JP4637499B2 - Sheet wound with interposer and IC tag - Google Patents

Description

  The present invention relates to a roll of a sheet with an interposer and an IC tag used for an IC tag that can exchange data without contact with an external reader / writer.

  2. Description of the Related Art As a non-contact IC tag that exchanges data without contact with an external reader / writer, a tag that includes an antenna-formed sheet on which an antenna circuit having a pair of contacts is formed and an interposer is known. Among these, the antenna-formed sheet is composed of a base sheet and an antenna circuit provided on the base sheet, and the shape of the antenna circuit is an electromagnetic wave when data is transmitted and received between the IC tag and the reader / writer. Determined by the frequency.

  On the other hand, the interposer has a pair of enlarged electrodes and an IC chip having a pair of electrodes each connected to a different enlarged electrode. Depending on the frequency band of the electromagnetic wave used when transmitting / receiving data to / from the reader / writer, the pair of enlarged electrodes functions as an antenna, and has a pair of enlarged electrodes and an IC chip without being combined with the antenna-formed sheet. The interposer can be used as an IC tag as it is. The term interposer in the present application is a concept including such an IC tag.

  In such an interposer, a pair of conductors extending in the feeding direction is provided on a support sheet, and then an IC chip is continuously arranged between the pair of conductors to first produce a sheet with an interposer. It is obtained by cutting the attached sheet for each IC chip. The produced interposer is then fixed on the antenna-formed sheet by joining each enlarged electrode to a different contact of the antenna circuit.

  In this case, various types of IC tags can be obtained by preparing in advance a wound body of an interposer-attached sheet in which an interposer-attached sheet is wound around a winding core and inserting it into each line for mounting on an antenna-formed sheet having a different shape. Can be efficiently manufactured. On the other hand, when the sheet with an interposer is wound around a winding core or the like, the IC chip may be broken or chipped.

  Further, the interposer and the antenna-formed sheet are usually joined by caulking each enlarged electrode and the contact of the antenna circuit. The purpose of the caulking is to electrically connect each enlarged electrode and the contact of the antenna circuit. In this case, there is a problem that the bonding between the interposer and the antenna-formed sheet is local and the bonding strength is weak. In this case, a material having a low strength such as a foil is not sufficient for the expansion electrode, and it is necessary to form the expansion electrode from a material having a high strength such as an aluminum plate. On the other hand, it is cumbersome to apply an adhesive agent between the interposer and the antenna-formed sheet every time, which increases the manufacturing cost of the IC tag.

  Furthermore, in recent years, the need for separation and disposal has increased, and it has been required to separate and discard IC chips from IC tags. Therefore, if the interposer and the antenna-formed sheet can be firmly bonded, there arises a problem that the IC chip cannot be easily peeled off from the IC tag.

  The present invention has been made in consideration of the above-described problems, and is a sheet with an interposer in which a sheet with an interposer that can easily and firmly fix an interposer to an antenna-formed sheet in a subsequent process is wound around a winding core. An object of the present invention is to provide a wound body and an IC tag.

  It is another object of the present invention to provide a sheet with an interposer and an IC tag that can easily separate an IC chip from an IC tag when the IC tag is discarded.

  The present invention provides an interposer having a support sheet extending in a strip shape, a pair of conductors that are provided on the support sheet and that are separated from each other along the support sheet, and a plurality of IC chips provided on the conductors. A sheet of an interposer-attached sheet comprising a sheet with an interposer, wherein a non-conductive adhesive is applied to one surface of the sheet with an interposer, and the sheet with an interposer is wound around a winding core. .

  The present invention includes a support sheet extending in a strip shape, a plurality of pairs of conductors provided along the longitudinal direction of the support sheet, and a large number of IC chips provided on the conductors. A sheet of interposer-attached sheet, comprising a sheet with an interposer, wherein a non-conductive adhesive is applied to one surface of the sheet with interposer, and the sheet with interposer is wound around a winding core It is.

  The present invention provides a wound body of a sheet with an interposer, wherein a surface of the sheet with an interposer that is not coated with a non-conductive adhesive is subjected to a peeling treatment.

  The sheet with an interposer according to the present invention is a wound body of a sheet with an interposer, wherein release sheets extending in a strip shape are overlapped and wound around a winding core.

  The present invention is the wound body of a sheet with an interposer, wherein the non-conductive adhesive is a thermoplastic adhesive.

  The present invention is a wound body of a sheet with an interposer, wherein a convex portion is provided along the longitudinal direction of the sheet with an interposer.

  The present invention is a wound body of a sheet with an interposer, wherein the IC chip is protected by laminating a protective film on the sheet with an interposer, or by sealing the IC chip with a resin.

  The present invention is a wound body of a sheet with an interposer, wherein holes are provided at equal intervals along the longitudinal direction in the vicinity of the edge in the width direction perpendicular to the longitudinal direction of the sheet with an interposer.

  The present invention provides a wound body of a sheet with an interposer, wherein perforations extending in the longitudinal direction of the sheet with an interposer are provided in the vicinity of the IC chip.

  In the present invention, a non-conductive adhesive or an anisotropic conductive adhesive is applied between an IC chip and a conductor, and the IC chip and the conductor are electrically connected by thermocompression bonding or ultrasonic bonding. It is the roll of the sheet | seat with an interposer characterized by being joined to.

  The present invention includes an antenna-formed sheet composed of a base sheet and an antenna circuit provided on the base sheet, and a pair of antennas provided on the antenna-formed sheet. An interposer having an enlarged electrode and an IC chip provided on the enlarged electrode and connected to the enlarged electrode, the surface of the interposer facing the enlarged electrode facing the surface of the antenna-formed sheet on the antenna circuit side; And an antenna-formed sheet are fixed via a non-conductive adhesive.

  The present invention includes an antenna-formed sheet composed of a base sheet and an antenna circuit provided on the base sheet, and a pair of antennas provided on the antenna-formed sheet. An interposer having an enlarged electrode and an IC chip provided on the enlarged electrode and connected to the enlarged electrode, the surface of the interposer on the side of the enlarged electrode is the surface on the side where the antenna circuit of the antenna formed sheet is not provided The IC tag is characterized in that the interposer and the antenna-formed sheet are fixed via a non-conductive adhesive.

  The present invention includes an antenna-formed sheet composed of a base sheet and an antenna circuit provided on the base sheet, and a pair of antennas provided on the antenna-formed sheet. An interposer having an enlarged electrode and an IC chip provided on the enlarged electrode and connected to the enlarged electrode, the surface of the interposer on which the enlarged electrode is not provided is the surface on the antenna circuit side of the antenna-formed sheet The IC tag is characterized in that the interposer and the antenna-formed sheet are fixed via a non-conductive adhesive.

  The present invention includes an antenna-formed sheet composed of a base sheet and an antenna circuit provided on the base sheet, and a pair of antennas provided on the antenna-formed sheet. An interposer having an enlarged electrode and an IC chip provided on the enlarged electrode and connected to the enlarged electrode, and the antenna circuit of the sheet on which the enlarged electrode is not provided is provided on the side of the interposer where the enlarged electrode is not provided The IC tag is characterized in that the interposer and the antenna-formed sheet are fixed to each other with a non-conductive adhesive facing the non-side surface.

The present invention is an IC tag in which an enlarged electrode of an interposer is caulked to an antenna circuit and connected by ultrasonic bonding , thermocompression bonding, or welding .

  According to this invention, the sheet | seat with an interposer is wound up by the winding core in the state by which the adhesive agent was apply | coated. Therefore, various types of IC tags can be efficiently manufactured by using the wound body of the sheet with an interposer according to the present invention. In the manufactured IC tag, the interposer is firmly fixed to the antenna-formed sheet.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 to FIG. 10 are views showing an IC tag manufactured using a roll of a sheet with an interposer and a roll of a sheet with an interposer according to the present invention.

  Among these, FIG. 1 and FIG. 2 is a perspective view which shows the manufacturing method of one Embodiment of the winding body of the sheet | seat with an interposer by this invention, FIG. 3 is the sheet | seat with an interposer along the 3-3 line of FIG. FIG. 4 is a perspective view showing a modified example of a support sheet laminated with conductors, FIG. 5 is a perspective view showing an antenna-formed sheet of an IC tag, and FIGS. 6 to 9 are ICs. FIG. 10 is a cross-sectional view showing a tag, and FIG. 10 is a perspective view showing a modification of the antenna-formed sheet of the IC tag.

[Wound of sheet with interposer]
First, the wound body 1 of a sheet with an interposer will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the wound body 1 of the sheet with an interposer according to the present embodiment is obtained by winding a laminated body 4 in which a sheet 2 with an interposer and a release paper 23 extending in a strip shape are stacked on a winding core 1 a. Is.

  Of these, the interposer-attached sheet 2 is provided on the support sheet 10 that extends in a belt shape, the pair of conductors 12 that extend along the support sheet 10 and are spaced apart from each other, and the conductor 12. And a large number of IC chips 15 (FIG. 1). The support sheet 10 is made of non-conductive paper, PET, or the like, and the conductor 12 is made of conductive foil such as aluminum or copper having conductivity or conductive ink.

  An anisotropic conductive adhesive 18 is applied between the IC chip 15 and the conductor 12, and the IC chip 15 is fixed on the conductor 12 via the anisotropic conductive adhesive 18. Yes. The IC chip 15 has a pair of electrodes 15a, 15a with sharp tips. As shown in FIG. 3, the electrode 15a is pierced into the conductor 12, and the electrode 15a of the IC chip 15 and the conductor 12 are electrically joined.

  The anisotropic conductive adhesive is made of a nonconductive thermosetting resin containing conductive particles such as nickel and silver. Therefore, even if the anisotropic conductive adhesive is applied so as to straddle the pair of conductors, the pair of conductors 12 do not conduct with each other.

  It is also possible to use an IC chip 15 having a flat electrode 15a. In this case, the electrode 15a of the IC chip 15 and the conductor 12 are electrically bonded to each other through conductive particles by thermocompression bonding. can do. In addition, a non-conductive adhesive can be used instead of the anisotropic conductive adhesive 18, and in this case, the electrode 15a of the IC chip 15 and the conductor 12 are electrically bonded by ultrasonic bonding. be able to.

  In the present embodiment, the protective film 21 is laminated on the IC chip 15 and a part of the conductor 22 via an adhesive. Lamination of the protective film 21 prevents the IC chip 15 from being chipped or displaced on the conductor 12 (enlarged electrode 13) when used as an interposer or when a sheet with an interposer is wound up. Therefore, the protection process for the IC chip 15 is performed. In the present embodiment, an example is shown in which the protective film 21 covers the IC chip 20 and part of the conductor 22 (FIG. 3), but is not limited thereto. The protective film 21 may cover only the IC chip 15 or may cover the IC chip 15 and the entire conductor 12. Furthermore, the protection process of the IC chip 20 may be performed by replacing the protective film 21 on the IC chip 15 and sealing the IC chip 15 with a resin. Such protection processing is not indispensable, and the protection processing may be omitted.

  A nonconductive adhesive 25 is applied to the upper surface of the sheet with interposer 2 (the surface on which the conductor 12 is provided) to form a nonconductive adhesive layer. The release paper 23 described above is laminated on the sheet 2 with an interposer so as to cover the adhesive layer. Therefore, the interposer-attached sheet 2 can be prevented from adhering to each other by the non-conductive adhesive 25 in the interposer-wrapped sheet 1, and the interposer-attached sheet 1 can be easily removed. Can be paid out.

  In addition, it can replace with lamination | stacking of the release paper 23, and the same effect can be acquired also by carrying out the peeling process of the side by which the nonelectroconductive adhesive 25 of the sheet | seat 2 with an interposer is not apply | coated. Moreover, in this case, when the sheet | seat 2 with an interposer is drawn out from the wound body 1 of the sheet | seat with an interposer, it is preferable at the point which a waste does not produce.

  In addition, a thermoplastic adhesive may be used as the nonconductive adhesive 25. Since the thermoplastic adhesive is not sticky at room temperature, the release paper 23 can be dispensed with when the sheet 2 with the interposer is wound up.

  As shown in FIG. 2, the sheet 2 with an interposer is cut into each IC chip by a punching device 71 in accordance with the shape of the interposer 6. This cut 35 has a shape corresponding to the outer shape of the interposer 6 elongated in the width direction orthogonal to the longitudinal direction of the sheet 2 with interposer (the direction of the thick arrow in FIGS. 1 and 2, also referred to as the feeding direction). For example, the cut 35 according to the present embodiment has a rectangular outer peripheral shape. As shown in FIG. 3, the notch 35 is formed from the interposer-attached sheet 2 side of the laminate 4 of the interposer-attached sheet 2 and the release paper 23. This cut 35 is a so-called half cut, and the support sheet 10 and the conductor 12 are divided, but the release paper 23 is not divided. For this reason, from the laminated body 4 of the sheet 2 with the interposer and the release paper 23 fed out from the wound body 1 of the sheet with the interposer, a pair of enlarged electrodes 13 supported by the support sheet 10 and formed from the conductor 12, The interposer 6 having the IC chip 15 connected to the enlarged electrode 13 can be easily removed. Further, the peeled interposer 6 has an adhesive layer made of a non-conductive adhesive 25 formed on the surface on which the conductor is provided. For this reason, the IC tag can be produced by directly attaching the interposer 6 to a desired place so that the surface on the support sheet 10 side is exposed.

  In addition, the manufacturing method of the IC tag 5 and the IC tag 5 using the interposer 6 obtained from the wound body 1 of the sheet with an interposer according to the present invention will be described later.

  Further, depending on the frequency band of the electromagnetic wave used when transmitting / receiving data to / from the reader / writer, the pair of enlarged electrodes 13 function as an antenna, and the interposer 6 having the pair of enlarged electrodes 13 and the IC chip 15 is formed as an antenna. The IC tag 5 can be used without being combined with the sheet 7. The term interposer 6 in the present application is a concept including such an IC tag 5.

  The laminate 4 of the sheet 2 with the interposer and the release paper 23 is embossed in the vicinity of both edges in the width direction perpendicular to the longitudinal direction and outside the notch 35, along the longitudinal direction. A convex portion 33 is formed. Embossing is performed from the surface of the sheet 2 with the interposer where the IC chip 15 is not provided (FIG. 2), and the convex portion 33 protrudes from the surface of the sheet 2 with the interposer on the side of the IC chip 33 (FIG. 2). 3). Further, as shown in FIG. 3, the thickness H1 of the laminate 4 in the convex portion 33 is equal to or greater than the thickness H2 of the laminate in the portion where the IC chip 15 is disposed. In the present embodiment, as shown in FIG. 2, the shape of the convex portion 33 is circular in a top view, but is not limited to this, and may be linear or other shapes.

  The interposer-attached sheet 2 is provided with a large number of through-holes 31 along the longitudinal direction in the vicinity of both edges in the width direction perpendicular to the longitudinal direction and outside the convex portion 33 (FIG. 3). ). This through-hole 31 is used for accurately conveying and positioning the interposer-attached sheet 2 when the interposer-attached sheet roll 1 is manufactured and when the interposer 6 is produced from the interposer-attached sheet roll 1. Used.

  Further, as shown in FIGS. 2 and 3, perforations 37 extending in the longitudinal direction are formed in the sheet 2 with an interposer. As shown in FIG. 3, the perforations 37 are arranged in the vicinity of the IC chip 15 and on both outer sides in the width direction of the IC chip 15. Therefore, the interposer 6 obtained from the wound body 1 of the sheet with an interposer according to the present embodiment can be easily divided into three portions along the perforation 37. Thereby, the part of the IC chip 15 can be easily separated from the interposer 6 or the IC tag produced using the interposer 6, which is very preferable from the viewpoint of separation and disposal.

  Next, the manufacturing method of the wound body 1 of a sheet with an interposer described above will be described in more detail with reference to FIGS.

  1 and 2 are perspective views showing the method of manufacturing the interposer-wrapped sheet 1 as described above, and the process proceeds from the left side to the right side of FIG. 1, and then the process is performed from the left side to the right side of FIG. Go ahead.

  As shown in FIG. 1, the support sheet 10 extending in a belt shape is first supplied and sent to the roller 51, and the conductor 12 extending in a belt shape along the support sheet 10 is supplied and sent to the roller 51. During this time, a pressure bonding type adhesive (not shown) is applied between the support sheet 10 and the conductor 12. Thereafter, the support sheet 10 and the conductor 12 are pressure-bonded by the roller 51, whereby the support sheet 10 and the conductor 12 are bonded and fixed to each other, and the conductor 12 is laminated on the support sheet 10.

  Next, the support sheet 10 and the conductor 12 are formed with the through hole 31 along the longitudinal direction by the punching device 54. As shown in FIG. 1, the through hole 31 is provided in the vicinity of the edge in the width direction of the laminated body of the support sheet 10 and the conductor 12. As shown in FIGS. 1 and 2, in the subsequent steps, the support sheet 10 is accurately conveyed without slipping on the roller 52 by the roller 52 having the positioning pin 52 a that engages with the through hole 31. . The movement in the width direction during the manufacturing process is restricted by the engagement between the through hole 31 and the positioning pin 52a, and the positioning in the feed direction is performed with the through hole 31 as a reference. For this reason, the roll 1 of a sheet with an interposer can be manufactured with high accuracy.

  In the present embodiment, as shown in FIG. 1, the width of the conductor 12 and the width of the support sheet 10 are the same, and the through hole 31 is formed to penetrate both of them. However, the present invention is not limited to this, and the widths of the two may be different. In this case, the through hole 31 may penetrate only the wider one.

  Then, the conductor 12 is cut | disconnected by the cutter 57 at the center of the width direction along a feed direction, and the conductor 12 is divided into a pair. In this case, the conductor 12 is cut so that the width of the gap between the pair of conductors 12 is smaller than the width between the electrodes 15 a of the IC chip 15. As shown in FIGS. 1 and 3, the cutting by the cutter 57 is a so-called half cut, and the entire thickness of the laminate of the conductor 12 and the support sheet 10 is not cut, but only the conductor 12 is divided. The support sheet 10 is not divided.

  Next, as shown in FIG. 1, the anisotropic conductive adhesive 18 is applied by a dispenser 59 or a screen printer so as to straddle the pair of conductors 12. Thereafter, as shown in FIG. 1, IC chips 15 having a pair of electrodes 15 a are sequentially mounted on the portion where the anisotropic conductive adhesive 18 is applied. In this case, the IC chip 15 is positioned on the conductor 12 after the electrodes 15 a are positioned so as to face different conductors 12.

  Thereafter, the IC chip 15 disposed on the conductor 12 is heated by a thermocompression bonding machine and pressed toward the conductor 12. At this time, when the IC chip 15 is pushed into the conductor 12, the electrode 15 a having a sharp tip of the IC chip 15 is pierced into contact with the conductor 12. Further, the anisotropic conductive adhesive is solidified by heating. As a result, the IC chip 15 is more firmly fixed on the conductor 12, and an electrical connection between each electrode 15a of the IC chip 15 and each conductor 12 can be reliably obtained.

  Still further, the IC chip 15 and the conductor-formed sheet 6 may be ultrasonically bonded by applying ultrasonic vibration. In this case, the adhesive layer is melted or broken, and the electrode 15a of the IC chip 15 and the conductor 12 are metal-bonded, and the IC chip 15 is securely fixed on the conductor 12, and each electrode 15a and each conductor An electrical connection with the body 12 can be reliably obtained.

  In this way, the support sheet 10 extending in a strip shape, the pair of conductors 12 provided on the support sheet 10, extending along the support sheet 10 and spaced apart from each other, and a number of conductors 12 provided on the conductor 12 The interposer-attached sheet 2 having the IC chip 15 is produced.

  Thereafter, according to the present embodiment, as shown in FIG. 1, the protective film 21 is laminated on the IC chip 15 and a part of the conductor 12. The protective film 21 has a so-called tape shape, and an adhesive layer is formed on the side facing the IC chip 15, and the protective film 21 is fixed to the sheet 2 with an interposer through this adhesive layer. In addition, such a protective film 21 is not indispensable, and the protective film 21 may not be provided on the sheet 2 with an interposer as described later.

  Next, as shown in FIG. 2, the non-conductive adhesive 25 is applied on the conductor 12 and the protective film 21 (shaded area in FIG. 2) by a screen printer 65 or a dispenser. In the present embodiment, the non-conductive adhesive 25 is applied on a portion excluding the vicinity of both edges of the conductor 12 and on the protective film 21.

  Thereafter, a disk cutter 68 that is rotatable and has a cutting edge on the outer peripheral portion is pressed against both side portions of the IC chip, thereby cutting the protective film 21, the conductor 12, and the support sheet 10 along the longitudinal direction. A perforation 37 is formed.

  Next, the release paper 23 is laminated on the surface of the interposer-attached sheet 2 to which the nonconductive adhesive 25 is applied. Thereafter, as described above, the punching device 71 sequentially forms the cuts 35 in the support sheet 10, the conductor 12, and the protective film 21 for each IC chip 15. Thereby, the interposer 6 having a pair of enlarged electrodes 13 formed from the conductor 12 and supported by the support sheet 10 and the IC chip 15 connected to the enlarged electrodes 13 is a piece of release paper 23 extending in a band shape. Are formed along the longitudinal direction in a state where they are adhered to each other.

  Next, the embossing machine 74 sequentially forms convex portions 33 along the longitudinal direction in the vicinity of the edge in the width direction of the sheet 2 with the interposer and inward of the through hole 31. In this case, the convex portion 33 is also formed on the release paper 23 laminated on the sheet with interposer 2. Then, it is wound up by the winding core 1a and the wound body 1 of a sheet | seat with an interposer is obtained.

  As described above, according to the present embodiment, since the non-conductive adhesive 25 is applied over a wide range to the interposer 6 obtained from the wound body 1 of the sheet with interposer, the interposer 6 is placed at a desired location. It can be firmly fixed. In addition, in the manufacture of the IC tag 5, it is more efficient to continuously apply the adhesive to the sheet-like sheet 2 with an interposer than to apply the adhesive to the individual interposers 6. Thereby, the final manufacturing cost of the IC tag 5 can be reduced.

  Moreover, since the sheet 2 with the interposer coated with the non-conductive adhesive 25 is wound around the winding core 1a together with the release paper 23, the sheet 2 with the interposer can be easily fed out from the wound body 1 of the sheet with the interposer. Can do.

  Furthermore, the convex part 33 is formed in the width direction vicinity of the sheet | seat 2 with an interposer by the embossing machine 74 along a longitudinal direction. The thickness H1 of the interposer-attached sheet 2 in the convex portion 33 is equal to or greater than the thickness H2 of the interposer-attached sheet 2 in which the IC chip 15 is disposed. Therefore, the sheet 2 with the interposer is wound around the winding core 1a so that the convex portions 33 overlap. For this reason, the stress applied to the IC chip 15 in the wound body 1 of the sheet with interposer can be reduced, and the IC chip 15 can be prevented from being damaged. Moreover, the winding form of the wound body 1 of the sheet with an interposer is stabilized, and rewinding can be prevented.

  Furthermore, a large number of through holes 31 are formed in the vicinity of both edges in the width direction of the sheet 2 with interposer along the longitudinal direction. By positioning the laminated body of the support sheet 10 and the conductors 12 through the through holes 31, a sheet with an interposer can be manufactured with high accuracy.

  Further, a perforation 37 extending in the longitudinal direction is formed in the vicinity of the IC chip and on both outer sides in the width direction. By dividing the interposer 6 obtained from the wound body 1 of the sheet with the interposer along the perforation 37, the IC chip 15 can be removed from the interposer 6, and the IC chip 15 can be easily separated and discarded.

  In addition, the interposer-attached sheet 2 fed out from the wound body 1 of the interposer-attached sheet is provided with a cut 35 that divides the support sheet 10, the conductor 12, and the protective film 21 along the shape of the interposer 6. Therefore, the interposer 6 is only held on the release paper 23 via the non-conductive adhesive 23, and the interposer 6 can be easily obtained from the wound body 1 of the sheet with the interposer. As described above, since the adhesive layer made of the non-conductive adhesive 25 is formed on the enlarged electrode 13 of the obtained interposer 6, the interposer 6 can be placed in a desired place without applying an adhesive again. It can be attached like a so-called seal.

  In the present embodiment, an example is shown in which the nonconductive adhesive 25 is applied on a portion other than the vicinity of both edges of the conductor 12 and on the protective film 21 (that is, on the hatched portion in FIG. 2). However, the application range is not limited to this, and the application range can be changed according to the method of using the interposer 6 obtained from the wound body 1 of the sheet with interposer.

  Moreover, in this Embodiment, although the example which apply | coats the nonelectroconductive adhesive 25 to the surface by which the conductor 12 of the sheet | seat 2 with an interposer was provided was shown, it is not restricted to this. As will be described later, according to the method of using the interposer 6, the non-conductive adhesive 25 includes a surface on the side where the conductor 12 of the sheet 2 with the interposer is provided, and a surface on the side where the conductor 12 is not provided. What is necessary is just to be apply | coated to the surface of either. When the non-conductive adhesive 25 is applied to the surface of the sheet with interposer 2 where the conductor 12 is not provided, the release paper 23 is the side of the sheet with interposer 2 where the conductor 12 is not provided. It is wound around the winding core 1a so as to overlap (on the side where the non-conductive adhesive 25 is applied).

  Furthermore, in the present embodiment, the pair of conductors 12 that are provided on the support sheet 10 extending in a strip shape and that extend along the support sheet 10 and are separated from each other are illustrated, but the conductors 12 are not limited thereto. . As shown in FIG. 4, a large number of pairs of conductors 12 may be provided on the support sheet 10 extending in a band shape, spaced apart in the width direction and arranged along the longitudinal direction of the support sheet 10. Such a conductor 12 can be formed on the support sheet 10 by etching, printing with conductive ink, or transfer of a foil. You may manufacture the roll 1 of a sheet | seat with an interposer by the method mentioned above using the support sheet 10 in which such the conductor 12 was provided.

[IC tag]
Next, the IC tag 5 manufactured from the interposer 6 obtained from the above-described sheet 1 with an interposer and the antenna-formed sheets 7 and 44 will be described in detail.

  First, the antenna-formed sheet 7 will be described with reference to FIG.

  The antenna-formed sheet 7 includes a base sheet 41 and an antenna circuit 42. Among these, as shown in FIG. 5, for example, the antenna circuit 42 is formed of a spiral circuit portion 42b and a pair of contacts 42a formed from both ends of the circuit portion 42b. Such an antenna-formed sheet 7 is produced, for example, by etching the antenna circuit 42 on the base sheet 41, transferring the foil, or printing it with a printing machine. The base sheet 41 is made of non-conductive paper, PET, or the like, and the antenna circuit 42 is made of conductive foil or conductive ink such as conductive aluminum or copper.

  The IC tag 5 is obtained by arranging the above-described interposer 6 on the antenna-formed sheet 7 and connecting each enlarged electrode 13 of the interposer 6 to a different contact 42 a of the antenna circuit 42.

  By using the interposer 6 obtained from the above-described wound body 1 of the sheet with an interposer, different types of IC tags 5 can be easily produced.

  When the non-conductive adhesive 25 is applied to the surface of the interposer 6 on the enlarged electrode 13 (conductor 12) side, the surface of the interposer 6 on the enlarged electrode 13 (conductor 12) side is the antenna-formed sheet. 7 is preferably arranged so as to face the surface of the antenna circuit 42 side (FIG. 6), or to face the surface of the antenna-formed sheet 7 where the antenna circuit 42 is not provided (FIG. 7). In either case, the interposer 6 and the antenna-formed sheet 7 are firmly bonded via the non-conductive adhesive 25 applied in advance to the interposer 6. Further, the IC chip 15 is disposed between the support sheet 10 and the base sheet 20. Therefore, without providing the protective film 21 as shown in FIGS. 6 and 7, it is possible to prevent the IC chip 15 from being chipped or displaced during use of the IC tag 5.

  When the surface of the interposer 6 on the side of the enlarged electrode 13 faces the surface of the antenna-formed sheet 7 on the side of the antenna circuit 42 (FIG. 6), the conductive enlarged electrode 13 and the antenna circuit 22 are arranged. You will face each other. However, since the non-conductive adhesive 25 is disposed between the enlarged electrode 13 and the antenna circuit 22, the antenna circuit 22 is insulated from the enlarged electrode 13 and is not electrically connected. Thereby, it is possible to prevent the antenna circuit 22 from being short-circuited by the enlarged electrode 13.

  On the other hand, when the non-conductive adhesive 25 is applied to the surface of the interposer 6 where the enlarged electrode 13 (conductor 12) is not provided, the side of the interposer 6 where the enlarged electrode 13 is not provided. The surface faces the antenna circuit 42 side surface of the antenna-formed sheet 7 (FIG. 8), or faces the surface of the antenna-formed sheet 7 where the antenna circuit 42 is not provided (FIG. 9). It is preferable to arrange. In either case, the interposer 6 and the antenna-formed sheet 7 are firmly bonded via the non-conductive adhesive 25 applied in advance to the interposer 6. Further, the surface of the interposer 6 facing the antenna-formed sheet 7 is flat because the IC chip 15 is not disposed, and the joint between the interposer 6 and the antenna-formed sheet 7 is further strengthened.

The enlarged electrode 13 of the interposer 6 and the contact 42a of the antenna circuit 42 arranged as described above are joined by caulking, ultrasonic joining, thermocompression bonding, or welding . Thereby, the adhesive layer made of the support sheet 10, the base sheet 41, or the nonconductive adhesive 25 disposed between the enlarged electrode 13 of the interposer 6 and the contact 42 a of the antenna circuit 42 is torn or melted. Thus, the enlarged electrode 13 of the interposer 6 and the contact 42a of the antenna circuit 42 are reliably electrically joined.

In the case where the non-conductive adhesive 25 is made of a thermoplastic adhesive as described above, the interposer 6 and the antenna circuit formed sheet 7 are joined by first melting the adhesive by heating, and then the interposer 6. The enlarged electrode 13 and the contact 42a of the antenna circuit 42 are joined by caulking, ultrasonic joining, thermocompression bonding, or welding . Thereby, the interposer 6 and the antenna circuit formed sheet 7 are firmly fixed, and the enlarged electrode 13 of the interposer 6 and the contact 42a of the antenna circuit 42 are reliably electrically joined.

  In this way, the antenna-formed sheet 7 including the base sheet 41 and the antenna circuit 42 provided on the base sheet 41, the antenna-formed sheet 7, the support sheet 10, and the support sheet 10 An IC tag 5 having a pair of enlarged electrodes 13 provided on top and an interposer 6 having an IC chip 15 provided on the enlarged electrodes 13 and connected to the enlarged electrodes 13 is obtained.

  As described above, according to the IC tag 5 according to the present embodiment, the interposer 6 is joined to the antenna-formed sheet 7 through the most part of one surface of the interposer 6 by the non-conductive adhesive 25. . Therefore, the interposer 6 and the antenna-formed sheet 7 are firmly fixed, and the interposer 6 can be prevented from being peeled off from the antenna-formed sheet 7 during use of the IC tag 5.

  Further, perforations 37 are formed in the vicinity of the IC chip 15 of the interposer 6 and on both outer sides in the width direction. By dividing the interposer 6 along the perforation 37, the IC chip 15 can be easily separated from the interposer 6, so that when the IC tag 5 is discarded, the IC chip 15 can be easily separated from the IC tag 5. Can be disposed of separately.

  As in the case of the sheet 2 with the interposer, the non-conductive adhesive 25 need not be applied to the entire surface of either one of the interposers 6. A portion corresponding to the IC chip 15, that is, a portion disposed between the IC chip 15 and the antenna-formed sheet 7 and facing the antenna-formed sheet 7 (in this embodiment, the portion of the support sheet 10 or the protective film 21) Alternatively, the non-conductive adhesive may not be applied to the surface portion of the IC chip 15 facing the antenna-formed sheet 7. In this case, since the portion including the IC chip 15 cut along the perforation 37 is not fixed to the antenna-formed sheet 7, the IC chip 15 can be more easily discarded.

  However, when the surface of the interposer 6 on the side of the enlarged electrode 13 is disposed so as to face the surface of the antenna formed sheet 7 on the side of the antenna circuit 42 (FIG. 6), at least the surface of the antenna formed sheet 7 faces. It is necessary to apply the nonconductive adhesive 25 to the surface portion of the enlarged electrode 13 (conductor 12) itself. This is because the antenna circuit 42 is prevented from being short-circuited by the enlarged electrode 13 as described above.

  Furthermore, the shape of the antenna circuit 42 of the antenna-formed sheet 7 is determined by the frequency of electromagnetic waves when data is transmitted and received between the IC tag 5 and the reader / writer. Therefore, the antenna circuit 42 is not limited to the above-described spiral shape, and may be formed of, for example, a pair of rod-shaped antenna circuits 45 as shown in FIG. Even when such an antenna-formed sheet 7 is used, the IC tag 5 can be manufactured by the method described above.

The perspective view which shows the manufacturing method of one Embodiment of the roll body of a sheet | seat with an interposer by this invention. The perspective view which shows the manufacturing method of one Embodiment of the roll body of a sheet | seat with an interposer by this invention. FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. 2. The perspective view which shows the modification of the support sheet laminated | stacked on the conductor. The perspective view which shows the antenna-formed sheet | seat of an IC tag. Sectional drawing which shows the manufacturing method of one Embodiment of the IC tag by this invention. Sectional drawing which shows the manufacturing method of the modification of an IC tag. Sectional drawing which shows the manufacturing method of the modification of an IC tag. Sectional drawing which shows the manufacturing method of the modification of an IC tag. The perspective view which shows the modification of the antenna-formed sheet | seat of an IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Winding body 1a sheet | seat with an interposer Winding core 2 Sheet | seat with an interposer 5 IC tag 6 Interposer 7 Antenna formed sheet 10 Support sheet 12 Conductor 13 Enlarged electrode 15 IC chip 15a Electrode 18 Anisotropic conductive adhesive 21 Protective film 23 Release paper 25 Non-conductive adhesive 31 Through hole 33 Convex part 35 Notch 37 Perforation 41 Base sheet 42 Antenna circuit 42a Circuit part 42b Contact 45 Antenna

Claims (3)

A support sheet extending in a strip shape, a pair of conductors provided on the support sheet and extending along the support sheet and spaced apart from each other, or a plurality of conductors disposed along the longitudinal direction of the support sheet, and a conductor A plurality of IC chips provided on the sheet, and a sheet with an interposer including a plurality of interposers,
An adhesive layer formed on one surface of the sheet with an interposer and having adhesiveness made of a non-conductive adhesive;
A release sheet extending in a strip shape superimposed on a sheet with an interposer via an adhesive layer, and being wound around a winding core as a laminate including the sheet with an interposer and the release paper,
A notch that does not pass through the laminate including the sheet with the interposer and the release paper, and the notch that extends from the side of the laminate with the interposer through the sheet with the interposer to the release paper forms each interposer. A wound body of a sheet with an interposer, which is formed along the outer shape of the region to be.   2. The interposer according to claim 1, wherein a convex portion is provided along a longitudinal direction of the sheet with the interposer at a position outward in the width direction from a region where the interposer of the sheet with the interposer is formed. A roll of attached sheets.   The sheet with an interposer is formed with perforations for cutting extending in the longitudinal direction of the sheet with an interposer in the vicinity of the IC chip and on both outer sides in the width direction of the IC chip. The roll of the sheet | seat with an interposer as described in 1 or 2.

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