JPH11208168A - Certification-identification card, and case for certification-identification card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a card from being damaged under environmental conditions at the times of manufacture and usage by a method wherein at a specified location between two base plates which are confronted with each other, a part containing an IC chip is placed, and a resin is filled, and on eitherone of the two base plates, a radiation means is provided. SOLUTION: On the opposite side (the internal side of an IC card) from a face having a writing property of a writing sheet 1, a metal layer 8 is provided, and also, an IC chip 2 and a coil-shaped antenna 3 are enclosed in a base plate resin 7 while preventing them from coming into contact with the metal layer 8, and they are electrically insulated. Also, in the vicinity of the external surface of the sheet, a material of a favorable heat conductivity such as a metal is mixed in so that the writing sheet 1 or an image receiving sheet 6 itself may have a radiation means. Thus, by the metal layer 8, heat which is applied to the IC card is unified, and the IC chip 2, and the connected part between the IC chip 2 and the coil-shaped antenna 3 can be prevented from becoming a high temperature. Also, by the radiation means, the card is prevented from accumulating heat, and at the same time, pressure and impact are softened, and the card can be prevented from being damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an identification card for use in a driver's license, an employee's card, a membership card, an alien registration card, a student's card, etc., using a non-contact type IC card.

[0002]

2. Description of the Related Art A non-contact type IC card is capable of forming an authentication identification image such as a face image and printing on the surface because electric parts are not exposed on the surface. By storing personal identification information and the like, it is advantageous to prevent forgery and falsification, and is suitable for use as an authentication identification card (hereinafter, also referred to as an ID card).

FIG. 1 shows an example of a non-contact type IC card having a cross section in the long side direction, which is manufactured by injection molding.

In FIG. 1, an IC chip 2 and a coiled antenna 3 are adhered to an underside of a writing sheet 1 having a writable surface directly or via a cushion layer with an adhesive 5 together with a joint 4 (adhesion). The whole enclosed with the agent 5 is also called an IC module). Reference numeral 6 denotes an image receiving sheet having an image receiving layer on its outer surface, and the substrate resin 7 between the writing sheet and the image receiving sheet is filled by injection. In addition, as a method of manufacturing a non-contact type IC card, a heat bonding method, an adhesive bonding method, or the like is adopted.

[0005]

By the way, ID cards such as driver's licenses are severe, for example, when left in a car in summer, when the owner is seated in a pocket or accidentally dropped. It remains exposed to conditions such as temperature (eg, 90 ° C. or higher), pressure, deformation, impact, and the like.
In particular, in the case of a card incorporating an IC chip as described above, such a severe condition may cause the card to bend, resulting in an accident such as the joint being detached or the IC being broken due to other causes. It may lead to reliability problems.

[0006] In addition, in order to mount an authentication identification image such as a face photograph on an IC card for use in an ID card, the smoothness of the surface on which the image is formed is required. Is often applied, which also leads to breakage of the IC and detachment of the junction, which causes a decrease in the manufacturing yield.

The present invention has been made in view of the above circumstances, and an object of the present invention is to prevent an ID card having a built-in IC chip from being damaged under environmental conditions during manufacture and use as much as possible.
Another object of the present invention is to prevent a damaged card from being used.

[0008]

SUMMARY OF THE INVENTION The object of the present invention is to dispose a component including an IC chip at a predetermined position between two opposing substrates, and to fill with a resin. Either one has an authentication identification card having a heat radiating means, the other of the two substrates has a heat insulating means, and a component including an IC chip is placed at a predetermined position between two opposing substrates and is filled with resin. An identification card having a coefficient of thermal expansion at a joint between the components substantially equal to a coefficient of thermal expansion around the joint; a component including an IC chip at a predetermined position between two opposing substrates; Is mounted and filled with resin.
This is achieved by an authentication / identification card having a means for indicating chip breakage, and an authentication / identification card case having heat dissipation means.

That is, the present inventor thought to prevent heat storage in the card, and to prevent curling caused by a difference in expansion coefficient to suppress detachment of a joint portion and breakage of an IC. The inventors came up with the idea of means that are not used.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to embodiments, but embodiments of the present invention are not limited thereto.

FIG. 2 shows a writing sheet having heat radiating means.
Shows the C card.

The IC card shown in FIG. 2A is located on the side opposite to the writable surface of the writing sheet (inside the IC card).
For example, a metal layer 8 of copper, aluminum, phosphor bronze, nickel, or the like is provided with a thickness of 3 to 20 μm, and the IC chip and the coiled antenna are sealed in a substrate resin so as not to contact the metal layer to be electrically insulated. Things. The heat applied to the IC card is made uniform by this metal layer, so that the temperature of the IC chip or the junction between the chip and the antenna can be prevented from becoming high. The surface of the metal sheet may be coated with resin 9 in advance so that the IC chip and the antenna do not directly contact the metal layer (see FIG. 2B), and a module such as an IC chip may be mounted thereon.

The metal layer can be inserted in the form of a metal sheet, and the end of the sheet is exposed to the outside of the card to enhance the heat dissipation effect, or the sheet can be wound around the outer surface of the card. The surface of the card may also contribute to heat radiation by being rotated or combined with ink having good thermal conductivity. Further, the heat radiation performance may be enhanced by forming a corrugation in the metal layer.

At least one side of the card surface must be arranged so as not to be shielded by a heat radiating member made of a metal layer so that the antenna does not hinder reception of radio waves from an external reader / writer and reception of induced power. is there. On the other hand, this metal layer can be appropriately used as a shield.

For example, in a form in which the information of the IC chip is read in a non-contact manner, in order to prevent the information from being read from anywhere and from any distance from the security surface, only the electromagnetic waves from a specific direction in the card are protected. In order to make the antenna responsive, in addition to the directivity by devising the shape of the antenna, the shield metal layer is formed to have an opening as shown at 82 in FIG. A secondary function such as reading from point A in the drawing but not from point B can be provided.

If a metal layer is arranged on the side opposite to the surface on which the authentication identification image is mounted (in this case, the writing sheet side), directivity can be given to the receiving direction as a card, and interception from an unusual direction can be achieved. This is preferable in terms of security because it is not performed. In this case, even as a reader / writer of the IC card,
The transmission / reception unit can be provided on the same member as the sensor that optically reads the face photograph and bibliographic information on the card, and it can be kept in non-contact with the side of the card that has the face image side, so that the image stains and damage on the card Can be prevented.

Incidentally, the metal layers 81 and 82 may be thermally connected to enhance the heat radiation effect. The low-temperature metal layer receives and radiates heat from the high-temperature metal layer.

The writable layer having writability is formed by coating an inorganic fine powder of calcium carbonate, talc, diatomaceous earth, titanium oxide, barium sulfate or the like with a thermoplastic resin (polyolefins such as polyethylene, or various copolymers). Etc.) to form a film. The image receiving layer of the image receiving sheet can be formed of a polymer material such as a polyvinyl chloride resin, a polyester resin, a polyvinyl acetal resin, a polyvinyl butyral resin, an epoxy resin, and an acrylic resin.

A material having good heat conductivity such as metal may be mixed in the vicinity of the outer surface of the sheet so that the writing sheet or the image receiving sheet itself has a heat radiating means.

As another method, it is conceivable to provide heat radiating means to a case for accommodating the authentication identification card. Thus, heat storage of the card can be prevented, and pressure and impact can be reduced to prevent damage. A warning may be issued (for example, a buzzer sounds) when the card is not stored in the case for a certain period of time. This case can be shielded to prevent content interception.

It is preferable that the substrate opposed to the substrate having the heat radiating means has a heat insulating means. In particular,
It is preferable to laminate or coat a sheet having a high reflectivity capable of reflecting heat rays (such as a sheet coated or mixed with a dye containing ZnO) so that the IC card does not absorb sunlight or the like and does not become hot.

In order to make the thermal expansion coefficient of a joint between components including an IC chip substantially the same as the thermal expansion coefficient of the periphery of the joint, for example, a filler or an adhesive covering the component and the joint is made of a polyurethane-based material. If an adhesive or a polyurethane-based hot melt adhesive is used, a combination having a similar thermal expansion coefficient to a polyethylene terephthalate (PET) sheet or the like constituting a substrate can be obtained. Further, the coefficient of thermal expansion may be adjusted by mixing a filler or the like with the adhesive or the like.

In addition, the rate of change of each thermal expansion coefficient is -10
It is preferable that the temperature be kept at 10% or less in the range of 90C to 90C. This can prevent the wiring from being cut or the card from being curled due to heat.

As a specific method of indicating the damage of the IC chip, 1) a check value is written in advance to detect the damage, and if the check values of the read data do not match, the card is damaged by liquid crystal or the like. Any method can be adopted, such as display, 2) providing a region in which microcapsule dyes or the like are dispersed, and discoloring when an unacceptable pressure is applied. At that time, introduce sensors that detect pressure, temperature, stress, etc., and if more than allowable force, pressure, heat, bending, etc. are received, for example, current will flow from the battery to the resistor, and the IC will be destroyed automatically. You may make it.

In order to prevent forgery and falsification, it is also effective to make the card itself easily breakable. For example,
As shown in FIG. 3, a weak portion 9 is set so that the card is cracked when a bending force exceeding a specified value is applied. If the card breaks, the wiring of the IC chip and antenna will be separated, or the IC will be broken to prevent forgery and leakage of erroneous information, as well as waste in the former case. Can be separated and the environment is considered. Furthermore, as shown in FIG. 3, if the authentication identification image 10, the bibliographic information 11, and the IC chip are concentrated on a predetermined area of the card (one of the cases where it is broken in this embodiment),
The metal-containing portion is moved to one side of the card, which is advantageous for separation at the time of disposal, and it is also preferable to minimize the portion to be incinerated at the time of disposal and to regenerate the remainder.

When the card as shown in FIG. 3 is stored in the card holder 12 as shown in FIG. 4, the written contents can be confirmed without taking out the card one by one.

As another preferable configuration, the wiring and the joints in the card can have a margin in the pulling direction such as a coil shape, a zigzag shape, an arc shape, etc. Prevent disconnection due to expansion or bending, etc. and prevent loss of information. Introduce cushioning material at the four corners of the card to obtain durability when dropped.
Wrap the IC chip with cushioning material, use a substrate resin having elasticity and stress absorption means, use shape memory as the substrate resin, prevent destruction, and provide a hardened foil on the card surface to protect the written contents , Antenna and I
For example, the joint with the C chip may be covered with a filler having a cushioning effect such as silicone rubber to prevent breakage due to heat fluctuation. The use of spring springs, elastic metal pieces, conductive rubber, etc. at the joints not only prevents breakage due to heat deformation and expansion but also breaks down to external stress. The stress property is improved.

[0028]

According to the present invention, it is possible to prevent an ID card having a built-in IC chip from being damaged under environmental conditions during manufacture and use, and the damaged card is not used.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a cross section in a long side direction of an example of a non-contact type IC card.

FIG. 2 is a diagram showing an IC card in which a writing sheet is provided with heat radiating means.

FIG. 3 is a diagram showing an example of an IC card according to the present invention.

FIG. 4 is a diagram showing a state where the card of FIG. 3 is stored in a card holder.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Writing sheet 2 IC chip 3 Coiled antenna 4 Joining part 5 Adhesive 6 Image receiving sheet 7 Substrate resin 8 Metal layer 10 Authentication identification image 11 Bibliographic information

Claims (5)

[Claims] 1. An I-beam is provided at a predetermined position between two opposing substrates.
An authentication identification card comprising a component including a C chip mounted thereon and filled with a resin, wherein one of the two substrates has a heat radiation means. 2. The authentication / identification card according to claim 1, wherein the other of the two substrates has heat insulating means. 3. The method according to claim 1, further comprising the step of:
A component including a C chip is placed and filled with resin, and a coefficient of thermal expansion of a joint between the components is substantially the same as a coefficient of thermal expansion around the joint. card. 4. The method according to claim 1, further comprising the step of:
An authentication / identification card comprising a component including a C chip mounted thereon and filled with a resin, and having means for indicating damage to the IC chip. 5. A case for an authentication identification card, comprising a heat radiating means.