JP2009075836A - Electroconductive member for non-contact type data carrier, and production method and device therefor - Google Patents

Electroconductive member for non-contact type data carrier, and production method and device therefor Download PDF

Info

Publication number
JP2009075836A
JP2009075836A JP2007243875A JP2007243875A JP2009075836A JP 2009075836 A JP2009075836 A JP 2009075836A JP 2007243875 A JP2007243875 A JP 2007243875A JP 2007243875 A JP2007243875 A JP 2007243875A JP 2009075836 A JP2009075836 A JP 2009075836A
Authority
JP
Japan
Prior art keywords
conductive
strip
data carrier
terminal portions
type data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007243875A
Other languages
Japanese (ja)
Other versions
JP5018370B2 (en
Inventor
Emiko Inotani
映美子 井ノ谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2007243875A priority Critical patent/JP5018370B2/en
Publication of JP2009075836A publication Critical patent/JP2009075836A/en
Application granted granted Critical
Publication of JP5018370B2 publication Critical patent/JP5018370B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve production yield of an electroconductive member for a non-contact type data carrier. <P>SOLUTION: This production method includes: a process for layering a first electroconductive strip 21 with a thermoplastic adhesive layer 11 formed thereon, and, a second electroconductive strip 14a via an insulating strip-like base material 10a through the thermoplastic adhesive layer 11 and a thermoplastic adhesive layer 12; a temporary cutting process for forming an electroconductive pattern 13 in the first electroconductive strip 21 at prescribed pitches; a first adhesive bonding process for bonding the first electroconductive strip 21 onto the base material 10a through the thermoplastic adhesive layer 11; a cutting process for removing an unnecessary part 14b in the first electroconductive strip 21 at a boundary with an electroconductive strip 14; a second adhesive bonding process for bonding the electroconductive strip 14 onto the base material 10a; a first unnecessary part removal process for peeling the other electroconductive portion 13c; and a second unnecessary part removal process for peeling the unnecessary part 14b from the base material 10a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ICタグ等の非接触型データキャリア用導電部材とその製造方法及び装置に関する。   The present invention relates to a conductive member for a non-contact type data carrier such as an IC tag and a manufacturing method and apparatus thereof.

非接触型データキャリア用導電部材であるICタグ、ICカード等は絶縁性基材の表裏面の一方又は双方に金属箔からなる導電層を備える。たとえば、絶縁性基材の表側の導電層はアンテナとして形成され、裏側の導電層はアンテナの端子部間を接続するブリッジとして形成される。或いは、表側にアンテナ及びブリッジの双方の導電層が形成される場合もある。アンテナの端子部とブリッジはスルーホール、カシメ、溶接等により電気的に接合される。   An IC tag, an IC card, or the like, which is a non-contact data carrier conductive member, includes a conductive layer made of a metal foil on one or both of the front and back surfaces of an insulating substrate. For example, the conductive layer on the front side of the insulating substrate is formed as an antenna, and the conductive layer on the back side is formed as a bridge that connects between the terminal portions of the antenna. Or the conductive layer of both an antenna and a bridge | bridging may be formed in the front side. The terminal portion of the antenna and the bridge are electrically joined by through holes, caulking, welding or the like.

従来、アンテナは化学的方法、或いは機械的方法により形成されている。化学的方法としては、例えば、金属層を絶縁性基材に積層し、金属層上に所定のパターンのレジスト膜を形成し、しかる後エッチングをしてアンテナのパターンのみを絶縁性基材上に残すという方法がある。また、機械的方法には、例えば次のようなものがある。すなわち、連続状の金属箔を連続状の絶縁性基材に被せ、この金属箔のうちアンテナとして必要な部分を予め塗布した熱可塑性接着剤層を介して基材に接着し、打ち抜き、アンテナとして必要でない部分を不要部として除去する。そして、アンテナを有した連続状の絶縁性基材をロール状に巻き取り、或いは枚葉状に分断して次の工程に送る。アンテナを抜き取った後の連続状の金属箔は、不要部として例えばロール状に巻き取って処分する(例えば、特許文献1参照。)。   Conventionally, an antenna is formed by a chemical method or a mechanical method. As a chemical method, for example, a metal layer is laminated on an insulating substrate, a resist film having a predetermined pattern is formed on the metal layer, and then etching is performed so that only the antenna pattern is formed on the insulating substrate. There is a way to leave. Examples of mechanical methods include the following. That is, a continuous metal foil is placed on a continuous insulating base material, and a portion of the metal foil necessary as an antenna is adhered to the base material through a pre-applied thermoplastic adhesive layer. Unnecessary parts are removed as unnecessary parts. And the continuous insulating base material which has an antenna is wound up in roll shape, or it divides | segments into a sheet form, and sends it to the following process. The continuous metal foil after extracting the antenna is wound up as an unnecessary portion, for example, in a roll shape and disposed of (see, for example, Patent Document 1).

また、ブリッジもアンテナと同様に化学的方法、或いは機械的方法により絶縁性基材上に形成している。   The bridge is also formed on the insulating base material by a chemical method or a mechanical method in the same manner as the antenna.

化学的方法の場合は、ブリッジ用の金属層を絶縁性基材に積層し、金属層上に所定のブリッジパターンに対応したレジスト膜を形成し、しかる後エッチングをすることによりブリッジを絶縁性基材に形成している。   In the case of a chemical method, a bridge metal layer is laminated on an insulating substrate, a resist film corresponding to a predetermined bridge pattern is formed on the metal layer, and then etched to form an insulating group. It is formed on the material.

機械的方法の場合は、図7及び図8に示すように、ブリッジ1の材料となる連続状の金属箔2を、アンテナ3が形成された絶縁性基材4に被せ、この金属箔2のうちブリッジ1として必要な部分を加熱盤5により押圧して絶縁性基材4に接着し、打ち抜き刃6でブリッジ1を打ち抜く。加熱盤5と打ちぬき刃6は基盤7に保持され一体で上下方向に往復移動可能である。金属箔2には予め熱可塑性接着剤層9が形成されており、この熱可塑性接着剤層9が加熱盤5からの熱で溶けてブリッジ1の金属箔を絶縁性基材4に接着する。ブリッジ1が抜き取られた後の金属箔2は不要部2aとして帯状のまま残留し、ロール状に巻き取られるなどして回収される。
特開2006−277700号公報
In the case of the mechanical method, as shown in FIGS. 7 and 8, a continuous metal foil 2 that is a material of the bridge 1 is placed on an insulating base material 4 on which an antenna 3 is formed. Among them, a portion necessary as the bridge 1 is pressed by the heating board 5 to be bonded to the insulating substrate 4, and the bridge 1 is punched with the punching blade 6. The heating panel 5 and the punching blade 6 are held by a base 7 and can be reciprocated up and down integrally. A thermoplastic adhesive layer 9 is formed in advance on the metal foil 2, and the thermoplastic adhesive layer 9 is melted by the heat from the heating panel 5 to adhere the metal foil of the bridge 1 to the insulating substrate 4. The metal foil 2 after the bridge 1 is pulled out remains as a strip as an unnecessary portion 2a and is collected by being wound up in a roll shape.
JP 2006-277700 A

従来のアンテナ3およびブリッジ1の機械的形成方法においては、図7及び図8に示すように、アンテナ3とブリッジ1とは別々に形成され、既に絶縁性基材4に形成されたアンテナ3を、基盤7に対向するように配置された基台8上において、絶縁性基材4に重ねた金属箔2から打ち抜き刃6によりブリッジ1を打ち抜く際、アンテナ3のアンテナ線3a,3a同士の間や、アンテナの端子部3b,3bとアンテナ線3aとの間に隙間δが存在する箇所で金属箔2にかかる打ち抜き刃6の力が低下しやすく、端子部3b,3bやアンテナ線3aが存在する箇所では金属箔2にかかる打ち抜き刃6の力が大きくなりやすい。このため、打ち抜き刃6に加える力の加減が難しく、打ち抜き刃6に対する押圧力が小さ過ぎるとブリッジの打ち抜きが不正確になり、正確に打ち抜こうとして大きくし過ぎるとアンテナ線が破断することになり、適正な押圧力を調整するための作業が極めて煩雑になる。   In the conventional method for mechanically forming the antenna 3 and the bridge 1, as shown in FIGS. 7 and 8, the antenna 3 and the bridge 1 are formed separately, and the antenna 3 already formed on the insulating base 4 is used. When the bridge 1 is punched by the punching blade 6 from the metal foil 2 superimposed on the insulating base 4 on the base 8 arranged so as to face the base 7, between the antenna wires 3 a and 3 a of the antenna 3. In addition, the force of the punching blade 6 applied to the metal foil 2 is likely to be reduced where there is a gap δ between the antenna terminal portions 3b and 3b and the antenna wire 3a, and the terminal portions 3b and 3b and the antenna wire 3a are present. The force of the punching blade 6 applied to the metal foil 2 is likely to increase at the place where it is to be performed. For this reason, it is difficult to adjust the force applied to the punching blade 6, and if the pressing force against the punching blade 6 is too small, the bridge will be punched inaccurate, and if it is too large to be accurately punched, the antenna wire will be broken. Thus, the work for adjusting the appropriate pressing force becomes extremely complicated.

また、アンテナ3とブリッジ1とが別々に形成されるので、打ち抜き刃6の打ち抜き方向の動作とアンテナ3が形成された絶縁性基材4の機械による送り速度とのタイミングが良好でない場合または機械的な誤差がある場合には、アンテナ3とブリッジ1との形成位置がずれることがあり、生産の歩留まりに影響を及ぼすことも考えられた。   Further, since the antenna 3 and the bridge 1 are formed separately, the timing between the operation of the punching blade 6 in the punching direction and the feed speed of the insulating base material 4 on which the antenna 3 is formed is not good or the machine If there is a certain error, the formation position of the antenna 3 and the bridge 1 may be shifted, which may affect the production yield.

従って、本発明は上記課題を解決することができる手段を提供することを目的とする。   Therefore, an object of the present invention is to provide means that can solve the above-described problems.

上記課題を解決するため、本発明は次のような構成を採用する。   In order to solve the above problems, the present invention employs the following configuration.

すなわち、請求項1に係る発明は、対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部(13a)とを有する導電性パターン(13)が一定ピッチ(p)で形成されるべき、熱可塑性接着剤層(11)が形成された第一の導電性細帯(21)と、各導電性パターン(13)の前記端子部(13b、13b)間を結ぶべき導電性細片(14)と同幅に形成され、熱可塑性接着剤層(12)が形成された第二の導電性細帯(14a)と、絶縁性帯状基材(10a)とを、前記熱可塑性接着剤層(11および12)を介して、前記絶縁性帯状基材(10a)を中層として重ね合わせる工程と、 前記第一の導電性細帯(21)における、対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部(13a)とを有する導電性パターン(13)を一定ピッチで形成する仮切断工程と、前記第一の導電性細帯(21)における対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部(13a)とを有する導電性パターン(13)を、前記第一の導電性細帯(21)の熱可塑性接着剤層(11)を介し前記基材(10a)に接着する第一の接着工程と、前記第一の導電性細帯(21)における隣接する導電性パターン(13)の端子部(13b、13b)間に介在する部分を不要部(14b)として前記導電性細片(14)との境で前記第二の導電性細帯(14a)から切り離す切断工程と、前記第一の導電性細帯(21)における各導電性パターン(13)の前記端子部(13b、13b)間を結ぶ部分を、前記導電性細片(14)として前記第二の導電性細帯(14a)の熱可塑性接着剤層(12)を介して前記基材(10a)に接着する第二の接着工程と、前記第一の導電性細帯(21)における、前記対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部とを有する一定ピッチで形成された導電性パターン(13a)を除くその他の導電性部分(13c)を剥し取る第一の不要部除去工程と、前記不要部(14b)を前記基材(10a)から剥し取る第二の不要部除去工程と、を包含してなることを特徴とする非接触型データキャリア用導電部材の製造方法。   That is, in the invention according to claim 1, the conductive pattern (13) having the paired terminal portions (13b, 13b) and the conductive portions (13a) passing between the terminal portions (13b, 13b) has a constant pitch. Between the first conductive strip (21) formed with the thermoplastic adhesive layer (11) to be formed in (p) and the terminal portions (13b, 13b) of each conductive pattern (13) A second electrically conductive strip (14a) formed with the same width as the electrically conductive strip (14) to be connected, and formed with a thermoplastic adhesive layer (12), and an insulating strip substrate (10a) And a step of superposing the insulating strip-shaped substrate (10a) as an intermediate layer through the thermoplastic adhesive layer (11 and 12) and a pair in the first conductive strip (21) Between the terminal portions (13b, 13b) and the terminal portions (13b, 13b) A temporary cutting step of forming a conductive pattern (13) having a conductive portion (13a) at a constant pitch, and a pair of terminal portions (13b, 13b) in the first conductive strip (21), A conductive pattern (13) having a conductive portion (13a) passing between the terminal portions (13b, 13b) is passed through the thermoplastic adhesive layer (11) of the first conductive strip (21). The first bonding step for bonding to the substrate (10a) and the portion interposed between the terminal portions (13b, 13b) of the adjacent conductive pattern (13) in the first conductive strip (21) are unnecessary. Cutting step of separating from the second conductive strip (14a) at the boundary with the conductive strip (14) as a portion (14b), and each conductive pattern in the first conductive strip (21) Connect the terminal portions (13b, 13b) of (13) A second bonding step in which a portion is bonded to the base material (10a) through the thermoplastic adhesive layer (12) of the second conductive strip (14a) as the conductive strip (14); In the first conductive strip (21), a conductive material formed at a constant pitch having the paired terminal portions (13b, 13b) and a conductive portion passing between the terminal portions (13b, 13b). First unnecessary portion removing step of peeling off the other conductive portion (13c) excluding the conductive pattern (13a) and second unnecessary portion removing step of peeling off the unnecessary portion (14b) from the substrate (10a). And a method of manufacturing a non-contact data carrier conductive member.

請求項2に記載されるように、請求項1に記載の非接触型データキャリア用導電部材の製造方法において、前記第一の接着工程、前記第二の接着工程、及び前記切断工程を同時に行うことを特徴とする。   The method for manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the first bonding step, the second bonding step, and the cutting step are simultaneously performed. It is characterized by that.

請求項3に記載されるように、請求項1に記載の非接触型データキャリア用導電部材の製造方法において、前記導電性細片(14)を、前記仮切断工程の実行とともに、前記重ね合わせ工程において重ね合わされた前記第一の導電性細帯(21)、前記第二の導電性細帯(14a)、および前記絶縁性帯状基材(10a)を有する積層材料(29)を予め定められたピッチ(P)移動した場所において、前記積層材料(29)に対して前記第一の接着工程、前記第二の接着工程、及び切断工程を同時に行うことを特徴とする。   3. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the conductive strip (14) is overlapped with the execution of the temporary cutting step. A laminated material (29) having the first conductive strip (21), the second conductive strip (14a), and the insulating strip substrate (10a) superimposed in the process is predetermined. The first bonding step, the second bonding step, and the cutting step are simultaneously performed on the laminated material (29) at the place where the pitch (P) has moved.

請求項4に記載されるように、請求項3に記載の非接触型データキャリア用導電部材の製造方法において、前記仮切断工程の実行と同時に実行される前記第一の接着工程、前記第二の接着工程、及び切断工程の後に、前記仮切断工程が実行された前記積層材料(29)を予め定められたピッチ(P)移動し、前記仮切断工程が実行された前記積層材料(29)に対して、前記第一の接着工程、前記第二の接着工程、及び切断工程が同時に行われ、前記重ね合わせ工程において重ね合わせられた積層材料(29)を予め定められたピッチ(P)移動するごとに、前記仮切断工程の実行と同時に前記第一の接着工程、前記第二の接着工程、及び切断工程を実行することを特徴とする。   4. The method of manufacturing a non-contact data carrier conductive member according to claim 3, wherein the first bonding step and the second bonding step are performed simultaneously with the temporary cutting step. After the bonding step and the cutting step, the laminated material (29) subjected to the temporary cutting step is moved by a predetermined pitch (P), and the laminated material (29) subjected to the temporary cutting step. On the other hand, the first bonding step, the second bonding step, and the cutting step are performed simultaneously, and the laminated material (29) superposed in the superposition step is moved by a predetermined pitch (P). Whenever it does, said 1st adhesion process, said 2nd adhesion process, and a cutting process are performed simultaneously with execution of said temporary cutting process.

請求項5に記載されるように、請求項1乃至請求項4のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、第一の不要部除去工程および第二の不要部除去工程を吸引ノズルにより吸引することにより行うことを特徴とする。   5. The method for manufacturing a non-contact data carrier conductive member according to claim 1, wherein the first unnecessary portion removing step and the second unnecessary portion removing are performed. The step is performed by sucking with a suction nozzle.

請求項6に記載されるように、請求項1乃至請求項5のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、前記第一の不要部除去工程および前記第二の不要部除去工程をエア吹出しノズルでエアを吹き付けることを特徴とする。   6. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the first unnecessary portion removing step and the second unnecessary portion are provided. The part removing step is characterized by blowing air with an air blowing nozzle.

請求項7に記載されるように、 請求項1乃至請求項6のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、導電性パターン(13)がアンテナであり、導電性細片(14)がブリッジであることを特徴とする。   According to a seventh aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to any one of the first to sixth aspects, the conductive pattern (13) is an antenna, The piece (14) is a bridge.

また、請求項8に係る発明は、対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る導電部(13a)とを有する導電性パターン(13)が一定ピッチ(P)で形成されるべき、熱可塑性接着剤層(11)が形成された第一の導電性細帯(21)と、各導電性パターン(13)の前記端子部(13b,13b)間を結ぶべき導電性細片(14)と同幅に形成され、熱可塑性接着剤層(12)が形成された第二の導電性細帯(14a)と、絶縁性帯状基材(10a)とを、前記熱可塑性接着剤層(11および12)を介して、前記絶縁性帯状基材(10a)を中層として重ね合わせて一方向に送る搬送手段と、前記第一の導電性細帯(21)における、対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る導電部(13a)とを有する導電性パターン(13)を一定ピッチで形成する仮切断刃(24)と、前記第一の導電性細帯(21)における前記対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る前記導電部(13a)とを有する前記導電性パターン(13)を、前記第一の導電性細帯(21)の熱可塑性接着剤層(11)を介し前記基材(10a)に接着する第一の接着手段と、前記第一の導電性細帯(21)における各導電性パターン(13)の前記端子部(13b,13b)間を結ぶ部分に、前記導電性細片(14)を用いて前記第二の導電性細帯(14a)の熱可塑性接着剤層(12)を介して前記基材(10a)に接着する第二の接着手段と、前記第一導電性細帯(21)における隣接する導電性パターン(13)の端子部(13b,13b)間に介在する部分を不要部(14b)として前記導電性細片(14)との境で前記第二の導電性細帯(14a)から切り離す切断刃(23、23)と、前記第一の導電性細帯(21)における、前記対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る前記導電部(13a)とを有する一定ピッチで形成された導電性パターン(13)を除くその他の導電性部分(13c)を剥し取る第一の不要部除去手段(27)と、前記不要部(14b)を前記基材(10a)から剥し取る第二の不要部除去手段(28)と、を包含してなることを特徴とする。   In the invention according to claim 8, the conductive pattern (13) having the paired terminal portions (13b, 13b) and the conductive portions (13a) passing between the terminal portions (13b, 13b) has a constant pitch. (P) between the first conductive strip (21) on which the thermoplastic adhesive layer (11) is formed and the terminal portions (13b, 13b) of each conductive pattern (13) A second electrically conductive strip (14a) formed with the same width as the electrically conductive strip (14) to be connected, and formed with a thermoplastic adhesive layer (12), and an insulating strip substrate (10a) Through the thermoplastic adhesive layer (11 and 12), the transporting means for sending the insulating strip-like base material (10a) as a middle layer in one direction, and the first conductive strip (21 ) In the paired terminal portions (13b, 13b) and the terminal portions (13b, 1) b) The temporary cutting blade (24) for forming a conductive pattern (13) having a conductive portion (13a) passing between them at a constant pitch and the pair in the first conductive strip (21). The conductive pattern (13) having the terminal portions (13b, 13b) and the conductive portions (13a) passing between the terminal portions (13b, 13b) is transferred to the heat of the first conductive strip (21). A first adhesive means for adhering to the substrate (10a) through a plastic adhesive layer (11); and the terminal portions (13b) of the respective conductive patterns (13) in the first conductive strip (21). , 13b) on the base material (10a) via the thermoplastic adhesive layer (12) of the second conductive strip (14a) using the conductive strip (14) at the portion connecting the two. Second adhering means for adhering and adjacent in the first conductive strip (21) A portion interposed between the terminal portions (13b, 13b) of the conductive pattern (13) is defined as an unnecessary portion (14b), and the second conductive strip (14a) at the boundary with the conductive strip (14). The cutting blades (23, 23) to be separated from the first conductive thin strip (21) and the conductive portions passing between the paired terminal portions (13b, 13b) and the terminal portions (13b, 13b). A first unnecessary portion removing means (27) for peeling off the other conductive portion (13c) excluding the conductive pattern (13) formed at a constant pitch having the portion (13a), and the unnecessary portion (14b). And a second unnecessary portion removing means (28) for peeling off the substrate from the substrate (10a).

請求項9に記載されるように、請求項8に記載の非接触型データキャリア用導電部材の製造装置において、前記第一の接着手段、前記第二の接着手段、及び前記切断刃(23,23)が一体化されていることを特徴とする。   As described in claim 9, in the apparatus for manufacturing a non-contact data carrier conductive member according to claim 8, the first bonding means, the second bonding means, and the cutting blade (23, 23). 23) is integrated.

請求項10に記載されるように、請求項8に記載の非接触型データキャリア用導電部材の製造方法において、前記仮切断刃(24)と、一体化されている前記第一の接着手段、前記第二の接着手段、及び切断刃(23、23)との間隔を予め定められたピッチ(P)間隔とすることを特徴とする。   In the method of manufacturing a conductive member for a non-contact type data carrier according to claim 8, as described in claim 10, the temporary bonding blade (24) and the first bonding means integrated with the temporary cutting blade (24), The distance between the second bonding means and the cutting blades (23, 23) is a predetermined pitch (P) distance.

請求項11に記載されるように、請求項10に記載の非接触型データキャリア用導電部材の製造装置において、前記仮切断刃(24)、前記第一の接着手段、前記第二の接着手段、及び切断刃(23、23)が一体化されていることを特徴とする。   The non-contact type data carrier conductive member manufacturing apparatus according to claim 10, wherein the temporary cutting blade (24), the first adhesion means, and the second adhesion means. And the cutting blades (23, 23) are integrated.

請求項12に記載されるように、請求項8乃至請求項11のいずれかに記載の非接触型データキャリア用導電部材の製造装置において、前記第一の不要部除去手段および前記第二の不要部除去手段が吸引ノズルを含むことを特徴とする。   12. The manufacturing apparatus for a non-contact type data carrier conductive member according to claim 8, wherein the first unnecessary portion removing means and the second unnecessary portion are described in claim 12. The part removing means includes a suction nozzle.

請求項13に記載されるように、請求項8乃至請求項12のいずれかに記載の非接触型データキャリア用導電部材の製造装置において、前記第一の不要部除去手段および前記第二の不要部除去手段がエアを吹き付けるエア吹出しノズルを含むことを特徴とする。   In the manufacturing apparatus of the non-contact type data carrier conductive member according to any one of claims 8 to 12, as described in claim 13, the first unnecessary portion removing means and the second unnecessary portion. The part removing means includes an air blowing nozzle for blowing air.

請求項14に記載されるように、対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部とを有する導電性パターン(13a)が形成された第一の導電性細帯(21)が絶縁性基材(10a)に熱可塑性接着剤層(11)を介して接着され、導電性細片(14)がその両端部と上記端子部(13b、13b)とが合致するように前記絶縁性基材(10a)の他の面に他の熱可塑性接着剤層(12)を介して接着され、この導電性細片(14)の両端縁を整える切断刃(23、23)が前記第一の導電性細帯(21)、前記絶縁性基材(10a)、前記熱可塑性接着剤層(11、12)、を貫通することにより貫通孔(30、30)が形成されていることを特徴とする。   A first conductive pattern (13a) having a pair of terminal portions (13b, 13b) and a conductive portion passing between the terminal portions (13b, 13b) is formed. The conductive strip (21) is bonded to the insulating substrate (10a) through the thermoplastic adhesive layer (11), and the conductive strip (14) is connected to both ends thereof and the terminal portions (13b, 13b). ) Is bonded to the other surface of the insulating substrate (10a) through another thermoplastic adhesive layer (12) so as to match with each other, and the both ends of the conductive strip (14) are trimmed. A blade (23, 23) penetrates the first conductive thin strip (21), the insulating base (10a), and the thermoplastic adhesive layer (11, 12), thereby allowing a through hole (30, 30) is formed.

請求項15に記載されるように、請求項14に記載の非接触型データキャリア用導電部材において、導電性パターン(13)がアンテナであり、導電性細片(14)がブリッジであることを特徴とする。   The conductive member for a non-contact type data carrier according to claim 14, wherein the conductive pattern (13) is an antenna and the conductive strip (14) is a bridge. Features.

請求項16に記載されるように、請求項14又は15に記載の非接触型データキャリア用導電部材において、前記基材(10a)の表裏面が被覆層(18、19)で覆われ、前記基材(10a)の表裏面の被覆層(18,19)が貫通孔(30、30)を通じて互いに接着していることを特徴とする。   The conductive member for a non-contact type data carrier according to claim 14 or 15, wherein the front and back surfaces of the base material (10a) are covered with a covering layer (18, 19), The coating layers (18, 19) on the front and back surfaces of the substrate (10a) are bonded to each other through the through holes (30, 30).

請求項1に係る発明によれば、対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部(13a)とを有する導電性パターン(13)が一定ピッチ(p)で形成されるべき、熱可塑性接着剤層(11)が形成された第一の導電性細帯(21)と、各導電性パターン(13)の前記端子部(13b、13b)間を結ぶべき導電性細片(14)と同幅に形成され、熱可塑性接着剤層(12)が形成された第二の導電性細帯(14a)と、絶縁性帯状基材(10a)とを、前記熱可塑性接着剤層(11および12)を介して、前記絶縁性帯状基材(10a)を中層として重ね合わせる工程と、前記第一の導電性細帯(21)における、対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部(13a)とを有する導電性パターン(13)を一定ピッチで形成する仮切断工程と、前記第一の導電性細帯(21)における対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部(13a)とを有する導電性パターン(13)を、前記第一の導電性細帯(21)の熱可塑性接着剤層(11)を介し前記基材(10a)に接着する第一の接着工程と、前記第一の導電性細帯(21)における隣接する導電性パターン(13)の端子部(13b、13b)間に介在する部分を不要部(14b)として前記導電性細片(14)との境で前記第二の導電性細帯(14a)から切り離す切断工程と、前記第一の導電性細帯(21)における各導電性パターン(13)の前記端子部(13b、13b)間を結ぶ部分を、前記導電性細片(14)として前記第二の導電性細帯(14a)の熱可塑性接着剤層(12)を介して前記基材(10a)に接着する第二の接着工程と、前記第一の導電性細帯(21)における、前記対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部とを有する一定ピッチで形成された導電性パターン(13a)を除くその他の導電性部分(13c)を剥し取る第一の不要部除去工程と、前記不要部(14b)を前記基材(10a)から剥し取る第二の不要部除去工程と、を包含してなることを特徴とする非接触型データキャリア用導電部材の製造方法であるから、従来のような幅広の金属箔からブリッジのような導電性細片を打ち抜く必要がなく、第二の導電性細帯(14a)を一対の端子部(13b,13b)の両側で切断することにより導電性細片(14)を形成するので、金属箔の不要部の発生が低減し、したがって金属箔の無駄を防止することができる。   According to the first aspect of the present invention, the conductive pattern (13) having the paired terminal portions (13b, 13b) and the conductive portions (13a) passing between the terminal portions (13b, 13b) has a constant pitch. Between the first conductive strip (21) formed with the thermoplastic adhesive layer (11) to be formed in (p) and the terminal portions (13b, 13b) of each conductive pattern (13) A second electrically conductive strip (14a) formed with the same width as the electrically conductive strip (14) to be connected, and formed with a thermoplastic adhesive layer (12), and an insulating strip substrate (10a) And the step of superimposing the insulating strip substrate (10a) as an intermediate layer through the thermoplastic adhesive layer (11 and 12) and the first conductive strip (21). Between the terminal portion (13b, 13b) and the terminal portion (13b, 13b). A temporary cutting step of forming a conductive pattern (13) having a portion (13a) at a constant pitch, a pair of terminal portions (13b, 13b) in the first conductive strip (21), and this terminal A conductive pattern (13) having a conductive portion (13a) passing between the portions (13b, 13b) through the thermoplastic adhesive layer (11) of the first conductive strip (21). The first bonding step for bonding to (10a) and the portion interposed between the terminal portions (13b, 13b) of the adjacent conductive pattern (13) in the first conductive strip (21) are unnecessary portions ( 14b) a cutting step of separating from the second conductive strip (14a) at the boundary with the conductive strip (14), and each conductive pattern (13 in the first conductive strip (21)). ) Of connecting the terminal portions (13b, 13b) A second bonding step of bonding to the substrate (10a) through the thermoplastic adhesive layer (12) of the second conductive strip (14a) as the conductive strip (14); Conductive pattern formed at a constant pitch having the paired terminal portions (13b, 13b) and conductive portions passing between the terminal portions (13b, 13b) in the first conductive strip (21). A first unnecessary part removing step of peeling off the other conductive part (13c) excluding (13a), a second unnecessary part removing step of peeling off the unnecessary part (14b) from the substrate (10a), Therefore, there is no need to punch a conductive strip such as a bridge from a wide metal foil as in the prior art. The conductive strip (14a) of the pair of terminal portions (13 Since the conductive strip (14) is formed by cutting on both sides of b and 13b), the generation of unnecessary portions of the metal foil is reduced, and therefore waste of the metal foil can be prevented.

また、従来の工程数に比較して半分の工程数になるので、コストの削減、および歩留まりの向上が可能になる。   Further, since the number of processes is half that of the conventional processes, the cost can be reduced and the yield can be improved.

また、導電性細片(14)は第二の導電性細帯(14a)を一対の端子部(13b,13b)の両側で切断することにより形成することができ、従来のような端子部(13b,13b)間を通る導電部(13a)を横切るように打ち抜き刃を入れて導電性細片(14)を形成する必要がないので、簡易かつ正確に導電性細片(14)を形成することができ、端子部(13b,13b)間を通る導電部(13a)の断線も防止される。また、不要部(14b)は基材(10a)に仮留めされたうえで除去されるので、不要部(14b)の散乱が防止され、不要部(14b)の円滑な回収が可能になる。   The conductive strip (14) can be formed by cutting the second conductive strip (14a) on both sides of the pair of terminal portions (13b, 13b). Since it is not necessary to form a conductive strip (14) by inserting a punching blade across the conductive portion (13a) passing between 13b and 13b), the conductive strip (14) is formed easily and accurately. This also prevents disconnection of the conductive portion (13a) passing between the terminal portions (13b, 13b). Further, since the unnecessary portion (14b) is temporarily fixed to the base material (10a) and then removed, the unnecessary portion (14b) is prevented from being scattered and the unnecessary portion (14b) can be smoothly recovered.

請求項2に記載されるように、請求項1に記載の非接触型データキャリア用導電部材の製造方法において、前記第一の接着工程、前記第二の接着工程、及び前記切断工程を同時に行うようにすれば、各工程間を搬送することによる機械的な誤差が少なくなり、確実に接着し、および正確な精度で切断を行なうことが可能となる。   The method for manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the first bonding step, the second bonding step, and the cutting step are simultaneously performed. By doing so, mechanical errors due to conveyance between the respective processes are reduced, and it becomes possible to securely bond and perform cutting with accurate accuracy.

請求項3に記載されるように、請求項1に記載の非接触型データキャリア用導電部材の製造方法において、前記導電性細片(14)を、前記仮切断工程の実行とともに、前記重ね合わせ工程において重ね合わされた前記第一の導電性細帯(21)、前記第二の導電性細帯(14a)、および前記絶縁性帯状基材(10a)を有する積層材料(29)を予め定められたピッチ(P)移動した場所において、前記積層材料(29)に対して前記第一の接着工程、前記第二の接着工程、及び前記切断工程を同時に行うようにすれば、ピッチ(P)間隔で非接触型データキャリア用導電部材を精度よく生産できるので、非接触型データキャリア用導電部材を量産するために効率的な生産方法で作成することができる。   3. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the conductive strip (14) is overlapped with the execution of the temporary cutting step. A laminated material (29) having the first conductive strip (21), the second conductive strip (14a), and the insulating strip substrate (10a) superimposed in the process is predetermined. If the first bonding step, the second bonding step, and the cutting step are simultaneously performed on the laminated material (29) at the place where the pitch (P) has moved, the pitch (P) interval Thus, the non-contact type data carrier conductive member can be produced with high accuracy, so that the non-contact type data carrier conductive member can be produced by an efficient production method for mass production.

請求項4に記載されるように、請求項3に記載の非接触型データキャリア用導電部材の製造方法において、前記仮切断工程の実行と同時に実行される前記第一の接着工程、前記第二の接着工程、及び切断工程の後に、前記仮切断工程が実行された前記積層材料(29)を予め定められたピッチ(P)移動し、前記仮切断工程が実行された前記積層材料(29)に対して、前記第一の接着工程、前記第二の接着工程、及び切断工程が同時に行われ、前記重ね合わせ工程において重ね合わせられた積層材料(29)を予め定められたピッチ(P)移動するごとに、前記仮切断工程の実行と同時に前記第一の接着工程、前記第二の接着工程、及び切断工程を実行するようにすれば、非接触型データキャリア用導電部材の製造ラインを短くすることができる。また、各工程が一体となっているので、ピッチ(P)の送り精度が正確であれば、機械的な誤差の発生がなく、均一な機械的寸法の非接触型データキャリア用導電部材を効率的に量産することが可能となる。   4. The method of manufacturing a non-contact data carrier conductive member according to claim 3, wherein the first bonding step and the second bonding step are performed simultaneously with the temporary cutting step. After the bonding step and the cutting step, the laminated material (29) subjected to the temporary cutting step is moved by a predetermined pitch (P), and the laminated material (29) subjected to the temporary cutting step. On the other hand, the first bonding step, the second bonding step, and the cutting step are performed simultaneously, and the laminated material (29) superposed in the superposition step is moved by a predetermined pitch (P). When the first bonding step, the second bonding step, and the cutting step are performed simultaneously with the temporary cutting step, the production line for the non-contact data carrier conductive member can be shortened. To do Kill. In addition, since each process is integrated, if the pitch (P) feed accuracy is accurate, there is no mechanical error and a non-contact type data carrier conductive member with uniform mechanical dimensions can be efficiently used. Mass production is possible.

請求項5に記載されるように、請求項1乃至請求項4のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、第一の不要部除去工程および第二の不要部除去工程を吸引ノズル(27、28)により吸引することにより行うようにすれば、基材(21)や導電性細片(14)に非接触で不要部(14b)、およびその他の導電性部分(13c)を除去することができる。   5. The method for manufacturing a non-contact data carrier conductive member according to claim 1, wherein the first unnecessary portion removing step and the second unnecessary portion removing are performed. If the process is performed by sucking with the suction nozzles (27, 28), the substrate (21) and the conductive strip (14) are brought into contact with the unnecessary portion (14b) and other conductive portions ( 13c) can be removed.

請求項6に記載されるように、請求項1乃至請求項5のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、第一の不要部除去工程および第二の不要部除去工程をエア吹出しノズル(30、31)でエアを吹き付けるようにすれば、基材(21)や導電性細片(14)に非接触で不要部(14b)、およびその他の導電性部分(13c)を除去することができる。また、吸引ノズル(27、28)を併用することにより不要部(14b)およびその他の導電性部分(13c)をより円滑かつ確実に除去することができる。   6. The method for manufacturing a non-contact data carrier conductive member according to claim 1, wherein the first unnecessary portion removing step and the second unnecessary portion removing are performed. If air is blown by the air blowing nozzles (30, 31) in the process, unnecessary portions (14b) and other conductive portions (13c) are contacted with the base material (21) and the conductive strip (14) in a non-contact manner. ) Can be removed. Further, by using the suction nozzles (27, 28) in combination, the unnecessary portion (14b) and other conductive portions (13c) can be removed more smoothly and reliably.

請求項7に記載されるように、 請求項1乃至請求項6のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、導電性パターン(13)がアンテナであり、導電性細片(14)がブリッジとすることにより、アンテナ(13)にブリッジ(14)を簡易かつ正確に取り付けることができる。   According to a seventh aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to any one of the first to sixth aspects, the conductive pattern (13) is an antenna, When the piece (14) is a bridge, the bridge (14) can be easily and accurately attached to the antenna (13).

また、請求項8に係る発明は、対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る導電部(13a)とを有する導電性パターン(13)が一定ピッチ(P)で形成されるべき、熱可塑性接着剤層(11)が形成された第一の導電性細帯(21)と、各導電性パターン(13)の前記端子部(13b,13b)間を結ぶべき導電性細片(14)と同幅に形成され、熱可塑性接着剤層(12)が形成された第二の導電性細帯(14a)と、絶縁性帯状基材(10a)とを、前記熱可塑性接着剤層(11および12)を介して、前記絶縁性帯状基材(10a)を中層として重ね合わせて一方向に送る搬送手段と、前記第一の導電性細帯(21)における、対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る導電部(13a)とを有する導電性パターン(13)を一定ピッチで形成する仮切断刃(24)と、前記第一の導電性細帯(21)における前記対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る前記導電部(13a)とを有する前記導電性パターン(13)を、前記第一の導電性細帯(21)の熱可塑性接着剤層(11)を介し前記基材(10a)に接着する第一の接着手段と、前記第一の導電性細帯(21)における各導電性パターン(13)の前記端子部(13b,13b)間を結ぶ部分に、前記導電性細片(14)を用いて前記第二の導電性細帯(14a)の熱可塑性接着剤層(12)を介して前記基材(10a)に接着する第二の接着手段と、前記第一導電性細帯(21)における隣接する導電性パターン(13)の端子部(13b,13b)間に介在する部分を不要部(14b)として前記導電性細片(14)との境で前記第二の導電性細帯(14a)から切り離す切断刃(23、23)と、前記第一の導電性細帯(21)における、前記対になった端子部(13b,13b)とこの端子部(13b,13b)間を通る前記導電部(13a)とを有する一定ピッチで形成された導電性パターン(13)を除くその他の導電性部分(13c)を剥し取る第一の不要部除去手段(27)と、前記不要部(14b)を前記基材(10a)から剥し取る第二の不要部除去手段(28)と、を包含してなる非接触型データキャリア用導電部材の製造装置であるから、従来のような幅広の金属箔からブリッジのような導電性細片を打ち抜く必要がなく、第二の導電性細帯(14a)を一対の端子部(13b,13b)の両側で切断することにより導電性細片(14)を形成するので、金属箔の不要部の発生が低減し、したがって金属箔の無駄を防止することができる。   In the invention according to claim 8, the conductive pattern (13) having the paired terminal portions (13b, 13b) and the conductive portions (13a) passing between the terminal portions (13b, 13b) has a constant pitch. (P) between the first conductive strip (21) on which the thermoplastic adhesive layer (11) is formed and the terminal portions (13b, 13b) of each conductive pattern (13) A second electrically conductive strip (14a) formed with the same width as the electrically conductive strip (14) to be connected, and formed with a thermoplastic adhesive layer (12), and an insulating strip substrate (10a) Through the thermoplastic adhesive layer (11 and 12), the transporting means for sending the insulating strip-like base material (10a) as a middle layer in one direction, and the first conductive strip (21 ) In the paired terminal portions (13b, 13b) and the terminal portions (13b, 1) b) The temporary cutting blade (24) for forming a conductive pattern (13) having a conductive portion (13a) passing between them at a constant pitch and the pair in the first conductive strip (21). The conductive pattern (13) having the terminal portions (13b, 13b) and the conductive portions (13a) passing between the terminal portions (13b, 13b) is transferred to the heat of the first conductive strip (21). A first adhesive means for adhering to the substrate (10a) through a plastic adhesive layer (11); and the terminal portions (13b) of the respective conductive patterns (13) in the first conductive strip (21). , 13b) on the base material (10a) via the thermoplastic adhesive layer (12) of the second conductive strip (14a) using the conductive strip (14) at the portion connecting the two. Second adhering means for adhering and adjacent in the first conductive strip (21) A portion interposed between the terminal portions (13b, 13b) of the conductive pattern (13) is defined as an unnecessary portion (14b), and the second conductive strip (14a) at the boundary with the conductive strip (14). The cutting blades (23, 23) to be separated from the first conductive thin strip (21) and the conductive portions passing between the paired terminal portions (13b, 13b) and the terminal portions (13b, 13b). A first unnecessary portion removing means (27) for peeling off the other conductive portion (13c) excluding the conductive pattern (13) formed at a constant pitch having the portion (13a), and the unnecessary portion (14b). And a second unnecessary portion removing means (28) for stripping the substrate from the base material (10a). Punching conductive strips like bridges from There is no need, and the conductive strip (14) is formed by cutting the second conductive strip (14a) on both sides of the pair of terminal portions (13b, 13b). Therefore, the waste of the metal foil can be prevented.

また、従来の工程数に比較して半分の工程数になるので、コストの削減、および歩留まりの向上が可能になる。   Further, since the number of processes is half that of the conventional processes, the cost can be reduced and the yield can be improved.

また、導電性細片(14)は第二の導電性細帯(14a)を一対の端子部(13b,13b)の両側で切断することにより形成することができ、従来のような端子部(13b,13b)間を通る導電部(13a)を横切るように打ち抜き刃を入れて導電性細片(14)を形成する必要がないので、簡易かつ正確に導電性細片(14)を形成することができ、端子部(13b,13b)間を通る導電部(13a)の断線も防止される。また、不要部(14b)は基材(10a)に仮留めされたうえで除去されるので、不要部(14b)の散乱が防止され、不要部(14b)の円滑な回収が可能になる。   The conductive strip (14) can be formed by cutting the second conductive strip (14a) on both sides of the pair of terminal portions (13b, 13b). Since it is not necessary to form a conductive strip (14) by inserting a punching blade across the conductive portion (13a) passing between 13b and 13b), the conductive strip (14) is formed easily and accurately. This also prevents disconnection of the conductive portion (13a) passing between the terminal portions (13b, 13b). Further, since the unnecessary portion (14b) is temporarily fixed to the base material (10a) and then removed, the unnecessary portion (14b) is prevented from being scattered and the unnecessary portion (14b) can be smoothly recovered.

請求項9に記載されるように、請求項8に記載の非接触型データキャリア用導電部材の製造装置において、前記第一の接着手段、前記第二の接着手段、及び前記切断刃(23,23)が一体化されていれば、各工程を同時に行うことになるので、各工程間を搬送することによる機械的な誤差が少なくなり、確実に接着し、および正確な精度で切断を行なうことが可能となる。   As described in claim 9, in the apparatus for manufacturing a non-contact data carrier conductive member according to claim 8, the first bonding means, the second bonding means, and the cutting blade (23, 23). If 23) is integrated, each process is performed at the same time, so that mechanical errors due to conveyance between the processes are reduced, bonding is performed securely, and cutting is performed with accurate accuracy. Is possible.

請求項10に記載されるように、請求項8に記載の非接触型データキャリア用導電部材の製造方法において、前記仮切断刃(24)と、一体化されている前記第一の接着手段、前記第二の接着手段、及び切断刃(23、23)との間隔を予め定められたピッチ(P)間隔とすることにより、前記第一の接着、前記第二の接着、及び切断を同時に行うようにすれば、ピッチ(P)間隔で非接触型データキャリア用導電部材を精度よく生産できるので、非接触型データキャリア用導電部材を量産するために効率的な生産方法で作成することができる。   In the method of manufacturing a conductive member for a non-contact type data carrier according to claim 8, as described in claim 10, the temporary bonding blade (24) and the first bonding means integrated with the temporary cutting blade (24), The first bonding, the second bonding, and the cutting are simultaneously performed by setting the interval between the second bonding means and the cutting blades (23, 23) to a predetermined pitch (P) interval. By doing so, the non-contact type data carrier conductive member can be accurately produced at a pitch (P) interval, so that the non-contact type data carrier conductive member can be produced by an efficient production method for mass production. .

請求項11に記載されるように、請求項10に記載の非接触型データキャリア用導電部材の製造装置において、前記仮切断刃(24)、前記第一の接着手段、前記第二の接着手段、及び切断刃(23、23)が一体化されているので、仮切断、第一の接着、第二の接着及び切断を同時に実行するようにすれば、非接触型データキャリア用導電部材の製造ラインを短くすることができる。また、各工程が一体となっているので、ピッチ(P)の送り精度が正確であれば、機械的な誤差の発生がなく、均一な機械的寸法の非接触型データキャリア用導電部材を効率的に量産することが可能となる。   The non-contact type data carrier conductive member manufacturing apparatus according to claim 10, wherein the temporary cutting blade (24), the first adhesion means, and the second adhesion means. Since the cutting blades (23, 23) are integrated, the provisional cutting, the first bonding, the second bonding, and the cutting can be performed at the same time, so that the non-contact type data carrier conductive member can be manufactured. The line can be shortened. In addition, since each process is integrated, if the pitch (P) feed accuracy is accurate, there is no mechanical error and a non-contact type data carrier conductive member with uniform mechanical dimensions can be efficiently used. Mass production is possible.

請求項12に記載されるように、請求項8乃至請求項11のいずれかに記載の非接触型データキャリア用導電部材の製造装置において、前記第一の不要部除去手段および前記第二の不要部除去手段が吸引ノズル(27、28)を含むものにすれば、基材(21)や導電性細片(14)に非接触で不要部(14b)、およびその他の導電性部分(13c)を除去することができる。   12. The manufacturing apparatus for a non-contact type data carrier conductive member according to claim 8, wherein the first unnecessary portion removing means and the second unnecessary portion are described in claim 12. If the part removing means includes the suction nozzle (27, 28), the unnecessary part (14b) and the other conductive part (13c) are not in contact with the base material (21) or the conductive strip (14). Can be removed.

請求項13に記載されるように、請求項8乃至請求項12のいずれかに記載の非接触型データキャリア用導電部材の製造装置において、前記第一の不要部除去手段および前記第二の不要部除去手段がエアを吹き付けるエア吹出しノズル(30、31)を含むものとすると、基材(21)や導電性細片(14)に非接触で不要部(14b)、およびその他の導電性部分(13c)を除去することができる。また、吸引ノズル(27、28)を併用することにより不要部(14b)をより円滑かつ確実に除去することができる。   In the manufacturing apparatus of the non-contact type data carrier conductive member according to any one of claims 8 to 12, as described in claim 13, the first unnecessary portion removing means and the second unnecessary portion. If the part removing means includes an air blowing nozzle (30, 31) for blowing air, the unnecessary part (14b) and other conductive parts (non-contact with the base material (21) and the conductive strip (14) ( 13c) can be removed. Further, the unnecessary portion (14b) can be removed more smoothly and reliably by using the suction nozzles (27, 28) in combination.

請求項14に記載されるように、対になった端子部(13b、13b)とこの端子部(13b、13b)間を通る導電部とを有する導電性パターン(13a)が形成された第一の導電性細帯(21)が絶縁性基材(10a)に熱可塑性接着剤層(11)を介して接着され、導電性細片(14)がその両端部と上記端子部(13b、13b)とが合致するように前記絶縁性基材(10a)の他の面に他の熱可塑性接着剤層(12)を介して接着され、この導電性細片(14)の両端縁を整える切断刃(23、23)が前記第一の導電性細帯(21)、前記絶縁性基材(10a)、前記熱可塑性接着剤層(11、12)、を貫通することにより貫通孔(15、15)が形成されている非接触型データキャリア用導電部材であるから、貫通孔(15、15)の存否を目視等で確認することで、導電性細片(14)が基材(10a)に適正に取り付けられているか否かを判別することができる。   A first conductive pattern (13a) having a pair of terminal portions (13b, 13b) and a conductive portion passing between the terminal portions (13b, 13b) is formed. The conductive strip (21) is bonded to the insulating substrate (10a) through the thermoplastic adhesive layer (11), and the conductive strip (14) is connected to both ends thereof and the terminal portions (13b, 13b). ) Is bonded to the other surface of the insulating substrate (10a) through another thermoplastic adhesive layer (12) so as to match with each other, and the both ends of the conductive strip (14) are trimmed. A blade (23, 23) penetrates through the first conductive strip (21), the insulating base (10a), and the thermoplastic adhesive layer (11, 12), thereby allowing a through hole (15, 15) is a non-contact type data carrier conductive member formed with a through-hole (15 By confirming the presence or absence of 15) visually, etc., it can be electrically conductive strips (14) it is determined whether or not properly attached to the substrate (10a).

請求項15に記載されるように、請求項14に記載の非接触型データキャリア用導電部材において、導電性パターン(13)がアンテナであり、導電性細片(14)がブリッジとすることにより、貫通孔の存否を目視等で確認することで、ブリッジ(14)がアンテナ(13)に適正に接続されているか否かを判別することができる。   The conductive member for a non-contact type data carrier according to claim 14, wherein the conductive pattern (13) is an antenna and the conductive strip (14) is a bridge. It is possible to determine whether or not the bridge (14) is properly connected to the antenna (13) by visually confirming the presence or absence of the through hole.

請求項16に記載されるように、請求項14又は15に記載の非接触型データキャリア用導電部材において、前記基材(10a)の表裏面が被覆層(18、19)で覆われ、前記基材(10a)の表裏面の被覆層(18,19)が貫通孔(15、15)を通じて互いに接着たものとすることにより、被覆層(18,19)の剥がれ等を防止することができ、耐久性に優れたICカード等とすることができる。   The conductive member for a non-contact type data carrier according to claim 14 or 15, wherein the front and back surfaces of the base material (10a) are covered with a covering layer (18, 19), By making the coating layers (18, 19) on the front and back surfaces of the substrate (10a) adhere to each other through the through holes (15, 15), peeling of the coating layers (18, 19) can be prevented. An IC card having excellent durability can be obtained.

以下、図面を参照して本発明を実施するための最良の形態について説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

図1、図2及び図4(A)は、この非接触型データキャリア用導電部材の製造方法により製造することができる非接触型データキャリア用導電部材を示している。   1, FIG. 2 and FIG. 4 (A) show a non-contact type data carrier conductive member that can be manufactured by this non-contact type data carrier conductive member manufacturing method.

これらの図に示すように、非接触型データキャリア用導電部材における絶縁性基材10の表裏面には、それぞれ熱可塑性接着剤層11,12がアンテナ13やブリッジ14の所望の導電性パターンに形成され、この熱可塑性接着剤層11,12の上にアンテナ13やブリッジ14のパターンに対応する導電層が積層され固着される。   As shown in these drawings, the thermoplastic adhesive layers 11 and 12 are formed in desired conductive patterns of the antenna 13 and the bridge 14 on the front and back surfaces of the insulating base material 10 in the non-contact data carrier conductive member, respectively. Then, a conductive layer corresponding to the pattern of the antenna 13 or the bridge 14 is laminated and fixed on the thermoplastic adhesive layers 11 and 12.

絶縁性基材10は、合成樹脂製シートあるいはそれらを積層したシートにより形成される。絶縁性基材10の厚さは、大体30μm〜70μmである。絶縁性基材10は、図示例では長方形に形成されるが、その他の所望の形状とすることができる。合成樹脂としては例えばポリエチレンテレフタレート(PET)を用いることができる。   The insulating substrate 10 is formed of a synthetic resin sheet or a sheet obtained by laminating them. The thickness of the insulating substrate 10 is approximately 30 μm to 70 μm. The insulating substrate 10 is formed in a rectangular shape in the illustrated example, but may have other desired shapes. For example, polyethylene terephthalate (PET) can be used as the synthetic resin.

図1及び図4(A)に示すように、上記アンテナ13は、渦巻状に形成されたアンテナ線13aや、対になった端子部13b,13bを備える。アンテナ線13aは対になった端子部13b,13b間を通っている。アンテナ線13aの一部には、対になった接続部13b,13bが形成される。   As shown in FIGS. 1 and 4A, the antenna 13 includes an antenna wire 13a formed in a spiral shape and a pair of terminal portions 13b and 13b. The antenna line 13a passes between the paired terminal portions 13b and 13b. A pair of connection portions 13b and 13b are formed in a part of the antenna line 13a.

また、絶縁性基材10の裏面のブリッジ14は、金属箔製の導電性細片で形成され、リボン状の細長い長方形に形成される。   The bridge 14 on the back surface of the insulating substrate 10 is formed of a conductive strip made of metal foil and is formed into a ribbon-like long and narrow rectangle.

ブリッジ14は、後述するように細い帯状のアルミニウム箔等の金属箔を絶縁性基材10に貼着することにより形成される。図2及び図4(A)において、符号15は後述するように導電性細片をブリッジ14として整える際に導電性細片の両端に切断刃により形成される切抜き部分を示す。   The bridge 14 is formed by sticking a thin metal foil such as a strip-like aluminum foil to the insulating substrate 10 as will be described later. 2 and 4A, reference numeral 15 denotes a cut-out portion formed by cutting blades at both ends of the conductive strip when the conductive strip is arranged as a bridge 14 as will be described later.

上記非接触型データキャリア用導電部材を非接触型データキャリアとして機能させるには、上記アンテナ13の端子部13b,13b間を電気的に導通させなければならない。そのため、図3及び図4(B)に示すように、上記非接触型データキャリア用導電部材におけるアンテナ13の対になった端子部13b,13bとブリッジ14の両端部とが接合され、アンテナ13の導電層とブリッジ14の導電層との間の電気的導通が確保される。   In order for the non-contact data carrier conductive member to function as a non-contact data carrier, the terminal portions 13b and 13b of the antenna 13 must be electrically connected. Therefore, as shown in FIG. 3 and FIG. 4B, the terminal portions 13b and 13b of the antenna 13 in the non-contact data carrier conductive member and the both ends of the bridge 14 are joined to each other. Electrical conduction between the conductive layer and the conductive layer of the bridge 14 is ensured.

この電気的導通は、例えばアンテナ13の対になった端子部13b,13bとブリッジ14の両端部とを絶縁性基材10の厚さ方向で超音波溶接することによって行われる。図3及び図4(B)において、符号16,16は超音波振動子により押圧されることにより形成された凹陥部を示す。その他、上記電気的導通は、抵抗溶接、機械的カシメ、スルーホール等によっても行うことができる。   This electrical continuity is performed, for example, by ultrasonically welding the terminal portions 13b and 13b that form a pair of the antenna 13 and both ends of the bridge 14 in the thickness direction of the insulating base material 10. 3 and 4B, reference numerals 16 and 16 denote concave portions formed by being pressed by the ultrasonic transducer. In addition, the electrical continuity can be performed by resistance welding, mechanical caulking, through holes, and the like.

また、上記非接触型データキャリア用導電部材を非接触型データキャリアとして機能させるため、図3に示すように、アンテナ13の対になった接続部13b,13bにICチップ17が乗せられ、電気的に接続される。   Further, in order to make the conductive member for the non-contact type data carrier function as a non-contact type data carrier, as shown in FIG. Connected.

上記の如くブリッジ14がアンテナ13に電気的に接続され、ICチップ17が搭載された非接触型データキャリア用導電部材は、例えば図5に示すように絶縁性基材10の表裏面がカード用被覆層18,19で覆われることにより例えばICカードとされる。   As described above, the non-contact type data carrier conductive member in which the bridge 14 is electrically connected to the antenna 13 and the IC chip 17 is mounted, for example, as shown in FIG. By being covered with the covering layers 18 and 19, for example, an IC card is obtained.

図5において、符号18a,19aは絶縁性基材10の表面と裏面にそれぞれアンテナ13の導電層及びブリッジ14の導電層の上から被せられる芯材層を示し、符号18b,19bは芯材層18a,19aの表面をそれぞれ覆う表面層を示す。芯材層18a,19aはカードとしての強度を与える樹脂シート等を含んでおり、表面層18b,19bは所望の内容を表示する印刷インキ層等を含んでいる。   In FIG. 5, reference numerals 18 a and 19 a denote core material layers that are covered on the conductive layer of the antenna 13 and the conductive layer of the bridge 14 on the front and back surfaces of the insulating base material 10, respectively. The surface layers which respectively cover the surfaces of 18a and 19a are shown. The core layers 18a and 19a include a resin sheet that gives strength as a card, and the surface layers 18b and 19b include a printing ink layer that displays desired contents.

上記構成のICカードの使用に際して、ICチップ17に対して図示しない読取書込器により電磁界内において種々の情報の読み取り又は書き込みが行われる。この読み取り又は書き込みに使用される周波数は、例えば8MHz〜208MHzである。   When the IC card having the above configuration is used, various kinds of information are read or written in the electromagnetic field by a reading / writing device (not shown) with respect to the IC chip 17. The frequency used for reading or writing is, for example, 8 MHz to 208 MHz.

次に、図1、図2及び図4(A)に示した非接触型データキャリア用導電部材1の製造方法及び装置について、図6に基づいて説明する。   Next, a manufacturing method and apparatus for the non-contact data carrier conductive member 1 shown in FIGS. 1, 2 and 4A will be described with reference to FIG.

図6に示すように、対になった端子部13b,13bとこの端子部13b,13b間を通るアンテナ線13aである導電部とを有するアンテナ13の導電性パターンが一定ピッチで形成されることになる第一の導電性細帯21が、矢印で示す方向に所定のピッチpで間欠送りされる。図6中、符号22は第一の導電性細帯21を絶縁性帯状基材10aに押し当てるためのローラを示す。この第二の導電性細帯14aの絶縁性帯状基材10aに対向する片面には、熱可塑性接着剤層11(図4参照)が形成されている。熱可塑性接着剤層11の材料である熱可塑性接着剤としては、ポリエステル系接着剤を用いることができる。ポリエステル系接着剤は80℃程度で加熱することにより粘着性を呈し、比較的熱に弱いPET製の絶縁性帯状基材10aに第二の導電性細帯14aを接着するのに好適である。   As shown in FIG. 6, the conductive pattern of the antenna 13 having a pair of terminal portions 13b and 13b and a conductive portion which is an antenna line 13a passing between the terminal portions 13b and 13b is formed at a constant pitch. The first conductive strip 21 is intermittently fed at a predetermined pitch p in the direction indicated by the arrow. In FIG. 6, the code | symbol 22 shows the roller for pressing the 1st electroconductive strip 21 against the insulating strip | belt-shaped base material 10a. A thermoplastic adhesive layer 11 (see FIG. 4) is formed on one surface of the second conductive thin strip 14a facing the insulating strip substrate 10a. As the thermoplastic adhesive that is the material of the thermoplastic adhesive layer 11, a polyester-based adhesive can be used. The polyester-based adhesive exhibits tackiness when heated at about 80 ° C., and is suitable for bonding the second conductive fine band 14a to the insulating band-shaped substrate 10a made of PET that is relatively heat-sensitive.

また、上記各アンテナ13の端子部13b,13b間を結ぶべき導電性細片であるブリッジ14と同幅に形成された第二の導電性細帯14aが、上記アンテナ13の端子部13b,13bで合致するように絶縁性帯状基材10aに重ね合わせられる。図6中、符号20は第二の導電性細帯14aを絶縁性帯状基材10aに押し当てるためのローラを示す。さらに、第一の導電性細帯21と同様に、矢印で示す方向に所定のピッチpで間欠送りされる。この第二の導電性細帯14aの絶縁性帯状基材10aに対向する片面には、第一の導電性細帯21と同様に、熱可塑性接着剤層12(図4参照)が形成されている。熱可塑性接着剤層12の材料である熱可塑性接着剤としては、ポリエステル系接着剤を用いることができる。ポリエステル系接着剤は80℃程度で加熱することにより粘着性を呈し、比較的熱に弱いPET製の絶縁性帯状基材10aに第二の導電性細帯14aを接着するのに好適である。   In addition, the second conductive strip 14a formed in the same width as the bridge 14 which is a conductive strip to be connected between the terminal portions 13b, 13b of each antenna 13 is connected to the terminal portions 13b, 13b of the antenna 13. Are overlaid on the insulating belt-like substrate 10a so as to match. In FIG. 6, the code | symbol 20 shows the roller for pressing the 2nd electroconductive strip 14a against the insulating strip | belt-shaped base material 10a. Further, similarly to the first conductive thin band 21, it is intermittently fed at a predetermined pitch p in the direction indicated by the arrow. A thermoplastic adhesive layer 12 (see FIG. 4) is formed on one surface of the second conductive strip 14a facing the insulating strip-shaped substrate 10a, like the first conductive strip 21. Yes. As the thermoplastic adhesive that is the material of the thermoplastic adhesive layer 12, a polyester-based adhesive can be used. The polyester-based adhesive exhibits tackiness when heated at about 80 ° C., and is suitable for bonding the second conductive fine band 14a to the insulating band-shaped substrate 10a made of PET that is relatively heat-sensitive.

また、第一の導電性細帯21と第二の導電性細帯14aとに挟まれる中層としての絶縁性帯状基材10aが、第一の導電性細帯21と第二の導電性細帯14aとの搬送と同期して矢印で示す方向に所定のピッチpで間欠送りされる。すなわち、重なり合った第一の導電性細帯21と第二の導電性細帯14aと絶縁性帯状基材10aとの重畳体(積層材料29)は、矢印で示す方向に所定のピッチpで間欠送りされる。絶縁性帯状基材10aは図1乃至図4に示した絶縁性基材10の連続体である。   Further, the insulating band-shaped substrate 10a as an intermediate layer sandwiched between the first conductive band 21 and the second conductive band 14a is formed by the first conductive band 21 and the second conductive band. Synchronously with the conveyance with 14a, it is intermittently fed at a predetermined pitch p in the direction indicated by the arrow. That is, the overlapping body (laminated material 29) of the overlapping first conductive strip 21, second conductive strip 14a, and insulating strip base material 10a is intermittent at a predetermined pitch p in the direction indicated by the arrow. Sent. The insulating belt-like base material 10a is a continuous body of the insulating base material 10 shown in FIGS.

この絶縁性帯状基材10a(および重畳体(積層材料29))を送る搬送手段は、図示しないが例えば絶縁性帯状基材10aを上下から挟むローラ、サーボモータ等で構成することができ、ローラをサーボモータで間欠回転させることにより絶縁性帯状基材10aを矢印方向に間欠的に走行させることができる。また、絶縁性帯状基材10aの左右両側に形成された図示しないマージナルパンチホールにピン車を係止し、ピン車を間欠回転させることによっても搬送することができる。   Although not shown, the conveying means for sending the insulating strip base material 10a (and the superposed body (laminate material 29)) can be constituted by, for example, a roller or a servo motor that sandwiches the insulating strip base material 10a from above and below. Is intermittently rotated by a servo motor, so that the insulating strip base material 10a can be intermittently run in the direction of the arrow. Further, the pin wheel can be locked in a marginal punch hole (not shown) formed on both the left and right sides of the insulating belt-like base material 10a, and the pin wheel can be conveyed by intermittent rotation.

さらに、第一の導電性細帯21における、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部13aとを有する導電性パターン13を一定ピッチで形成する仮切断刃24と、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部13aとを有する導電性パターン13を第一の導電性細帯21の熱可塑性接着剤層11を介し基材10aに接着する加熱盤26(第一の接着手段)と、重畳体の送り方向に沿って、第二の導電性細帯14aにおける各アンテナ13の端子部13b,13b間を結ぶ部分をブリッジ14として熱可塑性接着剤層12を介し絶縁性帯状基材10aに接着する加熱盤25(第二の接着手段)と、上記不要部14bをブリッジ14との境で第二の導電性細帯14aから切り離す切断刃23,23と、前記第一の導電性細帯21における、前記対になった端子部13b、13bとこの端子部13b、13b間を通る導電部とを有する一定ピッチで形成された導電性パターン13aとを除くその他の絶縁性帯状基材10aに仮留めされた導電性部分13cを剥し取る第一の不要部除去手段27と、絶縁性帯状基材10aに仮留めされた不要部14bを絶縁性帯状基材10aから剥し取る第二の不要部除去手段28とが配置される。   Furthermore, the temporary cutting blade which forms the conductive pattern 13 which has the terminal part 13b, 13b which became the pair in the 1st conductive thin strip 21, and the conductive part 13a which passes between this terminal part 13b, 13b with a fixed pitch. 24 and a conductive pattern 13 having a pair of terminal portions 13b and 13b and a conductive portion 13a passing between the terminal portions 13b and 13b are interposed through the thermoplastic adhesive layer 11 of the first conductive strip 21. A portion connecting the terminal portions 13b and 13b of the antennas 13 in the second conductive strip 14a along the feeding direction of the superposed body and the heating board 26 (first bonding means) to be bonded to the base material 10a. A heating plate 25 (second bonding means) for bonding to the insulating strip substrate 10a via the thermoplastic adhesive layer 12 as the bridge 14 and the second conductive thin band at the boundary between the unnecessary portion 14b and the bridge 14. Cut from 14a The cutting blades 23, 23, and the first conductive strip 21 are formed at a constant pitch having the paired terminal portions 13b, 13b and conductive portions passing between the terminal portions 13b, 13b. First unnecessary portion removing means 27 for stripping off the conductive portion 13c temporarily secured to the other insulating strip substrate 10a excluding the conductive pattern 13a, and the unnecessary portion temporarily secured to the insulating strip substrate 10a A second unnecessary portion removing means 28 for peeling 14b from the insulating belt-like substrate 10a is disposed.

また、本実施形態においては、図6に示したように、第一の導電性細帯21における、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部13aとを有する導電性パターン13を一定ピッチで形成する仮切断刃24と、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部13aとを有する導電性パターン13を第一の導電性細帯21の熱可塑性接着剤層11を介し基材10aに接着する加熱盤26(第一の接着手段)と、重畳体の送り方向に沿って、第二の導電性細帯14aにおける各アンテナ13の端子部13b,13b間を結ぶ部分をブリッジ14として熱可塑性接着剤層12を介し絶縁性帯状基材10aに接着する加熱盤25(第二の接着手段)とは、一つの基盤31(彫刻刃)に一体として形成されている。   In the present embodiment, as shown in FIG. 6, the pair of terminal portions 13 b and 13 b and the conductive portion 13 a passing between the terminal portions 13 b and 13 b in the first conductive strip 21 are provided. The conductive pattern 13 having a temporary cutting blade 24 for forming the conductive pattern 13 having a constant pitch, a pair of terminal portions 13b and 13b, and a conductive portion 13a passing between the terminal portions 13b and 13b is formed as a first pattern. A heating board 26 (first bonding means) for bonding to the base material 10a through the thermoplastic adhesive layer 11 of the conductive strip 21 and a second conductive strip 14a along the feeding direction of the superimposed body A heating board 25 (second bonding means) for bonding to the insulating belt-like substrate 10a through the thermoplastic adhesive layer 12 with the portion connecting the terminal portions 13b, 13b of each antenna 13 as a bridge 14 is one base. 31 (engraving blade) It is formed as a body.

さらに、詳述すると、基盤31の上流側には、第一の導電性細帯21における、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部13aとを有する導電性パターン13を一定ピッチで形成する仮切断刃24が設けられ、基盤31の下流側には、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部13aとを有する導電性パターン13を第一の導電性細帯21の熱可塑性接着剤層11を介し基材10aに接着する加熱盤26(第一の接着手段)と、重畳体の送り方向に沿って、第二の導電性細帯14aにおける各アンテナ13の端子部13b,13b間を結ぶ部分をブリッジ14として熱可塑性接着剤層12を介し絶縁性帯状基材10aに接着する加熱盤25(第二の接着手段)とが基盤31に一体として形成されている。   More specifically, on the upstream side of the base 31, a conductive material having a pair of terminal portions 13 b and 13 b and a conductive portion 13 a passing between the terminal portions 13 b and 13 b in the first conductive thin strip 21. The temporary cutting blade 24 for forming the sexual pattern 13 at a constant pitch is provided, and on the downstream side of the base 31, there is a pair of terminal portions 13b, 13b and a conductive portion 13a passing between the terminal portions 13b, 13b. A heating board 26 (first bonding means) for bonding the conductive pattern 13 to the base material 10a via the thermoplastic adhesive layer 11 of the first conductive strip 21 and a feed direction of the superimposed body, A heating plate 25 (second bonding) for bonding the portion between the terminal portions 13b, 13b of each antenna 13 in the two conductive thin strips 14a to the insulating strip base material 10a via the thermoplastic adhesive layer 12 as a bridge 14. Means) It is integrally formed in one.

加熱盤25,26は、上記重畳体の搬送方向に設けられる。加熱盤25が設けられることで、ブリッジ14が絶縁性帯状基材10aやアンテナ13の端子部13b,13bに、強固に接着されることになる。この加熱盤25は、ブリッジ14の形状に合致する形状の加熱面を有する。   The heating boards 25 and 26 are provided in the conveyance direction of the superimposed body. By providing the heating board 25, the bridge 14 is firmly bonded to the insulating belt-like substrate 10 a and the terminal portions 13 b and 13 b of the antenna 13. The heating board 25 has a heating surface having a shape that matches the shape of the bridge 14.

また、加熱盤26が設けられることで、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部とを有する一定ピッチで形成された導電性パターン13aが絶縁性帯状基材10aに、強固に接着されることになる。この加熱盤25は、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部とを有する一定ピッチで形成された導電性パターン13aの形状に合致する形状の加熱面を有する。   Further, by providing the heating board 26, the conductive pattern 13a formed at a constant pitch having a pair of terminal portions 13b, 13b and a conductive portion passing between the terminal portions 13b, 13b can be formed into an insulating strip base. It will adhere firmly to the material 10a. The heating board 25 has a heating surface having a shape that matches the shape of the conductive pattern 13a formed at a constant pitch and having a pair of terminal portions 13b and 13b and a conductive portion passing between the terminal portions 13b and 13b. Have.

切断刃23,23は、基盤31に設けられる。切断刃23,23はそれぞれ第二の導電性細帯14aを横断するように配置され、ブリッジ14の長さに対応した間隔で設けられる。   The cutting blades 23, 23 are provided on the base 31. The cutting blades 23, 23 are arranged so as to cross the second conductive strip 14 a, and are provided at intervals corresponding to the length of the bridge 14.

上流側の仮切断刃24及び下流側の加熱盤25、加熱盤26、切断刃23,23は、重畳体の搬送方向に一ピッチpずれるように配置される。そして、前述したように、上流側の仮切断刃24及び下流側の加熱盤25、加熱盤26、切断刃23,23のすべては、一枚の板状の基盤25に固定されることにより一体化されている。基盤25内には図示しない電気熱線が組み込まれ、この電気熱線の熱が加熱盤25および加熱盤26に伝わるようになっている。   The temporary cutting blade 24 on the upstream side, the heating plate 25 on the downstream side, the heating plate 26, and the cutting blades 23, 23 are arranged so as to be shifted by one pitch p in the conveying direction of the superimposed body. As described above, the temporary cutting blade 24 on the upstream side, the heating plate 25 on the downstream side, the heating plate 26, and the cutting blades 23, 23 are all integrated by being fixed to a single plate-like base 25. It has become. An electric heating wire (not shown) is incorporated in the base 25, and the heat of the electric heating wire is transmitted to the heating board 25 and the heating board 26.

基盤25は加熱盤25,加熱盤26等が第一の導電性細帯21に対峙するように重畳体の上方に配置される。また、重畳体を間に挟んで基盤25に対向するように重畳体の下方には基台30が設けられる。   The base plate 25 is disposed above the superposed body so that the heating plate 25, the heating plate 26, and the like face the first conductive thin band 21. Further, a base 30 is provided below the superimposed body so as to face the base 25 with the superimposed body interposed therebetween.

ただし、本実施形態は、上述した図6における上方から基盤25、重畳体、基台30の順番に配置される場合に限定されるわけではなく、図6における一番上方に基台30があり、一番下方に基盤25があり、基台30と基盤25との間に重畳体が搬送される形態とすることも可能である。この場合には、重畳体の層構成は図6と逆になる。すなわち、図6において重畳体の最下層は第一の導電性細帯21となり、重畳体の最上層は第二の導電性細帯14aとなり、中層に絶縁性帯状基材10aが位置するようになる。また、図6において基盤25の上面側に仮切断刃24、加熱盤25、加熱盤26、および切断刃23,23が設けられる。   However, this embodiment is not limited to the case where the base 25, the superposed body, and the base 30 are arranged in this order from above in FIG. 6, and the base 30 is at the top in FIG. It is also possible to adopt a form in which the base 25 is at the lowermost position and the superposed body is conveyed between the base 30 and the base 25. In this case, the layer structure of the superimposed body is opposite to that shown in FIG. That is, in FIG. 6, the lowest layer of the superposed body is the first conductive thin band 21, the top layer of the superposed body is the second conductive thin band 14a, and the insulating belt-like substrate 10a is located in the middle layer. Become. In FIG. 6, a temporary cutting blade 24, a heating plate 25, a heating plate 26, and cutting blades 23 and 23 are provided on the upper surface side of the base 25.

第一の不要部除去手段および第二の不要部除去手段は、吸引ノズル27並びに吸引ノズル28及びエア吹出しノズル30並びにエア吹出しノズル31を含むものとして構成される。   The first unnecessary part removing unit and the second unnecessary part removing unit are configured to include the suction nozzle 27, the suction nozzle 28, the air blowing nozzle 30, and the air blowing nozzle 31.

吸引ノズル27は重畳体の搬送方向に見て下流側の基盤25よりも更に下流側において、その吸引口27aが第一の導電性細帯21に対峙するように配置される。吸引ノズル27は図示しないブロア等の駆動により負圧を生じ、その吸引口27aから第一の導電性細帯21のその他の導電性部分13cを絶縁性帯状基材10aに非接触で吸引し除去するようになっている。   The suction nozzle 27 is arranged so that the suction port 27 a faces the first conductive thin band 21 further downstream than the downstream side base 25 as viewed in the conveying direction of the superimposed body. The suction nozzle 27 generates a negative pressure by driving a blower (not shown), and the other conductive portion 13c of the first conductive thin strip 21 is sucked and removed from the suction opening 27a to the insulating strip base material 10a without contact. It is supposed to be.

エア吹出しノズル30は、吸引ノズル27の近傍において、その吹出し口30aが第一の導電性細帯21と絶縁性帯状基材10aとの間にエアを吹き付けることができるように配置される。エア吹出しノズル30は、図示しないブロア等から供給されるエアを吹出し口30aから第一の導電性細帯21に向かって吹き出し、絶縁性帯状基材10aに仮留めされた第一の導電性細帯21のその他の導電性部分13cを絶縁性帯状基材10aから剥し取る。これにより、第一の導電性細帯21のその他の導電性部分13cは非接触で絶縁性帯状基材10aから確実に除去される。   The air blowing nozzle 30 is arranged in the vicinity of the suction nozzle 27 so that the blowing port 30a can blow air between the first conductive strip 21 and the insulating strip base material 10a. The air blowing nozzle 30 blows air supplied from a blower or the like (not shown) from the blowing port 30a toward the first conductive thin band 21, and the first conductive fine band temporarily fixed to the insulating band-shaped substrate 10a. The other conductive portion 13c of the band 21 is peeled off from the insulating band-shaped substrate 10a. Thereby, the other electroconductive part 13c of the 1st electroconductive strip 21 is reliably removed from the insulating strip | belt-shaped base material 10a by non-contact.

なお、吸引ノズル27及びエア吹出しノズル30は、この実施形態のように併用してもよいし、各々単独で設けて吸引又はエア吹き付けによって第一の導電性細帯21のその他の導電性部分13cを基材10aから除去するようにしてもよい。   The suction nozzle 27 and the air blowing nozzle 30 may be used in combination as in this embodiment, or may be provided independently and other conductive portions 13c of the first conductive strip 21 by suction or air blowing. May be removed from the substrate 10a.

吸引ノズル28は重畳体の搬送方向に見て下流側の基盤25よりも更に下流側において、その吸引口28aが第二の導電性細帯14aに対峙するように配置される。吸引ノズル28は図示しないブロア等の駆動により負圧を生じ、その吸引口28aから第二の導電性細帯14aの不要部14bを絶縁性帯状基材10aに非接触で吸引し除去するようになっている。   The suction nozzle 28 is arranged on the further downstream side of the substrate 25 on the downstream side when viewed in the conveying direction of the superposed body so that the suction port 28a faces the second conductive thin band 14a. The suction nozzle 28 generates a negative pressure by driving a blower (not shown), and the unnecessary portion 14b of the second conductive thin strip 14a is sucked and removed from the suction strip 28a in a non-contact manner to the insulating strip base material 10a. It has become.

エア吹出しノズル31は、吸引ノズル28の近傍において、その吹出し口31aが第二の導電性細帯14aと絶縁性帯状基材10aとの間にエアを吹き付けることができるように配置される。エア吹出しノズル31は、図示しないブロア等から供給されるエアを吹出し口31aから第二の導電性細帯14aに向かって吹き出し、絶縁性帯状基材10aに仮留めされた不要部14bを絶縁性帯状基材10aから剥し取る。これにより、不要部14bは非接触で絶縁性帯状基材10aから確実に除去される。   The air blowing nozzle 31 is disposed in the vicinity of the suction nozzle 28 so that the blowing port 31a can blow air between the second conductive thin strip 14a and the insulating strip-shaped substrate 10a. The air blowing nozzle 31 blows air supplied from a blower (not shown) from the blowing port 31a toward the second conductive thin band 14a, and insulates the unnecessary portion 14b temporarily fixed to the insulating band-shaped substrate 10a. It peels off from the strip | belt-shaped base material 10a. Thereby, the unnecessary part 14b is reliably removed from the insulating strip base material 10a in a non-contact manner.

なお、吸引ノズル28及びエア吹出しノズル31は、この実施形態のように併用してもよいし、各々単独で設けて吸引又はエア吹き付けによって不要部14bを基材10aから除去するようにしてもよい。   The suction nozzle 28 and the air blowing nozzle 31 may be used in combination as in this embodiment, or may be provided alone to remove the unnecessary portion 14b from the base material 10a by suction or air blowing. .

図6に示すように、第一の導電性細帯21、絶縁性帯状基材10a、および第二の導電性細帯14aが重なった重畳体が、矢印方向に所定のピッチpで間欠送りされると、重畳体が停止する都度上記基盤25が矢印方向に一往復する。   As shown in FIG. 6, the superposed body in which the first conductive strip 21, the insulating strip base material 10a, and the second conductive strip 14a overlap is intermittently fed at a predetermined pitch p in the arrow direction. Then, each time the superimposed body stops, the base 25 reciprocates once in the direction of the arrow.

これにより、基盤25が上下に一往復することにより重畳体の一ピッチ内に図1、図2及び図4(A)に示した一つの非接触型データキャリア用導電部材が形成されることになる。   As a result, one non-contact type data carrier conductive member shown in FIGS. 1, 2, and 4A is formed in one pitch of the superposed body by the substrate 25 reciprocating up and down once. Become.

すなわち、基盤25が上下方向に一往復すると、上流側の仮切断刃24が、第一の導電性細帯21において、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部13aとを有する導電性パターン(アンテナパターン)13を一定ピッチで形成する。これにより、アンテナパターンが絶縁性帯状基材10aに接着した状態で形成される。仮切断刃24は、第一の導電性細帯21を切断するが、絶縁性帯状基材10aは切断しないように仮切断刃24の位置調整が成される。   That is, when the base 25 is reciprocated once in the vertical direction, the temporary cutting blade 24 on the upstream side passes through the pair of terminal portions 13b and 13b and the terminal portions 13b and 13b in the first conductive strip 21. Conductive patterns (antenna patterns) 13 having conductive portions 13a are formed at a constant pitch. Thereby, the antenna pattern is formed in a state where it is adhered to the insulating strip substrate 10a. The temporary cutting blade 24 cuts the first conductive strip 21, but the position of the temporary cutting blade 24 is adjusted so as not to cut the insulating strip base material 10a.

また、同時に(基盤25の一往復目の下降時に)、基盤25の下流側では、加熱盤25がアンテナ13の端子部13b,13b間に第二の導電性細帯14aのブリッジ14に相当する部分を押し付け熱圧着する。これにより、ブリッジ14に相当する部分の熱可塑性接着剤層12が熱により粘着性を呈し、このブリッジ14に相当する部分が絶縁性帯状基材10aに接着する。   At the same time (at the time of the first reciprocation of the base plate 25), on the downstream side of the base plate 25, the heating board 25 corresponds to the bridge 14 of the second conductive thin band 14a between the terminal portions 13b and 13b of the antenna 13. Press the part and thermocompression. Thereby, the portion of the thermoplastic adhesive layer 12 corresponding to the bridge 14 exhibits adhesiveness due to heat, and the portion corresponding to the bridge 14 adheres to the insulating strip base material 10a.

さらに、同時に(基盤25の一往復目の下降時に)、基盤25の下流側では、加熱盤26が、対になった端子部13b、13bとこの端子部13b、13b間を通る導電部とを有する一定ピッチで形成された導電性パターン13aを押し付け熱圧着する。これにより、導電性パターン13aに相当する部分の熱可塑性接着剤層11が熱により粘着性を呈し、この導電性パターン13aに相当する部分が絶縁性帯状基材10aに接着する。   Furthermore, at the same time (at the time of lowering of the first round-trip of the base plate 25), on the downstream side of the base plate 25, the heating board 26 connects the paired terminal portions 13b and 13b and the conductive portion passing between the terminal portions 13b and 13b. The conductive pattern 13a formed at a constant pitch is pressed and thermocompression bonded. As a result, the portion of the thermoplastic adhesive layer 11 corresponding to the conductive pattern 13a exhibits adhesiveness due to heat, and the portion corresponding to the conductive pattern 13a adheres to the insulating strip substrate 10a.

さらに、同時に(基盤25の一往復目の下降時に)、二枚の切断刃23,23が第一の導電性細帯21および絶縁性帯状基材10aを貫通しつつ、第二の導電性細帯14aを押し付けるようにして切断する。これにより、第二の導電性細帯14aのブリッジ14と不要部14bとの境が切断され、ブリッジ14の両端縁が整えられる。また、その際二枚の切断刃23,23によって図2及び図4(A)に示したような貫通穴15,15が第一の導電性細帯21および絶縁性帯状基材10aに形成される。   Furthermore, at the same time (at the time of lowering of the first reciprocation of the base plate 25), the two cutting blades 23, 23 pass through the first conductive strip 21 and the insulating strip base material 10a, while the second conductive strip. Cutting is performed by pressing the band 14a. Thereby, the boundary between the bridge 14 and the unnecessary portion 14b of the second conductive thin strip 14a is cut, and both end edges of the bridge 14 are adjusted. In this case, through holes 15 and 15 as shown in FIG. 2 and FIG. 4A are formed in the first conductive thin strip 21 and the insulating strip base material 10a by the two cutting blades 23 and 23. The

更に、基盤25が二往復目の上昇を行い、重畳体が更に一ピッチ進んで停止し、基盤25が下降すると、上流側の仮切断刃24、および下流側の加熱盤25、加熱盤26および切断刃23、23が、上述した工程を繰り返す。   Further, when the base plate 25 is raised for the second reciprocation, and the superposed body is further advanced by one pitch and stopped, and the base plate 25 is lowered, the upstream temporary cutting blade 24, the downstream heating plate 25, the heating plate 26, The cutting blades 23 and 23 repeat the process described above.

以上のように基盤25が上下方向に一往復するごとに重畳体に一つのアンテナ13が形成されると共に、重畳体の一つのアンテナ13に対するブリッジ14の取り付けが完了し、このような基盤25の上下往復動が繰り返されることによりブリッジ14が取り付けられたアンテナ13が連続して基盤25外へと送り出される。また、第二の導電性細帯14aにおけるブリッジ14,14間の不要部14b、および第一の導電性細帯21におけるその他の導電性部分13cが絶縁性帯状基材10aに仮留めされた状態で絶縁性帯状基材10aと共に基盤25外へと送り出される。   As described above, each time the base 25 reciprocates in the vertical direction, one antenna 13 is formed on the superposed body, and the attachment of the bridge 14 to one antenna 13 of the superposed body is completed. By repeating the up and down reciprocation, the antenna 13 to which the bridge 14 is attached is continuously sent out of the base 25. In addition, the unnecessary portion 14b between the bridges 14 and 14 in the second conductive strip 14a and the other conductive portion 13c in the first conductive strip 21 are temporarily fastened to the insulating strip base material 10a. Is sent out of the base 25 together with the insulating belt-like substrate 10a.

基盤25外へと送り出された重畳体は吸引ノズル28の直上へと搬送され、その表面が吸引ノズル28の吸引口28aにより吸引される。また、エア吹出しノズル31の吹出し口31aからのエアが不要部14bと絶縁性帯状基材10aとの間に送られる。これにより、絶縁性帯状基材10aに仮留めされた第二の導電性細帯14aの不要部14bが絶縁性帯状基材10aから剥し取られ、吸引ノズル28内に吸引されて図示しない集塵袋等に回収される。   The superposed body sent out of the base 25 is conveyed directly above the suction nozzle 28, and the surface thereof is sucked by the suction port 28 a of the suction nozzle 28. Moreover, the air from the blowing port 31a of the air blowing nozzle 31 is sent between the unnecessary part 14b and the insulating strip-shaped base material 10a. As a result, the unnecessary portion 14b of the second conductive strip 14a temporarily secured to the insulating strip base material 10a is peeled off from the insulating strip base material 10a and sucked into the suction nozzle 28 to collect dust that is not shown. Collected in a bag.

同様に、基盤25外へと送り出された重畳体は吸引ノズル27の直下へと搬送され、その表面が吸引ノズル27の吸引口27aにより吸引される。また、エア吹出しノズル30の吹出し口30aからのエアが第一の導電性細帯21のその他の導電性部分13cと絶縁性帯状基材10aとの間に送られる。これにより、絶縁性帯状基材10aに仮留めされた第一の導電性細帯21のその他の導電性部分13cが絶縁性帯状基材10aから剥し取られ、吸引ノズル27内に吸引されて図示しない集塵袋等に回収される。   Similarly, the superposed body fed out of the base 25 is conveyed directly below the suction nozzle 27, and the surface thereof is sucked by the suction port 27 a of the suction nozzle 27. In addition, air from the outlet 30a of the air outlet nozzle 30 is sent between the other conductive portion 13c of the first conductive strip 21 and the insulating strip base material 10a. As a result, the other conductive portion 13c of the first conductive strip 21 temporarily attached to the insulating strip substrate 10a is peeled off from the insulating strip substrate 10a and sucked into the suction nozzle 27. Not collected in a dust bag.

この第二の導電性細帯14aにおけるブリッジ14,14間の不要部14b、および第一の導電性細帯21におけるその他の導電性部分13cが除去された重畳体は、図3及び図4(B)に示したように電気的導通処理、ICチップ装着処理、裁断処理等の後工程に付され、更には図5に示したような例えばICカードに加工される。   The superposed body from which the unnecessary portion 14b between the bridges 14 and 14 in the second conductive strip 14a and the other conductive portion 13c in the first conductive strip 21 are removed is shown in FIGS. As shown in B), it is subjected to subsequent steps such as electrical conduction processing, IC chip mounting processing, cutting processing, and the like, and further processed into, for example, an IC card as shown in FIG.

なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨の範囲内において種々変更可能である。例えば、上記実施の形態では重畳体を間欠送りしつつ非接触型データキャリア用導電部材を製造するようになっているが、基盤をロータリー式に改変して重畳体を連続送りすることで非接触型データキャリア用導電部材を製造するようにしてもよい。また、実施の形態では絶縁性帯状基材をPET等の合成樹脂で構成したが、紙又は紙と樹脂との積層体で絶縁性帯状基材を構成することも可能である。   In addition, this invention is not limited to the said embodiment, A various change is possible within the range of the summary of this invention. For example, in the above embodiment, the conductive member for the non-contact type data carrier is manufactured while intermittently feeding the superimposed body. However, the base is changed to a rotary type so that the superimposed body is continuously fed without contact. You may make it manufacture the electrically-conductive member for type | mold data carriers. In the embodiment, the insulating strip base material is made of a synthetic resin such as PET. However, the insulating strip base material can be made of paper or a laminate of paper and resin.

本発明に係る製法により製造された非接触型データキャリア用導電部材の表面図である。It is a surface view of the electroconductive member for non-contact type data carriers manufactured by the manufacturing method concerning the present invention. 図1に示す非接触型データキャリア用導電部材の裏面図である。It is a reverse view of the electroconductive member for non-contact type data carriers shown in FIG. ブリッジをアンテナに導電可能に接合しICチップを実装した非接触型データキャリア用導電部材の表面図である。FIG. 3 is a surface view of a non-contact data carrier conductive member in which an IC chip is mounted by electrically connecting a bridge to an antenna. (A)は図1中IVA−IVA線矢視断面図、(B)は図3中IVB−IVB線矢視断面図である。1A is a cross-sectional view taken along line IVA-IVA in FIG. 1, and FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. 図3に示す非接触型データキャリア用導電部材を使用して作成されたICカードの断面図である。It is sectional drawing of the IC card produced using the electrically-conductive member for non-contact-type data carriers shown in FIG. 本発明の実施の形態に係る非接触型データキャリア用導電部材の製造方法を示す斜視図である。It is a perspective view which shows the manufacturing method of the electroconductive member for non-contact-type data carriers which concerns on embodiment of this invention. 従来の非接触型データキャリア用導電部材の製造方法を示す斜視図である。It is a perspective view which shows the manufacturing method of the conventional conductive member for non-contact-type data carriers. 図7中、XII−XII線矢視断面図である。FIG. 7 is a cross-sectional view taken along line XII-XII in FIG.

符号の説明Explanation of symbols

10…絶縁性基材
10a…絶縁性帯状基材
12…熱可塑性接着剤層
13…アンテナ
13b,13b…端子部
13a…アンテナ線
14…ブリッジ
14a…第二の導電性細帯
14b…不要部
15,15…貫通孔
18,19…被覆層
21…第一の導電性細帯
23…切断刃
24…仮切断刃
27、28…吸引ノズル
P…ピッチ
DESCRIPTION OF SYMBOLS 10 ... Insulating base material 10a ... Insulating strip-shaped base material 12 ... Thermoplastic adhesive layer 13 ... Antenna 13b, 13b ... Terminal part 13a ... Antenna wire 14 ... Bridge 14a ... Second electroconductive strip 14b ... Unnecessary part 15 , 15 ... Through-hole 18, 19 ... Cover layer 21 ... First conductive strip 23 ... Cutting blade 24 ... Temporary cutting blade 27, 28 ... Suction nozzle P ... Pitch

Claims (16)

対になった端子部とこの端子部間を通る導電部とを有する導電性パターンが一定ピッチで形成されるべき、熱可塑性接着剤層が形成された第一の導電性細帯と、各導電性パターンの前記端子部間を結ぶべき導電性細片と同幅に形成され、熱可塑性接着剤層が形成された第二の導電性細帯と、絶縁性帯状基材とを、前記熱可塑性接着剤層を介して、前記絶縁性帯状基材を中層として重ね合わせる工程と、
前記第一の導電性細帯における、対になった端子部とこの端子部間を通る導電部とを有する導電性パターンを一定ピッチで形成する仮切断工程と、
前記第一の導電性細帯における前記対になった端子部とこの端子部間を通る前記導電部とを有する前記導電性パターンを、前記第一の導電性細帯の熱可塑性接着剤層を介し前記基材に接着する第一の接着工程と、
前記第一の導電性細帯における各導電性パターンの前記端子部間を結ぶ部分に、前記導電性細片を用いて前記第二の導電性細帯の熱可塑性接着剤層を介して前記基材に接着する第二の接着工程と、
前記導電性細帯における隣接する導電性パターンの端子部間に介在する部分を不要部として前記導電性細片との境で前記第二の導電性細帯から切り離す切断工程と、
前記第一の導電性細帯における、前記対になった端子部とこの端子部間を通る導電部とを有する一定ピッチで形成された導電性パターンを除くその他の導電性部分を剥し取る第一の不要部除去工程と、
前記不要部を前記基材から剥し取る第二の不要部除去工程と、
を包含してなることを特徴とする非接触型データキャリア用導電部材の製造方法。
A conductive pattern having a pair of terminal portions and a conductive portion passing between the terminal portions should be formed at a constant pitch, a first conductive thin band formed with a thermoplastic adhesive layer, and each conductive A second conductive thin strip formed with the same width as the conductive strip to be connected between the terminal portions of the conductive pattern and formed with a thermoplastic adhesive layer, and the insulating strip-shaped substrate. A step of superposing the insulating strip-shaped base material as an intermediate layer through an adhesive layer;
In the first conductive strip, a temporary cutting step of forming a conductive pattern having a pair of terminal portions and a conductive portion passing between the terminal portions at a constant pitch,
The conductive pattern having the pair of terminal portions in the first conductive strip and the conductive portion passing between the terminal portions, and the thermoplastic adhesive layer of the first conductive strip. A first bonding step for bonding to the substrate via,
In the part connecting the terminal portions of each conductive pattern in the first conductive strip, the base is interposed through the thermoplastic adhesive layer of the second conductive strip using the conductive strip. A second bonding step for bonding to the material;
A cutting step of separating from the second conductive strip at the boundary with the conductive strip as an unnecessary portion a portion interposed between terminal portions of adjacent conductive patterns in the conductive strip;
The first conductive strip removes the other conductive portions except the conductive pattern formed at a constant pitch having the paired terminal portions and the conductive portions passing between the terminal portions. An unnecessary part removing step,
A second unnecessary part removing step of peeling off the unnecessary part from the substrate;
A method for producing a non-contact data carrier conductive member, comprising:
請求項1に記載の非接触型データキャリア用導電部材の製造方法において、前記第一の接着工程、前記第二の接着工程、及び前記切断工程を同時に行うことを特徴とする非接触型データキャリア用導電部材の製造方法。   2. The non-contact type data carrier manufacturing method according to claim 1, wherein the first bonding step, the second bonding step, and the cutting step are performed simultaneously. For producing a conductive member. 請求項1に記載の非接触型データキャリア用導電部材の製造方法において、前記導電性細片を、前記仮切断工程の実行とともに、前記重ね合わせ工程において重ね合わされた前記第一の導電性細帯、前記第二の導電性細帯、および前記絶縁性帯状基材を有する積層材料を予め定められたピッチ移動した場所において、前記積層材料に対して前記第一の接着工程、前記第二の接着工程、及び前記切断工程を同時に行うことを特徴とする非接触型データキャリア用導電部材の製造方法。   2. The method for manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the conductive strip is overlapped in the superimposing step with the first conductive strip as the temporary cutting step is performed. , The first bonding step, the second bonding to the laminated material at a place where the laminated material having the second conductive thin band and the insulating band-shaped substrate is moved by a predetermined pitch. A method for producing a conductive member for a non-contact type data carrier, wherein the step and the cutting step are performed simultaneously. 請求項3に記載の非接触型データキャリア用導電部材の製造方法において、前記仮切断工程の実行と同時に実行される前記第一の接着工程、前記第二の接着工程、及び切断工程の後に、前記仮切断工程が実行された前記積層材料を予め定められたピッチ移動し、前記仮切断工程が実行された前記積層材料に対して、前記第一の接着工程、前記第二の接着工程、及び切断工程が同時に行われ、前記重ね合わせ工程において重ね合わせられた積層材料を予め定められたピッチ移動するごとに、前記仮切断工程の実行と同時に前記第一の接着工程、前記第二の接着工程、及び前記切断工程を実行することを特徴とする非接触型データキャリア用導電部材の製造方法。   In the manufacturing method of the conductive member for non-contact type data carrier according to claim 3, after the first adhesion process, the second adhesion process, and the cutting process performed simultaneously with the execution of the temporary cutting process, The laminated material on which the temporary cutting step has been executed is moved by a predetermined pitch, and the first bonding step, the second bonding step, and the laminated material on which the temporary cutting step has been executed, and Each time the cutting process is performed and the laminated material superposed in the superimposing process is moved by a predetermined pitch, the first adhering process and the second adhering process are performed simultaneously with the execution of the temporary cutting process. And the manufacturing method of the electrically-conductive member for non-contact-type data carriers characterized by performing the said cutting process. 請求項1乃至請求項4のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、第一の不要部除去工程および第二の不要部除去工程を吸引ノズルにより吸引することにより行うことを特徴とする非接触型データキャリア用導電部材の製造方法。   5. The method of manufacturing a non-contact data carrier conductive member according to claim 1, wherein the first unnecessary portion removing step and the second unnecessary portion removing step are sucked by a suction nozzle. A method of manufacturing a conductive member for a non-contact type data carrier. 請求項1乃至請求項5のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、前記第一の不要部除去工程および前記第二の不要部除去工程をエア吹出しノズルでエアを吹き付けることにより行うことを特徴とする非接触型データキャリア用導電部材の製造方法。   6. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the first unnecessary portion removing step and the second unnecessary portion removing step are performed with an air blowing nozzle. A method for producing a conductive member for a non-contact type data carrier, which is performed by spraying. 請求項1乃至請求項6のいずれかに記載の非接触型データキャリア用導電部材の製造方法において、導電性パターンがアンテナであり、導電性細片がブリッジであることを特徴とする非接触型データキャリア用導電部材の製造方法。   7. The non-contact type data carrier conductive member manufacturing method according to claim 1, wherein the conductive pattern is an antenna and the conductive strip is a bridge. A method for manufacturing a conductive member for a data carrier. 対になった端子部とこの端子部間を通る導電部とを有する導電性パターンが一定ピッチで形成されるべき、熱可塑性接着剤層が形成された第一の導電性細帯と、各導電性パターンの前記端子部間を結ぶべき導電性細片と同幅に形成され、熱可塑性接着剤層が形成された第二の導電性細帯と、絶縁性帯状基材と、を、前記熱可塑性接着剤層を介して、前記絶縁性帯状基材を中層として重ね合わせて一方向に送る搬送手段と、
前記第一の導電性細帯における、対になった端子部とこの端子部間を通る導電部とを有する導電性パターンを一定ピッチで形成する仮切断刃と、
前記第一の導電性細帯における前記対になった端子部とこの端子部間を通る前記導電部とを有する前記導電性パターンを、前記第一の導電性細帯の熱可塑性接着剤層を介し前記基材に接着する第一の接着手段と、
前記第一の導電性細帯における各導電性パターンの前記端子部間を結ぶ部分に、前記導電性細片を用いて前記第二の導電性細帯の熱可塑性接着剤層を介して前記基材に接着する第二の接着手段と、
前記導電性細帯における隣接する導電性パターンの端子部間に介在する部分を不要部として前記導電性細片との境で前記第二の導電性細帯から切り離す切断刃と、
前記第一の導電性細帯における、前記対になった端子部とこの端子部間を通る前記導電部とを有する一定ピッチで形成された導電性パターンを除くその他の導電性部分を剥し取る第一の不要部除去手段と、
前記不要部を前記基材から剥し取る第二の不要部除去手段と、
を包含してなることを特徴とする非接触型データキャリア用導電部材の製造装置。
A conductive pattern having a pair of terminal portions and a conductive portion passing between the terminal portions should be formed at a constant pitch, a first conductive thin band formed with a thermoplastic adhesive layer, and each conductive A second conductive thin strip formed with the same width as the conductive strip to be connected between the terminal portions of the conductive pattern and having a thermoplastic adhesive layer formed thereon, and an insulating strip-shaped substrate. Conveying means for superimposing the insulating strip-shaped substrate as an intermediate layer and sending it in one direction through a plastic adhesive layer;
A temporary cutting blade for forming a conductive pattern having a pair of terminal portions and a conductive portion passing between the terminal portions at a constant pitch in the first conductive strip;
The conductive pattern having the pair of terminal portions in the first conductive strip and the conductive portion passing between the terminal portions, and the thermoplastic adhesive layer of the first conductive strip. A first adhesion means for adhering to the substrate via,
In the part connecting the terminal portions of each conductive pattern in the first conductive strip, the base is interposed through the thermoplastic adhesive layer of the second conductive strip using the conductive strip. A second bonding means for bonding to the material;
A cutting blade that separates from the second conductive strip at the boundary with the conductive strip as an unnecessary portion a portion interposed between terminal portions of adjacent conductive patterns in the conductive strip;
In the first conductive strip, the other conductive portions excluding the conductive pattern formed at a constant pitch having the paired terminal portions and the conductive portions passing between the terminal portions are peeled off. An unnecessary portion removing means;
A second unnecessary part removing means for peeling off the unnecessary part from the substrate;
An apparatus for manufacturing a conductive member for a non-contact type data carrier, comprising:
請求項8に記載の非接触型データキャリア用導電部材の製造装置において、前記第一の接着手段、前記第二の接着手段、及び前記切断刃が一体化されていることを特徴とする非接触型データキャリア用導電部材の製造装置。   9. The non-contact type data carrier conductive member manufacturing apparatus according to claim 8, wherein the first adhesive means, the second adhesive means, and the cutting blade are integrated. Manufacturing device for conductive member for type data carrier. 請求項8に記載の非接触型データキャリア用導電部材の製造方法において、前記仮切断刃と、一体化されている前記第一の接着手段、前記第二の接着手段、及び前記切断刃との間隔を予め定められたピッチ間隔とすることを特徴とする非接触型データキャリア用導電部材の製造装置。   9. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 8, wherein the temporary cutting blade and the first bonding means, the second bonding means, and the cutting blade integrated with each other. An apparatus for manufacturing a non-contact data carrier conductive member, characterized in that the interval is a predetermined pitch interval. 請求項10に記載の非接触型データキャリア用導電部材の製造装置において、前記仮切断刃、前記第一の接着手段、前記第二の接着手段、及び前記切断刃が一体化されていることを特徴とする非接触型データキャリア用導電部材の製造装置。   11. The non-contact data carrier conductive member manufacturing apparatus according to claim 10, wherein the temporary cutting blade, the first bonding means, the second bonding means, and the cutting blade are integrated. A non-contact type data carrier conductive member manufacturing apparatus. 請求項8乃至請求項11のいずれかに記載の非接触型データキャリア用導電部材の製造装置において、前記第一の不要部除去手段および前記第二の不要部除去手段が吸引ノズルを含むことを特徴とする非接触型データキャリア用導電部材の製造装置。   12. The non-contact data carrier conductive member manufacturing apparatus according to claim 8, wherein the first unnecessary portion removing means and the second unnecessary portion removing means include a suction nozzle. A non-contact type data carrier conductive member manufacturing apparatus. 請求項8乃至請求項12のいずれかに記載の非接触型データキャリア用導電部材の製造装置において、前記第一の不要部除去手段および前記第二の不要部除去手段がエアを吹き付けるエア吹出しノズルを含むことを特徴とする非接触型データキャリア用導電部材の製造装置。   13. The non-contact data carrier conductive member manufacturing apparatus according to claim 8, wherein the first unnecessary portion removing means and the second unnecessary portion removing means blow air. An apparatus for producing a non-contact type data carrier conductive member. 対になった端子部とこの端子部間を通る導電部とを有する導電性パターンが形成された第一の導電性細帯が絶縁性基材に熱可塑性接着剤層を介して接着され、導電性細片がその両端部と上記端子部とが合致するように前記絶縁性基材の他の面に他の熱可塑性接着剤層を介して接着され、この導電性細片の両端縁を整える切断刃が前記第一の導電性細帯、前記絶縁性基材、前記熱可塑性接着剤層、を貫通することにより貫通孔が形成されていることを特徴とする非接触型データキャリア用導電部材。   A first conductive strip formed with a conductive pattern having a pair of terminal portions and a conductive portion passing between the terminal portions is bonded to an insulating substrate via a thermoplastic adhesive layer, and conductive. The conductive strip is bonded to the other surface of the insulating base material through another thermoplastic adhesive layer so that the both end portions and the terminal portion are aligned, and the both end edges of the conductive strip are arranged. A conductive member for a non-contact type data carrier, characterized in that a through-hole is formed by a cutting blade penetrating the first conductive thin strip, the insulating substrate, and the thermoplastic adhesive layer. . 請求項14に記載の非接触型データキャリア用導電部材において、導電性パターンがアンテナであり、導電性細片がブリッジであることを特徴とする非接触型データキャリア用導電部材。   The conductive member for a non-contact type data carrier according to claim 14, wherein the conductive pattern is an antenna and the conductive strip is a bridge. 請求項14又は15に記載の非接触型データキャリア用導電部材において、基材の表裏面が被覆層で覆われ、基材の表裏面の被覆層が貫通孔を通じて互いに接着していることを特徴とする非接触型データキャリア用導電部材。   The conductive member for a non-contact type data carrier according to claim 14 or 15, wherein the front and back surfaces of the substrate are covered with a coating layer, and the coating layers on the front and back surfaces of the substrate are bonded to each other through a through hole. A conductive member for a non-contact type data carrier.
JP2007243875A 2007-09-20 2007-09-20 Non-contact type data carrier conductive member and method and apparatus for manufacturing the same Active JP5018370B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007243875A JP5018370B2 (en) 2007-09-20 2007-09-20 Non-contact type data carrier conductive member and method and apparatus for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007243875A JP5018370B2 (en) 2007-09-20 2007-09-20 Non-contact type data carrier conductive member and method and apparatus for manufacturing the same

Publications (2)

Publication Number Publication Date
JP2009075836A true JP2009075836A (en) 2009-04-09
JP5018370B2 JP5018370B2 (en) 2012-09-05

Family

ID=40610744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007243875A Active JP5018370B2 (en) 2007-09-20 2007-09-20 Non-contact type data carrier conductive member and method and apparatus for manufacturing the same

Country Status (1)

Country Link
JP (1) JP5018370B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009116779A (en) * 2007-11-09 2009-05-28 Toppan Printing Co Ltd Non-contact ic card

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11175676A (en) * 1997-12-12 1999-07-02 Hitachi Maxell Ltd Non-contact ic card
JP2003162701A (en) * 2001-11-28 2003-06-06 Dainippon Printing Co Ltd Method for forming antenna of non-contact ic card
JP2005338956A (en) * 2004-05-24 2005-12-08 Maxell Seiki Kk Method for manufacturing radio ic tag
JP2006209278A (en) * 2005-01-26 2006-08-10 Konica Minolta Photo Imaging Inc Ic card manufacturing method and ic card
JP2007067650A (en) * 2005-08-30 2007-03-15 Dainippon Printing Co Ltd Manufacturing method and forming mold of non-contact data carrier member
JP2007103881A (en) * 2005-10-07 2007-04-19 Dainippon Printing Co Ltd Conductive member for non-contact data carrier and its manufacturing method and device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11175676A (en) * 1997-12-12 1999-07-02 Hitachi Maxell Ltd Non-contact ic card
JP2003162701A (en) * 2001-11-28 2003-06-06 Dainippon Printing Co Ltd Method for forming antenna of non-contact ic card
JP2005338956A (en) * 2004-05-24 2005-12-08 Maxell Seiki Kk Method for manufacturing radio ic tag
JP2006209278A (en) * 2005-01-26 2006-08-10 Konica Minolta Photo Imaging Inc Ic card manufacturing method and ic card
JP2007067650A (en) * 2005-08-30 2007-03-15 Dainippon Printing Co Ltd Manufacturing method and forming mold of non-contact data carrier member
JP2007103881A (en) * 2005-10-07 2007-04-19 Dainippon Printing Co Ltd Conductive member for non-contact data carrier and its manufacturing method and device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009116779A (en) * 2007-11-09 2009-05-28 Toppan Printing Co Ltd Non-contact ic card

Also Published As

Publication number Publication date
JP5018370B2 (en) 2012-09-05

Similar Documents

Publication Publication Date Title
JP4752307B2 (en) Non-contact type data carrier conductive member and method and apparatus for manufacturing the same
US20080295318A1 (en) Method and Device for Continuously Producing Electronic Film Components and an Electronic Film Component
JP7353985B2 (en) Circuit patterns, RFID inlays, RFID labels and RFID media
US20100187316A1 (en) Chip module for an rfid system
JP4779556B2 (en) Method and apparatus for manufacturing conductive member for non-contact type data carrier
JP2005340773A (en) Conductive member for non-contact type data carrier, manufacturing method thereof and equipment thereof
JP5018370B2 (en) Non-contact type data carrier conductive member and method and apparatus for manufacturing the same
JP2005311179A (en) Process for manufacturing a conductive material for non-conductive data carriers, and equipment for manufacturing the non-conductive material
JP5040551B2 (en) Non-contact type data carrier conductive member and method and apparatus for manufacturing the same
JP4629535B2 (en) Non-contact data carrier member manufacturing method and mold
US8640325B2 (en) Method of continuously producing electronic film components
JP5083091B2 (en) Method and apparatus for forming non-contact data carrier conductive member
JP4637499B2 (en) Sheet wound with interposer and IC tag
JP2009032071A (en) Production method and device of conductive member for non-contact type data carrier
JP5050426B2 (en) Non-contact IC tag manufacturing method and apparatus
JP2005346696A (en) Conductive member for contactless type data carrier, and method and device for manufacturing the same
JP4910344B2 (en) Non-contact type IC tag and manufacturing method thereof
JP2009031958A (en) Production method and device of conductive member for non-contact type data carrier
JPH07226574A (en) Manufacture of flexible flat cable and manufacture of material for flexible flat cable
JP2005346695A (en) Conductive member for contactless type data carrier, and method and device for manufacturing the same
JP2009031964A (en) Production method and device for non-contact ic tag
JP2009075863A (en) Method and device for manufacturing electroconductive member for non-contact type data carrier
JP2008287694A (en) Manufacturing method and device of conductive member for contactless type data carrier
JP2008015969A (en) Method of manufacturing conductive member for contactless data carrier, and device
JP5167619B2 (en) A method and apparatus for manufacturing a conductive sheet for a non-contact type data carrier, and an apparatus for manufacturing a sheet with an IC tag.

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100611

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120502

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120515

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120528

R150 Certificate of patent or registration of utility model

Ref document number: 5018370

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150622

Year of fee payment: 3