JP4629535B2 - Non-contact data carrier member manufacturing method and mold - Google Patents

Description

  The present invention relates to a method for manufacturing a non-contact data carrier member and a mold used for manufacturing the non-contact data carrier member.

  As shown in FIG. 1, a wireless tag 1 associated with a product or the like is made by attaching an interposer 3 that is a non-contact data carrier member to an antenna 2.

  Similarly, the antenna 2 which is a member for a non-contact data carrier is obtained by superposing a conductive layer of aluminum or the like on a sheet 4 of polyester or the like through an adhesive layer and punching out a fine antenna pattern portion 5 in the conductive layer with a punching blade. The pattern part 5 is made by melting the adhesive layer by hot pressing and adhering it to the sheet 4, and then removing unnecessary portions of the conductive layer from the sheet 4 (see, for example, Patent Document 1).

  The interposer 3 has a layer structure similar to that of the antenna 2, but the present inventors have conventionally used conductive pattern portions 7 and 8 that are divided with a slit 6 interposed therebetween as shown in FIGS. 2 and 3. The IC chip 10 is placed on the conductive pattern portions 7 and 8 so as to straddle the slit 6 and the electrodes 10 a and 10 b of the IC chip 10 are electrically connected to the conductive pattern portions 7 and 8. Thus, the interposer 3 is manufactured.

  As shown in FIG. 3, the interposer 3 is spanned between the end portions 5a and 5b of the antenna pattern portion 5 of the antenna 2, and both ends of the conductive pattern portions 7 and 8 are formed on the antenna pattern portion 5 by caulking or the like. The wireless tag 1 is formed by being connected to the end portions 5a and 5b.

JP 2003-37427 A

  In recent years, the IC chip 10 has been miniaturized to, for example, about 0.5 mm square or less. When such an IC chip 10 is mounted on the conductive pattern portions 7 and 8 of the interposer 3 that is a member for a non-contact data carrier. If the width δ of the slit 6 is not formed to a size of about 0.1 mm to 0.2 mm, electrical conduction between the electrodes 10a and 10b of the IC chip 10 and the conductive pattern portions 7 and 8 can be obtained. I can't. However, conventionally, in order to increase the production efficiency of the interposer 3, all the cutting blades for punching the conductive pattern portions 7 and 8 are arranged apart from each other by the width of the slit 6, so that all the conductivity necessary for one interposer 3 is provided. The pattern portions 7 and 8 are punched at the same time. For this reason, the formation of the slits 6 in the conductive pattern portions 7 and 8 is likely to be inaccurate and uncertain, and the conductive pattern portions 7 and 8 on both sides of the slit 6 are easily electrically connected to each other. As a result, the performance of the wireless tag 1 is reduced.

  Accordingly, an object of the present invention is to provide a method and a mold for manufacturing a member for a non-contact data carrier that can solve the above-mentioned problems.

  In order to solve the above-mentioned problem, the invention according to claim 1 is characterized in that the punching blades (16, 17) for punching the conductive pattern portions (7, 8) divided by the narrow gap (6) are respectively formed on the base material (9 ) In the direction perpendicular to the feeding direction of the continuous body (9a) by the width of the slit (6), and in the feeding direction of the continuous body (9a) of the base material (9) by a predetermined feeding pitch (P). A superposition of the continuous body (9a) of the base material (9) and the continuous body (13) of the conductive pattern portions (7, 8) is formed at a predetermined feed pitch (P). The conductive pattern portion (7, 8) is punched into the continuous body (13) of the conductive pattern portion (7, 8) by pressing the superimposed body with the surface plate (15b) while intermittently feeding the conductive pattern. Method for manufacturing member for non-contact data carrier in which part (7, 8) is bonded to continuous body (9a) of substrate (9) Adopted to.

  The invention according to claim 2 is the method of manufacturing a member for a non-contact data carrier according to claim 1, wherein the slit (6a) extends in a direction orthogonal to the slit (6). The cutting blades (26, 27) of the other conductive pattern portions (23, 24) separated from the conductive pattern portions (7, 8) are moved in the feed pitch ( In addition to shifting by P, the phase is shifted by the width (γ) of the other slit (6a) to form on the surface plate, and the continuum of the base material (9) and the conductive pattern portion (7, 8, 23) , 24) The superposed body with the continuous body is intermittently fed at a predetermined feed pitch (P), and the superposed body is pressed with a surface plate to conduct the conductive body of the conductive pattern portion (7, 8, 23, 24). Punched conductive pattern portions (7, 8, 23) Employing the method of manufacturing the non-contact data carrier member for bonding 24) a continuum of the substrate (9).

  The invention according to claim 3 is the method for producing a member for a non-contact data carrier according to claim 1 or 2, wherein the continuous body (9a) or the conductive pattern portion (7, 7) of the base material (9). A conductive adhesive layer (7, 8) formed by forming a thermoplastic adhesive layer (12) on the surface of a continuous body (13) of 8, 23, 24) and punching with a punching blade (16, 17, 26, 27). , 23, 24) hot press plates (18, 19, 30, 31) for hot pressing the continuous body (9a) of the substrate (9) from the punching blade (17) in the feed direction of the superposed body. The conductive pattern portions (7, 8, 23, 24) formed on the surface plate (15b) by shifting by the pitch (P) and punched by the punching blades (16, 17) are heated press plates (18, 19, 30). , 31) to adhere to the continuous body (9a) of the substrate (9). Employing the manufacturing method of the A member.

  In the invention according to claim 4, the punching blades (16, 17) for punching out the conductive pattern portions (7, 8) divided by the slit (6) are continuous bodies of the base material (9). (9a) and the continuous body (13) of the conductive pattern portions (7, 8) are shifted by the width (δ) of the slit (6) in the direction perpendicular to the feeding direction of the superposed body, and the superposed body is fed. The conductive plate is provided on the surface plate (15b) so as to be displaced by a predetermined feed pitch (P) in the direction, and is punched into the continuous body (13) of the conductive pattern portion (7, 8) by the punching blade (16, 17). The hot press plates (18, 19) for hot pressing the sexual pattern portions (7, 8) onto the continuous body (9a) of the base material (9) are further fed from the punching blade (17) by the feed pitch in the feed direction of the superimposed body. A non-contact data carrier member mold provided on the surface plate (15b) so as to be displaced by (P) is adopted.

  According to a fifth aspect of the present invention, in the non-contact data carrier forming die according to the fourth aspect, the other slit (6a) extending in a direction perpendicular to the slit (6) is sandwiched between The punching blades (26, 27) of the other conductive pattern portions (23, 24) separated from the conductive pattern portions (7, 8) are fed in the feed direction of the continuous body of the base material (9) ( P) is shifted and the phase is shifted by the width (γ) of the other slit (6a) and provided on the surface plate, and the conductive pattern portion is formed by each punching blade (16, 17, 26, 27). A hot press plate (18) for hot-pressing the conductive pattern portion (7, 8, 23, 24) punched into the continuous body (13) of (7, 8, 23, 24) onto the continuous body of the base material (9). , 19, 30, 31) is a predetermined feed pitch (P Employing a mold of a non-contact data carrier member that is provided on the surface plate so as to be offset only.

  According to the invention according to claim 1 or claim 4, the minute slits (6) are accurately formed between the conductive pattern portions (7, 8) in the non-contact data carrier member, and the conductive pattern portion ( 7, 8) The electrical continuity between each other can be reliably interrupted. Therefore, even a small IC chip (10) can be mounted.

  According to the invention according to claim 2 or claim 5, two small perpendicular slits (6, 6a) between the conductive pattern portions (7, 8, 23, 24) in the non-contact data carrier member. Can be accurately formed, and electrical conduction between the conductive pattern portions (7, 8, 23, 24) can be reliably interrupted. Therefore, for example, even a small IC chip (25) having four terminals can be mounted.

  According to the invention which concerns on Claim 3, the electroconductive pattern part (7,8,23,24) pierced with the punching blade (16,17,26,27) is simply and rapidly on a base material (9). Can be glued. In addition, since the conductive pattern portions (7, 8, 23, 24) are punched into the metal foil and then bonded, the deformation of the base material (9) generated during the punching process and the wrinkles of the metal foil are caused by hot pressing during bonding. Completely removed, adhesion and adhesion of the conductive pattern portions (7, 8, 23, 24) to the base material (9) are improved, durability is improved and electrical performance is stabilized.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

<Embodiment 1>
As shown in FIGS. 1 to 3, the interposer 3 which is a kind of non-contact data carrier member is used as, for example, a component of the wireless tag 1 and is connected to the end portions 5 a and 5 b of the antenna pattern portion 5 in the antenna 2. By being connected, it is used as a data storage means.

  The antenna 2 has a structure similar to that of a conventional product, and a conductive layer made of a metal foil such as aluminum is laminated on a sheet 4 made of a synthetic resin such as polyester via a thermoplastic adhesive layer 11. The antenna pattern portion 5 is punched out, and the antenna pattern portion 5 is melted and bonded to the sheet 4 by hot pressing, and then unnecessary portions of the conductive layer are removed from the sheet 4.

  As shown in FIGS. 2 and 3, the interposer 3 includes a base material 9 made of a synthetic resin sheet such as polyester, and two conductive pattern portions 7 bonded to the base material 9 via a thermoplastic adhesive layer 12. , 8 and an IC chip 10 attached so as to straddle the two conductive pattern portions 7, 8.

  The IC chip 10 is a small thin chip of 0.5 mm square or less, for example, and two-terminal electrodes 10a and 10b are drawn from the back surface thereof.

  The substrate 9 is formed as an elongated strip-like sheet, and two conductive pattern portions 7 and 8 are bonded to the surface of the substrate 9 via a thermoplastic adhesive layer 12.

  The two conductive pattern portions 7 and 8 are each formed into an elongated rectangle by punching a conductive layer made of a metal foil such as aluminum, and a slit 6 is interposed between the two for insulation. The width δ of the slit 6 is, for example, about 0.1 mm to 0.2 mm, and is slightly smaller than the distance α between the electrodes 10 a and 10 b of the IC chip 10 for convenience of mounting the IC chip 10.

  As shown in FIGS. 2 and 3, the IC chip 10 is placed on two conductive pattern portions 7 and 8 so as to straddle the slit 6, and the electrodes 10a and 10b of the IC chip 10 are connected to the conductive pattern portions. 7 and 8 are electrically connected to each other. In the illustrated example, this electrical conduction is performed by caulking, and the bent metal foils of the conductive pattern portions 7 and 8 are in contact with the metal foils at the ends 5 a and 5 b of the antenna pattern portion 5.

  When the wireless tag 1 having the above configuration is brought close to a reader / writer (not shown), various information is read from or written into the IC chip 10 in an electromagnetic field.

  Next, a method for manufacturing an interposer member that is a non-contact data carrier member before mounting the IC chip 10 will be described.

  (1) As shown in FIGS. 4 and 5, first, a continuous body 9a of the base material 9 and a continuous body 13 of the conductive pattern portions 7 and 8 are prepared, and both the continuous bodies 9a and 13 are arranged in the direction of the arrow. Continue running at the same speed. The continuous body 9a of the substrate 9 is a synthetic resin film such as polyester, and the continuous body 13 of the conductive pattern portions 7 and 8 is a conductive metal foil such as aluminum.

  A thermoplastic adhesive layer 12 is formed on the surface of the continuous body 13 of the conductive pattern portions 7 and 8 by solid printing or coating. The continuous body 13 of the conductive pattern portions 7 and 8 is fed out in one direction from a winding roll (not shown), and similarly, the continuous body 9a of the base material 9 is fed out from a winding roll (not shown). Both continuous bodies 9a and 13 are overlapped at the position of the guide roller 14 so as to sandwich the thermoplastic adhesive layer 12 therebetween.

  (2) A molding die 15 is disposed on the downstream side of the guide roller 14 as viewed in the flow direction of the superposed body in which the continuous bodies 9a and 13 overlap. The molding die 15 includes a receiving die 15a for sandwiching a superposed body of the continuous bodies 9a and 13. The receiving die 15a is fixed at a fixed position on the traveling path of the superimposed body, and the forming die 15 performs a vertical reciprocating linear motion with respect to the receiving die 15a by a pneumatic cylinder device or the like (not shown).

  As shown in FIGS. 4 to 7, the mold 15 has a surface plate 15b extending in parallel with the superposed body of the continuous bodies 9a and 13, and on the lower surface facing the superposed body of the surface plate 15b, FIG. The punching blades 16 and 17 for punching out the conductive pattern portions 7 and 8 divided by sandwiching the slit 6 shown in FIG. 3 are shifted by a width δ of the slit 6 in the direction perpendicular to the feeding direction of the superimposed body, and The conductive pattern portions 7 and 8 which are provided so as to be shifted by a predetermined feed pitch P in the feeding direction of the superimposed body and punched into the continuous body 13 of the conductive pattern portions 7 and 8 by the punching blades 16 and 17 are respectively heated. The hot press plates 18 and 19 to be pressed are provided so as to be further displaced from the punching blade 17 by the same feed pitch P in the feed direction of the substrate continuous body 9a.

  The molding die 15 is provided with an electric heater (not shown) corresponding to the hot press plates 18 and 19. The heat press plates 18 and 19 are heated to a temperature at which the thermoplastic adhesive layer 12 between the superposed bodies can be melted by heat transfer from the electric heater.

  In this embodiment, when the mold 15 is reciprocated three times with respect to the superimposed body, three pairs of conductive pattern portions 7 and 8 are formed, and one of the conductive patterns divided by the slit 6 is sandwiched. Three sets of punching blades 16 for punching the sex pattern portion 7 are provided at a predetermined arrangement pitch p in the feeding direction of the superimposed body. In addition, three sets of punching blades 17 for punching the other conductive pattern portion 8 are similarly provided at an arrangement pitch p at a position shifted by a feed pitch P in the feed direction of the superimposed body. Furthermore, three pairs of hot press plates 18 and 19 for simultaneously hot pressing the three pairs of conductive pattern portions 7 and 8 are provided at positions shifted by a feed pitch P in the feed direction of the superposed body at an array pitch p. The hot press plates 18 and 19 are provided at positions adjacent to each other, and a gap corresponding to the slit 6 between the hot press plates 18 and 19 may or may not be provided. The superimposed body is intermittently fed three times to the mold 15 at a feed pitch P = 3p, and three pairs of conductive patterns are formed on the continuous body 9a of the base material 9 every time the mold 15 reciprocates three times. Parts 7 and 8 are formed.

  The number of pairs of conductive pattern portions 7 and 8 to be formed by three reciprocating motions of the mold 15 can be freely changed by adjusting the number of the punching blades 16 and 17 and the hot press plates 18 and 19 installed. . For example, in the case of a pair, the punching blades 16 and 17 and the hot press plates 18 and 19 are arranged one by one on the left and right of the surface plate 15b when viewed in the feeding direction of the superposed body, and one arrangement pitch p is superposed as the feeding pitch P. The body is fed intermittently. In the case of four pairs or more, four or more punching blades 16 and 17 and four hot press plates 18 and 19 are arranged on the left and right of the surface plate 15b, and the superposed body is intermittent with a feed pitch P of four or more times the arrangement pitch p. Sent.

  Further, as shown in FIG. 7, the amount of displacement of the punching blades 16 and 17 and the hot press plates 18 and 19 in the direction perpendicular to the feeding direction of the superposed body is such that the slits 6 in the pair of the conductive pattern portions 7 and 8 are in pairs. Corresponding to the width δ, the distance is set to about 0.1 mm to 0.2 mm. The punching blades 16 and 17 for punching the conductive pattern portions 7 and 8 divided by the gap 6 are not adjacent to each other in the direction orthogonal to the feeding direction of the superimposed body, and are predetermined in the feeding direction of the superimposed body. Since it is provided so as to be shifted by the feed pitch P, the punching blades 16 and 17 can be processed more sharply and accurately, and the shift amount corresponding to the width δ of the slit 6 can be set accurately.

  The receiving mold 15 a has a configuration in which a hard metal plate such as a stainless steel plate is attached to an elastic sheet such as rubber, and is disposed so that the metal plate is in contact with the continuous body 9 a of the base material 9.

  (3) The superimposed body is intermittently fed by a feed pitch P between the mold 15 and the receiving mold 15a, and the molding mold 15 reciprocates once with respect to the receiving mold 15a every time it is temporarily stopped. As shown in FIG. 5, when the mold 15 is reciprocated three times and the superimposed body is intermittently fed three times at a feed pitch P, the conductive pattern portions 7 and 8 that are divided across the slit 6 are made of metal foil. Three pairs are formed on the conductive layer.

  That is, as shown in FIG. 5, when the superimposed body stops at the mold 15, the mold 15 reciprocates once. As a result, one conductive pattern portion 7 divided across the slit 6 is simultaneously punched into the metal foil continuum 13 at three locations. Next, when the superposed body is fed into the mold 15 by the feed pitch P and stopped, the mold 15 reciprocates once, and the other conductive pattern portion 8 divided by sandwiching the slit 6 is made of metal foil. The continuous body 13 is simultaneously punched in three places. At this stage, the three pairs of conductive pattern portions 7 and 8 are punched, and the metal foil portions corresponding to the slits 6 in the three pairs of conductive pattern portions 7 and 8 are punched into the slit shape by the width δ. It is. When the superimposed body is further fed into the mold 15 by the feeding pitch P and stopped, the mold 15 reciprocates once, and the three pairs of punched conductive pattern portions 7 and 8 are formed by the hot press plates 18 and 19. The conductive pattern portions 7 and 8 are bonded to the continuous body 9 a of the base material 9 by the melted thermoplastic adhesive layer 12 pressed against the continuous body 9 a of the material 9.

  (4) By repeating the step (3), pairs of the conductive pattern portions 7 and 8 are continuously formed on the superposed body at intervals of the arrangement pitch p.

  (5) As shown in FIGS. 4 and 5, a suction tube 20 and a separation roller 21 are arranged on the downstream side of the mold 15 as means for separating the unnecessary portion 13 a from the metal foil continuum 13. The

  After the metal foil continuum 13 is heat-bonded to the continuum 9a of the base material 9 only by the molding die 15 corresponding to the conductive pattern portions 7 and 8, the metal foil continuum 13 and the base material 9 continuum. When the superposed body 9a arrives at the place where the suction pipe 20 and the separation roller 21 are installed, the unnecessary portion 13a of the metal foil continuous body 13 is sucked by the suction pipe 20, and the continuous body 9a of the base material 9 is guided to the separation roller 21. In reverse, it travels in an acute angle. Thereby, the unnecessary part 13a of the continuous body 13 of metal foil is appropriately peeled off from the continuous body 9a of the base material 9, and is recovered in a recovery box (not shown) to which the suction pipe 20 is connected.

  As shown in FIG. 4, a nozzle 21 that ejects a gas such as air is disposed at a location where the unnecessary portion 13 a of the metal foil continuum 13 is separated from the continuum 9 a of the base material 9. . The gas jetted from the nozzle 21 is blown toward the boundary between the continuous body 9a of the base material 9 and the unnecessary portion 13a of the continuous body 13 of the metal foil, thereby promoting the peeling and removal of the unnecessary portion 13a. The

  The continuum 9a of the substrate 9 from which the unnecessary portion 13a is removed and carrying only the conductive pattern portions 7 and 8 is subsequently sent to the mounting process of the IC chip 10, and as shown in FIG. 7 and 8, the IC chip 10 is mounted in the manner shown in FIGS. 2 and 3.

  Thereafter, the continuous body 9a of the base material 9 on which the IC chip 10 is mounted is cut into the pair of conductive pattern portions 7 and 8 to form the interposer 3 that is a non-contact data carrier member.

  The interposer 3 is attached to the wireless tag 1 in the manner shown in FIG.

<Embodiment 2>
As shown in FIG. 8, the non-contact data carrier member, the interposer 22, includes a base material 9 made of a synthetic resin sheet such as polyester and four base materials 9 bonded to the base material 9 through a thermoplastic adhesive layer. The conductive pattern portions 7, 8, 23, and 24 and the IC chip 25 attached so as to straddle the four conductive pattern portions 7, 8, 23, and 24 are provided.

  The IC chip 25 is a small thin chip of 0.5 mm square or less, for example, and four-terminal electrodes 25a, 25b, 25c, and 25d are drawn from the back surface thereof.

  The substrate 9 is formed as an elongated strip-like sheet, and four conductive pattern portions 7, 8, 23, and 24 are bonded to the surface via a thermoplastic adhesive layer 12 (see FIG. 3).

  In addition to the pair of conductive pattern portions 7 and 8 in the first embodiment, the conductive pattern portions 7, 8, 23 and 24 are paired with the other slit 6 a extending in the direction orthogonal to the slit 6. The other conductive pattern portions 23 and 24 are separated from the conductive pattern portions 7 and 8. Of the four conductive pattern portions 7, 8, 23, 24, the two conductive pattern portions 7, 8 arranged in a straight line are each made of a conductive foil made of a metal foil such as aluminum, as in the first embodiment. The layer is punched to form an elongated rectangle, and a slit 6 is interposed between the two for insulation. The width δ of the slit is, for example, about 0.1 mm to 0.2 mm, and is slightly larger than the distance between the electrodes 25a and 25c and the electrodes 25b and 25d of the IC chip 25 for convenience of mounting the IC chip 25. small.

  Further, the remaining two conductive pattern portions 23, 24 among the four conductive pattern portions 7, 8, 23, 24 are each formed into a short rectangle by punching a conductive layer made of a metal foil such as aluminum, The slit 6 between them is formed with the same width as an extension of the slit 6, and the slit 6 a between the pair of elongated conductive pattern portions 7, 8 has a width γ of the slit 6. It is formed so as to be substantially equal to the width δ.

  As shown in FIG. 8, the IC chip 25 is placed on the four conductive pattern portions 7, 8, 23, 24 so as to straddle the slits 6, 6a, and the electrodes 25a, 25b, 25c, 25d is connected to each conductive pattern portion 7, 8, 23, 24 so as to be electrically conductive.

  The interposer 22 is attached to the wireless tag 1 (see FIG. 1) in the same manner as in the first embodiment. When the wireless tag 1 approaches a reader / writer (not shown), various types of interposer 22 are connected to the IC chip 25 within the electromagnetic field. Information is read or written.

  Next, the manufacturing method of the member for interposers before mounting the said IC chip 25 is demonstrated.

  (1) As in the first embodiment, a continuum of the base material 9 and a continuum of the conductive pattern portions 7, 8, 23, and 24, which are metal foils, are prepared, and both continuums are continuous at the same speed. Run and overlap.

  (2) A molding die is disposed on the downstream side of the superposed body of both continuous bodies, and this molding die includes a punching blade and a hot press plate as shown in FIG.

  That is, the molding die includes a surface plate similar to that of the first embodiment, and punching blades 17 and 18 corresponding to the pair of elongated conductive pattern portions 7 and 8 on the lower surface of the surface plate, and another pair of conductive patterns. Heat that presses the conductive blades 26, 27 corresponding to the portions 23, 24 and the conductive pattern portions 7, 8, 23, 24 punched by the punches 17, 18, 26, 27 against the continuous body of the substrate 9. Press plates 18, 19, 30, and 31.

  In this embodiment, when the mold is reciprocated five times, six pairs of conductive pattern portions 7, 8, 23, and 24 are formed. Three sets of punching blades 16 for punching out the longer conductive pattern portion 7 among the pattern portions 7 and 23 are provided on the surface plate at a predetermined arrangement pitch p in the feeding direction of the superimposed body, and the feed pitch P in the feeding direction of the superimposed body is provided. Three sets of punching blades 17 for punching out the longer conductive pattern portion 8 of the other conductive pattern portions 8 and 24 are provided on the same surface plate at the same arrangement pitch p at positions shifted by a distance. Further, a punching blade for punching out the shorter conductive pattern portion 23 of the one conductive pattern portions 7 and 23 divided by the slit 6 at a position further shifted by the feed pitch P in the feed direction of the superimposed body. Three sets 26 are provided on the surface plate with a predetermined arrangement pitch p in the feeding direction of the superimposed body, and the other conductive pattern portions 8 and 24 are located at positions further shifted by the feeding pitch P in the feeding direction of the superimposed body. Three sets of punching blades 27 for punching out the shorter conductive pattern portion 24 are provided on the same surface plate with the same arrangement pitch p.

  Furthermore, the hot press plates 18, 19, 30, and 31 that simultaneously heat press the six pairs of conductive pattern portions 7, 8, 23, and 24 at positions shifted by the feed pitch P in the feed direction of the superimposed body are arranged pitch p. Six pairs are provided. The hot press plates 18, 19, 30, 31 are provided at positions adjacent to each other, and a gap corresponding to the slits 6, 6a between the hot press plates 18, 19, 30, 31 may or may not be provided. Also good. The superimposed body is intermittently fed five times at a feed pitch P = 3p to the mold, and six pairs of conductive pattern portions 7 and 8 are formed on the continuous body of the base material 9 every time the mold is reciprocated five times. , 23, 24 are formed.

  Of the punching blades 16, 17, 26, 27 and the heat press plates 18, 19, 30, 31 for the six pairs of conductive pattern portions 7, 8, 23, 24, the punching blades 26, 27 and the heat press plate 30, 31 is out of phase with respect to the other conductive pattern portions 7 and 8 and the hot press plates 28 and 29 by the width γ of the slit 6a.

  The number of sets of the conductive pattern portions 7, 8, 23, 24 formed by five reciprocations of the forming die adjusts the number of installation of the punching blades 16, 17, 26, 27 and the hot press plates 18, 19, 30, 31. It can be changed freely.

  Further, the amount of deviation of the punching blades 16, 17, 26, 27 and the heat press plates 18, 19, 30, 31 in the direction perpendicular to the feeding direction of the superposed body is inward of the conductive pattern portions 7, 8, 23, 24. Corresponding to the width [delta] of the slit 6 in FIG. As shown in FIG. 9, the punching blades 16, 17, 26, and 27 for punching out the conductive pattern portions 7, 8, 23, and 24, respectively, which are divided with the slit 6 interposed therebetween, have predetermined feeds in the feed direction of the superimposed body. Since the punching blades 16, 17, 26, and 27 are processed more sharply and accurately, the shift amount corresponding to the slits 6 and 6 a can be set accurately.

  (3) The superimposed body is intermittently fed by a feed pitch P between the mold and the receiving mold, and the punching die reciprocates with respect to the receiving mold every time it is temporarily stopped. When the superimposed body is intermittently fed five times and the mold is reciprocated five times, the four conductive pattern portions 7, 8, 23, and 24 that are divided across the slits 6 and 6a are arranged in three locations on the metal foil continuum. Simultaneously formed.

  That is, when the superposed body stops at the mold, the mold reciprocates once. As a result, one long conductive pattern portion 7 divided across the slit 6 is simultaneously punched over three locations on the metal foil continuum. Next, when the superposed body is fed into the mold by the feed pitch P and stopped, the mold reciprocates once, and the other long conductive pattern portion 8 separated by sandwiching the slit 6 is a continuous metal foil. It is punched in three places on the body at the same time. Further, when the superposed body is fed by the feed pitch P into the mold and stopped, the mold reciprocates once, and one short conductive pattern portion 23 that is divided across the slit 6 is a continuous body of metal foil. When the superimposed body is simultaneously punched over three places and the superposed body is further fed into the mold by the feed pitch P and stopped, the mold is reciprocated once, and the other short conductive pattern divided by the slit 6 therebetween. The part 24 is simultaneously punched over three places on the metal foil continuum. At this stage, three sets of conductive pattern portions 7, 8, 23, 24 are punched out, and the metal foil corresponding to the slits 6, 6a in the six pairs of long and short conductive pattern portions 7, 8, 23, 24. The portions are punched into slits with the widths δ and γ, respectively. When the superimposed body is further fed into the mold by the feed pitch P and stopped, the mold reciprocates once, and the three sets of conductive pattern portions 7, 8, 23, 24 punched out are the hot press plates 28, 29. , 30, 31 are pressed against the continuous body of the base material 9, and the conductive pattern portions 7, 8, 23, 24 are bonded to the continuous body of the base material 9 by the melted thermoplastic adhesive layer 12.

  (4) By repeating the step (3), the superposed body is continuously formed at intervals of the arrangement pitch p with the conductive pattern portions 7, 8, 23, 24 as a set.

  (5) The superimposed body on which the conductive pattern portions 7, 8, 23, and 24 are formed is processed in the same manner as in the first embodiment, and the IC chip 25 is mounted in the manner shown in FIG.

  Thereafter, the continuum of the base material 9 on which the IC chip 25 is mounted is cut into a set of conductive pattern portions 7, 8, 23, and 24 to form an interposer 22 that is a non-contact data carrier member. Attached to the wireless tag 1 or the like.

  The present invention is not limited to the above embodiment. For example, in the above embodiment, the interposer has been described as an example of the noncontact data carrier member. However, in addition to the interposer, other noncontact data carriers such as a dipole antenna. The present invention can also be applied to the structural member. That is, in Embodiment 2 described above, of the four conductive pattern portions 7, 8, 23, and 24, the two conductive pattern portions 7 and 8 that are arranged in an elongated rectangular straight line are formed in the shape of a dipole antenna. Thus, a non-contact data carrier conductive member as a dipole antenna can be manufactured.

It is a perspective view which shows the outline of the radio | wireless tag produced using the member for interposers which concerns on Embodiment 1 of this invention. In FIG. 1, it is an enlarged view of the principal part. FIG. 3 is a cross-sectional view taken along line III-III in FIG. It is a front view which shows the manufacturing process of the member for interposers which concerns on Embodiment 1 of this invention. It is a perspective view which shows the manufacturing process similar to FIG. It is the perspective view which looked at the shaping | molding die of the member for interposers from the back surface. It is a top view which shows the punching blade and hot press board of the shaping | molding die shown in FIG. It is a partial expansion perspective view of the wireless tag produced using the member for interposers concerning Embodiment 2 of the present invention. It is the perspective view which looked at the shaping | molding die of the member for interposers which concerns on Embodiment 2 of this invention from the back surface.

Explanation of symbols

6, 6a ... slit 7, 8, 23, 24 ... conductive pattern portion 9 ... substrate 9a ... continuum of substrate 12 ... thermoplastic adhesive layer 13 ... continuum of conductive pattern portion 15b ... surface plate 16 , 17, 26, 27 ... punching blades 18, 19, 30, 31 ... hot press plate P ... feed pitch

Claims (5)

  The punching blades for punching the conductive pattern parts divided by the gap are shifted by the width of the slit in the direction perpendicular to the feed direction of the base material continuum, and predetermined in the feed direction of the base material continuum. It is formed on the surface plate by shifting the feed pitch of the substrate, and the superimposed body of the continuous body of the base material and the continuous body of the conductive pattern part is intermittently fed at a predetermined feed pitch, and the superimposed body is pressed on the surface plate to make it conductive. A method for producing a member for a non-contact data carrier, comprising punching a conductive pattern portion into a continuous body of pattern portions, and bonding the punched conductive pattern portion to a continuous body of base material.   2. The method of manufacturing a member for a non-contact data carrier according to claim 1, wherein another conductive pattern portion is separated from the conductive pattern portion across another slit extending in a direction orthogonal to the slit. 3. The blade is shifted in the feed direction of the base material continuous body by the feed pitch, and the phase is shifted by the width of the other slits to form the surface plate, and the base material continuous body and the conductive pattern portion are continuous. Pressing the superimposed body with a surface plate while intermittently feeding the superimposed body with the body at a predetermined feed pitch, punching out the conductive pattern portion into the continuous body of the conductive pattern portion, and the punched conductive pattern portion is continuous with the substrate A method for producing a member for a non-contact data carrier, wherein the member is adhered to a body.   The method for manufacturing a member for a non-contact data carrier according to claim 1 or 2, wherein a thermoplastic adhesive layer is formed on the surface of the continuous body of the base material or the continuous body of the conductive pattern portion, and punched with a punching blade. A hot press plate that heat-presses the extracted conductive pattern portion onto the continuous body of the base material is formed on the surface plate by shifting the predetermined feed pitch from the punching blade in the feed direction of the superimposed body, and punched with the punching blade. A method for producing a member for a non-contact data carrier, wherein the adhesive pattern portion is bonded to a continuous body of a substrate with a hot press plate.   The punching blades that punch out the conductive pattern parts divided across the slits are shifted by the width of the slits in the direction perpendicular to the feed direction of the superimposed body of the base material continuum and the conductive pattern part continuum. In addition, the conductive pattern portion, which is provided on the surface plate so as to be shifted by a predetermined feed pitch in the feeding direction of the superimposed body, is punched into the continuous body of the conductive pattern portion with a punching blade, and is hot-pressed on the continuous body of the substrate. A non-contact data carrier member molding die, wherein a hot press plate is provided on a surface plate so as to be further displaced from the punching blade by the feed pitch in the feed direction of the superimposed body.   5. The non-contact data carrier member molding die according to claim 4, wherein another conductive pattern portion cut off from the conductive pattern portion is sandwiched by another slit extending in a direction orthogonal to the slit. The blade is provided on the surface plate by shifting the width of the slit in the feed direction of the continuous body of the substrate, and the conductive pattern portion punched into the continuous body of the conductive pattern portion by each punching blade A mold for forming a member for a non-contact data carrier, characterized in that a hot press plate for hot pressing on a body is provided on a surface plate so as to be further displaced by a predetermined feed pitch from a punching blade in the feed direction of the superimposed body.

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