastic elastomer may be added.

If necessary, a thermosetting resin layer may be used between the release layer of the present invention and the resin layer or the actinic ray curable layer. Specific examples include polyester resins, acrylic resins, epoxy resins, xylene resins, guanamine resins, diallyl phthalate resins, phenol resins, polyimide resins, maleic acid resins, melamine resins, urea resins, polyamide resins, urethane resins, and the like. Further, as described above, in order to prevent the card from adhering to the card and preventing the device bug, it may contain one or more of c) metal oxide fine particles, d) conductive powder or conductive resin.
(Surface protective layer)
A card surface protective layer can then be provided adjacent to the release layer. Specifically, polyvinyl chloride resin, copolymer resin of vinyl chloride and other monomers (for example, isobutyl ether, vinyl propionate, etc.), polyester resin, poly (meth) acrylate, polyvinyl pyrrolidone, polycarbonate, polystyrene, Examples of the surface protective layer for the card of the present invention are light vinyl toluene acrylate resin, polyurethane resin, epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, and modified products thereof. It is a resin such as a curable resin or a thermosetting resin. It is particularly preferable to provide a photocured cured layer.

  An actinic ray curable resin can be used as the photocurable resin layer. The actinic ray curable resin has addition polymerization property or ring-opening polymerization property, and the addition polymerization compound is a radical polymerizable compound such as Japanese Patent Application Laid-Open No. 7-159983, Japanese Patent Publication No. 7-31399, and Japanese Patent Application Laid-Open No. 8-224982, and a photocurable material using a photopolymerizable composition described in JP-A-10-863. As the addition-polymerizable compound, a cationic polymerization type photocurable resin is known. Recently, a photocationic polymerization type photocurable resin sensitized to a long wavelength region longer than visible light is also disclosed in, for example, -43633, JP-A-8-324137, and the like. The radical polymerizable compound includes ordinary photopolymerizable compounds and thermopolymerizable compounds. The radical polymerizable compound is a compound having an ethylenically unsaturated bond capable of radical polymerization, and may be any compound as long as it has at least one ethylenically unsaturated bond capable of radical polymerization in the molecule. , Oligomers, polymers and the like having a chemical form. Only one kind of radically polymerizable compound may be used, or two or more kinds thereof may be used in combination at an arbitrary ratio in order to improve desired properties. Examples of compounds having an ethylenically unsaturated bond capable of radical polymerization include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid and their salts, esters, urethanes, amides. And radically polymerizable compounds such as unsaturated monomers, acrylonitrile, styrene, various unsaturated polyesters, unsaturated polyethers, unsaturated polyamides, and unsaturated urethanes. Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butoxyethyl acrylate, carbitol acrylate, cyclohexyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, bis (4-acryloxypolyethoxyphenyl) propane, neopentyl glycol Diacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol triacrylate, pentaerythritol Tetraacrylate, dipentaery Acrylic acid derivatives such as lithol tetraacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, oligoester acrylate, N-methylol acrylamide, diacetone acrylamide, epoxy acrylate, methyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate , Lauryl methacrylate, allyl methacrylate, glycidyl methacrylate, benzyl methacrylate, dimethylaminomethyl methacrylate, 1,6-hexanediol dimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylol Methacryl derivatives such as tan trimethacrylate, trimethylolpropane trimethacrylate, 2,2-bis (4-methacryloxypolyethoxyphenyl) propane, and other derivatives of allyl compounds such as allyl glycidyl ether, diallyl phthalate, triallyl trimellitate More specifically, Yamashita Junzo, “Crosslinker Handbook”, (1981 Taiseisha); Kato Kiyomi, “UV / EB Curing Handbook (Materials)” (1985, Polymer Publication) ); Rad-Tech Study Group, “Application and Market of UV / EB Curing Technology”, p. 79, (1989, CMC); Eiichiro Takiyama, “Polyester Resin Handbook”, (1988, Nikkan Kogyo Shimbun) Commercially available products described in the above, or radically polymerizable or crosslinkable monomers known in the industry Oligomers and polymers can be used. The addition amount of the radical polymerizable compound in the radical polymerizable composition is preferably 1 to 97% by weight, more preferably 30 to 95% by weight. Particularly preferred among these are compounds that are excellent in stability at room temperature, have a high decomposition rate upon heating, and become colorless upon decomposition. Examples of such compounds include benzoyl peroxide, 2,2 ′ -Azobisisobutyronitrile and the like can be mentioned. Moreover, in this invention, these thermal polymerization initiators can be used 1 type or in mixture of 2 or more types. Furthermore, 0.1-30 weight% is preferable normally in a thermopolymerizable composition, and the range of 0.5-20 weight% is more preferable. As a cationic polymerization type photo-curing resin, an epoxy-type UV curable prepolymer of a type (mainly epoxy type) that is polymerized by cationic polymerization and a monomer containing two or more epoxy groups in one molecule. Mention may be made of polymers. Examples of such prepolymers include alicyclic polyepoxides, polyglycidyl esters of polybasic acids, polyglycidyl ethers of polyhydric alcohols, polyglycidyl ethers of polyoxyalkylene glycols, and polyglycidyls of aromatic polyols. Examples include ethers, hydrogenated compounds of polyglycidyl ethers of aromatic polyols, urethane polyepoxy compounds, and epoxidized polybutadienes. One of these prepolymers can be used alone, or two or more thereof can be mixed and used. The content of the prepolymer having two or more epoxy groups in one molecule in the coating agent for forming an ultraviolet curable protective layer is preferably 70% by weight or more. Other examples of the cationic polymerizable compound contained in the cationic polymerizable composition include the following (1) styrene derivatives, (2) vinyl naphthalene derivatives, (3) vinyl ethers, and (4) N-vinyl compounds. Can be mentioned.

  The content of the cationically polymerizable compound in the cationically polymerizable composition is preferably 1 to 97% by weight, more preferably 30 to 95% by weight.

  An aromatic onium salt can be mentioned as an initiator of the cationic polymerization photocurable resin. Examples of the aromatic onium salt include salts of Group Va elements of the periodic table, such as phosphonium salts (for example, triphenylphenacylphosphonium hexafluorophosphate), salts of Group VIa elements, such as sulfonium salts (for example, triphenylsulfonium tetrafluoroborate). , Triphenylsulfonium hexafluorophosphate, tris (4-thiomethoxyphenyl) hexafluorophosphate, sulfonium and triphenylsulfonium hexisafluoroantimonate), and salts of group VIIa elements such as iodonium salts (eg diphenyl chloride) Iodonium etc.).

  The use of such an aromatic onium salt as a cationic polymerization initiator in the polymerization of an epoxy compound is disclosed in U.S. Pat. Nos. 4,058,401, 4,069,055, and 4,101,513. And 4,161,478. Preferable cationic polymerization initiators include sulfonium salts of Group VIa elements. Among these, from the viewpoint of storage stability of ultraviolet curable and ultraviolet curable compositions, triarylsulfonium hexafluoroantimonate is preferable. In addition, the photopolymerization initiators described in pages 39 to 56 of the photopolymer handbook (published by Photographic Society Committee, 1989), JP-A 64-13142, JP-A-2-4804 Any compound can be used. If necessary, a sensitizer, a polymerization accelerator, a chain transfer agent, a polymerization inhibitor, and the like can be added to the actinic ray curable resin layer.

The photocured cured layer is preferably 3.0 to 15 g / m ² . Especially preferably, it is 3.0-13 g / m < ² >, More preferably, it is 5.0-13 g / m < ² >. When it is 3.0 g / m ² or less, the scratch strength is lowered, which causes a problem. When the film thickness of the photocured layer is 15 g / m ² or more, the scratch strength is good, but burrs are easily generated due to a change in peeling force after card transfer, and the amount of dust generated in the apparatus is increased and the amount of dust attached is increased. Increases and becomes a problem.

  As a method of curing the photocured layer, any method such as a method of curing at the time of manufacture may be adopted. As the actinic ray, any one that generates an electromagnetic wave active with respect to the polymerization initiator can be used. For example, a laser, a light emitting diode, a xenon flash lamp, a halogen lamp, a carbon arc lamp, a metal halide lamp, a tungsten lamp, a mercury lamp, an electrodeless light source, and the like can be given. Preferred examples include light sources such as xenon lamps, halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, mercury lamps, and the energy applied here adjusts the exposure distance, time, and intensity depending on the type of polymerization initiator. By doing so, it can be selected and used in a timely manner. In some cases, the actinic ray may block the air by a method such as nitrogen substitution or under reduced pressure to improve the polymerization rate. When a laser is used as a light source, it is easy to reduce the exposure area to a very small size, and high-resolution image formation is possible. As the laser light source, an argon laser, a He—Ne gas laser, a YAG laser, a semiconductor laser, or the like can be preferably used.

An optical change element layer transfer layer can be provided for the purpose of surface protection and prevention of falsification. An optical variable device (OVD) is 1) a two-dimensional CG image of a diffraction grating such as a kinegram, and the image of the line image structure freely moves and changes such as movement, rotation, expansion, and reduction. 1) Characteristic of point, 2) Image such as Pixelgram that changes positive and negative, 3) OSD (Optical Security Device) color that changes from gold to green, 4 ) An image such as LEAD (Long Lasting Economic Anti- Device) which appears to change, 5) A stripe type OVD, 6) A metal foil, etc., Japan Printing Society Journal (1998) Vol. 35, No. 6 Paper materials, special printing techniques, special inks as described in P482-P496 In may be to maintain the security. In the present invention, a hologram is particularly preferable.
(Intermediate layer, primer layer, barrier layer)
The transfer foil preferably has an intermediate layer and / or adhesive layer of polyvinyl butyral resin or polybutyral adjacent to the surface protective layer, and the intermediate layer and / or adhesive layer preferably contains an ultraviolet absorber. In addition to the intermediate layer, a barrier layer, a hologram layer, an optical change element layer, a primer layer, and the like may be provided for interlayer adhesion and card adhesion without limitation.

  The intermediate layer of the transfer foil is preferably composed of one or more intermediate layers. In some cases, it may be interposed as a primer layer or a barrier layer, or the adhesion between the layers may be further improved. The intermediate layer preferably contains at least one selected from an ultraviolet absorber, an antioxidant, and a light stabilizer in order to increase the light resistance of the image.

  Any ultraviolet absorber may be used as long as it functions as an ultraviolet absorber for a dye image and can be thermally transferred. For example, JP-A Nos. 59-158287, 63-74666, 63-145089, and 59-196292. , No. 62-229594, No. 63-122596, No. 61-283595, JP-A-1-204788, etc., and those that improve image durability in photographs and other image recording materials Known compounds can be used. Specific examples include salicylic acid type, benzophenone type, benzotriazole type, and cyanoacrylate type. For example, Tinuvin P, Tinuvin 123, 234, 320, 326, 327, 328, 312, 315, 384, 400 (manufactured by Ciba Geigy) ), Sumisorb-110, 130, 140, 200, 250, 300, 320, 340, 350, 400 (manufactured by Sumitomo Chemical Co., Ltd.), MarkLa-32, 36, 1413 (manufactured by Adeka Gas Chemical Co., Ltd.) The product name such as can be used. A pendant polymer having a benzophenone derivative or the like in the side chain is also preferably used. In addition, inorganic fine particles having absorption in the ultraviolet region, ultrafine metal oxide powder dispersants and the like can also be used. Examples of inorganic fine particles include titanium oxide, zinc oxide, and silicon compounds. Examples of the ultrafine metal oxide powder dispersant include ultrafine zinc oxide powder, ultrafine titanium oxide powder, and the like, water or alcohol mixed liquids or various oil-based dispersion media, surfactants, water-soluble polymers, and solvent-soluble polymers. And those made using a dispersing agent such as

  Antioxidants described in JP-A-59-182785, JP-A-60-130735, JP-A-1-127387, etc., and improvement in image durability in photographs and other image recording materials. Known compounds can be listed as examples. Specific examples include primary antioxidants such as phenols, monophenols, bisphenols, and amines, or secondary antioxidants such as sulfurs and phosphoruss. For example, Sumizer BBM-S, BHT, and BP-76. , MDP-S, GM, WX-R, BP-179, GA, TPM, TP-D, TNP (manufactured by Sumitomo Chemical Co., Ltd.), Irganox-245, 259, 565, 1010, 1035, 1076, 1081, Commercially available products such as 1098, 3114 (manufactured by Ciba-Geigy), MarkAQ-20, AO-30, AO-40 (manufactured by Adeka Argus Chemical Co., Ltd.) can be used.

  As light stabilizers, JP-A-59-158287, 63-74666, 63-145089, 59-196292, 62-229594, 63-122596, 61-283595 are disclosed. And compounds described in JP-A-1-204788, and known compounds for improving image durability in photographs and other image recording materials. Specific examples include hindered amines. For example, Tinuvin 622LD, 144, Chimassob 944 LD (manufactured by Ciba Geigy), Sanol LS-770, LS-765, LS-292, LS-2626, LS-114, LS-774 ( Sanyo Co., Ltd.), Mark LA-62, LA-67, LA-63, LA-68, LA-82, LA-87 (manufactured by Adeka Argus Chemical Co., Ltd.) and the like can be used.

  In addition to the ultraviolet absorber, the antioxidant and the light stabilizer, a binder can be used. In the present invention, it is particularly preferable to use a polyvinyl butyral resin or polybutyral as an intermediate layer from the viewpoint of adhesion to the photocured layer. preferable.

  In combination, for example, as a thermoplastic resin, vinyl chloride resin, polyester resin, acrylic resin, polyvinyl acetal resin, polyvinyl alcohol, polycarbonate, cellulose resin, styrene resin, urethane resin, urethane acrylate resin, amide resin Resin, urea resin, epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, thermoplastic elastomer, styrene (styrene block copolymer (SBC)), olefin (TP), urethane (TPU), Examples include polyester (TPEE), polyamide (TPAE), 1,2-polybutadiene, vinyl chloride (TPVC), fluorine, ionomer resin, chlorinated polyethylene, silicone, and the like. 996 Chemical Products "(The Chemical Daily Co., Ltd.) SEBS resins described in the like can be used as SEPS resin and their modified products. These resins can be used alone or in combination of two or more.

  As a specific compound, a thermoplastic resin composed of a block polymer of polystyrene and polyolefin, polyvinyl butyral, and the like are preferable.

  As a polyvinyl butyral resin, SRECIK BH-3, BX-1, BX-2, BX-5, BX-55, BH-S, BL-S manufactured by Sekisui Chemical Co., Ltd., manufactured by Denki Kagaku Kogyo Co., Ltd. Denkabutyral # 4000-2, # 5000-A, # 6000-EP and the like are commercially available. There is no limitation on the degree of polymerization before thermosetting as a thermosetting resin for polybutyral in the intermediate layer. A thermosetting compound may be added to increase the film strength. Specifically, an isocyanate curing agent, an epoxy curing agent, or the like can be used, and the thermal curing conditions are preferably 50 to 90 ° C. and 1 to 24 hours.

The ultraviolet absorber, antioxidant and light stabilizer are preferably 0.05 to 20% by weight, more preferably 0.05 to 10% by weight, based on 100% by weight of the binder. Ultraviolet absorber, an intermediate layer thickness containing an antioxidant and light stabilizer is preferably 0.05~15.0g / ^{m 2,} more preferably 0.05 to 10 g / ^{m 2} , more preferably from 0.1~10.0g / ^{m 2.}
(Adhesive layer)
For the adhesive layer of the transfer foil, ethylene vinyl acetate resin, ethyne ethyl acrylate resin, ethylene acrylic resin, ionomer resin, polybutadiene resin, acrylic resin, polystyrene resin, polyester resin, olefin resin, urethane resin, A tackifier (for example, a phenol resin, a rosin resin, a terpene resin, a petroleum resin, etc.) may be mentioned, and a copolymer or a mixture thereof may be used.

Specifically, as a urethane-modified ethylene ethyl acrylate copolymer, Hitech S-6254, S-6254B, S-3129 and the like manufactured by Toho Chemical Industry Co., Ltd. are commercially available, and as a polyacrylic acid ester copolymer, Japan. Jurimer AT-210, AT-510, AT-613 manufactured by Junyaku Co., Ltd., plus size L-201, SR-102, SR-103, J-4, etc. manufactured by Kyoyo Chemical Industry Co., Ltd. are commercially available. Yes. The weight ratio of the urethane-modified ethylene ethyl acrylate copolymer and the polyacrylic acid ester copolymer is preferably 9: 1 to 2: 8, and the thickness of the adhesive layer is preferably 0.1 to 1.0 μm. In addition, this layer may contain the ultraviolet absorber, the antioxidant and the light stabilizer described above.
<IC card making device>
Hereinafter, although an embodiment of an IC card making device will be described with reference to the drawings, the present invention is not limited to the description of the embodiments and the drawings. An embodiment of an IC card creation apparatus is shown in FIG.

  In FIG. 19, the card supply unit 110 and the information recording unit 120 are arranged at the upper position, the surface protective layer applying unit 170 is arranged at the lower position, and the surface protective layer applying unit 170 is further arranged after that. An IC card can be created as a body.

  In the card base material supply unit 110, a plurality of card base materials 150 that have been cut in a sheet shape in advance to write personal information of the card user are stocked with a face photo recording surface facing upward. . In this example, the card base 150 includes a support and an image receiving layer, and the card base 150 is automatically supplied from the card base supply unit 110 one by one at a predetermined timing.

In the information recording unit 120, a yellow ribbon cassette 121, a magenta ribbon cassette 122, a cyan ribbon cassette 123, and a black ribbon cassette 131 are arranged, and recording heads 125 to 128 are arranged correspondingly. While the card substrate 150 is being moved by thermal transfer using a thermal transfer sheet such as a yellow ribbon, magenta ribbon, or cyan ribbon, an image area having a gradation such as a photo of the card user is recorded in a predetermined area of the image receiving layer. Is done. In addition, a character ribbon cassette 131 and a recording head 132 are arranged, and authentication identification information such as a name and a card issue date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, and an image recording layer is formed. When a character information image is formed, pressurization is performed in the range of 0.3 kg / cm ^{2 to} 0.01 according to the recording signal, and the head temperature is 50 to 500 ° C., preferably 100 to 500 ° C. It is preferable to form a tone information-containing image. More preferably, it is 0.25 kg / cm < ² > -0.01, More preferably, it is 0.25 kg / cm < ² > -0.02.

  Further, a surface protective layer was provided on the image receptor on which images and characters were recorded by the following means.

  In the surface protective layer 170, a transfer foil cassette 171 is arranged, and a heat roll 172 is arranged corresponding to the transfer foil cassette 171. The surface protective transfer foil 164 is transferred, and a surface protective layer-containing transfer layer is provided.

The surface temperature of the heat roll when forming the transparent protective layer was transferred to 200 ° C. by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a heat roller having a diameter of 5 cm and a rubber hardness of 85. In the present invention, there is no particular limitation as long as it is an IC card making apparatus that records bibliographic information and identification information on a card. As one example of the present invention, an example in which two surface protective layers are provided is shown.
"Example"
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this.

[Creation of foamed resin]
<Foamed resin 1>
Macroplast QR3460 (manufactured by Henkel Co., Ltd.) Drying nitrogen was blown in while heating a moisture-curable hot melt adhesive at 120 ° C. to obtain a foamed resin with continuous stirring. The bulk density was 0.45 g / cm ³ .
<Foamed resin 2>
The following composition was heated and mixed at 120 ° C. to prepare a photopolymerizable composition. The composition was heated to 120 ° C. and pressurized to 0.4 MPa with dry nitrogen gas, stirred at 200 rpm for 30 minutes, pressurized with nitrogen gas, then released under atmospheric pressure and foamed, and 365 nm ultraviolet light was applied to 1500 mJ. Irradiated with an intensity of / cm ² to obtain a photocurable adhesive foam. The bulk density was 0.9 g / cm ³ .
Foam Resin 2 Composition Rika Resin DME-100 (manufactured by Shin Nippon Rika Co., Ltd.) 7 parts by weight Rika Resin BEO-60E (manufactured by Shin Nippon Rika Co., Ltd.) 25 parts by weight Epicoat 1003F (Oka Shell Epoxy Co., Ltd.) 60 parts by weight Photocationic polymerization initiator UVI-6990 (manufactured by Union Carbide Corp.) 5 parts by weight <Foamed resin 3>
The following composition was heated and mixed at 120 to prepare a foamed resin. This composition is heated to 120 ° C. to form a film at a specific location, and using a semiconductor laser with an oscillation wavelength of 830 nm, the entire surface of the film is exposed with an exposure intensity of 0.1 megawatt / cm ² to obtain a moisture-curable foam. Obtained. The bulk density was 0.4 g / cm ³ .
Foamed resin 3 composition Esdine 9621 (moisture curable adhesive) 80 parts by weight Carbon black dispersion [Dainippon Ink & Chemicals, SD-9020]
20 parts by weight <Foamed resin 4> (Comparative example)
The foaming resin 1 was prepared by the same production method as that of the foamed resin 1, but the dry nitrogen blowing amount was increased to about 10 times, and the foamed resin was obtained while mixing and stirring. The bulk density was 1.2 g / cm ³ .
<Foamed resin 5> (Comparative example)
Although it produced with the manufacturing method similar to the foamed resin 1, dry nitrogen blowing was not implemented. The bulk density was 0 g / cm ³ .
[Creation of adhesive used for bumps that electrically connect antennas]
<Adhesive 1>
Two-component curable elastic epoxy adhesive: A main agent and a curing agent using ULTITE 1540 set (after curing, 2% elastic modulus 0.4%) manufactured by Toho Kasei Kogyo Co., Ltd. were used.
<Adhesive 2>
The main agent and the curing agent using Three Bond main agent 2002H / curing agent 2105F (2% elastic modulus after curing 0.05%) were used.
<Adhesive 3>
Aron Alpha GEL-10 (2% elastic modulus 60 kg / mm ² , manufactured by Toagosei Co., Ltd.) was used.
<Adhesive 4> (Comparative Example)
Semicoat 220H (2% elastic modulus 300 kg / mm ² , manufactured by Shin-Etsu Chemical Co., Ltd.) was used.
<Adhesive 5>
The foamed resin 1 was used.
<Adhesive 6>
The foamed resin 2 was used.
<Adhesive 7>
The foamed resin 3 was used.
<Adhesive 8> (Comparative Example)
The foamed resin 4 was used.
<Adhesive 9> (Comparative Example)
The foamed resin 5 was used.
[Create IC module]
<IC module 1>
An IC chip having a thickness of 60 μm and a 3 × 3 mm square and an antenna are bonded to a transparent PET support having a thickness of 38 μm on which an antenna pattern has been formed by etching with a conductive adhesive, and then 4 × 4 mm having a thickness of 50 μm made of SUS301. A pressure roll (0) which is potted with a foamed resin 1 obtained by foaming a square plate-like reinforcing plate on the opposite side of the circuit surface with the pressure of dry nitrogen to a thickness of 10 μm and sealing the chip. The IC module 1 was obtained by pressing and adhering at 001 kg / cm ² ).
<IC module 2>
An IC chip having a thickness of 60 μm and a 3 × 3 mm square and an antenna are bonded to a transparent PET support having a thickness of 38 μm on which an antenna pattern has been formed by etching with a conductive adhesive, and then 4 × 4 mm having a thickness of 50 μm made of SUS301. A pressure roll (0) which is potted with a foamed resin 1 obtained by foaming a square plate-like reinforcing plate on the opposite side of the circuit surface with the pressure of dry nitrogen to a thickness of 10 μm and sealing the chip. 0.001 kg / cm ² ) and bonded. Next, the area of the second reinforcing plate becomes larger than the second reinforcing plate by the foamed resin 1 obtained by foaming the second reinforcing plate made of SU301 and having a thickness of 50 μm and having a thickness of 5 × 5 mm on the first reinforcing plate with the pressure of dry nitrogen to a thickness of 10 μm. The IC module 2 was obtained by pressing and bonding with a pressure roll (0.001 kg / cm ² ) that was potted and sealed to release the chip.
<IC module 3>
An IC chip having a thickness of 60 μm and a 3 × 3 mm square and an antenna are bonded to a transparent PET support having a thickness of 38 μm on which an antenna pattern has been formed by etching with a conductive adhesive, and then 4 × 4 mm having a thickness of 50 μm made of SUS301. A foamed resin 2 obtained by foaming a square plate-like reinforcing plate on the opposite side of the circuit surface with the pressure of dry nitrogen is potted so as to seal the chip with a thickness of 10 μm, and ultraviolet rays of 365 nm have an intensity of 1500 mJ / cm ² . The IC module 3 was obtained after being cured by pressing with a pressure roll (0.001 kg / cm ² ) that had been irradiated with and released from the mold.
<IC module 4>
An IC chip having a thickness of 60 μm and a 3 × 3 mm square and an antenna are bonded to a transparent PET support having a thickness of 38 μm on which an antenna pattern has been formed by etching with a conductive adhesive, and then 4 × 4 mm having a thickness of 50 μm made of SUS301. A foamed resin 3 obtained by foaming a square plate-like reinforcing plate on the opposite side of the circuit surface by the pressure of dry nitrogen is potted to a thickness of 10 μm so as to seal the chip. Further, the IC module 4 was obtained by being exposed by a semiconductor laser and pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to a release treatment.
<IC module 5> (Comparative example)
An IC chip having a thickness of 60 μm and a 3 × 3 mm square and an antenna are bonded to a transparent PET support having a thickness of 38 μm on which an antenna pattern has been formed by etching with a conductive adhesive, and then 4 × 4 mm having a thickness of 50 μm made of SUS301. A pressure roll (0) which is potted with a foamed resin 4 obtained by foaming a square plate-like reinforcing plate on the opposite side of the circuit surface with the pressure of dry nitrogen to a thickness of 10 μm and sealing the chip. The IC module 5 was obtained by pressing and adhering at 001 kg / cm ² ).
<IC module 6> (Comparative example)
An IC chip having a thickness of 60 μm and a 3 × 3 mm square and an antenna are bonded to a transparent PET support having a thickness of 38 μm on which an antenna pattern has been formed by etching with a conductive adhesive, and then 4 × 4 mm having a thickness of 50 μm made of SUS301. A pressure roll (0) which is potted with a foamed resin 5 obtained by foaming a square plate-like reinforcing plate on the opposite side of the circuit surface with the pressure of dry nitrogen to a thickness of 10 μm and sealing the chip. 001 kg / cm ² ) and bonded to obtain an IC module 6.
<IC module 7>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure is potted to a thickness of 10 μm, and the chip is pressed and bonded by a pressure roll (0.001 kg / cm ² ) that has been subjected to a mold release treatment to attach the IC module 7. Obtained.
<IC module 8>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, the bump was sealed by potting with an adhesive 1 from the side where the bumps were directly electrically connected to a thickness of 10 μm. Next, an IC module 8 was obtained by closely attaching a reinforcing plate and an antenna on a 50 μm-thick nonwoven fabric support.
<IC module 9>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate of SUS301 having a thickness of 4 × 4 mm square plate is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, the bump was sealed by potting with an adhesive 2 to a thickness of 10 μm from the side where the bumps were directly electrically connected. Next, the reinforcing plate and the antenna were brought into close contact with a 50 μm-thick nonwoven fabric support, and the adhesive 2 was irradiated with 365 nm ultraviolet light at an intensity of 1500 mJ / cm ² to obtain an IC module 9.
<IC module 10>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, the bump was sealed by potting with the adhesive 3 from the side where the bumps were directly electrically connected to the thickness of 10 μm. Then, a reinforcing plate and an antenna were brought into close contact with a 50 μm-thick nonwoven fabric support, and an IC module 10 was obtained after irradiating the adhesive 3 with a semiconductor laser.
<IC module 11>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Subsequently, the bump part was sealed by potting with the adhesive 4 from the side where the bumps were directly electrically connected to the thickness of 10 μm. Next, an IC module 11 was obtained by closely attaching a reinforcing plate and an antenna on a 50 μm-thick nonwoven fabric support.
<IC module 12>
A bump of an IC chip with a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna with a diameter of 50 μm, and the first reinforcing plate of 30 μm thick 4 × 4 mm square plate made of SUS301 is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, the bump portion was sealed by potting with a bonding agent 5 foamed by the pressure of dry nitrogen from the side where the bumps were directly connected directly to a thickness of 10 μm. Next, an IC module 12 was obtained by closely attaching a reinforcing plate and an antenna on a 50 μm-thick nonwoven fabric support.
<IC module 13>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Subsequently, the bump part was sealed so as to have a thickness of 10 μm with the adhesive 6 foamed by the pressure of nitrogen gas from the side where the bump was directly electrically connected. Next, an IC module 13 was obtained by closely attaching a reinforcing plate and an antenna on a 50 μm-thick nonwoven fabric support.
<IC module 14>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, the bumps were potted from the side where the bumps were directly directly connected, and the bumps were sealed so that the adhesive 7 foamed by the semiconductor laser had a thickness of 10 μm. Next, an IC module 14 was obtained by closely attaching a reinforcing plate and an antenna on a 50 μm-thick nonwoven fabric support.
<IC module 15>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, the bump part was sealed by potting with a sticking agent 8 foamed by the pressure of dry nitrogen from the side where the bumps were directly connected directly to a thickness of 10 μm. Next, an IC module 15 was obtained by closely attaching a reinforcing plate and an antenna on a 50 μm-thick nonwoven fabric support.
<IC module 16>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, the bump portion was sealed by potting with a bonding agent 9 foamed by the pressure of dry nitrogen from the side where the bumps were directly connected directly to a thickness of 10 μm. Next, an IC module 16 was obtained by closely attaching a reinforcing plate and an antenna on a 50 μm-thick nonwoven fabric support.
<IC module 17>
A bump of an IC chip having a thickness of 180 μm and a 3 × 3 mm square is electrically connected directly to a copper wire antenna having a diameter of 50 μm, and a first reinforcing plate having a 4 × 4 mm square plate made of SUS301 and having a thickness of 30 μm is opposite to the circuit surface. The foamed resin 1 foamed by dry nitrogen pressure was potted to a thickness of 10 μm, and the chip was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to mold release treatment. Next, a 5 × 5 mm square plate-shaped second reinforcing plate made of SUS301 is placed on the first reinforcing plate, and the chip is potted to a thickness of 10 μm with the foamed resin 1 foamed by the pressure of dry nitrogen. It was pressed and adhered by a pressure roll (0.001 kg / cm ² ) subjected to a release treatment. Next, an IC module 17 was obtained by closely attaching a reinforcing plate and an antenna onto a 50 μm-thick nonwoven fabric support.
<IC module 18>
An IC chip with a thickness of 180 μm and a 3 × 3 mm square is placed on a transparent PET support with a thickness of 250 μm on which an antenna pattern is formed by etching. The foamed resin 1 is potted to a thickness of 5 μm and brought into close contact with the chip. After the circuit and the lead frame are electrically connected by wire bonding, the adhesive resin 1 is further placed on the IC chip to be 80 μm for sealing. Potting was performed to seal the IC chip. Then, it pressed and molded with the pressure roll (0.001 kg / cm < ² >) by which the mold release process was carried out. Next, the chip sealing portion was fitted into the transparent PET on which the antenna was formed, and the lead frame and the antenna were electrically joined with a conductive adhesive to obtain the IC module 18.
<IC module 19>
An IC chip with a thickness of 180 μm and a 3 × 3 mm square is placed on a transparent PET support with a thickness of 250 μm on which an antenna pattern is formed by etching. Then, the foamed resin 1 is potted to a thickness of 5 μm and brought into close contact with the chip. After the circuit and the lead frame are electrically connected by wire bonding, the adhesive resin 5 is further placed on the IC chip to be 80 μm to be sealed. Potting was performed to seal the IC chip. Then, it pressed and molded with the pressure roll (0.001 kg / cm < ² >) by which the mold release process was carried out. Next, the chip sealing part was fitted into the transparent PET on which the antenna was formed, and the lead frame and the antenna were electrically joined with a conductive adhesive to obtain the IC module 19.
<IC module 20>
Although it created with the method similar to IC module 1, IC module 20 was obtained, without performing pressurization etc. with a flat plate press etc.
[Creation of first sheet member and second sheet member]
A first sheet member having an image receiving layer prepared below and a second sheet member forming method sheet having a writing layer were prepared, and a test card 1 was prepared by the following IC card substrate forming method.
<First sheet member creation method>
As a surface sheet base material, a first image-receiving layer forming coating solution and a second image-receiving layer forming coating solution having the following composition were applied and dried in this order on a T2 DuPont Film U2L98W-188 μm low heat yield grade, respectively. Were laminated so that the thickness of the first image receiving layer was 2.5 μm and the second image receiving layer was 0.5 μm.
<Formation of image receiving layer>
<First image-receiving layer forming coating solution>
6 parts by weight of polyvinyl butyral resin

[Sekisui Chemical Co., Ltd. product: S REC BX-1]
4 parts by weight of metal ion-containing compound (compound MS)

80 parts by weight of methyl ethyl ketone 10 parts by weight of butyl acetate <second image-receiving layer forming coating solution>
2 parts by weight of polyethylene wax [manufactured by Toho Chemical Co., Ltd .: Hitech E1000]
8 parts by weight of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Co., Ltd .: Hitech S6254]
Methylcellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 parts by weight Water 90 parts by weight (formation of a format printing layer on the image receiving layer)
On the image receiving layer, format printing (employee ID, name) was performed by a resin convex printing method to form a format printed first sheet member. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
<Method for creating second sheet member>
The first writing layer forming coating solution, the second writing layer forming coating solution, and the third writing layer forming coating solution on the T2jin DuPont Films U2L98W-188 μm low heat yield grade as the back sheet base material. The writing layer was formed by coating and drying in order, and laminating each of the first writing layer so as to have a thickness of 5 μm, 15 μm, and 0.2 μm. Ra of the outermost surface after application of the writing layer was 1.56 μm.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts by weight Isocyanate 1 part by weight [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part by weight Methyl ethyl ketone 80 parts by weight Butyl acetate 10 parts by weight <Coating liquid for forming the second writing layer>
4 parts by weight of polyester resin [Toyobo Co., Ltd .: Vylonal MD1200]
Silica 6 parts by weight Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 2 parts by weight Water 90 parts by weight <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts by weight Methanol 95 parts by weight (formation of format printing layer on writing layer)
Resin convex printing (ruled lines, issuer name, issuer telephone number) was performed on the writing layer by the resin convex printing method to produce a format-printed second sheet member 1. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

An IC card substrate could be obtained by the following manufacturing method using the first sheet member and the second sheet member prepared as described above.
<Method for producing ID card substrate>
Hereinafter, an image recording body, an apparatus for manufacturing the same, and a method for manufacturing the same will be described with reference to the drawings.
[ Creation of IC card substrate]
Using the first sheet member and the second sheet member, an IC card was created by the IC card making apparatus shown in FIGS. The IC card creation device will be described below.
<IC card substrate production method 1>
The IC card creation apparatus of FIG. 20 as an embodiment will be described. The IC card making apparatus of the present invention is provided with a second sheet member (back sheet) in the form of a long sheet and a first sheet member (front sheet) in the form of a single sheet, and supplies an adhesive to the first sheet member Moisture-curable hot melt adhesive MK2013 manufactured by Sekisui Chemical Co., Ltd. is melted at 120 ° C. under nitrogen, and the adhesive is supplied from the adhesive supply unit by a T-die coating method. An IC module including a reinforcing structure, an antenna, and the like is disposed from the IC module supply unit. From the adhesive supply section to the second sheet member (back sheet), IC card adhesive, Sekisui Chemical Co., Ltd. moisture-curing hot melt adhesive MK2013 adhesive is melted at 120 ° C. under nitrogen, and from the adhesive supply section. The adhesive was supplied by a T-die coating method.

The first sheet member and the second sheet member coated with the adhesive are bonded by a heating / pressurizing roll (pressure 3 kg / cm ² , roll surface temperature 65 ° C.), and controlled to 760 μm by a film thickness control roll. An original for the IC card base 4 is prepared. It is preferable to cut the makeup after the adhesive has been cured and the adhesiveness to the support has been sufficiently achieved. In the present invention, after the curing is accelerated for 14 days in an environment of 23 ° C./55%, the original plate is formed as shown in FIG. An IC card substrate having a size of 55 mm × 85 mm and a thickness of 760 μm could be obtained using the card punching machine shown in FIG.
<IC card substrate creation method 2>
The IC card making apparatus of FIG. 21 as an embodiment will be described. The IC card making apparatus of the present invention is provided with a second sheet member (back sheet) in the form of a long sheet and a first sheet member (front sheet) in the form of a single sheet, and supplies an adhesive to the first sheet member Moisture curable hot melt adhesive MK2013 adhesive manufactured by Sekisui Chemical Co., Ltd. is melted at 120 ° C. under nitrogen from the part, and the adhesive is supplied from the adhesive supply part by a T-die coating method. An IC module including a reinforcing structure, an antenna, and the like is disposed from the IC module supply unit. Further, after supplying the IC module, the foamed resin 3 that has been thermally melted from the foamed resin supply unit is potted on the reinforcing plate or the bump, and the foamed resin 3 before foaming is disposed. Went.

  Thereafter, the adhesive for IC card, the moisture curing type hot melt adhesive MK2013 adhesive manufactured by Sekisui Chemical Co., Ltd. is melted at 120 ° C. under nitrogen from the adhesive supply section to the second sheet member (back sheet), and the adhesive is supplied. The adhesive was supplied from the part by a T-die coating method.

The above-mentioned first and second sheet members coated with adhesive are bonded by a heating / pressurizing roll (pressure 3 kg / cm ² , roll surface temperature 65 ° C.) and controlled to 760 μm by a film thickness control roll. A master for the IC card substrate 4 is prepared. It is preferable to cut the makeup after the adhesive has been cured and the adhesiveness to the support has been sufficiently achieved. In the present invention, after the curing is accelerated for 14 days in an environment of 23 ° C./55%, the original plate is formed as shown in FIG. An IC card substrate having a size of 55 mm × 85 mm and a thickness of 760 μm could be obtained using the card punching machine shown in FIG.
<IC card base material creation method 3>
The IC card creation apparatus of FIG. 22 as an embodiment will be described. The IC card making apparatus of the present invention is provided with a second sheet member (back sheet) in the form of a long sheet and a first sheet member (front sheet) in the form of a single sheet, and an adhesive is supplied to the first sheet member Moisture curable hot melt adhesive MK2013 adhesive manufactured by Sekisui Chemical Co., Ltd. is melted at 120 ° C. under nitrogen, and the adhesive is supplied from the adhesive supply unit by a T-die coating method. An IC module including a reinforcing structure, an antenna, and the like is disposed from the IC module supply unit. Further, after supplying the IC module, the foamed resin melted from the foamed resin supply part is potted on the reinforcing plate or the bump, and the foamed resin 2 before photocuring is disposed. Immobilization was performed.

  Thereafter, the adhesive for IC card, the moisture curing type hot melt adhesive MK2013 adhesive manufactured by Sekisui Chemical Co., Ltd. is melted at 120 ° C. under nitrogen from the adhesive supply section to the second sheet member (back sheet), and the adhesive is supplied. The adhesive resin is supplied from the part by a T-die coating method, and immediately after that, the foamed resin melted from the foamed resin supply part at a position on the reinforcing plate or bump of the IC module supplied to the first sheet. The foamed resin 2 before photocuring was placed, and the foamed resin 2 was fixed by ultraviolet irradiation from the ultraviolet irradiation section.

Thereafter, the adhesive-coated first sheet member and second sheet member are bonded by a heating / pressurizing roll (pressure 3 kg / cm ² , roll surface temperature 65 ° C.) and controlled to 760 μm by a film thickness control roll. A master for the IC card substrate 4 is prepared. It is preferable to cut the makeup after the adhesive has been cured and the adhesiveness to the support has been sufficiently achieved. In the present invention, after the curing is accelerated for 14 days in a 23 ° C./55% environment, the original plate is formed as shown in FIG. An IC card substrate having a size of 55 mm × 85 mm and a thickness of 760 μm could be obtained using the card punching machine shown in FIG.
"Details of materials used in IC card issuing equipment"
<Creation of bibliographic information and identification information materials>
Using the thermal transfer recording ink sheet 1 and the surface protective layer transfer foil 1 described below, the IC card issuance apparatus shown in FIG. 23 was used to record bibliographic information and identification information, thereby producing an IC card.
[Sublimation type thermal transfer recording ink sheet preparation 1 and recording method]
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.

Bibliographic information and identification information are recorded on the card by superimposing the ink side of the ink sheet for sublimation type thermal transfer recording using a thermal head from the ink sheet side and an output of 0.23 W / dot, pulse width of 0.3 to A person image having gradation was able to be formed on the image by heating under conditions of 4.5 milliseconds and a dot density of 16 dots / mm.
<Coating liquid for yellow ink layer formation>
Yellow dye (MSY Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts by weight Polyvinyl acetal 5.5 parts by weight [manufactured by Denki Kagaku Kogyo Co., Ltd .: Denka Butyral KY-24]
Polymethyl methacrylate-modified polystyrene 1 part by weight [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 parts by weight [Dainipei Chemical Industry Co., Ltd .: Dialomer SP-2105]
Methyl ethyl ketone 70 parts by weight Toluene 20 parts by weight <Coating liquid for forming a magenta ink layer>
Magenta dye
(MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts by weight Polyvinyl acetal 5.5 parts by weight [manufactured by Denki Kagaku Kogyo Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 2 parts by weight [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 parts by weight [Dainipei Chemical Industry Co., Ltd .: Dialomer SP-2105]
Methyl ethyl ketone 70 parts by weight Toluene 20 parts by weight <Cyan ink layer forming coating solution>
Cyan dye
(Nippon Kayaku Co., Ltd. Kayaset Blue 136) 3 parts by weight Polyvinyl acetal 5.6 parts by weight [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethyl methacrylate-modified polystyrene 1 part by weight [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 parts by weight [Dainipei Chemical Industry Co., Ltd .: Dialomer SP-2105]
Methyl ethyl ketone 70 parts by weight Toluene 20 parts by weight (Preparation of ink sheet for melt-type thermal transfer recording (for image-receiving layer surface fusion printing))
[Melting type thermal transfer recording ink sheet preparation 1 and recording method]
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.

Bibliographic information and identification information are recorded on the card by superimposing the ink side of the ink sheet for melt-type thermal transfer recording on the ink sheet side using a thermal head and outputting 0.5 W / dot, pulse width 1.0 ms. Character information could be formed by heating at a dot density of 16 dots / mm.
<Ink layer forming coating solution>
Carnauba wax 1 part by weight Ethylene vinyl acetate copolymer 1 part by weight [Mitsui DuPont Chemical Co., Ltd .: EV40Y]
Carbon black 3 parts by weight Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamorol 521] 5 parts by weight Methyl ethyl ketone 90 parts by weight <Preparation of card surface protective transfer foil>
The surface protection transfer foil 1 described below was used to protect the surface of the card with an IC card issuing device.
[Synthesis of resin using surface protective layer]
In a three-necked flask under a nitrogen stream, 73 parts of methyl methacrylate, 15 parts of styrene, 12 parts of methacrylic acid, 500 parts of ethanol, and 3 parts of α, α'-azobisisobutyronitrile were placed at 80 ° C. in a nitrogen stream. For 6 hours in an oil bath. Thereafter, 3 parts of triethylammonium chloride and 1.0 part of glycidyl methacrylate were added and reacted for 3 hours to obtain a synthetic binder 1 of the desired acrylic copolymer.
<Creation of surface protection transfer foil 1>
(Release layer forming coating solution) Film thickness 0.2 μm
Polyvinyl alcohol (GL-05) (manufactured by Nippon Synthetic Chemical Co., Ltd.) 10 parts by weight water 90 parts by weight
The release layer was coated under a drying condition of 90 ° C./30 sec.
(Actinic ray curable compound) Film thickness 7.0 μm
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts by weight Reaction initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts by weight Synthetic binder 1 48 parts by weight Dainippon Ink Surfactant F-179 0.25 parts by weight Toluene 500 parts by weight The applied actinic ray curable compound was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mJ / cm ² ).
<Intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts by weight
Tuftex M-1913 (Asahi Kasei) 5 parts by weight curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts by weight Methyl ethyl ketone 90 parts by weight After curing, curing of the curing agent was carried out at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts by weight
Polyacrylic acid ester copolymer [Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts by weight
45 parts by weight of water After applying 45 parts by weight of ethanol, drying was performed at 70 ° C./30 sec.

Furthermore, on the image receptor or transparent resin layer in which images and characters are recorded, the scale pigment-containing layer is heated to a surface temperature of 200 ° C. using the actinic ray curable transfer foil 1 having the above-described configuration, and has a diameter of 5 cm and a rubber hardness of 85 Transfer was performed by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a heat roller.
"Evaluation methods"
<Repeated bending test>
Using a sag test device of JIS K6404-6, the chip was clamped and repeatedly bent 100 times with an amplitude of 50 mm, a gap of 30 mm, and 120 times / minute. Operation, deformation, and damage were confirmed after the test.
◎ ... No change without deformation / peeling ○ ... No problem with deformation / peeling but trace remains Δ ... No peeling damage but deformed × ... Deformation / peeling damage <Point Pressure strength test>
A 1 kg load was applied 200 times on a rubber sheet having a hardness of 50 on each of the circuit surface and non-circuit surface of the IC chip with a steel ball having a tip diameter of 1 mm. Operation, deformation, and damage were confirmed after the test.
◎ ... No change without deformation / peeling ○ ... No problem with deformation / peeling but trace remains Δ ... No peeling damage but deformed × ... Deformed / damaged <Impact test >
Using a falling impact tester of JIS K5600-5-3, firmly hold the card from above and below so that the IC chip is centered on a cradle with a hole with an inner diameter of 27 mm, tip diameter 20 mm, weight A 100 g weight (S45C steel) was dropped freely onto the IC chip at the center of the cradle from a height of 10 cm. Operation, deformation, and damage were confirmed after the test.
◎ ... No change without deformation / peeling ○ ... No problem with deformation / peeling but trace remains Δ ... No peeling damage but deformed × ... Deformation / peeling damage <Print Sex>
Sublimation images were printed on the cards created, and the degree of blur was evaluated.
◎ ・ ・ ・ Can print without problems ○ ・ ・ ・ Some levels can be discriminated, but can be discriminated △ ・ ・ ・ Partial density has fallen and cannot be discriminated ×× Color is completely missing Table 1 shows examples and Table 2 shows the results.
(table 1)
<IC module>

(Table 2)

  The present invention is applied to a contactless electronic card that stores personal information or the like that requires safety (security) such as forgery and alteration prevention, or an IC card suitable for application to a sheet and an IC card manufacturing method. Can improve durability, and improve surface quality at a high level.

FIG. 1A is a diagram showing a layer structure of an IC card, and FIG. 2B is a plan view of an IC chip portion. It is a figure which shows the layer structure of an IC card. FIG. 1A is a diagram showing a layer structure of an IC card, and FIG. 2B is a plan view of an IC chip portion. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. FIG. 1A is a diagram showing a layer structure of an IC card, and FIG. 2B is a plan view of an IC chip portion. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows the layer structure of an IC card. It is a figure which shows embodiment of an IC card production apparatus. It is a figure which shows embodiment of an IC card production apparatus. It is a figure which shows embodiment of an IC card production apparatus. It is a figure which shows embodiment of an IC card production apparatus. It is a figure which shows embodiment of an IC card production apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st sheet member 2 2nd sheet member 3 IC module 3a IC chip 3b Reinforcement structure 3c Antenna 4a, 4b IC card adhesive 20, 22, 23, 24, 25 Foam resin

Claims (11)

In a predetermined position between the first sheet member and the second sheet member facing each other, an IC chip, a reinforcing structure adjacent to the IC chip, and a component including an IC module including an antenna are arranged with an IC card adhesive interposed therebetween. In IC card,
A foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 is provided so as to be adjacent to any one member of the reinforcing structure and the IC chip. IC card to do. In a predetermined position between the first sheet member and the second sheet member facing each other, an IC chip, a reinforcing structure adjacent to the IC chip, and a component including an IC module including an antenna are arranged with an IC card adhesive interposed therebetween. In IC card,
An IC card, wherein the connecting adhesive for connecting the reinforcing structure and the IC chip is a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222. The 2% elastic modulus of the IC card adhesive is 1 kg / mm ² or more and 90 kg / mm ² or less, and the elongation at break is 200% or more and 1300% or less. IC card. Provided in the order of the adhesion layer, the reinforcing structure on the opposite side of the circuit surface of the IC chip,
The circuit surface side of the IC chip is
A bump electrically connected to the antenna formed on the module support;
It is made of a material satisfying either a resin component having a 2% elastic modulus of 0.05 to 80 kg / mm ² or a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222. The IC card according to any one of claims 1 to 3, wherein the IC card is an adhesive.   5. The IC card according to claim 1, wherein a thickness of the IC chip is 5 μm or more and 120 μm or less.   An image receiving layer is provided on at least one of the surfaces of the first sheet member and the second sheet member facing each other, personal identification information including a name and a face image is provided on the image receiving layer, and a writing layer capable of writing is provided on the other. The IC card according to any one of claims 1 to 5, wherein:   The IC card according to any one of claims 1 to 6, wherein the IC card adhesive is a reactive adhesive. A part including an IC chip, an IC module including an IC chip, a reinforcing structure adjacent to the IC chip, and an antenna is disposed at a predetermined position between the first sheet member and the second sheet member facing each other with an adhesive interposed therebetween. An IC card manufacturing method according to any one of claims 1 to 7,
For foaming, after forming a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 so as to be adjacent to any one member of the reinforcing structure and the IC chip A method for producing an IC card, which is foamed by the energy of In a predetermined position between the first sheet member and the second sheet member facing each other, an IC chip, a reinforcing structure adjacent to the IC chip, and a component including an IC module including an antenna are arranged with an IC card adhesive interposed therebetween. It is a manufacturing method of the IC card according to any one of claims 1 to 7,
For foaming, after forming a foamed resin having a bulk density of 0.03 to 0.95 g / cm ^{3 as} measured by JISK-7222 so as to be adjacent to any one member of the reinforcing structure and the IC chip A method for producing an IC card, wherein foaming is performed using the energy of, and molding is further performed using a flat plate press or a roll press.   An image receiving layer is provided on at least one of the surfaces of the first sheet member and the second sheet member facing each other, personal identification information including a name and a face image is provided on the image receiving layer, and a writing layer capable of writing is provided on the other side. An IC card manufacturing method according to claim 8 or 9, wherein: The method for manufacturing an IC card according to claim 8, wherein the IC card adhesive is a reactive adhesive.