JP2005339518A - Conductive member for contactless type data carrier and method and device for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the need to control synchronization with a process of punching metal foil since patterning is unnecessary in a bonding process when a conductive member for a contactless type data carrier such as a wireless tag is manufactured. <P>SOLUTION: A method for manufacturing the conductive member for the contactless type data carrier includes a printing process of printing a thermoplastic adhesive layer (5) in a specified pattern on the top surface of a continuous body (13a) of a carrier sheet (13) where a conductive layer (6) made of metal foil is laminated while making the continuous body travel, a punching process of punching the metal foil (6) in the pattern on the carrier sheet (13), the bonding process of stacking a continuous body (4a) of a base material (4) on a surface of the thermoplastic adhesive layer (5) and heating and bonding them together, and a separating process of separating an unnecessary part other than the pattern part bonded to the base material (4) together with the carrier sheet (13) integrally. Consequently, it is not necessary to control synchronization between the bonding process and the punching process of punching the metal foil. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a non-contact data carrier conductive member such as an antenna, an interposer, and a bridge, and a manufacturing method and apparatus thereof.

  For example, a wireless tag used for a product is manufactured using a non-contact data carrier conductive member such as an antenna.

  Conventionally, when an antenna or the like, which is a conductive member for a non-contact data carrier, is formed in a predetermined pattern, it is mainly manufactured by forming a resist pattern on a metal layer such as aluminum or copper laminated on a base material and etching it. Is done.

Another method is to directly form an antenna using a punching blade. In this method, a laminate is prepared by bonding a metal foil on a carrier such as a synthetic resin film via a release layer and an adhesive, and applying a thermoplastic adhesive on the metal foil. And the metal foil of this laminated body is cut | disconnected with the said pattern, it overlaps with a base material, a laminated body is pressed and heated with the metal mold | die which has the convex part corresponding to the said pattern. As a result, the adhesiveness of the pressure-sensitive adhesive decreases and the adhesiveness of the thermoplastic adhesive increases at the same time, the metal foil patterned by the incision adheres to the substrate, and the excess metal foil is separated together with the pressure-sensitive adhesive. An antenna or the like is formed (for example, see Patent Document 1).
JP 9-44762 A

  According to the conventional manufacturing method, in the case of the etching method, equipment for resist plate making and equipment for etching are required, and a resist pattern must be prepared for each product, and the resist must be stripped alternately by etching. The production speed is limited.

  Also, in the case of the punching method, it is possible to form an accurate pattern such as an antenna if the operation is not accurately synchronized after the metal foil punching blade and the mold press are made to match the pattern accurately. There is a problem that you can not.

  Furthermore, as a second problem, bubbles or the like are mixed between the metal foil and the base material, the edge of the pattern is lifted from the base material after the pattern is attached to the antenna, etc., or the surface of the metal foil is undulated. There is a possibility. In such a case, the characteristics as an antenna or the like deteriorate.

  As a third problem, there is a possibility that defective punching occurs when a metal foil is punched with a punching blade, or insufficient melting of the adhesive or uneven pressurization occurs when bonding. In such a case, formation of a pattern such as an antenna becomes uncertain.

  As a fourth problem, there is a case where it is required to use an adhesive that does not need to be heated when the metal foil is bonded to the substrate.

  Accordingly, an object of the present invention is to provide means for solving the above-mentioned problems.

  In order to solve the above-mentioned problems, the invention according to claim 1 is characterized in that a thermoplastic adhesive layer (5) is formed in a predetermined pattern on a substrate (4), and the thermoplastic adhesive layer (5) is formed on the thermoplastic adhesive layer (5). A non-contact type data carrier conductive member in which a conductive layer (6) made of a metal foil having a pattern substantially the same as the above pattern is heat-bonded and a protective layer (7) is laminated on the conductive layer (6) is employed. .

  The invention according to claim 2 is the non-contact data carrier conductive member according to claim 1, wherein the protective layer (7) is a non-contact data carrier conductive member formed of an adhesive layer. To do.

  According to a third aspect of the present invention, a carrier sheet (13) having a conductive layer (6) made of a metal foil and a thermoplastic adhesive layer (5) formed in a predetermined pattern on the surface is run. Meanwhile, the punching step of punching the conductive layer (6) of the carrier sheet (13) with the pattern, and the bonding step of heating and adhering the base material (4) on the surface of the thermoplastic adhesive layer (5) And a separation step of separating the unnecessary portion (6a) other than the pattern portion bonded to the base material (4) integrally with the carrier sheet (13). A method for manufacturing a conductive member is employed.

  Further, the invention according to claim 4 is a printing in which the thermoplastic adhesive layer (5) is printed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. A step of punching the conductive layer (6) of the carrier sheet (13) in the above pattern, and an adhesion step of superposing the base material (4) on the surface of the thermoplastic adhesive layer (5) and heat-bonding, A method of manufacturing a non-contact type data carrier conductive member including a separation step of separating the unnecessary portion (6a) other than the pattern portion bonded to the substrate (4) integrally with the carrier sheet (13) is adopted. .

  The invention according to claim 5 is the method for manufacturing a non-contact data carrier conductive member according to claim 3 or 4, wherein the thermoplastic adhesive layer (5) formed in the predetermined pattern is dried. A method for manufacturing a non-contact data carrier conductive member including a drying step is employed.

  According to a sixth aspect of the present invention, in the method for manufacturing a conductive member for a non-contact data carrier according to the third or fourth aspect, the carrier sheet (13) is provided with a release layer (14), a protective layer. A method of manufacturing a conductive member for a non-contact type data carrier formed by sequentially laminating a layer (7) and a conductive layer (6) made of a metal foil is employed.

  According to a seventh aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to the sixth aspect, the protective layer (7) is a non-contact data carrier conductive material formed of an adhesive layer. A method for manufacturing the member is adopted.

  According to an eighth aspect of the present invention, in the method for manufacturing a non-contact type data carrier conductive member according to claim 4, the non-contact type data carrier conductive member in which the printing step and the punching step are simultaneously performed. Adopt the method.

  According to a ninth aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to the fourth aspect, the non-contact type data carrier conductive member that performs the printing step after performing the punching step. Adopt manufacturing method.

  According to a tenth aspect of the present invention, in the method for manufacturing a non-contact type data carrier conductive member according to the fourth aspect, the non-contact type data carrier conductive member that performs the punching step after the printing step is performed. Adopt manufacturing method.

  The invention according to claim 11 is the method for producing a non-contact type data carrier conductive member according to any one of claims 3 to 10, wherein the printing step and the punching step are combined with a cylinder (15 The manufacturing method of the conductive member for a non-contact type data carrier performed by the above is adopted.

  According to a twelfth aspect of the present invention, in the method of manufacturing a non-contact data carrier conductive member according to any one of the third to tenth aspects, the bonding step and the punching step are performed on a flat plate ( The method for producing a conductive member for a non-contact data carrier performed in 30) is employed.

  In the invention according to claim 13, the carrying sheet (13) in which the conductive layer (6) made of metal foil is laminated and the thermoplastic adhesive layer (5) is formed in a predetermined pattern on the surface is run. However, a punching step of punching out the conductive layer (6) of the carrier sheet (13) in the pattern, a removing step of removing only unnecessary portions from the carrier sheet (13), and a residue on the carrier sheet (13). A non-contact type data carrier conductive member comprising a bonding step in which a base material (4) is superposed on the surface of the thermoplastic adhesive layer (5) of the patterned portion and heated and bonded. Adopt manufacturing method.

  Further, the invention according to claim 14 is a printing in which the thermoplastic adhesive layer (5) is printed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. A step of punching the conductive layer (6) of the carrier sheet (13) in the above pattern, a removing step of removing only unnecessary portions from the carrier sheet (13), and a pattern portion remaining on the carrier sheet (13) A method for producing a non-contact type data carrier conductive member including a bonding step of superposing a base material (4) on the surface of the thermoplastic adhesive layer (5) and heat-bonding is adopted.

  The invention according to claim 15 is the method of manufacturing a non-contact data carrier conductive member according to claim 13 or 14, wherein the thermoplastic adhesive layer (5) formed in the predetermined pattern is dried. A method for manufacturing a non-contact data carrier conductive member including a drying step is employed.

  In the invention according to claim 16, a carrying sheet (13) in which a conductive layer (6) made of a metal foil is laminated and a thermoplastic adhesive layer (5) is formed in a predetermined pattern on its surface is run. On the other hand, punching means (15) for punching out the conductive layer (6) of the carrier sheet (13) in the pattern and a base material (4) on the surface of the thermoplastic adhesive layer (5) are heat bonded. And a separating means (26) for separating an unnecessary part other than the pattern part adhered to the base material (4) integrally with the carrier sheet (13). An apparatus for manufacturing a conductive member for a non-contact type data carrier is employed.

  The invention according to claim 17 is a printing in which a thermoplastic adhesive layer (5) is printed in a predetermined pattern on a surface of a carrying sheet (13) on which a conductive layer (6) made of a metal foil is laminated. The means (15), the punching means (15) for punching out the conductive layer (6) of the carrier sheet (13) in the above pattern, and the base material (4) overlaid on the surface of the thermoplastic adhesive layer (5) are heated. Non-contact type data carrier comprising an adhering means (25) for adhering and a separating means (26) for separating unnecessary parts other than the pattern part adhering to the base material (4) integrally with the carrier sheet (13). A manufacturing apparatus for conductive members is used.

  The invention according to claim 18 is the noncontact data carrier conductive member manufacturing apparatus according to claim 16 or 17, wherein the thermoplastic adhesive layer (5) printed in the predetermined pattern is dried. A non-contact data carrier conductive member manufacturing apparatus including a drying means (23) is employed.

  According to the nineteenth aspect of the present invention, a carrier sheet (13) having a conductive layer (6) made of a metal foil and a thermoplastic adhesive layer (5) formed in a predetermined pattern on the surface is run. The punching means (15) for punching out the conductive layer (6) of the carrier sheet (13) in the pattern, the removing means for removing only unnecessary portions from the carrier sheet (13), and the carrier sheet (13) Non-contact type characterized in that it includes an adhesive means (25) for superimposing a base material (4) on the surface of the thermoplastic adhesive layer (5) of the pattern portion remaining thereon and heat-adhering it. An apparatus for manufacturing a data carrier conductive member is employed.

  The invention according to claim 20 is a printing in which a thermoplastic adhesive layer (5) is printed in a predetermined pattern on a surface of a carrying sheet (13) on which a conductive layer (6) made of a metal foil is laminated. Means (15), punching means (15) for punching the conductive layer (6) of the carrier sheet (13) in the above pattern, removal means for removing only unnecessary portions from the carrier sheet (13), and the carrier sheet (13) An electrically conductive member for a non-contact type data carrier comprising an adhesive means (25) for superimposing a base material (4) on the surface of the thermoplastic adhesive layer (5) of the pattern portion remaining thereon and heat-bonding Adopt manufacturing equipment.

  The invention according to claim 21 is the non-contact data carrier conductive member manufacturing apparatus according to claim 17 or 20, wherein the same cylinder (15) is provided with the printing means and the punching means. An apparatus for manufacturing a conductive member for a contact data carrier is employed.

  According to a twenty-second aspect of the present invention, in the apparatus for manufacturing a non-contact data carrier conductive member according to any one of the sixteenth to twenty-first aspects, the bonding means and the punching means are the same flat plate. The non-contact data carrier conductive member manufacturing apparatus provided in (30) is employed.

  According to a twenty-third aspect of the present invention, in the apparatus for manufacturing a non-contact data carrier conductive member according to any one of the fourteenth to twenty-second aspects, the punching means (17) includes the conductive layer (6). A non-contact type data carrier conductive member manufacturing apparatus including a cushioning pressing body (40) that presses a superposed body with the carrier sheet (13) is employed.

  According to a twenty-fourth aspect of the present invention, in the non-contact data carrier conductive member manufacturing apparatus according to any one of the sixteenth to twenty-third aspects, an unnecessary portion of the conductive layer (6) is removed. An apparatus for producing a conductive member for a non-contact type data carrier, comprising a heat press means (41, 42) for heating and pressing a superposed body of a subsequent conductive layer (6) and a base material (4) Is adopted.

  According to a twenty-fifth aspect of the present invention, in the noncontact data carrier conductive member manufacturing apparatus according to the nineteenth or twentieth aspect, the thermoplastic adhesive layer (5) printed in the predetermined pattern is dried. A non-contact data carrier conductive member manufacturing apparatus including a drying means (23) is employed.

  According to a twenty-sixth aspect of the present invention, there is provided a non-contact type data carrier characterized in that an interposer is electrically connected to the antenna which is the conductive member for a non-contact type data carrier according to the first or second aspect. adopt.

  According to a twenty-seventh aspect of the present invention, a bridge and an IC chip are electrically connected to the antenna that is the conductive member for a non-contact type data carrier according to the first or second aspect. Adopt type data carrier.

  The invention according to claim 28 is the method of manufacturing a non-contact data carrier conductive member according to any one of claims 3 to 15, wherein the conductive layer (6) and the supporting sheet ( A method of manufacturing a non-contact data carrier conductive member is employed, in which the superposed body with 13) is pressed through a cushioning material.

  The invention according to claim 29 is the method of manufacturing a conductive member for a non-contact type data carrier according to any one of claims 3 to 15 or 28, wherein the conductive layer (6) and the substrate are separated after the separation step. A method of manufacturing a conductive member for a non-contact type data carrier, which further includes a hot pressing step of pressing the superposed body with the material (4) while heating is adopted.

  Further, the invention according to claim 30 is the carrying sheet (13) in which the conductive layer (6) made of metal foil is laminated, and the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. A punching step of punching out the conductive layer (6) of the carrying sheet (13) in the pattern while running, and a UV or EB curable adhesive layer (5b) formed on the running carrying sheet (13). ) Irradiation step of irradiating UV or EB, superimposing step of superimposing the base material (4) on the UV or EB curable adhesive layer (5b) irradiated with UV or EB, and the above-mentioned group And a separation step of separating unnecessary portions other than the pattern portion bonded to the material (4) integrally with the carrier sheet (13). Is adopted.

  In the invention according to claim 31, the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. A printing step for printing, a punching step for punching the conductive layer (6) of the carrier sheet (13) in the pattern, and a UV or EB curable adhesive layer printed on the traveling carrier sheet (13) ( 5b) an irradiation step of irradiating UV or EB, an overlapping step of superposing and bonding the base material (4) on the UV or EB curable adhesive layer (5b) irradiated with UV or EB, and the above A non-contact type data carrier conductive member comprising: a separation step of separating an unnecessary portion other than the pattern portion adhered to the base material (4) integrally with the carrier sheet (13). Adopt the method

  The invention according to claim 32 is the method for producing a conductive member for a non-contact type data carrier according to claim 30 or 31, wherein the carrier sheet (13) has a release layer (14) thereon, a protective layer. A method of manufacturing a conductive member for a non-contact type data carrier, which is formed by sequentially laminating a layer (7) and a conductive layer (6) made of a metal foil, is adopted.

  The invention according to claim 33 is the non-contact type data carrier conductive member manufacturing method according to claim 32, wherein the protective layer (7) is formed of an adhesive layer. A method for manufacturing a conductive member for a contact type data carrier is adopted.

  The invention according to claim 34 is the non-contact type data carrier manufacturing method according to claim 31, wherein the printing step and the punching step are performed simultaneously. A method for manufacturing a conductive member is employed.

  The invention according to claim 35 is the method of manufacturing a non-contact data carrier conductive member according to claim 31, wherein the printing step is performed after the punching step. The manufacturing method of the conductive member for carriers is adopted.

  The invention according to claim 36 is the method for producing a non-contact type data carrier conductive member according to any one of claims 31 to 35, wherein the printing step and the punching step are combined with a cylinder (15 The method for manufacturing a non-contact type data carrier conductive member is employed.

  The invention according to claim 37 is the method of manufacturing a non-contact data carrier conductive member according to any one of claims 30 to 35, wherein the punching step is performed by a flat plate (30). A method of manufacturing a conductive member for a non-contact type data carrier is adopted.

  The invention according to claim 38 is characterized in that the carrying sheet (13) in which a conductive layer (6) made of a metal foil is laminated and a UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. ), The punching step of punching the conductive layer (6) of the carrier sheet in the pattern, the removing step of removing only unnecessary portions from the carrier sheet (13), and the carrier sheet (13 ) Irradiation step of irradiating UV or EB to the UV or EB curable adhesive layer (5b) in the pattern portion remaining on the UV or EB curable adhesive layer (5b) irradiated with UV or EB And a superimposing step of superposing and bonding the base material (4) from above. A method for producing a non-contact type data carrier conductive member is adopted.

  In the invention according to claim 39, the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. A printing process for printing, a punching process in which the conductive layer (6) of the carrier sheet is punched in the pattern while running the carrier sheet (13), and only unnecessary portions are removed from the carrier sheet (13). Removal step to remove, irradiation step to irradiate UV or EB to the UV or EB curable adhesive layer (5b) of the pattern portion remaining on the carrying sheet, and UV or EB curing to irradiate UV or EB And a superimposing step of superposing and adhering the base material (4) on the adhesive adhesive layer (5b). A method for producing a non-contact type data carrier conductive member is adopted.

  The invention according to claim 40 is the method of manufacturing a non-contact data carrier conductive member according to any one of claims 30 to 39, wherein the conductive layer (6) and the carrier sheet ( A method of manufacturing a non-contact data carrier conductive member is employed, in which the superposed body with 13) is pressed through a cushioning material.

  The invention according to claim 41 is the method for producing a conductive member for a non-contact data carrier according to any one of claims 30 to 40, wherein the conductive layer (6) and the substrate ( A method for producing a non-contact type data carrier conductive member is further included, which further includes a hot pressing step of heating and heating the superposed body with 4).

  In the invention according to claim 42, the carrying sheet (13), in which a conductive layer (6) made of a metal foil is laminated and a UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. And the irradiation means for irradiating the UV or EB curable adhesive layer (5b) formed on the traveling sheet (13), which is formed on the traveling sheet (13). Means, superimposing means for superposing and adhering the base material on the UV or EB curable adhesive layer (5b) irradiated with UV or EB, and unnecessary parts other than the pattern part adhering to the base material (4) A non-contact type data carrier conductive member manufacturing apparatus characterized by including a separating means that separates the carrier sheet and the carrier sheet (13) integrally.

  The invention according to claim 43 includes a printing means for laminating a conductive layer (6) made of a metal foil and printing a UV or EB curable adhesive layer (5b) in a predetermined pattern on the surface, and the carrier sheet. The punching means for punching the conductive layer (6) of (13) with the pattern and the UV or EB irradiating the UV or EB curable adhesive layer (5b) printed on the traveling support sheet (13). Irradiating means, superimposing means for superposing and bonding the base material (4) on the UV or EB curable adhesive layer (5b) irradiated with UV or EB, and a pattern adhered to the base material (4) An apparatus for manufacturing a non-contact type data carrier conductive member characterized by including separation means for separating the unnecessary portion (6a) other than the portion integrally with the carrying sheet (13) is employed.

  In the invention according to claim 44, the carrying sheet (13), in which a conductive layer (6) made of a metal foil is laminated and a UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. ) Of the conductive layer (6) in the pattern, a removing means for removing only unnecessary portions from the support sheet (13), and a pattern portion remaining on the support sheet (13). An irradiation means for irradiating the UV or EB curable adhesive layer (5b) with UV or EB, and a substrate (4) from above the UV or EB curable adhesive layer (5b) irradiated with UV or EB. An apparatus for manufacturing a non-contact type data carrier conductive member characterized by including superimposing means for overlapping and adhering is adopted.

  In the invention according to claim 45, a UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface of a carrier sheet (13) on which a conductive layer (6) made of a metal foil is laminated. Printing means for printing, punching means for punching the conductive layer (6) of the carrier sheet (13) with the pattern, removing means for removing only unnecessary portions from the carrier sheet (13), and the carrier sheet ( 13) Irradiation means for irradiating UV or EB to the UV or EB curable adhesive layer (5b) in the pattern portion remaining on the UV or EB curable adhesive layer (5b) irradiated with UV or EB And a superimposing means for superimposing and adhering the base material (4) from above, a non-contact data carrier conductive member manufacturing apparatus is employed.

  The invention according to claim 46 is the noncontact data carrier conductive member manufacturing apparatus according to claim 43 or 45, wherein the same cylinder (15) is provided with the printing means and the punching means. An apparatus for manufacturing a conductive member for a non-contact type data carrier is used.

  According to a 47th aspect of the present invention, in the noncontact data carrier conductive member manufacturing apparatus according to any one of the 42th to 46th aspects, the flat plate (30) includes the punching means. An apparatus for manufacturing a conductive member for a non-contact type data carrier is employed.

  According to a 48th aspect of the present invention, in the apparatus for manufacturing a non-contact data carrier conductive member according to any one of the 42nd to 47th aspects, the punching means includes a conductive layer (6) and a carrying sheet ( A non-contact type data carrier conductive member manufacturing apparatus is provided, which is provided with a cushioning pressing body (40) that presses the superposed body with 13).

  According to a 49th aspect of the invention, in the non-contact data carrier conductive member manufacturing apparatus according to any one of the 42nd to 48th aspects, an unnecessary portion of the conductive layer (6) is removed. An apparatus for manufacturing a conductive member for a non-contact type data carrier, comprising a heat press means (40, 41) for heating and pressurizing a superposed body of a subsequent conductive layer (6) and a substrate (4) Is adopted.

  According to the first aspect of the present invention, the thermoplastic adhesive layer (5) is printed in a predetermined pattern on the substrate (4), and is substantially the same as the pattern on the thermoplastic adhesive layer (5). Since the conductive layer (6) made of a patterned metal foil is heat-bonded and the protective layer (7) is laminated on the conductive layer (6), the conductive layer (6) ) Can be prevented, and damage can be prevented.

  According to the invention of claim 2, in the non-contact data carrier conductive member according to claim 1, the protective layer (7) is formed of an adhesive layer. Temporary bonding can be performed, and the bonding work efficiency of the non-contact data carrier conductive member can be improved.

  According to the invention of claim 3, the carrying sheet (13), in which the conductive layer (6) made of the metal foil is laminated and the thermoplastic adhesive layer (5) is formed in a predetermined pattern on the surface, is run. Meanwhile, the punching step of punching the conductive layer (6) of the carrier sheet (13) with the pattern, and the bonding step of heating and adhering the base material (4) on the surface of the thermoplastic adhesive layer (5) And a non-contact type data carrier conductive member including a separation step of separating the unnecessary portion (6a) other than the pattern portion adhered to the base material (4) integrally with the carrier sheet (13). Since it is a method, patterning is not required in the bonding process, and therefore, synchronous control with the metal foil punching process is not required, and an accurate pattern can be formed.

  According to the invention of claim 4, printing is performed in which the thermoplastic adhesive layer (5) is printed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. A step of punching the conductive layer (6) in the above pattern on the support sheet (13), and an adhesion step of heating and adhering the base material (4) on the surface of the thermoplastic adhesive layer (5) Since it is a method for producing a non-contact type data carrier conductive member including a separation step of separating the unnecessary portion other than the pattern portion adhered to the base material (4) integrally with the carrier sheet (13), Since patterning is not required in the process, synchronization control with the metal foil punching process becomes unnecessary, and an accurate pattern can be formed. Further, since the thermoplastic adhesive layer can be printed only on necessary portions, the adhesive can be saved.

  According to a fifth aspect of the present invention, in the method for producing a non-contact data carrier conductive member according to the third or fourth aspect, the thermoplastic adhesive layer (5) formed in the predetermined pattern is dried. Since it is the manufacturing method of the electrically-conductive member for non-contact-type data carriers characterized by including a drying process, the solvent etc. which are contained in a thermoplastic adhesive layer can be removed and it can be made to dry.

  According to a sixth aspect of the present invention, in the method for manufacturing a conductive member for a non-contact type data carrier according to the third or fourth aspect, the carrier sheet (13) has a release layer (14), a protective layer thereon. Since it is a method for producing a non-contact type data carrier conductive member in which a layer (7) and a conductive layer (6) made of a metal foil are sequentially laminated, a thermoplastic adhesive layer is printed in a predetermined pattern on the surface of the conductive layer It becomes easy to do.

  According to a seventh aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to the sixth aspect, the protective layer (7) is a non-contact data carrier conductive material formed of an adhesive layer. Since it is a manufacturing method of a member, it can punch in a predetermined pattern, hold | maintaining a conductive layer on a protective layer reliably.

  According to an eighth aspect of the invention, in the method for manufacturing a non-contact type data carrier conductive member according to claim 4, the non-contact type data carrier conductive member in which the printing step and the punching step are simultaneously performed. Since it is a method, it is not necessary to synchronize the printing process and the punching process, and therefore the non-contact type data carrier conductive member can be manufactured easily and accurately.

  According to a ninth aspect of the present invention, in the method for manufacturing a non-contact type data carrier conductive member according to claim 4, the non-contact type data carrier conductive member that performs the printing step after the punching step is performed. Since it is a manufacturing method, the synchronous control of an adhesion process and a punching process becomes unnecessary, simplifying a structure.

  According to a tenth aspect of the present invention, in the method for manufacturing a non-contact type data carrier conductive member according to the fourth aspect, the non-contact type data carrier conductive member that performs the punching step after the printing step is performed. Since it is a manufacturing method, the synchronous control of an adhesion process and a punching process becomes unnecessary, simplifying a structure.

  According to an eleventh aspect of the present invention, in the method of manufacturing a non-contact type data carrier conductive member according to any one of the third to tenth aspects, the printing step and the punching step are performed using a cylinder (15 ), The manufacturing speed of the non-contact data carrier conductive member can be increased.

  Here, the cylinder (15) refers to a cylinder such as an engraving roll or a rotary die.

  According to the twelfth aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to any one of the third to tenth aspects, the bonding step and the punching step are performed on a flat plate ( 30), the punching pattern of the conductive layer (6) in the punching process can be easily changed.

  Here, the flat plate (30) refers to a flat plate such as a flat press engraving blade or a flat press die.

  According to the thirteenth aspect of the present invention, the carrying sheet (13) having the conductive layer (6) made of metal foil laminated thereon and the thermoplastic adhesive layer (5) formed in a predetermined pattern is run. However, a punching step of punching out the conductive layer (6) of the carrier sheet (13) in the pattern, a removing step of removing only unnecessary portions from the carrier sheet (13), and a residue on the carrier sheet (13). A non-contact type data carrier conductive member including a bonding step in which the base material (4) is superposed on the surface of the thermoplastic adhesive layer (5) of the patterned portion and heated and bonded. Since the bonding process does not require patterning, synchronization control with the conductive layer punching process is unnecessary, and an accurate pattern can be formed.

  According to the invention of claim 14, printing is performed in which the thermoplastic adhesive layer (5) is printed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. A step of punching the conductive layer (6) on the support sheet (13) in the above pattern, a removal step of removing only unnecessary portions from the support sheet (13), and a pattern remaining on the support sheet (13) A non-contact type data carrier conductive member manufacturing method comprising a bonding step in which a base material (4) is superposed on the surface of the thermoplastic adhesive layer (5) of the part and heated and bonded. In this case, since patterning is unnecessary, synchronization control with the punching process of the conductive layer is unnecessary, and an accurate pattern can be formed. Further, the metal foil sheet and the support sheet can be separated and recovered.

  According to a fifteenth aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to the thirteenth or fourteenth aspect, the thermoplastic adhesive layer (5) formed in the predetermined pattern is dried. Since it is the manufacturing method of the electroconductive member for non-contact-type data carriers including a drying process, the solvent etc. which are contained in a thermoplastic adhesive layer can be removed and it can be made to dry.

  According to the invention of claim 16, the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated and the thermoplastic adhesive layer (5) is formed in a predetermined pattern on its surface is caused to travel. On the other hand, punching means (15) for punching out the conductive layer (6) of the carrier sheet (13) in the pattern and a base material (4) on the surface of the thermoplastic adhesive layer (5) are heat bonded. Non-contact type data including an adhering means (25) for carrying out and a separating means (26) for separating an unnecessary part other than the pattern part adhering to the base material (4) integrally with the carrying sheet (13). Since it is an apparatus for manufacturing a conductive member for a carrier, patterning is not required in the bonding process, and therefore, synchronization control with the punching process of the conductive layer is unnecessary, and an accurate pattern can be formed.

  According to the seventeenth aspect of the invention, printing is performed in which the thermoplastic adhesive layer (5) is printed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. The means (15), the punching means (15) for punching out the conductive layer (6) of the carrier sheet (13) in the above pattern, and the base material (4) overlaid on the surface of the thermoplastic adhesive layer (5) are heated. Non-contact type data carrier comprising an adhering means (25) for adhering and a separating means (26) for separating unnecessary parts other than the pattern part adhering to the base material (4) integrally with the carrier sheet (13). Since it is a manufacturing apparatus of the electrically conductive member for an object, since a thermoplastic adhesive bond layer (5) can be printed only to a required part, the saving of an adhesive agent can be aimed at.

  According to an eighteenth aspect of the present invention, in the noncontact data carrier conductive member manufacturing apparatus according to the sixteenth or seventeenth aspect, the thermoplastic adhesive layer (5) printed in the predetermined pattern is dried. Since it is an apparatus for producing a non-contact type data carrier conductive member including a drying means (23), the solvent and the like contained in the thermoplastic adhesive layer can be removed and dried.

  According to the nineteenth aspect of the present invention, the carrying sheet (13) having the conductive layer (6) made of metal foil laminated thereon and the thermoplastic adhesive layer (5) formed in a predetermined pattern is run. The punching means (15) for punching out the conductive layer (6) of the carrier sheet (13) in the pattern, the removing means for removing only unnecessary portions from the carrier sheet (13), and the carrier sheet (13) A conductive member for a non-contact type data carrier comprising an adhesive means (25) for superimposing a base material (4) on the surface of the thermoplastic adhesive layer (5) of the pattern portion remaining thereon and heat-bonding Therefore, the heating and bonding means can be simplified, and the carrier sheet winding device can be simplified.

  According to the twentieth aspect of the invention, printing is performed in which the thermoplastic adhesive layer (5) is printed in a predetermined pattern on the surface of the carrier sheet (13) on which the conductive layer (6) made of metal foil is laminated while traveling. Means (15), punching means (15) for punching the conductive layer (6) of the carrier sheet (13) in the above pattern, removal means for removing only unnecessary portions from the carrier sheet (13), and the carrier sheet (13) An electrically conductive member for a non-contact type data carrier comprising an adhesive means (25) for superimposing a base material (4) on the surface of the thermoplastic adhesive layer (5) of the pattern portion remaining thereon and heat-bonding Since it is a manufacturing apparatus, the heat bonding means can be simplified and the carrier sheet winding apparatus can be simplified.

  According to a twenty-first aspect of the present invention, in the noncontact data carrier conductive member manufacturing apparatus according to the seventeenth or twentieth aspect, the same cylinder (15) is provided with the printing means and the punching means. Since it is an apparatus for manufacturing a conductive member for a contact type data carrier, printing and punching can be performed at the same place, so that the apparatus can be made compact and installation space can be reduced.

  According to a twenty-second aspect of the present invention, in the apparatus for manufacturing a non-contact type data carrier conductive member according to any one of the sixteenth to twenty-first aspects, the bonding means and the punching means are the same flat plate. Since (30) is an apparatus for manufacturing a non-contact type data carrier conductive member, the bonding and punching can be performed at the same place, so that the apparatus can be made compact and the installation space can be reduced.

  According to a twenty-third aspect of the present invention, in the non-contact data carrier conductive member manufacturing apparatus according to any one of the sixteenth to twenty-second aspects, the punching means (17) includes the conductive layer (6). Since it is a manufacturing apparatus of a non-contact type data carrier conductive member provided with a cushioning pressing body that presses the superimposed body with the carrying sheet (13), the conductive layer (6) is formed by the cushioning pressing body (40) when punching. ) And the base material (4) can be pressed with a uniform applied pressure, and thus a conductive layer (6) having an appropriate pattern can be formed on the base material (4).

  According to the invention of claim 24, in the non-contact data carrier conductive member manufacturing apparatus according to any one of claims 16 to 23, the unnecessary portion (6a) of the conductive layer (6) is provided. Conductive member for non-contact type data carrier comprising heat pressing means (41, 42) for applying pressure while heating the superposed body of conductive layer (6) and base material (4) after being removed Therefore, bubbles or the like are mixed between the conductive layer (6) and the base material (4), or the pattern edge of the conductive layer (6) is lifted from the base material (4) after punching the pattern. Even if the surface of the conductive layer (6) is wavy, the conductive layer (6) can be smoothly adhered to the substrate (4) over the entire pattern by the hot press means (41, 42). . Therefore, characteristics as an antenna or the like can be improved. It is also possible to embed the pattern of the conductive layer (6) in the substrate (4) by adjusting the pressing force of the hot press means (41, 42). In that case, the pattern of the conductive layer (6) Is properly protected.

  According to a twenty-fifth aspect of the present invention, in the apparatus for manufacturing a non-contact type data carrier conductive member according to the nineteenth or twentieth aspect, the thermoplastic adhesive layer (5) printed in the predetermined pattern is dried. Since it is an apparatus for producing a non-contact type data carrier conductive member including a drying means (23), the solvent and the like contained in the thermoplastic adhesive layer can be removed and dried.

  According to a twenty-sixth aspect of the present invention, there is provided a non-contact type data carrier characterized in that an interposer is electrically connected to the antenna that is the conductive member for the non-contact type data carrier according to the first or second aspect. Therefore, the wireless tag or the like can be made excellent in electrical performance.

  According to a twenty-seventh aspect of the present invention, a bridge and an IC chip are electrically connected to the antenna that is the conductive member for a non-contact type data carrier according to the first or second aspect. Since it is a type data carrier, a wireless tag or the like can be made excellent in electrical performance.

  According to the invention of claim 28, in the method of manufacturing a non-contact data carrier conductive member according to any one of claims 3 to 15, the conductive layer (6) and the supporting sheet ( 13) is a method for producing a non-contact type data carrier conductive member, wherein the superposed body is pressed through a cushion material, so that the conductive layer (6) and the base material (4) Thus, the conductive layer (6) having an appropriate pattern can be formed on the substrate (4).

  According to a twenty-ninth aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to any one of the third to fifteenth or twenty-eighth aspects, the conductive layer (6) and the substrate are separated after the separation step. Since it is a manufacturing method of the electrically-conductive member for non-contact-type data carriers characterized by further including the hot press process which heats and presses a superposition body with material (4), it is the conductive layer (6) and base material (4) ), Bubbles are mixed in, the pattern edge of the conductive layer (6) is lifted from the substrate (4) after pattern punching, or the surface of the conductive layer (6) is wavy Alternatively, the conductive layer (6) can be smoothly adhered to the substrate (4) over the entire pattern. Therefore, characteristics as an antenna or the like can be improved. Further, the pattern of the conductive layer (6) can be buried in the base material (4) by adjusting the pressure, etc., but in this case, the pattern of the conductive layer (6) is appropriately protected.

  According to the invention of claim 30, a carrying sheet (13) in which a conductive layer (6) made of metal foil is laminated and a UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. A punching step of punching out the conductive layer (6) of the carrying sheet (13) in the pattern while running, and a UV or EB curable adhesive layer (5b) formed on the running carrying sheet (13). ) Irradiation step of irradiating UV or EB, superimposing step of superimposing the base material (4) on the UV or EB curable adhesive layer (5b) irradiated with UV or EB, and the above-mentioned group And a separation step of separating unnecessary portions other than the pattern portion bonded to the material (4) integrally with the carrier sheet (13). So UV Can be enhanced greatly the production efficiency of the running speed of the EB-curable adhesive layer is so (5b) is cured relatively quickly substrate (4) and the conductive layer (6). In addition, it is possible to prevent the process atmosphere from becoming hot as compared with the case where a thermoplastic adhesive is used as the adhesive. Further, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the adhesive property to the UV or EB curable adhesive layer (5b) regardless of the material of the substrate (4). Can be granted.

  According to the invention of claim 31, the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface of the carrying sheet (13) on which the conductive layer (6) made of metal foil is laminated. A printing step for printing, a punching step for punching the conductive layer (6) in the pattern on the carrier sheet (13), and a UV or EB curable adhesive layer printed on the traveling carrier sheet (13). An irradiation step of irradiating UV or EB with respect to (5b), and an overlapping step of superposing and bonding the base material (4) on the UV or EB curable adhesive layer (5b) irradiated with UV or EB; Since it is a manufacturing method of the conductive member for non-contact type data carriers including the separation process of separating the unnecessary part other than the pattern part adhered to the base material (4) integrally with the carrier sheet (13). , UV or EB Because of adhesive layer (5b) is cured relatively quickly can be enhanced greatly the production efficiency of the running speed of the substrate (4) and the conductive layer (6). In addition, it is possible to prevent the process atmosphere from becoming hot as compared with the case where a thermoplastic adhesive is used as the adhesive. Further, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the adhesive property to the UV or EB curable adhesive layer (5b) regardless of the material of the substrate (4). Can be granted.

  According to a thirty-second aspect of the present invention, in the method for producing a non-contact data carrier conductive member according to the thirty-third or thirty-first aspect, the carrier sheet comprises a release layer, a protective layer, and a metal foil. Since it is a manufacturing method of the conductive member for non-contact type data carriers formed by sequentially laminating conductive layers, it becomes easy to print a thermoplastic adhesive layer in a predetermined pattern on the surface of the conductive layer.

  According to a thirty-third aspect of the present invention, in the method for manufacturing a non-contact type data carrier conductive member according to the thirty-second aspect, the protective layer is a non-contact type data carrier conductive member formed of an adhesive layer. Since it is a manufacturing method, it can punch in a predetermined pattern, hold | maintaining a conductive layer on a protective layer reliably.

  According to a thirty-fourth aspect of the present invention, in the method for manufacturing a non-contact data carrier conductive member according to the thirty-first aspect, the printing step and the punching step are performed simultaneously. Therefore, it is not necessary to synchronize the printing process and the punching process, and therefore the non-contact data carrier conductive member can be manufactured easily and accurately.

  According to a thirty-fifth aspect of the present invention, in the non-contact type data carrier conductive member manufacturing method according to the thirty-first aspect, the non-contact type data is characterized in that the printing step is performed after the punching step. Since it is a manufacturing method of the conductive member for carriers, the synchronous control between the bonding process and the punching process becomes unnecessary while simplifying the configuration.

  According to a thirty-sixth aspect of the present invention, in the method for manufacturing a non-contact type data carrier conductive member according to any one of the thirty-first to thirty-fifth aspects, the printing step and the punching step are performed by a cylinder (15 ), The manufacturing speed of the non-contact data carrier conductive member can be increased.

  According to a thirty-seventh aspect of the present invention, in the method of manufacturing a non-contact data carrier conductive member according to any one of the thirty-third to thirty-fifth aspects, the punching step is performed by a flat plate (30). Since it is a manufacturing method of the conductive member for contact type data carriers, the punching pattern of the conductive layer (6) in the punching process can be easily changed.

  According to the invention of claim 38, the carrier sheet (13) in which the conductive layer (6) made of a metal foil is laminated and the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. ), The punching step of punching the conductive layer (6) of the carrier sheet in the pattern, the removing step of removing only unnecessary portions from the carrier sheet (13), and the carrier sheet (13 ) Irradiation step of irradiating UV or EB to the UV or EB curable adhesive layer (5b) in the pattern portion remaining on the UV or EB curable adhesive layer (5b) irradiated with UV or EB Since it is a manufacturing method of a non-contact type data carrier conductive member including a superimposing step of superimposing and adhering the base material (4) from above, the UV or EB curable adhesive layer (5b) is compared. Promptly Because of can be enhanced greatly the production efficiency of the running speed of the substrate (4) and the conductive layer (6). In addition, the process atmosphere can be prevented from being heated higher than when a thermoplastic adhesive is used as the adhesive. Further, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the adhesive property to the UV or EB curable adhesive layer (5b) regardless of the material of the substrate (4). Can be granted.

  According to the invention of claim 39, a printing process of printing a UV or EB curable adhesive layer in a predetermined pattern on a surface of a carrying sheet on which a conductive layer made of metal foil is laminated, and the carrying sheet, , The punching step of punching the conductive layer of the carrier sheet in the pattern, the removing step of removing only unnecessary portions from the carrier sheet, and the UV or EB of the pattern portion remaining on the carrier sheet It includes an irradiation step of irradiating UV or EB to the curable adhesive layer, and an overlapping step of overlapping and bonding the base material on the UV or EB curable adhesive layer irradiated with UV or EB. Since the UV or EB curable adhesive layer (5b) is cured relatively quickly, the conductive member for the non-contact data carrier is characterized in that It can be enhanced greatly the production efficiency of the running speed of the layers (6). In addition, it is possible to prevent the process atmosphere from becoming hot as compared with the case where a thermoplastic adhesive is used as the adhesive. Further, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the adhesive property to the UV or EB curable adhesive layer (5b) regardless of the material of the substrate (4). Can be granted.

  According to the invention of claim 40, in the method for manufacturing a non-contact type data carrier conductive member according to any one of claims 30 to 39, the conductive layer (6) and the supporting sheet ( 13) is a manufacturing method of a non-contact type data carrier conductive member that pressurizes the superposed body through a cushion material, so that the superposed body of the conductive layer (6) and the base material (4) is uniformly formed at the time of punching. Therefore, the conductive layer (6) having an appropriate pattern can be formed on the substrate (4).

  According to the invention of claim 41, in the method for producing a conductive member for a non-contact type data carrier according to any one of claims 30 to 40, the conductive layer (6) and a substrate ( 4) is a method for producing a conductive member for a non-contact type data carrier, which further includes a hot pressing step of pressing while heating the superposed body, and thus superposing the conductive layer (6) and the base material (4) after the separation step. Since it is a manufacturing method of the conductive member for non-contact type data carriers characterized by further including the hot press process of pressing while heating a body, it is air bubbles etc. between a conductive layer (6) and a substrate (4) The conductive layer (6) may be mixed even if the edge of the pattern of the conductive layer (6) is lifted from the substrate (4) after the pattern is punched or the surface of the conductive layer (6) is undulated. On the base material (4) It is possible to wear. Therefore, characteristics as an antenna or the like can be improved. Further, the pattern of the conductive layer (6) can be buried in the base material (4) by adjusting the pressure, etc., but in this case, the pattern of the conductive layer (6) is appropriately protected.

  According to the invention of claim 42, the carrier sheet (13) in which the conductive layer (6) made of a metal foil is laminated and the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. And punching means (15) for punching the conductive layer (6) in the pattern, and UV or EB for the UV or EB curable adhesive layer (5b) formed on the traveling support sheet (13). Irradiation means for irradiating, superimposing means for superimposing and adhering the base material on the UV or EB curable adhesive layer (5b) irradiated with UV or EB, and a pattern portion adhered to the base material (4) Since this is an apparatus for manufacturing a non-contact type data carrier conductive member including separation means for separating the unnecessary portion integrally with the carrier sheet (13), the UV or EB curable adhesive layer (5b) is compared. Hardens quickly Can be enhanced greatly the production efficiency substrate and (4) the conductive layer running speed (6). In addition, it is possible to prevent the process atmosphere from becoming hot as compared with the case where a thermoplastic adhesive is used as the adhesive.

  According to the invention of claim 43, the printing means for laminating the conductive layer (6) made of metal foil and printing the UV or EB curable adhesive layer (5b) in a predetermined pattern on the surface thereof, and the carrying sheet ( 13) The punching means for punching the conductive layer (6) in the pattern and the UV or EB curable adhesive layer (5b) printed on the traveling support sheet (13) are irradiated with UV or EB. Irradiation means, superposition means for superposing and adhering the base material (4) on the UV or EB curable adhesive layer (5b) irradiated with UV or EB, and a pattern part adhered to the base material (4) A non-contact type data carrier conductive member manufacturing apparatus including a separating unit that integrally separates the unnecessary portion (6a) other than the carrier sheet (13), and thus a UV or EB curable adhesive layer (5b) is relatively quick Since curing can be enhanced greatly the production efficiency of the running speed of the substrate (4) and the conductive layer (6). In addition, it is possible to prevent the process atmosphere from becoming hot as compared with the case where a thermoplastic adhesive is used as the adhesive. Further, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the adhesive property to the UV or EB curable adhesive layer (5b) regardless of the material of the substrate (4). Can be granted.

  According to the invention of claim 44, the carrier sheet (13) in which the conductive layer (6) made of metal foil is laminated, and the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface thereof. Punching means for punching the conductive layer (6) in the pattern, removing means for removing only unnecessary portions from the support sheet (13), and the pattern portion remaining on the support sheet (13). An irradiation means for irradiating UV or EB to the UV or EB curable adhesive layer (5b) and a substrate (4) are stacked on the UV or EB curable adhesive layer (5b) irradiated with UV or EB. And a superimposing means for adhering together, so that the UV or EB curable adhesive layer (5b) is cured relatively quickly, so that the substrate ( 4) and conductive layer (6 It can be enhanced greatly the production efficiency of the running speed of the. In addition, it is possible to prevent the process atmosphere from becoming hot as compared with the case where a thermoplastic adhesive is used as the adhesive. Further, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the adhesive property to the UV or EB curable adhesive layer (5b) regardless of the material of the substrate (4). Can be granted.

  According to the invention of claim 45, the UV or EB curable adhesive layer (5b) is formed in a predetermined pattern on the surface of the carrying sheet (13) in which the conductive layer (6) made of a metal foil is laminated. Printing means for printing, punching means for punching the conductive layer (6) of the carrier sheet (13) in the pattern, removing means for removing only unnecessary portions from the carrier sheet (13), and the carrier sheet ( 13) Irradiation means for irradiating UV or EB to the UV or EB curable adhesive layer (5b) in the pattern portion remaining on the UV or EB curable adhesive layer (5b) irradiated with UV or EB And a superposing means for superposing and adhering the base material (4) from above, a manufacturing apparatus for a non-contact type data carrier conductive member, and a UV or EB curable adhesive Layer (5b There can be enhanced greatly the production efficiency of the running speed of the substrate (4) and the conductive layer (6) Since the cured relatively quickly. In addition, the process atmosphere can be prevented from being heated higher than when a thermoplastic adhesive is used as the adhesive. Further, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the adhesive property to the UV or EB curable adhesive layer (5b) regardless of the material of the substrate (4). Can be granted.

  According to the invention of claim 46, in the non-contact data carrier conductive member manufacturing apparatus according to claim 43 or 45, the non-contact type wherein the same cylinder (15) is provided with the printing means and the punching means. Since it is a manufacturing apparatus of the conductive member for data carriers, the manufacturing speed of the conductive member for non-contact type data carriers can be increased.

  According to the invention of claim 47, in the non-contact data carrier conductive member manufacturing apparatus according to any one of claims 42 to 46, the flat plate (30) includes the punching means. Since it is an apparatus for manufacturing a non-contact type data carrier conductive member, the punching pattern of the conductive layer (6) can be easily changed.

  According to the invention of claim 48, in the apparatus for manufacturing a non-contact data carrier conductive member according to any one of claims 42 to 47, the punching means comprises a conductive layer (6) and a carrier sheet ( 13) Since it is an apparatus for manufacturing a non-contact type data carrier conductive member provided with a cushioning pressing body (40) for pressing a superposed body, the conductive layer (6) and the base material (4) Thus, the conductive layer (6) having an appropriate pattern can be formed on the substrate (4).

  According to the invention of claim 49, in the non-contact data carrier conductive member manufacturing apparatus according to any one of claims 42 to 48, an unnecessary portion of the conductive layer (6) is removed. Since it is an apparatus for manufacturing a non-contact type data carrier conductive member provided with a hot press means (40, 41) for heating and pressurizing the superposed body of the subsequent conductive layer (6) and substrate (4), separation Since it is a method of manufacturing a conductive member for a non-contact type data carrier, the method further includes a hot pressing step of heating and pressing the superposed body of the conductive layer (6) and the base material (4) after the step. Bubbles or the like are mixed between the layer (6) and the base material (4), the pattern edge of the conductive layer (6) is lifted from the base material (4) after pattern punching, or the conductive layer (6) Even if the surface of the substrate is wavy, the conductive layer (6) is used as the base material. Can be bonded smoothly across pattern 4). Therefore, characteristics as an antenna or the like can be improved. Further, the pattern of the conductive layer (6) can be buried in the base material (4) by adjusting the pressure, etc., but in this case, the pattern of the conductive layer (6) is appropriately protected.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

<Embodiment 1>
A wireless tag 1 shown in FIG. 1 is created using an antenna 2 which is a non-contact type data carrier conductive member shown in FIG. 2 and an interposer 3 which is a non-contact type data carrier conductive member shown in FIG. . As shown in FIG. 1, the end portions 2a and 2b of the antenna 2 are electrically connected by an interposer 3, and the surface of the antenna 2 is covered with a protective layer 7 made of an adhesive layer.

  The antenna 2 has a layer configuration as shown in FIG. That is, the thermoplastic adhesive layer 5 is printed in the same pattern as the pattern of the antenna 2 on the sheet-like base material 4 made of paper, resin, etc., and aluminum is formed in the pattern of the antenna 2 on the thermoplastic adhesive layer 5. The conductive layer 6 made of a metal foil such as copper, copper alloy, phosphor bronze, or SUS is heat bonded. Here, the antenna has various patterns such as a bar-shaped pattern, a pad-shaped pattern, and a cross-shaped pattern depending on the communication frequency band in addition to the spiral pattern. A protective layer 7 made of an adhesive layer is laminated on the conductive layer 6 as shown in FIG.

  Here, the thermoplastic adhesive layer 5 is applied to the pattern of the antenna 2 by a printing method such as inkjet printing, gravure printing, flexographic printing, offset printing, or screen printing.

  Since the thermoplastic adhesive layer 5 is formed on the base material 4 by such a printing method, the conductive layer 6 is formed on the base material 4 without being greatly raised, and the thermoplastic adhesion from below the conductive layer 6 is performed. The protrusion of the agent 5 is prevented. And since the protective layer 7 is laminated | stacked on the conductive layer 6, while preventing the oxidation of the conductive layer 6, damage can be prevented beforehand. Furthermore, since the protective layer 7 is formed of an adhesive layer, the interposer 3 which is a non-contact data carrier conductive member can be temporarily bonded, and the bonding work efficiency of the interposer 3 can be improved.

  The interposer 3 is formed by electrically connecting strip-like conductive sheets 9 and 9 to electrodes (not shown) on both sides of the IC chip 8 as shown in FIG. 4, and as shown in FIG. The conductive sheets 9 and 9 on both sides are bonded to the end portions 2a and 2b of the antenna 2 with a conductive adhesive or the like. As shown in FIG. 5, the conductive sheets 9, 9 have substantially the same layer structure as the antenna 2, and the adhesive layer 11 is disposed on the base material 10 that is relatively thinner than the base material 4 of the antenna 2. The conductive layer 12 made of metal foil such as aluminum, copper, copper alloy, phosphor bronze, SUS, or alloy foil is bonded or laminated. A protective layer 7 may be laminated on the conductive layer 12 in the same manner as the antenna 2.

  When the wireless tag 1 having the above configuration is used, various information is read or written in the electromagnetic field by a reader / writer (not shown) with respect to the IC chip 8.

  Next, a method for manufacturing the antenna 2 will be described based on a manufacturing apparatus shown in FIG.

  (1) First, a carrier substrate 13 which is a carrying sheet is configured by sequentially laminating a release layer 14, a protective layer 7, and a conductive layer 6 made of a metal foil such as an aluminum foil. 13 continuous bodies 13a and a continuous body 4a of the base material 4 are prepared, and both continuous bodies 13a and 4a are continuously run at the same speed in the arrow direction.

  (2) The processing cylinder 15 and the receiving roller 16 are arranged on the upstream side in the travel path of the continuous body 13a of the carrier base material 13 so as to sandwich the continuous body 13a of the carrier base material 13 therebetween.

  The processing cylinder 15 has a number of punching blades 17 corresponding to the pattern of the antenna 2 formed on the peripheral surface thereof. For example, four sets of punching blades 17 for punching the pattern of one antenna 2 are arranged around the processing cylinder 15. However, the number of groups arranged differs depending on the dimensions of the antenna outer shape and the processing cylinder diameter. The receiving roller 16 is formed of a metal roll, and has a structure in which an interval (gap) from the processing cylinder 15 can be adjusted according to the thickness of the base material.

  Further, the processing cylinder 15 is adjacent to a pattern cylinder 18, and an application portion 18 a for applying the thermoplastic adhesive layer 5 to the pattern of the antenna 2 is formed in a convex shape on the pattern cylinder 18. An adhesive supply cylinder 19 is disposed so as to be in contact with the application portion 18a, and a receiving cylinder 20 is disposed so as to be in contact with the adhesive supply cylinder 19. An adhesive nozzle 21 is disposed above the receiving cylinder 20.

  Accordingly, the liquid thermoplastic adhesive 5 a is received from the adhesive nozzle 21 and discharged toward the peripheral surface of the cylinder 20. Then, the liquid thermoplastic adhesive 5 a is supplied from the receiving cylinder 20 to the application portion 18 a of the pattern cylinder 18 through the supply cylinder 19.

  Then, after the liquid thermoplastic adhesive 5a is applied to the application portion 18a of the pattern cylinder 18 in the same pattern as the pattern of the antenna 2, the liquid thermoplastic adhesive 5a is punched into the processing cylinder 15. The blade 17 is supplied to a portion corresponding to the pattern portion of the conductive layer 6.

  The continuum 13a of the carrier substrate 13 is formed by cutting the conductive layer 6 made of metal foil along the outline of the antenna 2 by the punching blade 17 and the conductive layer 6 of the punching blade 17 of the processing cylinder 15. The liquid thermoplastic adhesive 5a supplied to the part corresponding to the pattern part is printed on the conductive layer 6 which is a metal foil in the same pattern as the antenna 2 at regular intervals.

  Thus, since the punching process of the conductive layer 6 and the printing process of the thermoplastic adhesive 5a are performed simultaneously, the antenna 2 is manufactured easily and accurately. Further, the manufacturing apparatus is made compact and the installation space is reduced.

  In addition, a cut is formed in the carrier base 13 so as to cut the conductive layer 6 along the pattern of the antenna 2, that is, the contour of the conductive layer 6. By this cutting, the contour of the pattern of the conductive layer 6 is neatly arranged, and the electrical performance of the conductive layer 6 is enhanced.

  (3) A dryer 23 is disposed downstream of the processing cylinder 15 and the receiving roller 16. The thermoplastic adhesive layer 5 printed on the surface of the conductive layer 6 of the continuous body 13a of the carrier substrate 13 is dried by removing the solvent contained therein by the dryer 23.

  (4) The continuum 13a of the carrier base material 13 travels and overlaps the lower surface of the continuum 4a of the base material 4 from the surface of the thermoplastic adhesive layer 5 and at the same time downstream of the dryer 23. The conductive layer 6 of metal foil is pressed by the heating roller 25. At that time, the thermoplastic adhesive layer 5 is heated by the heating roller 25 to have adhesiveness, and the conductive layer 6 and the protective layer 7 of the metal foil adhere to the thermoplastic adhesive layer 5.

  (5) After that, when passing through the separation roller 26, the continuous body 4a of the base material 4 and the continuous body 13a of the carrier base material 13 are pulled in different directions, and the antenna 2 is carried under the continuous body 4a of the base material 4. Traveling in the direction of the arrow as it is, the metal foil punching unnecessary portion 6a in the continuous body 13a of the carrier base material 13 travels in the direction of the arrow while being separated from the continuous body 4a of the base material 4.

  Thereafter, the continuum 4a of the base material 4 is divided for each antenna 2 and used for manufacturing a wireless tag as described above, for example.

  The strip-shaped conductive sheet 9 of the interposer 3 can also be manufactured by a method and apparatus similar to the method and apparatus used for manufacturing the antenna 2.

<Embodiment 2>
FIG. 7 is a schematic side view showing an antenna manufacturing apparatus according to Embodiment 2 of the present invention.

  In addition, the same code | symbol is attached | subjected and demonstrated to the part which is the same as that of the manufacturing apparatus of the antenna which concerns on the said Embodiment 1, or respond | corresponds. The same applies to other embodiments.

  As shown in FIG. 7, the processing cylinder 15 and the receiving roller 16 are arranged on the upstream side of the continuous body 13 a of the carrier base material 13 so as to sandwich the continuous body 13 a of the carrier base material 13. The processing cylinder 15 has a number of punching blades 17 corresponding to the pattern of the antenna 2 formed on the peripheral surface thereof. Thereby, in the continuous body 13 a of the carrier base material 13, the conductive layer 6 which is a metal foil is cut along the outline of the antenna 2 by the punching blade 17.

  In addition, an inkjet nozzle 27 is disposed on the downstream side of the processing cylinder 15, and the inkjet nozzle 27 discharges the liquid thermoplastic adhesive 5 a toward the surface of the continuous body 13 a of the carrier substrate 13. Thereby, the thermoplastic adhesive layer 5 is printed on the surface of the continuous body 13a of the carrier base 13 in the same pattern as the pattern of the antenna 2 at regular intervals.

  Further, a dryer 23 is disposed on the downstream side of the inkjet nozzle 27. The thermoplastic adhesive layer 5 printed on the surface of the conductive layer 6 of the continuous body 13a of the carrier substrate 13 is dried by removing the solvent contained therein by the dryer 23.

  As in the first embodiment, the continuous body 13a of the carrier base material 13 travels and is simultaneously pressed against the lower surface of the continuous body 4a of the base material 4 from the surface of the thermoplastic adhesive layer 5 and pressed. At that time, the thermoplastic adhesive layer 5 is heated by the heating roller 25 to have adhesiveness, and the conductive layer 6 and the protective layer 7 of the metal foil adhere to the thermoplastic adhesive layer 5. Then, the continuum 13a of the carrier substrate 13 and the continuum 4a of the substrate 4 are pulled in different directions, and the antenna 2 travels in the direction of the arrow while being supported under the continuum 4a of the substrate 4, and the carrier base The continuum 13a of the material 13 and the punching unnecessary portion 6a of the metal foil travel in the direction of the arrow while being separated from the continuum 4a of the substrate 4.

  As described above, according to the second embodiment, since the printing process is performed after the punching process is performed, the synchronization control between the bonding process and the punching process can be made unnecessary while simplifying the configuration.

  The strip-shaped conductive sheet 9 of the interposer 3 can also be manufactured by a method and apparatus similar to the method and apparatus used for manufacturing the antenna 2. The same applies to the following embodiments.

<Embodiment 3>
FIG. 8 is a schematic side view showing an antenna manufacturing apparatus according to Embodiment 3 of the present invention.

  As shown in FIG. 8, in the third embodiment, unlike the second embodiment, an inkjet nozzle 27 and a dryer 23 are arranged on the upstream side of the processing cylinder 15 and the receiving roller 16.

  That is, in the third embodiment, the inkjet nozzle 27, the dryer 23, the processing cylinder 15, and the receiving roller 16 are arranged in this order from the upstream side of the continuous body 13a of the carrier base material 13.

  Therefore, the inkjet nozzle 27 discharges the liquid thermoplastic adhesive 5 a toward the surface of the continuous body 13 a of the carrier base 13. Thereby, the thermoplastic adhesive layer 5 is printed on the surface of the continuous body 13a of the carrier base 13 in the same pattern as the pattern of the antenna 2 at regular intervals.

  Subsequently, the thermoplastic adhesive layer 5 printed on the surface of the conductive layer 6 of the continuous body 13a of the carrier base material 13 is removed by the dryer 23 and dried.

  Further, in the continuous body 13 a of the carrier base material 13, the conductive layer 6 that is a metal foil is cut along the outline of the antenna 2 by the punching blade 17.

  As in the first embodiment, the continuous body 13a of the carrier base material 13 travels and is simultaneously pressed against the lower surface of the continuous body 4a of the base material 4 from the surface of the thermoplastic adhesive layer 5 and pressed. At that time, the thermoplastic adhesive layer 5 is heated by the heating roller 25 to have adhesiveness, and the conductive layer 6 and the protective layer 7 of the metal foil adhere to the thermoplastic adhesive layer 5. Then, the continuum 13a of the carrier substrate 13 and the continuum 4a of the substrate 4 are pulled in different directions, and the antenna 2 travels in the direction of the arrow while being supported under the continuum 4a of the substrate 4, and the carrier base The continuum 13a of the material 13 and the punching unnecessary portion 6a of the metal foil travel in the direction of the arrow while being separated from the continuum 4a of the substrate 4.

  As described above, according to the third embodiment, since the punching process is performed after the printing process is performed, it is possible to eliminate the synchronization control between the bonding process and the punching process while simplifying the configuration.

  Further, according to the third embodiment, the liquid thermoplastic adhesive 5a is ejected from the inkjet nozzle 27 toward the surface of the continuous body 13a of the carrier base material 13, and the same pattern as the antenna 2 is formed on the surface of the continuous body 13a. Since the thermoplastic adhesive layer 5 is formed in a pattern at regular intervals, the liquid thermoplastic adhesive 5a is not masked and exposed, and the masking member and the exposure apparatus can be dispensed with.

<Embodiment 4>
As shown in FIG. 9, in the fourth embodiment, unlike the case of the third embodiment, the machining cylinder 15 and the receiving roller 16 are replaced with a machining flat plate 30 and a receiving table 31.

  In this case, the continuous body 13 a of the carrier base material 13 having the conductive layer 6 is intermittently fed at a constant pitch between the processing flat plate 30 and the cradle 31, and the processing flat plate 30 reciprocates up and down with respect to the cradle 31. Exercise. And the continuous body 13a of the carrier base material 13 is punched into the pattern of the antenna 2 by the punching blade 17 for each reciprocation. Note that a pressing body 32 is inserted between the blades of the pattern portion of the punching blade 17 on the processing flat plate 30 as necessary.

  After that, it is pressed by the heating roller 25 at the same time as overlapping the lower surface of the continuous body 4 a of the base material 4 from the surface of the thermoplastic adhesive layer 5. At that time, the thermoplastic adhesive layer 5 is heated and has adhesiveness, and the conductive layer 6 and the protective layer 7 of the metal foil are adhered to the thermoplastic adhesive layer 5. Then, the continuum 13a of the carrier substrate 13 and the continuum 4a of the substrate 4 are pulled in different directions, and the antenna 2 travels in the direction of the arrow while being supported under the continuum 4a of the substrate 4, and the carrier base The continuum 13a of the material 13 and the punching unnecessary portion 6a of the metal foil travel in the direction of the arrow while being separated from the continuum 4a of the substrate 4.

  The processing flat 30 and the cradle 31 may be separated into a heating flat and a punching flat, and the cradle 31 may be assigned to each.

<Embodiment 5>
FIG. 10 is a schematic side view showing an antenna manufacturing apparatus according to Embodiment 5 of the present invention.

  As shown in FIG. 10, in the fifth embodiment, an unnecessary part removing roll 33 and an unnecessary part winding device 34 as a removing unit are arranged on the upstream side of the heating roller 25. Further, in the fifth embodiment, the inkjet nozzle 27 and the dryer 23 are arranged on the upstream side of the processing cylinder 15 and the receiving roller 16 as in the third embodiment.

  Therefore, in the fifth embodiment, after the printing, drying process and punching process of the thermoplastic adhesive layer 5 as in the third embodiment, the unnecessary portion removing roll 33 and the unnecessary portion winding device 34 are used on the carrier base material 13. Only the unnecessary portion of the conductive layer 6 where the thermoplastic adhesive layer 5 is not printed is peeled off from the release layer 14 of the carrier base 13 and wound up to be removed.

  Next, the continuous body 13a of the carrier base material 13 is pressed while being overlapped with the surface of the thermoplastic adhesive layer 5 on the lower surface of the continuous body 4a of the base material 4 while traveling. At that time, the thermoplastic adhesive layer 5 is heated by the heating roller 25 to have adhesiveness, and the conductive layer 6 and the protective layer 7 of the metal foil adhere to the thermoplastic adhesive layer 5.

  Then, the continuum 13a of the carrier substrate 13 and the continuum 4a of the substrate 4 are pulled in different directions, and the antenna 2 travels in the direction of the arrow while being supported under the continuum 4a of the substrate 4, and the carrier base The continuous body 13a of the material 13 travels in the direction of the arrow while being separated from the continuous body 4a of the base material 4. There is no metal foil layer in the separated carrier substrate, and only the carrier substrate 13 and the release layer 14 are present.

  As described above, according to the fifth embodiment, since the patterning is not required in the bonding process, the synchronization control with the metal foil punching process is not required, and an accurate pattern can be formed. Further, the metal foil sheet and the support sheet can be separated and recovered.

<Embodiment 6>
As shown in FIG. 11, in the wireless tag 35 of the sixth embodiment, unlike the case of the first embodiment, an IC chip 8 is attached in the middle of the antenna 2 that is a conductive member for a non-contact type data carrier. The two end portions 2 a and 2 b are electrically connected by a bridge 36 instead of the interposer 3. The bridge 36 is formed of a laminate formed by laminating a conductive layer of metal foil on a base material made of a resin film or the like via a thermoplastic adhesive layer.

  The bridge 36 can be manufactured in the same manner as the antenna 2 described in the first embodiment.

<Embodiment 7>
As shown in FIG. 12, the interposer 37 of the seventh embodiment is configured as an interposer with an antenna. The antennas 38 and 38 are formed of a laminate in which a conductive layer of metal foil is laminated on a base material made of a resin film or the like via a thermoplastic adhesive layer. The antenna 38 is an example of a bar-shaped pattern antenna in the above-described shape.

  The antenna 38 can be manufactured in the same manner as the antenna described in the first embodiment.

<Eighth embodiment>
As shown in FIG. 13, the manufacturing apparatus for the non-contact type data carrier conductive member in the eighth embodiment differs from that in the first embodiment shown in FIG. 6 in that the release layer 14, the protective layer 7 and aluminum When printing and punching is performed on the continuous body 13a of the carrier base material 13 in which the conductive layers 6 made of metal foil such as foil are sequentially stacked, the continuous body 13a of the carrier base material 13 which is a superimposed body in which the conductive layers 6 are stacked. Is pressurized through a cushioning material. Specifically, a cushioning pressing body 40 such as a rubber sheet is wound around the peripheral surface of the receiving roller 16 facing the processing cylinder 15. Thereby, the continuous body 13a of the carrier base material 13 is pressurized with a uniform applied pressure when passing between the processing cylinder 15 and the receiving roller 16, and the conductive layer 6 is accurately punched on the carrier base material 13. At the same time, the liquid thermoplastic adhesive 5 a is accurately printed on the conductive layer 6.

  Further, the punching unnecessary portion 6 a is separated from the continuous body 4 a of the base material 4 in the separation roller 26 downstream of the dryer 23 through the processing cylinder 15, while the antenna 2 is bonded to the bottom of the continuous body 4 a of the base material 4. Then, it is pressed while being heated and further heated on the downstream side. Specifically, a superposed body of the antenna 2 including the conductive layer 6 and the base material 4 is hot-pressed by the heating roller 41 and the pressure roller 42. Thereby, even after pattern punching, bubbles or the like are mixed between the conductive layer 6 and the base material 4, the pattern edge of the conductive layer 6 is lifted from the base material 4, or the surface of the conductive layer 6 is waved. Even if it strikes, the pattern of the conductive layer 6 is smoothly adhered onto the base material 4 throughout the pattern.

  In this heating press, the pattern of the conductive layer 6 protrudes onto the substrate 4 as shown in FIG. 22 by appropriately adjusting the pressure applied to the substrate 4 by the heating roller 41 and the pressure roller 42, the heating temperature, and the like. Although it is possible to adhere in a state, as shown in FIG. 24, the pattern of the conductive layer 6 can be embedded in the softened base material 4. In the latter case, the entire surface of the substrate 4 is a smooth surface, and the pattern of the conductive layer 6 is more appropriately protected from abrasion and the like.

  In addition, in FIG. 13, the same part as the part in FIG. 6 is attached | subjected and shown only with the same referential mark, and the overlapping description is abbreviate | omitted.

<Embodiment 9>
As shown in FIG. 14, in the ninth embodiment, the processing cylinder 15 and the receiving roller 16 are arranged on the most upstream side of the continuous body 13a of the carrier base material 13 so as to sandwich the continuous body 13a of the carrier base material 13. The In addition, an inkjet nozzle 27 is disposed on the downstream side of the processing cylinder 15, and the inkjet nozzle 27 discharges the liquid thermoplastic adhesive 5 a toward the surface of the continuous body 13 a of the carrier substrate 13.

  A cushioning pressing body 40 such as a rubber sheet is wound around the receiving roller 16. Thereby, the continuous body 13a of the carrier base material 13 is pressurized with a uniform applied pressure when passing between the processing cylinder 15 and the receiving roller 16, and the conductive layer 6 is accurately punched on the carrier base material 13. It will be.

  In addition, in FIG. 14, the same parts as those in FIGS. 13 and 7 are indicated by the same reference numerals, and redundant description is omitted.

<Embodiment 10>
As shown in FIG. 15, in the tenth embodiment, unlike the ninth embodiment, an inkjet nozzle 27 and a dryer 23 are arranged on the upstream side of the processing cylinder 15 and the receiving roller 16. A cushioning pressing body 40 such as a rubber sheet is wound around the receiving roller 16. Thereby, the continuous body 13a of the carrier base material 13 is pressurized with a uniform applied pressure when passing between the processing cylinder 15 and the receiving roller 16, and the conductive layer 6 is accurately punched on the carrier base material 13. At the same time, the liquid thermoplastic adhesive 5 a is accurately printed on the conductive layer 6.

  In addition, in FIG. 15, the same part as the part in FIG.13 and FIG.8 is attached | subjected and shown only, and the overlapping description is abbreviate | omitted.

<Embodiment 11>
As shown in FIG. 16, in the eleventh embodiment, the processing cylinder 15 and the receiving roller 16 in the tenth embodiment are replaced with a processing flat plate 30 and a receiving base 31 which are flat blades of a flat press device. And the press body 32 is inserted between the blades of the pattern part of the punching blade 17 in the processing flat plate 30 as necessary.

  Further, when punching the continuous body 13a of the carrier base material 13, the continuous body 13a is pressurized via a cushion material. Specifically, a cushioning pressing body 40 such as a rubber sheet is attached to the upper surface of the cradle 31. As a result, the continuous body 13a of the carrier base material 13 is pressed with a uniform applied pressure when pressed by the processing flat plate 30 and the cradle 31, and the conductive layer 6 is accurately punched on the carrier base material 13. At the same time, the liquid thermoplastic adhesive 5 a is accurately printed on the conductive layer 6.

  In addition, in FIG. 16, the same part as the part in FIG. 13 and FIG. 9 is shown by attaching | subjecting the same referential mark, and the overlapping description is abbreviate | omitted.

<Embodiment 12>
As shown in FIG. 17, in the twelfth embodiment, an unnecessary portion removing roll 33 and an unnecessary portion winding device 34 are disposed on the upstream side of the heating roller 25, and the machining cylinder 15 and the like as in the tenth embodiment. An inkjet nozzle 27 and a dryer 23 are disposed on the upstream side of the receiving roller 16.

  Further, a cushioning pressing body 40 such as a rubber sheet is wound around the receiving roller 16. Thereby, the continuous body 13a of the carrier base material 13 is pressurized with a uniform applied pressure when passing between the processing cylinder 15 and the receiving roller 16, and the conductive layer 6 is accurately punched on the carrier base material 13. At the same time, the liquid thermoplastic adhesive 5 a is accurately printed on the conductive layer 6.

  In addition, in FIG. 17, the same part as the part in FIG. 13 and FIG. 10 is attached | subjected and shown only, and the overlapping description is abbreviate | omitted.

<Embodiment 13>
Although the antenna manufactured by the manufacturing method and apparatus of the thirteenth embodiment has the same layer configuration as that shown in FIG. 3, the adhesive layer 5 is formed of adhesives having different properties.

  That is, a UV (ultraviolet ray) or EB (electron beam) curable adhesive layer 5b is printed in the same pattern as the antenna 2 pattern on a sheet-like carrier substrate 13 made of paper, resin, etc., and this UV or EB curing is performed. A conductive layer 6 made of a metal foil or alloy foil of aluminum, copper, copper alloy, phosphor bronze, SUS or the like is bonded on the conductive adhesive layer 5b in the pattern of the antenna 2. The UV or EB curable adhesive layer 5b is applied to the pattern of the antenna 2 by a printing method such as inkjet printing, gravure printing, flexographic printing, or screen printing. Since the UV or EB curable adhesive layer 5b is formed on the base material 4 by such a printing method, the conductive layer 6 is formed on the base material 4 without being greatly raised, and from the bottom of the conductive layer 6 Protrusion of the adhesive is prevented.

  In addition, as shown in FIG. 3, the surface of the conductive layer 6 is covered with a protective layer 7 as necessary, and is protected from oxidation, scratches, and the like. As the protective layer 7, a resin or the like is used. Further, the adhesive layer 11 of the interposer 3 shown in FIG. 5 can also be a UV or EB curable adhesive layer.

  Next, a method for manufacturing the antenna will be described with reference to FIG.

  (1) First, a carrier substrate 13 which is a carrying sheet is configured by sequentially laminating a release layer 14, a protective layer 7, and a conductive layer 6 made of a metal foil such as an aluminum foil. 13 continuous bodies 13a and a continuous body 4a of the base material 4 are prepared, and both continuous bodies 13a and 4a are continuously run at the same speed in the arrow direction.

  (2) The processing cylinder 15 and the receiving roller 16 are disposed on the traveling path of the continuous body 13a of the carrier base material 13 so as to sandwich the continuous body 13a of the carrier base material 13 therebetween.

  The processing cylinder 15 has a number of punching blades 17 corresponding to the pattern of the antenna 2 formed on the peripheral surface thereof. For example, four sets of punching blades 17 for punching the pattern of one antenna 2 are arranged around the processing cylinder 15. However, the number of groups arranged differs depending on the dimensions of the antenna outer shape and the processing cylinder diameter. And the press body 32 is inserted between the blades of the pattern part of the punching blade 17 as needed. The pressing body 32 is preferably made of a cushioning material made of rubber, heat-resistant resin or the like. It is also possible to form a portion corresponding to the pressing body 32 with the same material as the punching blade 17.

  The receiving roller 16 may be a single metal roller, but preferably a cushioning pressing body 40 made of a cushion material such as a rubber sheet is attached to the peripheral surface.

  The processing cylinder 15 is adjacent to a pattern cylinder 18, and an application portion 18 a for applying the UV or EB curable adhesive layer 5 b to the pattern of the antenna 2 is formed in a convex shape on the pattern cylinder 18. An adhesive supply cylinder 19 is disposed so as to be in contact with the application portion 18a, and a receiving cylinder 20 is disposed so as to be in contact with the adhesive supply cylinder 19. An adhesive nozzle 21 is disposed above the receiving cylinder 20.

  Accordingly, the liquid UV or EB curable adhesive layer 5 b is received from the adhesive nozzle 21 and discharged toward the peripheral surface of the cylinder 20. Then, the liquid UV or EB curable adhesive layer 5 b is supplied from the receiving cylinder 20 to the application portion 18 a of the pattern cylinder 18 through the supply cylinder 19.

  Then, after the liquid UV or EB curable adhesive layer 5b is applied to the application portion 18a of the pattern cylinder 18 in the same pattern as the pattern of the antenna 2, the liquid UV or EB curable adhesive layer 5b is The punching blade 17 formed in the processing cylinder 15 is supplied to a portion corresponding to the pattern portion of the conductive layer 6.

  Thus, since the punching process of the conductive layer 6 and the printing process of the UV or EB curable adhesive layer 5b are simultaneously performed, the antenna 2 is manufactured easily and accurately. Further, the manufacturing apparatus is made compact and the installation space is reduced.

  In addition, a cut is formed in the carrier base 13 so as to cut the conductive layer 6 along the pattern of the antenna 2, that is, the contour of the conductive layer 6. By this cutting, the contour of the pattern of the conductive layer 6 is neatly arranged, and the electrical performance of the conductive layer 6 is enhanced.

  (3) A UV or EB irradiation device 43 is disposed downstream of the processing cylinder 15 and the receiving roller 16. This UV or EB irradiation device 43 directly irradiates UV or EB to the UV or EB curable adhesive layer 5 b applied in the same pattern as the pattern of the antenna 2. Thereby, UV or EB curable adhesive layer 5b exhibits adhesiveness. Accordingly, since the UV or EB curable adhesive layer 5b is directly irradiated with UV or EB, even if the material of the carrier substrate 13 does not transmit UV or EB, the UV or EB curable adhesive layer 5b. Adhesiveness can be imparted to.

  (4) While the continuous body 13a of the carrier base material 13 is traveling, it overlaps with the lower surface of the continuous body 4a of the base material 4 from the surface of the UV or EB curable adhesive layer 5b, and is downstream of the UV or EB irradiation device 43. The conductive layer 6 of metal foil is pressed by the pressing roller 44 arranged on the side. The conductive layer 6 is attached to the lower surface of the continuous body 4a of the base material 4 by the UV or EB curable adhesive layer 5b. At that time, the conductive layer 6 and the protective layer 7 of the metal foil adhere to the UV or EB curable adhesive layer 5b.

  (5) After that, when passing through the separation roller 26, the continuous body 4a of the base material 4 and the continuous body 13a of the carrier base material 13 are pulled in different directions, and the antenna 2 is carried under the continuous body 4a of the base material 4. Traveling in the direction of the arrow as it is, the metal foil punching unnecessary portion 6a in the continuous body 13a of the carrier base material 13 travels in the direction of the arrow while being separated from the continuous body 4a of the base material 4.

  The unnecessary portion 6b of the metal foil can be collected not only by being wound around a winding roller (not shown) but also by being sucked by a suction device.

  (6) On the downstream side of the pressing roller 44, there is a hot press unit that pressurizes the superposed body of the conductive layer 6 and the base material 4 after the unnecessary portion 6 b of the conductive layer 6 is removed as necessary. Provided. Specifically, the heat press means includes a heating roller 41 and a pressure roller 42. The superposed body of the conductive layer 6 and the base material 4 is hot-pressed by both the rollers 41 and 42, so that bubbles or the like are mixed between the conductive layer 6 of the metal foil and the base material 4 even after pattern punching. Even if the edge of the pattern of the conductive layer 6 is lifted from the base material 4 or the surface of the metal foil of the conductive layer 6 is wavy, the pattern of the conductive layer 6 is smooth on the base material 4 over the entire surface. Glued.

  In this heating press, the pattern of the conductive layer 6 is formed on the substrate 4 in the same manner as shown in FIG. 22 by adjusting the pressure applied to the substrate 4 by the heating roller 41 and the pressure roller 42, the heating temperature, and the like. Although it is possible to bond in a protruding state, the pattern of the conductive layer 6 can be embedded in the softened base material 4 as in the case shown in FIG. In the latter case, the entire surface of the substrate 4 is a smooth surface, and the pattern of the conductive layer 6 is more appropriately protected from abrasion and the like.

  Thereafter, the continuum 4a of the base material 4 is divided for each antenna 2 and used for manufacturing a wireless tag as described above, for example.

  The strip-shaped conductive sheet 9 of the interposer 3 can also be manufactured by a method and apparatus similar to the method and apparatus used for manufacturing the antenna 2.

<Embodiment 14>
As shown in FIG. 19, in the fourteenth embodiment, the processing cylinder 15 and the receiving roller 16 are arranged on the most upstream side of the continuous body 13a of the carrier base material 13 so as to sandwich the continuous body 13a of the carrier base material 13. The In addition, an inkjet nozzle 27 is disposed on the downstream side of the processing cylinder 15, and the inkjet nozzle 27 discharges the UV or EB curable adhesive layer 5 b toward the surface of the continuous body 13 a of the carrier substrate 13. A UV or EB irradiation device 43 that directly irradiates UV or EB onto the UV or EB curable adhesive layer 5 b on the carrier substrate 13 is disposed on the downstream side of the inkjet nozzle 27. Thereby, before superimposing the conductive layer 6 on the lower surface of the base material 4 via the UV or EB curable adhesive layer 5b, the UV or EB curable adhesive layer 5b exhibits adhesiveness.

  Accordingly, in the fourteenth embodiment, the UV or EB curable adhesive layer 5b is directly irradiated with UV or EB as in the thirteenth embodiment, and therefore the material of the carrier base material 13 does not transmit UV or EB. Even so, adhesion can be imparted to the UV or EB curable adhesive layer 5b.

  In addition, in FIG. 19, the same part as the part in FIG. 18 is shown only with the same referential mark, and the overlapping description is abbreviate | omitted.

<Embodiment 15>
As shown in FIG. 20, in this fifteenth embodiment, unlike the fourteenth embodiment, an ink jet nozzle 27 is arranged on the upstream side of the processing cylinder 15 and the receiving roller 16.

  As shown in FIG. 20, in the fifteenth embodiment, the UV or EB curable adhesive layer 5b is printed in a predetermined pattern on the surface of the carrier substrate 13 by running the continuous body 13a of the carrier base 13 by the ink jet nozzle 13. The UV or EB irradiation device 43 directly irradiates UV or EB to the UV or EB curable adhesive layer 5b, and the UV or EB curable adhesive is applied to the lower surface of the substrate 4 using the pressing roller 44 as a superimposing means. They are superposed from the side of the agent layer 5b.

  Since the UV or EB curable adhesive layer 5b is directly irradiated with UV or EB, the UV or EB curable adhesive layer 5b is applied to the UV or EB curable adhesive layer 5b regardless of the material of the continuous body provided with the UV or EB curable adhesive layer 5b. Adhesiveness can be imparted.

  In addition, in FIG. 20, the same part as the part in FIG. 19 is shown only with the same referential mark, and the overlapping description is abbreviate | omitted.

<Embodiment 16>
As shown in FIG. 21, in the sixteenth embodiment, the processing cylinder 15 and the receiving roller 16 in the fifteenth embodiment are replaced with a processing flat plate 30 and a receiving base 31 which are flat blades of a flat press device. And the press body 32 is inserted between the blades of the pattern part of the punching blade 17 in the processing flat plate 30 as necessary.

  The pressing body 32 is preferably made of a cushioning material made of rubber, heat-resistant resin or the like. It is also possible to form a portion corresponding to the pressing body 32 with the same material as the punching blade 17.

  In addition, in FIG. 21, the same part as the part in FIG. 20 is shown only with the same referential mark, and the overlapping description is abbreviate | omitted.

<Embodiment 17>
As shown in FIG. 22, in the seventeenth embodiment, an unnecessary portion removing roll 33, an unnecessary portion winding device 34 and a UV or EB irradiation device 43 are sequentially arranged on the upstream side of the heating roller 25 and the processing cylinder 15. An ink jet nozzle 27 is disposed upstream of the receiving roller 16.

  Therefore, in the seventeenth embodiment, after the printing or punching process of the UV or EB curable adhesive layer 5b, the unnecessary portion removing roll 33 and the unnecessary portion winding device 34 perform UV or irradiation on the conductive layer 6 on the carrier substrate 13. Only the unnecessary part on which the EB curable adhesive layer 5b is not printed is peeled off from the release layer 14 of the carrier substrate 13 and wound up to be removed.

  The UV or EB curable adhesive layer 5 b on which the UV or EB curable adhesive layer 5 b is printed is directly irradiated with UV or EB by the UV or EB irradiation device 43.

  In addition, in FIG. 22, the same part as the part in FIG.17 and FIG.20 is shown only with the same referential mark, and the overlapping description is abbreviate | omitted.

<Embodiment 18>
As shown in FIG. 25, in the eighteenth embodiment, the peeling process is performed by the turn bar 45.

  When the superposed body of the base material 4 and the conductive layer 6 is guided by the first guide roller 46, it is separated into the base material 4 and the unnecessary portion 6a of the conductive layer by the turn bar 45, and the base material 4 is reversed at the same time. And travels to the second guide roller 47. Since the base 4 flows in the turn bar 45 so that the corner 2c of the pattern of the antenna 2 made of the conductive layer 6 precedes, the pattern of the antenna 2 easily separates from the continuous body of the conductive layer 6 on the turn bar 45.

<Embodiment 19>
As shown in FIG. 26, in the nineteenth embodiment, the pattern of the antenna 2 is punched into the superimposed body of the base material 4 and the conductive layer 6 so as to be inclined with respect to the traveling direction. Accordingly, when the superposed body is divided into the base material 4 and the unnecessary portion 6a of the conductive layer 6 while passing through the heating roller 25 or the pressing roller 45 and the separation roller 26, the corner portion 2c of the pattern of the antenna 2 precedes the others. Therefore, the pattern of the antenna 2 is easily separated from the conductive layer 6.

It is a perspective view which shows the outline of the wireless tag made using the antenna and interposer which concern on this invention. It is a perspective view which shows the outline of the antenna which concerns on this invention. FIG. 3 is a cross-sectional view taken along line III-III in FIG. It is a perspective view which shows the outline of the interposer which concerns on this invention. In FIG. 4, it is a VV arrow directional cross-sectional view. It is a schematic side view which shows the manufacturing apparatus of the antenna which concerns on Embodiment 1 of this invention. It is a schematic side view which shows the manufacturing apparatus of the antenna which concerns on Embodiment 2 of this invention. It is a schematic side view which shows the manufacturing apparatus of the antenna which concerns on Embodiment 3 of this invention. It is a schematic side view which shows the manufacturing apparatus of the antenna which concerns on Embodiment 4 of this invention. It is a schematic side view which shows the manufacturing apparatus of the antenna which concerns on Embodiment 5 of this invention. It is a perspective view which shows the outline of the radio | wireless tag made using the antenna and bridge which concern on Embodiment 6 of this invention. It is a perspective view which shows the outline of the interposer with an antenna which concerns on Embodiment 7 of this invention. It is a schematic side view of the antenna manufacturing apparatus according to Embodiment 8 of the present invention. It is a schematic side view of the antenna manufacturing apparatus according to the ninth embodiment of the present invention. It is a schematic side view of the antenna manufacturing apparatus according to Embodiment 10 of the present invention. It is a schematic side view of the antenna manufacturing apparatus according to Embodiment 11 of the present invention. It is a schematic side view of the antenna manufacturing apparatus according to Embodiment 12 of the present invention. It is a schematic side view of the antenna manufacturing apparatus according to the thirteenth embodiment of the present invention. It is a schematic side view of the antenna manufacturing apparatus which concerns on Embodiment 14 of this invention. It is a schematic side view of the antenna manufacturing apparatus according to Embodiment 15 of the present invention. It is a schematic side view of the antenna manufacturing apparatus according to Embodiment 16 of the present invention. It is a schematic side view of the antenna manufacturing apparatus according to Embodiment 17 of the present invention. It is sectional drawing before the heat press of the antenna manufactured with the antenna manufacturing apparatus which concerns on Embodiment 8 of this invention. It is sectional drawing after the heat press of the antenna manufactured with the antenna manufacturing apparatus which concerns on Embodiment 8 of this invention. It is a perspective view which shows the isolation | separation process in the antenna manufacturing apparatus based on Embodiment 18 of this invention. It is a perspective view which shows the isolation | separation process in the antenna manufacturing apparatus based on Embodiment 19 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Antenna 4 ... Base material 4a ... Continuous body of base material 5 ... Thermoplastic adhesive layer 5b ... UV or EB curable adhesive layer 6 ... Conductive layer 6a ... Metal foil punching unnecessary part 7 ... Protective layer 13 ... Carrier Base material (supporting sheet)
13a: carrier base material 15 ... processing cylinder 16 ... receiving roller 18 ... punching blade 21 ... adhesive nozzle 23 ... dryer 25 ... heating roller 26 ... separation roller 27 ... inkjet nozzle 30 ... processing flat (flat)
31 ... Receiver 33 ... Unnecessary part removing roll (removing means)
40 ... Cushioning pressure body 41 ... Heating roller (heat press means)
42 ... Pressure roller (heat press means)
43 ... UV or EB irradiation device

Claims (49)

  A thermoplastic adhesive layer is formed in a predetermined pattern on the substrate, and a conductive layer made of a metal foil having substantially the same pattern as the above pattern is heated and bonded on the thermoplastic adhesive layer, and the conductive layer is formed on the conductive layer. A conductive member for a non-contact type data carrier, wherein a protective layer is laminated.   The conductive member for a non-contact type data carrier according to claim 1, wherein the protective layer is formed of an adhesive layer.   A punching step of punching the conductive layer of the support sheet in the pattern while laminating a conductive sheet made of a metal foil and running a support sheet on which the thermoplastic adhesive layer is formed in a predetermined pattern; and It includes a bonding step in which a base material is superposed on the surface of the thermoplastic adhesive layer and heat-bonded, and a separation step in which unnecessary portions other than the pattern portion bonded to the base material are separated from the carrier sheet integrally. A method of manufacturing a conductive member for a non-contact type data carrier.   A printing process for printing a thermoplastic adhesive layer in a predetermined pattern on the surface of the carrying sheet on which a conductive layer made of a metal foil is laminated, and a punching process for punching the conductive layer of the carrying sheet in the pattern; Including a bonding step in which a base material is superposed on the surface of the thermoplastic adhesive layer and heat-bonded, and a separation step in which unnecessary portions other than the pattern portion bonded to the base material are separated from the carrier sheet integrally. A method of manufacturing a conductive member for a non-contact type data carrier.   5. The non-contact type data carrier conductive member manufacturing method according to claim 3, further comprising a drying step of drying the thermoplastic adhesive layer formed in the predetermined pattern. A method for manufacturing a conductive member for a carrier.   5. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 3 or 4, wherein the carrier sheet is formed by sequentially laminating a release layer, a protective layer, and a conductive layer made of a metal foil. A method for manufacturing a non-contact data carrier conductive member.   7. The method of manufacturing a non-contact data carrier conductive member according to claim 6, wherein the protective layer is formed of an adhesive layer.   5. The method for manufacturing a non-contact type data carrier conductive member according to claim 4, wherein the printing step and the punching step are performed simultaneously.   5. The method for manufacturing a non-contact type data carrier conductive member according to claim 4, wherein the printing step is performed after the punching step.   5. The method for manufacturing a non-contact type data carrier conductive member according to claim 4, wherein the punching step is performed after the printing step.   11. The non-contact type data carrier manufacturing method according to claim 3, wherein the printing step and the punching step are performed by a cylinder. For producing a conductive member.   The method of manufacturing a non-contact type data carrier conductive member according to any one of claims 3 to 10, wherein the punching step is performed by a flat plate. Production method.   A punching step of punching the conductive layer of the carrier sheet in the pattern while laminating a conductive sheet made of metal foil and running a carrier sheet on which the thermoplastic adhesive layer is formed in a predetermined pattern; and It includes a removing step for removing only unnecessary portions from the carrying sheet, and an adhesion step for superposing and heating the substrate on the surface of the thermoplastic adhesive layer of the pattern portion remaining on the carrying sheet. A method for manufacturing a conductive member for a non-contact type data carrier.   A printing process for printing a thermoplastic adhesive layer in a predetermined pattern on the surface of the carrying sheet on which a conductive layer made of a metal foil is laminated, and a punching process for punching the conductive layer of the carrying sheet in the pattern; It includes a removal step of removing only unnecessary portions from the carrier sheet, and an adhesion step of heating and adhering a base material on the surface of the thermoplastic adhesive layer of the pattern portion remaining on the carrier sheet. A method of manufacturing a conductive member for a non-contact type data carrier.   15. The method for manufacturing a conductive member for a non-contact type data carrier according to claim 13 or 14, further comprising a drying step of drying the thermoplastic adhesive layer formed in the predetermined pattern. A method for manufacturing a conductive member for a carrier.   Punching means for punching the conductive layer of the carrier sheet in the pattern while laminating a conductive sheet made of a metal foil and having a thermoplastic adhesive layer formed in a predetermined pattern on the surface of the conductive sheet; It includes an adhesion means for heating and adhering a base material on the surface of the thermoplastic adhesive layer, and a separation means for separating unnecessary parts other than the pattern part adhered to the base material integrally with the carrier sheet. An apparatus for manufacturing a conductive member for a non-contact type data carrier.   Printing means for printing a thermoplastic adhesive layer in a predetermined pattern on the surface of the carrying sheet on which a conductive layer made of metal foil is laminated, and a punching means for punching out the conductive layer of the carrying sheet in the pattern; Including a bonding means for heating and adhering a base material on the surface of the thermoplastic adhesive layer, and a separation means for separating unnecessary parts other than the pattern part bonded to the base material integrally with the carrying sheet. An apparatus for manufacturing a conductive member for a non-contact type data carrier.   18. The non-contact data carrier conductive member manufacturing apparatus according to claim 16 or 17, further comprising a drying means for drying the thermoplastic adhesive layer formed in the predetermined pattern. An apparatus for manufacturing a conductive member for a carrier.   Punching means for punching the conductive layer of the carrier sheet in the pattern while laminating a conductive sheet made of a metal foil and having a thermoplastic adhesive layer formed in a predetermined pattern on the surface of the conductive sheet; A removal means for removing only unnecessary portions from the carrying sheet; and an adhesion means for superposing and heating the base material on the surface of the thermoplastic adhesive layer of the pattern portion remaining on the carrying sheet. An apparatus for manufacturing a conductive member for a non-contact type data carrier.   Printing means for printing a thermoplastic adhesive layer in a predetermined pattern on the surface of the carrying sheet on which a conductive layer made of metal foil is laminated, and a punching means for punching out the conductive layer of the carrying sheet in the pattern; It includes a removing means for removing only unnecessary portions from the carrying sheet, and an adhering means for heating and adhering a base material on the surface of the thermoplastic adhesive layer of the pattern portion remaining on the carrying sheet. An apparatus for manufacturing a conductive member for a non-contact type data carrier.   21. The non-contact type data carrier conductive member manufacturing apparatus according to claim 17 or 20, wherein the same cylinder is provided with the printing means and the punching means. manufacturing device.   The non-contact type data carrier conductive member manufacturing apparatus according to any one of claims 16 to 21, wherein the flat plate includes the punching means. Manufacturing equipment for members.   23. The apparatus for manufacturing a non-contact data carrier conductive member according to claim 16, wherein the punching means includes a cushioning pressing body that presses the superposed body of the conductive layer and the carrying sheet. An apparatus for manufacturing a conductive member for a non-contact type data carrier.   24. The apparatus for manufacturing a non-contact data carrier conductive member according to claim 16, wherein the superposed body of the conductive layer and the substrate after the unnecessary portion of the conductive layer is removed is heated. An apparatus for producing a conductive member for a non-contact type data carrier, comprising a heat press means for pressurizing while pressing.   21. The non-contact type data carrier conductive member manufacturing apparatus according to claim 19, further comprising a drying means for drying the thermoplastic adhesive layer formed in the predetermined pattern. An apparatus for manufacturing a conductive member for a carrier.   An interposer is electrically connected to an antenna that is a conductive member for a noncontact data carrier according to claim 1 or 2.   A non-contact type data carrier, wherein a bridge and an IC chip are electrically connected to an antenna that is a conductive member for a non-contact type data carrier according to claim 1 or 2.   The method for manufacturing a conductive member for a non-contact type data carrier according to any one of claims 3 to 15, wherein the superposed body of the conductive layer and the carrying sheet is pressed through a cushion material in a punching process. A method for manufacturing a non-contact data carrier conductive member.   29. The method of manufacturing a conductive member for a non-contact data carrier according to any one of claims 3 to 15 or 28, wherein the pressing is performed while heating the superposed body of the conductive layer and the substrate after the separation step. The manufacturing method of the electrically-conductive member for non-contact data carriers characterized by further including a process.   A punching process of punching the conductive layer of the support sheet in the pattern while laminating a conductive sheet made of a metal foil and running a support sheet on which the UV or EB curable adhesive layer is formed in a predetermined pattern And an irradiation step of irradiating UV or EB to the UV or EB curable adhesive layer formed on the traveling support sheet, and a UV or EB curable adhesive layer irradiated with UV or EB from above. Non-contact type data comprising: a superimposing step for superposing and adhering materials; and a separation step for separating unnecessary portions other than the pattern portion adhered to the base material integrally with the carrier sheet. A method for manufacturing a conductive member for a carrier.   A printing process in which a UV or EB curable adhesive layer is printed in a predetermined pattern on a surface of a carrying sheet on which a conductive layer made of a metal foil is laminated, and punching in which the conductive layer of the carrying sheet is punched in the pattern. A step of irradiating UV or EB to the UV or EB curable adhesive layer printed on the traveling carrier sheet, and a UV or EB curable adhesive layer irradiated with UV or EB. A non-contact type comprising: a superimposing step of superposing and adhering the base material; and a separation step of separating unnecessary parts other than the pattern part adhered to the base material integrally with the carrying sheet. A method for manufacturing a conductive member for a data carrier.   32. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 30 or 31, wherein the carrier sheet is formed by sequentially laminating a release layer, a protective layer, and a conductive layer made of metal foil thereon. A method for manufacturing a non-contact data carrier conductive member.   33. The method of manufacturing a non-contact data carrier conductive member according to claim 32, wherein the protective layer is formed of an adhesive layer.   32. The method for manufacturing a non-contact type data carrier conductive member according to claim 31, wherein the printing step and the punching step are performed simultaneously.   32. The method of manufacturing a non-contact type data carrier conductive member according to claim 31, wherein the printing step is performed after the punching step.   36. The method of manufacturing a conductive member for a non-contact type data carrier according to any one of claims 31 to 35, wherein the printing step and the punching step are performed by a cylinder. For producing a conductive member.   36. The method of manufacturing a non-contact type data carrier conductive member according to any one of claims 30 to 35, wherein the punching step is performed by a flat plate. Production method.   Punching by punching the conductive layer of the carrier sheet in the pattern while running the carrier sheet on which a conductive layer made of metal foil is laminated and the UV or EB curable adhesive layer is formed in a predetermined pattern on the surface A step of removing only unnecessary portions from the support sheet; an irradiation step of irradiating the UV or EB curable adhesive layer of the pattern portion remaining on the support sheet with UV or EB; Or a superimposing step of superposing and adhering the base material on the UV or EB curable adhesive layer irradiated with EB, and a method for producing a non-contact type data carrier conductive member.   A printing process in which a UV or EB curable adhesive layer is printed in a predetermined pattern on a surface of a carrying sheet on which a conductive layer made of a metal foil is run, and the carrying sheet is run while the carrying sheet is moved. A punching step of punching the conductive layer in the pattern, a removing step of removing only unnecessary portions from the support sheet, and a UV or EB for the UV or EB curable adhesive layer of the pattern portion remaining on the support sheet. Non-contact type data comprising an irradiation step of irradiating and a superposition step of superposing and adhering a base material on a UV or EB curable adhesive layer irradiated with UV or EB A method for manufacturing a conductive member for a carrier.   40. The method of manufacturing a conductive member for a non-contact type data carrier according to any one of claims 30 to 39, wherein the superposed body of the conductive layer and the carrying sheet is pressed through a cushion material in a punching process. A method for manufacturing a non-contact data carrier conductive member.   The method for manufacturing a conductive member for a non-contact type data carrier according to any one of claims 30 to 40, wherein a hot pressing step of pressing the superposed body of the conductive layer and the substrate after the separation step is performed. Furthermore, the manufacturing method of the electrically-conductive member for non-contact-type data carriers characterized by the above-mentioned.   A punching means for punching out the conductive layer of the carrier sheet having a predetermined pattern on which a conductive layer made of metal foil is laminated and having a UV or EB curable adhesive layer formed on the surface thereof, and the carrier sheet traveling An irradiation means for irradiating UV or EB to the UV or EB curable adhesive layer formed thereon, and a base material are overlapped and bonded onto the UV or EB curable adhesive layer irradiated with UV or EB. An apparatus for manufacturing a conductive member for a non-contact type data carrier, comprising: a superimposing unit; and a separating unit for separating an unnecessary portion other than the pattern portion adhered to the base material integrally with the carrier sheet. .   A printing means for laminating a conductive layer made of metal foil and printing a UV or EB curable adhesive layer on the surface thereof in a predetermined pattern; a punching means for punching out the conductive layer of the carrier sheet in the pattern; and the traveling An irradiation means for irradiating UV or EB to the UV or EB curable adhesive layer printed on the support sheet, and a substrate from above the UV or EB curable adhesive layer irradiated with UV or EB A non-contact type data carrier conductive member comprising: a superimposing unit for adhering; and a separating unit for separating an unnecessary portion other than the pattern unit adhered to the base material integrally with the carrier sheet. manufacturing device.   A punching means for punching out the conductive layer of the carrier sheet in which a conductive layer made of a metal foil is laminated and a UV or EB curable adhesive layer is formed in a predetermined pattern on the surface, and from above the carrier sheet Removal means for removing only unnecessary portions, irradiation means for irradiating the UV or EB curable adhesive layer of the pattern portion remaining on the carrier sheet with UV or EB, and UV or EB irradiated with UV or EB An apparatus for manufacturing a conductive member for a non-contact type data carrier, comprising: a superimposing unit that superimposes and adheres a base material on a curable adhesive layer.   Printing means for printing a UV or EB curable adhesive layer in a predetermined pattern on a surface of a carrying sheet on which a conductive layer made of metal foil is laminated, and punching for punching out the conductive layer of the carrying sheet in the pattern Removing means for removing only unnecessary portions from the support sheet, irradiation means for irradiating the UV or EB curable adhesive layer of the pattern portion remaining on the support sheet with UV or EB, and UV Or a superposing means for superposing and adhering the base material on the UV or EB curable adhesive layer irradiated with EB, and a non-contact data carrier conductive member manufacturing apparatus.   46. The non-contact type data carrier conductive member according to claim 43 or 45, wherein the cylinder is provided with the printing means and the punching means. manufacturing device.   47. The non-contact type data carrier conductive member manufacturing apparatus according to claim 42, wherein a flat plate is provided with the punching means. Manufacturing equipment for members.   48. The manufacturing apparatus for a non-contact data carrier conductive member according to claim 42, wherein the punching means includes a cushioning pressing body that presses the superposed body of the conductive layer and the carrying sheet. An apparatus for manufacturing a conductive member for a non-contact type data carrier.   49. The non-contact data carrier conductive member manufacturing apparatus according to any one of claims 42 to 48, wherein the superposed body of the conductive layer and the substrate after the unnecessary portion of the conductive layer is removed is heated. An apparatus for producing a non-contact type data carrier conductive member, comprising a heat press means for pressurizing while pressing.

Images