JP2006209278A - Ic card manufacturing method and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce costs, increase productivity and improve environmental friendliness. <P>SOLUTION: An antenna base 100 having in advance a metal thin film layer 104 on an antenna support 101 is half-cut to form an antenna shape into layers at least excluding the antenna support 101 and including the metal thin film layer 104. Only an antenna part 110 half-cut in the antenna shape is transferred to a card base 120. An IC chip is connected to the transferred antenna part 110 to create an IC module 113. A cover sheet 140 is attached over the IC module 113. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card manufacturing method and an IC card suitable for application to an IC card that stores personal information or the like that requires safety (security) such as forgery and alteration prevention.

  Conventionally, magnetic cards for recording data by a magnetic recording method have been widely used for identification cards (ID cards) and credit cards. However, since data can be rewritten relatively easily in a magnetic card, data falsification is not sufficiently prevented, it is susceptible to external influences due to magnetism, data protection is insufficient, and recording capacity is small. There were problems such as.

  Some ID cards have, for example, a face layer and description information on the front surface and a writing layer on the back surface that can be filled in with a writing tool or the like. Such ID cards can be made easily and inexpensively due to recent advances in sublimation printing technology, and have been rapidly spread over the past few years, but have not yet been fully spread.

  An IC chip is built in the ID card, and the high cost is cited as the biggest impediment factor that has not yet spread in earnest. Moreover, since it does not spread, it cannot be mass-produced and becomes expensive, and since it is expensive, it has entered a vicious cycle.

  On the other hand, the quantitative problem is partly due to the fact that the technology for stably and inexpensively producing cards has not yet been established. As a conventional IC card production method, for example, there is a comparatively thick thickness, an IC component and a wireless antenna are housed in a cover made of upper and lower resin molds, and the joint surface of the upper and lower covers is melted by heat. A sheet created by bonding or by cutting a groove in a sheet material, housing an IC component and a radio antenna in the groove, sealing it with resin, and a sheet for holding an image receiving layer thereon Some are created by bonding materials. As a wireless antenna, a metal foil made of copper or aluminum material is made into an antenna shape by dissolving it with an etching treatment liquid, an antenna shape made by printing ink mixed with carbon particles or silver particles in a resin, Many are made by winding a copper wire into an antenna coil.

  Various attempts have been made to disseminate IC cards safely in large quantities at low cost. However, while being used for various purposes and becoming widespread, it has been necessary to devise an environment-friendly device that is cheaper and more productive. However, the method of creating an antenna shape by printing ink in which carbon particles or silver particles are mixed with resin is relatively high in productivity for printing, but silver particles are expensive, and carbon ink is inexpensive. However, since the ink used for printing contains a resin or the like as a binder in addition to the particles, there is a drawback that the electrical performance as an antenna for an IC module whose capacity is increased in recent years is low.

About what was created by winding a copper wire in the shape of an antenna coil, for example, as disclosed in Japanese Patent Application Laid-Open No. 2002-74298, a thin metal wire wound in a ring shape on the same surface is used. .
JP 2002-74298 (page 1 to page 7, FIGS. 1 to 5)

  Although the thing of patent document 1 is comparatively superior in the electrical performance compared with the said 2 system, it is necessary to wind one by one in the shape of an antenna coil, and the improvement of productivity is required. The method of creating an antenna shape by dissolving copper or aluminum metal foil into an antenna shape with an etching solution requires the use of a strong alkaline solution or a strong acid solution, which not only increases the size of the manufacturing facility but also reduces productivity. In recent years, changes in awareness of the environment, which is a global trend, are becoming difficult to handle. As various improvements, a method of re-transferring the antenna without using the etching solution has been proposed. However, simply re-transferring the antenna does not produce a clear transfer such as burrs on the metal antenna. However, there is a problem in that the shorted antenna is in contact with the adjacent antenna and short-circuited.

  The present invention has been made in view of this point, and an object of the present invention is to provide an IC card manufacturing method and an IC card that are inexpensive, have high productivity, and can improve environmental suitability.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

Invention of Claim 1 uses the antenna base material which provided the metal thin film layer beforehand on the antenna support body,
Leaving at least the antenna support, half-cutting the layer including the metal thin film layer into an antenna shape,
Only the antenna part obtained by half-cutting into the antenna shape is transferred to the card substrate,
Create an IC module by connecting an IC chip to the transferred antenna part,
An IC card manufacturing method, wherein a cover sheet is pasted on the IC module.

  The invention according to claim 2 is characterized in that the antenna substrate has a structure in which a release layer, an adhesive layer, a metal thin film layer, and an adhesive layer are provided in this order on an antenna support in advance. 1. The IC card manufacturing method according to 1.

  According to a third aspect of the present invention, there is provided the IC card manufacturing method according to the first or second aspect, wherein the transfer is performed by pressing and heating substantially the same as the antenna shape.

The invention according to claim 4 is an antenna part obtained by half-cutting a layer including a metal thin film layer into an antenna shape while leaving at least the antenna support of the antenna substrate,
A card substrate to which only the antenna portion is transferred;
An IC module created by connecting an IC chip to the transferred antenna portion;
An IC card comprising: a cover sheet affixed on the IC module.

  With the above configuration, the present invention has the following effects.

  According to the first and fourth aspects of the present invention, an antenna base material in which a metal thin film layer is previously provided on an antenna support is used, at least the antenna support is left, and the layer including the metal thin film layer is formed into an antenna shape. Only the antenna part obtained by half-cutting and half-cutting into the antenna shape can be transferred to the card substrate without burrs, and there is no problem of short-circuiting with adjacent antennas. In addition, by connecting an IC chip to the transferred antenna part to create an IC module and attaching a cover sheet on the IC module, the metal thin film layer does not require wet processing such as etching, simplifying the equipment, The card configuration can be simplified, and it is inexpensive, has high productivity, and can improve environmental suitability.

  According to the invention described in claim 2, the antenna substrate has a structure in which a release layer, an adhesive layer, a metal thin film layer, and an adhesive layer are provided in this order on the antenna support in advance, and includes the metal thin film layer. The layer is half-cut into an antenna shape, and only the antenna portion obtained by half-cutting into the antenna shape can be transferred to the card substrate without burr.

  According to the third aspect of the present invention, only the antenna portion can be transferred to the card base material without any burrs by transferring it by applying pressure and heating substantially the same as the antenna shape.

  Hereinafter, an IC card manufacturing method and an IC card according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  FIG. 1 is a diagram showing a layer structure and a manufacturing method of an IC card, FIG. 2 is a diagram showing a state of half-cutting into an antenna shape, FIG. 3 is a diagram showing a state where only the antenna portion is transferred to a card substrate, and FIG. FIG. 5 is a diagram showing the transferred antenna portion, FIG. 5 is a diagram showing a state in which an IC chip is connected to the antenna portion, and FIG. 6 is a diagram showing a state in which a cover sheet is pasted on the IC module.

  In this embodiment, the antenna substrate 100 has a configuration in which a release layer 102, an adhesive layer 103, a metal thin film layer 104, an intermediate layer 105, and an adhesive layer 106 are provided in this order on an antenna support 101 in advance. As shown in FIG. 2, the antenna substrate 100 is placed on the punched underlay 200 and the punching blade 201 is pressed in the direction of the punched underlay 200 from above. With this punching blade 201, the antenna substrate 100 leaves at least the antenna support 101, and the antenna portion 110 is obtained by half-cutting the layer including the metal thin film layer 104 into an antenna shape.

  Next, as shown in FIG. 3, only the antenna region is transferred to the card substrate 120. The card substrate 120 has a card support 120a and an image receiving layer 120b. This transfer is performed by applying transfer rolls 130 and 131 having projections and depressions approximately the same as the antenna in advance, and applying pressure and heating in substantially the same manner as the antenna. As shown in FIG. 4, only the antenna area is carded. Transfer can be performed without burr on the substrate 120.

  Then, as shown in FIG. 5, the IC chip 111 is connected to the transferred antenna region portion, and the reinforcing structure 112 is connected to the IC chip 111 to create the IC module 113. A cover sheet 140 is attached on the IC module 113. The cover sheet 140 includes a sheet support 140a, a writing layer 140b, and an adhesive layer 140c.

  The present invention uses an antenna substrate 100 in which a metal thin film layer 104 is previously provided on an antenna support 101, leaves at least the antenna support 101, and half-cuts the layer including the metal thin film layer 104 into an antenna shape, thereby creating an antenna shape. Only the antenna region obtained by half-cutting can be transferred to the card substrate 120 without any burrs, and there is no problem of short-circuiting with adjacent antennas. Further, the IC chip 111 is connected to the transferred antenna region portion to create the IC module 113, the cover sheet 140 is pasted on the IC module 113, and the metal thin film layer does not require wet processing such as etching. Simplification and card configuration can be simplified, and it is inexpensive, has high productivity, and can improve environmental suitability.

  Next, the configuration of the present invention will be described in detail.

<Antenna substrate>
The antenna substrate can be used without any particular limitation. As the antenna support, a resin sheet such as polyester resin, polyethylene naphthalate (PEN), ABS resin, polyimide resin, vinyl chloride resin, thermal transfer paper, fine paper, art paper, paper such as coated paper, and the like can be used. .

  The metal thin film layer as the antenna material preferably has high electrical performance, and is preferably made of a metal foil. As the metal foil, at least one selected from aluminum foil, copper foil, stainless steel foil, titanium foil, tin foil and the like can be used. Among these, it is most preferable to use an aluminum foil from the viewpoints of economy, versatility, and reliability. Here, the aluminum foil is not limited to pure aluminum foil, but also includes aluminum alloy foil.

  It is preferable to use an adhesive when the metal foil is provided on the antenna support. As the adhesive, a generally used resin material can be used without limitation. Use of synthetic rubbers such as epoxy, urethane, silicone, cyanoacrylate, nitrile rubber, UV curable, hot melt, anaerobic, cellulose adhesive, vinyl acetate adhesive, etc. it can. These adhesives can be used alone or in combination. Preferably, urethane or epoxy adhesive is used. More preferably, an elastic epoxy adhesive is used.

In order to perform transfer, it is preferable to provide a release layer between the antenna support and the adhesive. As the release layer, resins such as acrylic resins having a high glass transition temperature, polyvinyl acetal resins, poly vinyl butyral resins, waxes, silicone oils, fluorine compounds, water-soluble polyvinyl pyrrolidone resins, polyvinyl alcohol resins, Si-modified Polyvinyl alcohol, methyl cellulose resin, hydroxy cellulose resin, silicone resin, paraffin wax, acrylic modified silicone, polyethylene wax, resin such as ethylene vinyl acetate, and other polydimethylsiloxane and modified products such as polyester modified silicone, acrylic modified Oils and resins such as silicone, urethane modified silicone, alkyd modified silicone, amino modified silicone, epoxy modified silicone, polyether modified silicone, Other This cured product, and the like. Other fluorinated compounds include fluorinated olefins and perfluorophosphate ester compounds. Preferred olefinic compounds include dispersions such as polyethylene and polypropylene, and long-chain alkyl compounds such as polyethyleneimine octadecyl. These release agents having poor solubility can be used after being dispersed. The thickness of the release layer is not particularly limited, but is preferably 0.000 g / m ^{2 to} 3.00 g / m ² , more preferably 0.000005 g / m ^{2 to} 2.00 g / m. m ² , more preferably 0.00001 g / m ^{2 to} 2.00 g / m ² .

  The adhesive layer provided on the metal thin film layer is preferably a thermal adhesive. As heat sticking resin, ethylene vinyl acetate resin, ethyne ethyl acrylate resin, ethylene acrylic acid resin, ionomer resin, polybutadiene resin, acrylic resin, polystyrene resin, polyester resin, olefin resin, urethane resin, tackifier (for example, phenol resin, Rosin resin, terpene resin, petroleum resin, etc.) and their copolymers and mixtures.

  Specifically, as a urethane-modified ethylene ethyl acrylate copolymer, Hitech S-6254, S-6254B, S-3129 and the like manufactured by Toho Chemical Industry Co., Ltd. are commercially available, and as a polyacrylic acid ester copolymer, Japan. Jurimer AT-210, AT-510, AT-613 manufactured by Junyaku Co., Ltd., plus size L-201, SR-102, SR-103, J-4, etc. manufactured by Kyoyo Chemical Industry Co., Ltd. are commercially available. Yes. The weight ratio of the urethane-modified ethylene ethyl acrylate copolymer and the polyacrylic acid ester copolymer is preferably 9: 1 to 2: 8, and the thickness of the adhesive layer is preferably 0.1 to 1.0 μm. Moreover, you may contain additives, such as a ultraviolet absorber or antioxidant mentioned later of this below-mentioned layer, antioxidant, a light stabilizer, and an antistatic agent.

<Half cut of metal thin film layer>
As the half-cut method, a known method can be used without particular limitation.

<Card base material and cover sheet>
Examples of the card support for the card base and the sheet support for the cover sheet include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, and polyolefin resins such as polyethylene, polypropylene, and polymethylpentene. , Polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, and other polyfluorinated ethylene resins, nylon 6, nylon 6.6, and other polyamides, polyvinyl chloride, vinyl chloride / Vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, vinyl polymers such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable Biodegradable resins such as lilactic acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, biodegradable polycaprolactone, cellulose resins such as cellulose triacetate, cellophane, methyl polymethacrylate, ethyl polymethacrylate, Acrylic resins such as polyethyl acrylate and polybutyl acrylate, synthetic resin sheets such as polystyrene, polycarbonate, polyarylate, and polyimide, or paper such as fine paper, thin paper, glassine paper, sulfate paper, and metal foil A layered body or a laminate of two or more layers is mentioned.

  The thickness of the card support of the card substrate of the present invention and the sheet support of the cover sheet is 30 to 300 μm, preferably 50 to 200 μm. It is a problem that wrinkles or the like are caused at the time of bonding of 50 μm or less.

  In this invention, the thermal contraction rate at 150 ° C./30 min obtained by adding a white pigment to improve the concealing property or by performing an annealing treatment to reduce the thermal contraction rate is vertical (MD It is preferable to use a base material of 1.2% or less in lateral and 0.5% or less in lateral (TD). It has been confirmed that the post-processing described above becomes difficult due to the shrinkage of the support which is 1.2% or more in the longitudinal (MD) and 0.5% or more in the transverse (TD). Further, an easy-contact process may be performed on the support for post-processing to improve adhesion, and an antistatic process may be performed for chip protection.

  Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

[Image receiving layer]
The card base is preferably provided with an image receiving layer and a cushion layer in order to form a face image of the card user. It is preferable that an image element is provided on the surface of the card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing is provided.

  As the image receiving layer, a known resin can be used. For example, polyvinyl chloride resin, copolymer resin of vinyl chloride and other monomers (for example, isobutyl ether, vinyl propionate, etc.), polyester resin, poly (meth) Acrylic ester, polyvinyl pyrrolidone, polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl alcohol, polycarbonate, cellulose triacetate, polystyrene, copolymer of styrene and other monomers (for example, acrylic ester, acrylonitrile, ethylene chloride, etc.) , Vinyl toluene acrylate resin, polyurethane resin, polyamide resin, urea resin, epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, and modified products thereof. Preferred are polyvinyl chloride resin, copolymers of vinyl chloride and other monomers, polyester resins, polyvinyl acetal resins, polyvinyl butyral resins, copolymers of styrene and other monomers, epoxy Resin.

[Cushion layer]
As a material for forming the cushion layer, photocurable resins and polyolefins described in Japanese Patent Application No. 2001-1693 are preferable. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block A copolymer, a styrene-hydrogenated isoprene-styrene block copolymer, a polybutadiene having flexibility and low thermal conductivity is suitable.

  The cushion layer means a soft resin layer that is located between the support and the image receiving layer that receives an image, and that plays a role of mitigating the effects of unevenness caused by electronic components such as an IC module. The cushion layer is not particularly limited as long as it has a cushion layer between the image receiving layer and the electronic component, but it is particularly preferable that the cushion layer is formed by being coated or bonded on one or both sides of the support.

[Writing layer]
The writing layer is a layer that allows writing on the back surface of the IC card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. The writing layer is formed on the surface of the sheet support on which the plurality of layers are not laminated.

<IC chip>
The IC chip and loop antenna can be joined using conductive adhesives such as silver paste, copper paste and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). It is known to use industrial anisol or the like) or to perform solder bonding, but any method may be used.

  The IC chip is preferably one that has been polished to reduce the thickness of the semiconductor wafer. This polishing process is performed by mechanically polishing the back surface opposite to the circuit forming surface after forming a circuit pattern on the surface of the semiconductor wafer. In the case of this invention, it is preferable to perform dry etching or chemical etching after mechanical polishing. Dry etching includes etching using fine particles in addition to etching using general gas plasma, ions, or laser. For example, plasma etching, reactive ion etching, ion milling, sandblast laser processing, and the like are included in dry etching. Chemical etching is performed using a chemical solution such as hydrofluoric acid or nitric acid.

  When the thickness of the IC chip is 190 μm or less, the unevenness after card formation becomes small, and the information recording property by the thermal transfer method is excellent. More preferably, it is 100 μm or less. Similarly, the maximum thickness of the inlet after the IC chip is installed is 400 μm or less, and the information recording property by the thermal transfer system is excellent.

  In the present invention, the reinforcing structure is fixed to the IC chip in order to improve the durability of the IC chip. The reinforcing structure is preferably excellent in mechanical strength. If the reinforcing structure is made thicker to ensure strength, the card thickness becomes thicker and the surface printability and the like are lowered, so that the reinforcing structure is preferably a high-strength material. Metals, ceramics, carbon fibers, glass fibers, aramid fibers, high elastic resins, etc. are raised. One or more composite materials selected from these may be used. In particular, a material having a Young's modulus of 100 GPa or more is preferably used for the main structure. The thickness is 10 to 300 μm, preferably 30 to 200 μm, and more preferably 50 to 150 μm. The shape of the reinforcing structure can be used as appropriate as long as it does not contradict the gist of the present invention. In the present invention, a reinforcing structure shape having a curved surface that matches the curve of the IC chip is preferable. The reinforcing structure shape may be formed by a single member or a plurality of members.

<Antenna transfer>
In the case of a normal temperature adhesive, the antenna transfer from the antenna substrate to the card substrate can be performed by a pressure application device such as a pressure roller or a stamper. Preferably, the transfer can be performed using a thermal adhesive and a means capable of applying pressure while heating, such as a thermal head, a heat roller, or a hot stamp machine. For example, specifically, when using a hot stamping machine, the surface temperature is heated to 150 to 300 ° C., and heat is applied at a pressure of 50 to 500 kg / cm ² for 0.5 to 10 seconds using a heat roller having a diameter of 5 cm and a rubber hardness of 85. Can be transferred.

[Adhesive between cover sheet and card substrate]
The cover sheet and the card substrate are preferably integrated via an adhesive that forms an adhesive layer. As the adhesive, a generally used resin can be used without limitation. Use of synthetic rubbers such as epoxy, urethane, silicone, cyanoacrylate, nitrile rubber, UV curable, hot melt, anaerobic, cellulose adhesive, vinyl acetate adhesive, etc. it can. These adhesives can be used alone or in combination. Preferably, the hot melt adhesive can be dispersed, and the main component of the hot melt adhesive is, for example, ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, polyolefin. Etc.

  However, if the card base is easily warped, or if the card surface is provided with a layer that is vulnerable to high-temperature processing such as an image-receiving layer for image formation by thermal transfer, the card may be damaged or pasted at high temperatures. In the case of bonding through an adhesive from the problem that the base material undergoes thermal shrinkage and the like and the positional accuracy at the time of bonding deteriorates, it is preferable to bond at 80 ° C. or lower, and more preferably 10 to 80 ° C. More preferably, it is 20-80.

  Among the low temperature adhesives, specifically, a reactive hot melt adhesive is preferable. A reactive hot melt adhesive (hereinafter referred to as reactive adhesive) is a type of adhesive in which a resin is melted and bonded, and then the moisture is absorbed to cure the resin. Its characteristics are that it has a curing reaction compared to normal hot melt, has a long bonding time, and has a high softening temperature after bonding, so it has high durability and is suitable for processing at low temperatures. Is mentioned. As an example of the reactive adhesive, there is one in which an isocyanate group-containing urethane polymer is a main component at a molecular end, and this isocyanate group reacts with moisture to form a crosslinked structure. Examples of reactive adhesives that can be used in the present invention include TE030 and TE100 manufactured by Sumitomo 3M, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bond Master 170 series manufactured by Kanebo UESC, and Macroplast QR 3460 manufactured by Henkel.

  Moisture curable materials as reactive hot melt adhesives are disclosed in JP 2000-036026, JP 2000-211985, JP 2000-21278, JP 2000-21855, and Japanese Patent Application 2000-369855. JP-A-10-316959, JP-A-11-5964 and the like are disclosed as photocurable adhesives. Any of these adhesives may be used, and it is preferable to use a material that is not limited in the present invention.

  The film thickness of the adhesive is preferably 10 to 600 μm, more preferably 10 to 500 μm, and still more preferably 10 μ to 450 μm in terms of the thickness including the electronic component of the IC module within the scope of the present invention.

<Attaching method of cover sheet>
As a manufacturing method for integrating the cover sheet and the card substrate of the present invention, a heat bonding method, an adhesive bonding method, and an injection molding method are known, but they may be bonded by any method. In addition, the cover sheet and the card substrate may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, inkjet method, sublimation. It can be formed by any method such as a transfer method, an electrophotographic method, and a heat melting method.

  The IC card manufacturing method of the present invention includes at least a step of previously providing a metal thin film layer on an antenna substrate, a step of half-cutting a layer including the metal thin film layer leaving at least the substrate into an antenna shape, and only the antenna portion A step of transferring an IC card to a card substrate, a step of connecting an IC module to the transferred metal thin film antenna portion, and a step of providing an adhesive member on the cover sheet that is a solid or viscous body at room temperature and softens in the heated state And bonding the cover sheet onto the IC module.

  The adhesive member that softens in the heated state of the solid or viscous body is preferably formed by bonding the adhesive itself with a method of forming and forming the adhesive itself in a sheet form by heating or melting at room temperature and injection molding.

  The temperature at which the cover sheet and the card substrate can be bonded is preferably 80 ° C. or less, more preferably 0 to 80 ° C., and still more preferably 20 ° C. to 70 ° C. It is preferable to provide a cooling step in order to reduce warping or the like of the IC card after bonding. The cooling temperature is preferably 70 ° C. or lower, more preferably −10 to 70 ° C., still more preferably 10 to 60 ° C.

At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the card base material and the adhesion between the cover sheet and the card base material, and it is preferable to manufacture by a top and bottom press method, a laminate method, etc. In consideration of cracks in IC parts, it is preferable to use a flat press die that avoids a roller that is close to line contact and that exerts an unreasonable bending force even with slight displacement. The heating is preferably 10 to 120 ° C, more preferably 30 to 100 ° C. The pressurization is preferably 0.1 to 300 kgf / cm ² , more preferably 0.1 to 100 kgf / cm ² . An IC chip having a higher pressure is damaged. The heating and pressurizing time is preferably 0.1 to 180 sec, more preferably 0.1 to 120 sec.

  The bonded single-wafer sheet or continuous coating lami roll formed as a continuous sheet by the adhesive bonding method or the resin injection method records an authentication identification image and bibliographic items after being allowed to stand for a predetermined curing time of the adhesive. Alternatively, it may be formed into a predetermined card size thereafter. As a method of forming a predetermined card size, a punching method, a cutting method, or the like is mainly selected.

<Image forming method of IC card>
The face image forming method is not particularly limited, but is usually a full-color image having gradation, and is produced by, for example, a sublimation type thermal transfer recording method or a silver halide color photographic method. The character information image is a binary image, and is produced by, for example, a melt type thermal transfer recording system, a sublimation type thermal transfer recording system, a silver halide color photographic system, an electrophotographic system, an ink jet system, or the like. In the present invention, it is preferable to record an authentication identification image such as a face image and an attribute information image by a sublimation type thermal transfer recording method.

  The attribute information includes name, address, date of birth, qualification, etc., and the attribute information is usually recorded as character information, and a melt type thermal transfer recording method is generally used. Format printing or information recording may be performed. By any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, heat melting method, etc. Can be formed.

  Further, for the purpose of preventing forgery and alteration, watermark printing, holograms, fine patterns, etc. may be employed. Anti-counterfeiting anti-counterfeiting layer is selected from printed materials, holograms, barcodes, matte patterns, fine patterns, ground patterns, concavo-convex patterns, etc., visible light absorbing colorant, ultraviolet absorbing material, infrared absorbing material, fluorescent whitening material, metal It consists of a vapor deposition layer, a glass vapor deposition layer, a bead layer, an optical change element layer, a pearl ink layer, an adjacent pigment layer, and the like.

[Example]
Examples of the present invention will be described below.

  An antenna substrate provided with a metal thin film was prepared.

  As shown below, 10 μm of moisture-curable hot melt adhesive is provided on a transparent polyethylene terephthalate film having a thickness of 50 μm provided with a release layer, and a metal thin film layer made of an aluminum thin film having a thickness of 30 μm is transferred and integrated. An intermediate layer and an adhesive layer were provided in this order.

Next, the following intermediate layer and adhesive layer were provided on the aluminum thin film.
(Release layer) Film thickness 0.2 g / m ²
Anionic surfactant (Adeka Coal CC-36, manufactured by Asahi Denka) 1 part polyvinyl alcohol (GL-05)
(Nippon Synthetic Chemical Co., Ltd.) 9 parts Water 90 parts The release layer was coated under a drying condition of 90 ° C./30 sec.
(Hot melt adhesive)
Macroplast QR3460 (2% elastic modulus 15 kg / mm ² , moisture-curing adhesive) manufactured by Henkel was used.
<Intermediate layer> Film thickness 2μm
Polyvinyl butyral resin [Sekisui Chemical Co., Ltd. product: ESREC BX-1]
5 parts Tuftex M-1913 (Asahi Kasei) 3 parts curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane]
90 parts of 2 parts methyl ethyl ketone After curing, the curing agent was cured at 50 ° C. for 24 hours.
<Adhesive layer> Film thickness 0.5μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts Application Thereafter, drying was performed at 70 ° C./30 sec.

  Next, only the metal thin film layer of the antenna substrate was half-cut as shown in FIG. 1 using a punching blade. This was cut into a strip having a width of 60 mm to obtain an antenna substrate.

  Next, a card substrate was prepared as follows.

Card substrate;
A white polyester sheet having a thickness of 125 μm was used.

The first image-receiving layer-forming coating solution, the second image-receiving layer-forming coating solution, and the third image-receiving-layer-forming coating solution having the following composition are applied in this order to the surface of the <card base material> 125 μm subjected to corona discharge treatment. The image receiving layer was formed by drying and laminating | stacking so that each thickness might be 0.2 micrometer, 2.5 micrometer, and 0.5 micrometer. This was cut into a strip having a width of 60 mm to obtain a card substrate.
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part water 90 parts (format printing)
The logo and OP varnish were sequentially printed by the resin letterpress printing method.

Next, using a hot stamping machine, heating to a surface temperature of 150 ° C., and using a heat roller with an uneven shape of an antenna having a diameter of 5 cm and a rubber hardness of 85, according to the antenna position of the antenna substrate that has been half-cut in advance. Transfer was performed by applying heat at a pressure of 100 kg / cm ² for 1 second, and only the half-cut antenna portion was transferred again to the card substrate using a transfer roll.

  Next, an IC chip with a thickness of 50 μm is flip-chip bonded to the antenna using an adhesive tape for underfill (Hitachi Chemical Industries; UF511), and then a 150 μm thick reinforcing plate made of SUS304 is provided on the surface opposite to the circuit surface of the IC chip. An elastic epoxy adhesive (manufactured by Toho Kasei; Ultite 1540 set) was bonded to a thickness of 10 μm.

  Next, a moisture curable adhesive was provided in a thickness of 450 μm and attached to the IC card cover sheet prepared as follows.

(Creating a cover sheet)
As the cover sheet, a white polyester sheet having a thickness of 125 μm was used. The first writing layer forming coating solution, the second writing layer forming coating solution and the third writing layer forming coating solution having the following composition are applied and dried in this order on the corona discharge-treated surface, and the respective thicknesses are determined. The writing layer was formed by laminating so as to be 5 μm, 15 μm, and 0.2 μm. This was cut into a strip having a width of 60 mm to obtain a cover sheet.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second writing layer forming coating solution>
4 parts of polyester resin [Toyobo Co., Ltd .: Bironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts FIG. 7 shows an example of an IC card manufacturing apparatus.

  The IC card manufacturing apparatus 209 is provided with a feed shaft 210 that feeds the cover sheet 140, and the cover sheet 140 fed from the feed shaft 210 is supplied to the guide roller 211 and the drive roller 212. An applicator coater 213 is disposed between the delivery shaft 210 and the guide roller 211. The applicator coater 213 applies the adhesive to the sheet with a predetermined thickness.

  Further, the IC card manufacturing apparatus 209 is provided with a delivery shaft 214 that feeds out the card base 120, and the card base 120 delivered from the delivery shaft 214 is supplied over the guide roller 215 and the drive roller 216. .

  The cover sheet 140 coated with the adhesive and the card substrate 120 are brought into contact with each other from a state of being opposed to each other and conveyed along the conveyance path 218. An IC chip and a reinforcing plate are mounted on the antenna, and an IC module 113 is provided at a position where the cover sheet 140 and the card substrate 120 face each other at a distance.

  The IC chip and the reinforcing plate are supplied as a single unit or a plurality of sheets or rolls. In the conveyance path 218 of the IC card manufacturing apparatus 209, a heating laminate unit 219 and a cutting unit 220 are arranged along the conveyance direction of the cover sheet 140 and the card base 120. The heat laminate is preferably a vacuum heat laminate. Further, a protective film supply unit may be provided in front of the heating laminating unit 219, and it is preferable that the protective film supply unit is disposed so as to face the upper and lower sides of the conveyance path 218. The heating laminate unit 219 includes a flat heating laminate upper mold 221 and a heating laminate lower mold 222 that are arranged to face the upper and lower sides of the conveyance path 218. The heating laminate upper mold 221 and the lower mold 222 are provided so as to be movable in the direction of coming into contact with and separating from each other. After passing through the heat laminating section 219, the sheet material is cut into a predetermined size at the cutting section.

  Next, the IC card sheet thus prepared was punched by the following IC card punching die apparatus.

  FIG. 8 is an overall schematic perspective view of the punching die device, and FIG. 9 is a front end view of the main part of the punching die device. This punching die apparatus has a punching die having an upper blade 310 and a lower blade 320. The upper blade 310 includes a punching punch 311 provided with a relief 341 inside the outer extension, and the lower blade 320 includes a punching die 321. The punching punch 311 is lowered into a die hole 322 provided in the center of the punching die 321, thereby punching an IC card having the same size as the die hole 322. For this reason, the size of the punching punch 311 is slightly smaller than the size of the die hole 322.

  Next, bibliographic items and images were printed on the IC card, a protective layer was provided, and electronic data was written to create an IC card.

  Without using a strong alkaline solution or a strong acid solution, an IC card having excellent environmental properties, a simple card configuration and high productivity could be produced.

    This invention uses an antenna base material in which a metal thin film layer is previously provided on an antenna support, leaves at least the antenna support, half cuts the layer including the metal thin film layer into an antenna shape, and half cuts into an antenna shape. Only the resulting antenna portion can be transferred to the card base material without any burrs, and there is no problem of shorting due to contact with adjacent antennas. In addition, by connecting an IC chip to the transferred antenna part to create an IC module and attaching a cover sheet on the IC module, the metal thin film layer does not require wet processing such as etching, simplifying the equipment, The card configuration can be simplified, and it is inexpensive, has high productivity, and can improve environmental suitability.

FIG. 1 is a diagram showing an IC card manufacturing method. It is a figure which shows the state which carries out the half cut to the antenna shape. It is a figure which shows the state which transcribe | transfers only an antenna part to a card | curd base material. It is a figure which shows the transferred antenna part. It is a figure which shows the state which connects an IC chip to an antenna part. It is a figure which shows the state which affixes a cover sheet on an IC module. It is an example of an IC card manufacturing apparatus. 1 is an overall schematic perspective view of a punching die device. It is a front end view of the principal part of a punching die apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Antenna base material 101 Antenna support body 102 Release layer 103 Adhesion layer 104 Metal thin film layer 105 Intermediate layer 106 Adhesion layer 110 Antenna part 113 IC module 120 Card base material 140 Cover sheet 200 Punching underlay 201 Punching blade

Claims (4)

Using an antenna substrate provided with a metal thin film layer on an antenna support beforehand,
Leaving at least the antenna support, half-cutting the layer including the metal thin film layer into an antenna shape,
Only the antenna part obtained by half-cutting into the antenna shape is transferred to the card substrate,
Create an IC module by connecting an IC chip to the transferred antenna part,
An IC card manufacturing method, wherein a cover sheet is pasted on the IC module.   2. The IC card manufacturing method according to claim 1, wherein the antenna substrate has a structure in which a release layer, an adhesive layer, a metal thin film layer, and an adhesive layer are provided in this order on an antenna support in advance.   3. The IC card manufacturing method according to claim 1, wherein the transfer is performed by pressing and heating substantially the same as the antenna shape. An antenna portion obtained by half-cutting an antenna shape with a layer including a metal thin film layer leaving at least the antenna support of the antenna substrate;
A card substrate to which only the antenna portion is transferred;
An IC module created by connecting an IC chip to the transferred antenna portion;
An IC card comprising: a cover sheet affixed on the IC module.

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