JPH11345299A - Non-contact ic card and manufacture of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card which is constituted so that a built-in IC module, especially an IC chip and its electrical connection part is made to flexibly disperse the stress applied from the outside and not directly applied by impact and to provide its manufacturing method. SOLUTION: Break and peeling of an IC chip and its electrical connection parts are reduced and the reliability of a card is improved remarkably by such a manner that an IC module 14, an antenna 15 or an IC module inlet 17 is prevented from being contactly adhesive to a resin layer 12 so that they can shift their positions in the resin layer and accordingly the stress produced in the card is prevented from being directly transferred to the IC chip and the stress of dislocation is dispersed even when impact such as external pressure is applied to the card and the card is bent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card provided with an IC module having an integrated circuit connected to a coil or an antenna, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, an IC card, which has become widespread, uses a microprocessor, a microprocessor having a built-in memory, and an IC chip having a built-in microcontroller, and has a high data processing capability and a large memory capacity. ID authentication, as a storage medium or information processing medium,
It has been widely used in the fields of finance, transportation, transportation, and information security. Until now, the contact type in which the IC card and the external device communicated with power supply via the connection terminal and mainly communicated was used. However, since the connection terminal was exposed on the surface of the IC card, the connection terminal was dirty. However, there is a non-contact type IC card which has a coupling means in the IC card which enables communication in a non-contact state instead of a connection terminal by a communication method using an electromagnetic wave, although it has a disadvantage that it is easily broken. This non-contact I
Since the communication method of the C card uses electromagnetic waves, it is only necessary to bring the communication close to the terminal device, the communication work is easy, and the connection terminal is not broken, so that the handling is easy.

[0005] A non-contact type IC card 40 shown in FIG. 5 is connected to an IC module 43 in which an IC chip 41 for performing information processing and storage processing is mounted on a substrate 42, and communicates with the outside. , At least a coil or an antenna 44 as a means for supplying power or the like, and is incorporated in a resin layer 45 formed between two bases 46. As a method of manufacturing this non-contact type IC card, there are conventionally a lamination method, a resin filling method, and an injection (injection molding) method.

As an example of the laminating method, an IC module having an integrated circuit connected to a coil or an antenna is placed on a plastic sheet thinner than a predetermined card thickness, and the oversheet is fitted to the plastic sheet and heated. This is a method of manufacturing a non-contact type IC card in which both are heat-sealed by lamination and are integrally formed.

As an example of the resin filling method, a spacer and an IC module which are at least one size larger than the IC module and have a thickness to achieve a desired card thickness are arranged on a base material, and an ultraviolet (UV) curing resin is used. Alternatively, a resin layer is formed by filling a thermosetting resin and embedding an IC module, and further bonding a base material to a surface of the resin layer opposite to the base material, and irradiating the resin by ultraviolet (UV) irradiation or heating. There is a method of manufacturing a non-contact type IC card which is cured and molded.

As an example of the injection method, there is a manufacturing method in which an IC module is resin-molded into a card shape by injection molding using a mold.

[0007] Non-contact type IC carded as described above.
In a card, the main components of the IC module are all embedded in the resin inside the card base material.
Since the C chip and the substrate on which it is mounted are strongly bonded to the surrounding resin, the IC module is fixed in the resin layer, and when the card is deformed, for example, the card is bent during use, If the card is twisted or subjected to an impact, the stress applied to the card is directly transmitted to the IC module, especially the IC chip and its electrical connection, so that the IC chip is broken or the connection is damaged. Peeling sometimes occurred, and the reliability of the information recording medium was reduced.

As a protective measure against destruction of the data recording portion with the IC chip, magnetic recording means is formed on the card,
A backup means for recording the recording data of the C chip in the magnetic recording means is conceivable. However, the time required for the recording of the backup and the existence of the different recording means of magnetic recording perform the data communication of the non-contact type IC card in a non-contact manner. Has the disadvantage of losing the feature. Also, using a plurality of IC chips or a plurality of IC modules,
Although there is a method of recording the same data, there are serious problems in realizing complicated structure and high cost, and the structural enhancement of the current IC card is required. No measures have been taken in this area.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and is directed to a built-in IC module, in particular, an IC module for a stress applied from the outside of a non-contact type IC card. The chip and its electrical connection parts disperse the stress flexibly and the structure is not directly impacted.It is strong in impact resistance and has high reliability to meet required card characteristics such as durability and mechanical characteristics. Another object of the present invention is to provide an inexpensive non-contact type IC card and a method for manufacturing the same.

[0010]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object.

According to a first aspect of the present invention, there is provided an IC module in which at least a base material, a resin layer, and an integrated circuit connected to a coil or an antenna in a layer are adhered on a substrate, or a coil or an antenna connected to the IC module. A resin layer having an IC module inlet having an integrated circuit and a back substrate are sequentially laminated, and the adhesive strength between the IC module or the IC module inlet and the resin constituting the resin layer is 50 g / 25 mm or less. Non-contact type IC card characterized by the above-mentioned.

According to a second aspect of the present invention, there is provided the non-contact type IC card according to the first aspect, further comprising a release layer between the IC module (or the IC module inlet) and the resin layer, wherein the release layer does not adhere to both. It is characterized by the following.

According to a third aspect of the present invention, there is provided an IC module having an integrated circuit connected to a coil or an antenna.
Alternatively, a release layer is formed around a coil or antenna on a substrate and an IC module inlet having an integrated circuit connected thereto, and the IC module is placed between a substrate and a back substrate, A method for manufacturing a non-contact type IC card, characterized by forming a filling layer by filling a resin.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the drawings.
This will be described in detail. 1A and 1B are plan views showing the configuration of the non-contact type IC card of the present invention, and FIG. 1C is a cross-sectional view taken along line X-X, and FIG. FIG. 2A is a plan view showing an example of an IC module used in the non-contact type IC card of the present invention and an antenna connected thereto, and FIG. 2B is a plan view showing an example of an IC module inlet; FIG. 3 is a sectional view showing another configuration of the non-contact type IC card of the present invention, and FIG. 4 is a manufacturing process diagram showing a method of manufacturing the non-contact type IC card of the present invention.

The non-contact type IC card 1 shown in FIG. 1A has a substrate 11, a resin layer 12, and a back substrate 13 which are sequentially laminated.
It has a configuration including a module 14 and an antenna 15 electrically connected thereto. The non-contact type IC card 2 shown in FIG. 1B also has a base 11, a resin layer 12, and a back base 13 sequentially laminated, an IC module 14, and an antenna 15 electrically connected thereto. And then IC
The release layer 16 is located between the module 14 and the resin of the resin layer 12.
Is provided. Further, the non-contact type IC card 3 shown in FIG.
Is replaced with the IC module 14 shown in FIG.
This uses the IC module inlet 17 shown in FIG. 1 (a) and 1 (b) show cross sections of a non-contact type IC card taken along line XX of FIG. 1 (c), respectively, and FIG. 2 (a) and FIG. 3 shows a cross section of the IC module 14 or the IC module inlet 17 in X-ray. This configuration shows the basic configuration of the present invention, and is not limited only to this configuration.

Next, each configuration of the non-contact type IC card 1 will be described. First, the base material 11 and the back base material 13, which are the outer layers of the non-contact type IC card 1, are made of paper having strength, synthetic paper,
Synthetic resins, natural resins, metals, ceramics, and the like are used alone or as a mixture, copolymer, or composite. For example, polyester resin, acrylonitrile styrene resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, ABS resin, polyethylene terephthalate (PET) resin, polyvinyl chloride resin, vinyl acetate resin, polylactic acid, polyvinyl alcohol A resin, a polyurethane resin, a modified PPO resin, a polybutylene terephthalate resin, a thermoplastic resin such as a polyphenylene sulphate resin, or a resin mixture obtained by combining those materials;
A copolymer or the like can be used, and further, a reinforced resin obtained by adding a glass fiber or a pigment can be used. In addition, biodegradable resins such as polylactic acid, polycaprolactone, poly (3-hydroxybutyrate-3 hydroxyvalerate), and polyvinyl alcohol resin can be used. Further, a resin alone, a resin mixture, or a copolymer can be used. Can be. If the resin satisfies the above conditions,
Resins other than the above may be used. The material of the base material 11 and the back base material 13 can be selected according to the situation and configuration of using the non-contact type IC card, and the thickness of the base material is the same as the target non-contact type IC card. Is set appropriately according to the required thickness and configuration. Further, if necessary, printing of a picture such as a design, transfer formation of a character or a photographic image, formation of a magnetic recording portion, and the like can be added to the base material 11 and the back base material 13.

Since the resin layer 12 is laminated on each of the base material 11 and the backing material 13, it is necessary that the adhesiveness with the material is good. 12 can be subjected to an easy-adhesion treatment, for example, a corona discharge treatment, a plasma treatment, a surfactant application, a resin application, or the like, so that the adhesion can be improved. Since the other surfaces of the base material 11 and the back base material 13 are surfaces of a non-contact type IC card, a part or the entire surface thereof is provided with a functional layer such as a protective layer, a magnetic recording layer, a reversible thermosensitive recording layer, A print pattern layer or the like can be provided.

Next, the resin layer 12 is formed between the base material 11 and the back base material 15, respectively, and adheres and fixes the IC module 14, the antenna 15, or the IC module inlet 17, and will be caused by its shape. Irregularities can also be embedded and smoothed with resin, and also have a function as protection means against physical impact on the IC chip and its electrical connection.

The resin used for the resin layer 12 fills the IC module 14, the antenna 15, or the IC module inlet 17 around and forms a resin layer in which the IC module 14 and the antenna 15 are built. A material having the same composition as that of the base material 11 or the back base material 13 may be used. Further, it may be formed integrally with the base material 11 and the back base material 13. For example, a polymer resin such as a thermoplastic resin or a thermosetting resin, or an inorganic substance structure such as a glass body or ceramics can be used depending on the use of the card.

The former is preferred, and the thermoplastic resins include polyester resin, acrylonitrile styrene resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, ABS resin, polyethylene terephthalate (PET) resin, There are vinyl chloride resin, vinyl acetate resin, polylactic acid, polyvinyl alcohol resin, polyurethane resin, modified PPO resin, polybutylene terephthalate resin, polyphenylene sulfate resin, and the like. Can also be used. Further, glass fiber or pigment may be added to form a reinforced resin. In addition, biodegradable resins such as polylactic acid, polycaprolactone, poly (3-hydroxybutyrate-3 hydroxyvalerate), and polyvinyl alcohol resin can be used. Further, a resin alone, a resin mixture, or a copolymer can be used. Can be.

As the thermosetting resin, there are unsaturated polyester resin, acrylic resin, epoxy resin, polyurethane resin, and ultraviolet (UV) curable resin, and these resins can be used alone or as a resin mixture. . From the gist of the present invention, the integrated IC module 14, the antenna 15, or the IC as shown in FIG.
A resin that does not easily adhere to the module inlet 17, specifically, a resin having an adhesive strength of 50 g / 25 mm or less may be selected. Examples of the resin having poor adhesion include a resin alone such as a saturated polyester resin, an acrylic resin, a polyethylene resin, a polypropylene resin, a polypropylene PP resin, and a silicone resin, a mixture of these resins, and an alloy. Further, a lubricant such as silicone oil can be added to these resins for use. As another selection condition, the resin may be defined depending on the manufacturing method used. Also, as shown in FIGS. 1B and 4, there is a method of providing a release layer 16 which does not adhere to the resin layer on the surface of the IC module 14, the antenna 15, or the IC module inlet 17, for example, a silicone resin, a Teflon resin. , A resin such as an ultraviolet-curable acrylic resin, or a silicone oil, a low molecular organic acid, or the like.
It is applied and formed on the entire surface of the C module 14, the antenna 15, or the IC module inlet 17.

As shown in FIG. 2A, the IC module 14 includes an IC chip 2 such as a CPU and a memory on a substrate 21.
2. Besides, electronic circuit components 23 and the like are electrically connected and mounted, and further connected to the antenna 15 via an antenna terminal 24 on the substrate 21. Note that IC chip 2
2 may be resin-sealed with a resin such as an epoxy resin, a polypropylene resin, or a polyamide resin, if necessary.

The IC module inlet 17 is
As shown in FIG. 2B, an IC chip 32 such as a CPU and a memory, and other electronic circuit components 33 are electrically connected and mounted on a substrate 31, and are further printed and wired on the substrate 31. The antenna 34 is an antenna terminal 35 on the substrate 31
Connected through. The size of the substrate 31 is smaller than the size of the IC card to be manufactured, and may be any size that can be incorporated. Note that the IC chip 22 can be
For example, resin sealing may be performed with a resin such as an epoxy resin, a polypropylene resin, or a polyamide resin. Since the IC module inlet 13 is built in the card, the card itself has an extremely thin structure.
The shape of the C module inlet 13 changes the appearance of the card,
It is preferable to use a thin type so as not to affect the shape and the like. IC module inlet 17
In order to make the IC chip 32 thinner, a concave portion capable of accommodating the IC chip 32 may be provided in a thicker type such as a printed circuit board, depending on the substrate 21, and the mounting of the IC chip 32 may be performed in a film-like shape. The part may be thinned. With this IC
The module inlet 13 is now flattened,
Unevenness on the card surface during lamination is less noticeable.

The non-contact type IC card includes a system in which a battery is built in as a power source, and a system in which an electromagnetic wave transmitted from an external data processing device is received by an antenna and electric power is obtained from the electromagnetic wave. In the present embodiment, the latter is used. The former has a built-in battery, so that the power is supplied stably, so that the non-contact IC card can be operated more actively.

As another antenna, there is a coil wound from an insulated wire or the like. Further, as another communication method, an electromagnetic induction method including a dedicated or dual-purpose coil as a function of a power supply by electromagnetic induction and a communication antenna by electromagnetic induction, and an electrostatic plate for the data communication using the electromagnetic induction method as a power supply. There is also a combination of a capacitance method using a power supply and a supply of power from a battery.

The substrates 21 and 31 have IC chips 22 and 3
2 has a certain strength and rigidity that can be mounted, and is easy to handle. The same material as the above-described base material 11 or back base material 15 may be used.
Other materials may be used. However, from the gist of the present invention, it is preferable to select a material that does not easily adhere to the above-described resin filled around the resin. It is also important that electronic components and the like formed on the substrate can operate normally.

An adhesive can be used to adhere the IC chips 22 and 32 to the substrates 21 and 31. Examples of the adhesive include, but are not particularly limited to, a UV-curable adhesive, a cationic-curable adhesive, an EB-curable adhesive, a polyurethane adhesive, an epoxy adhesive, a vinyl acetate adhesive, a vinyl chloride adhesive, and a polyvinyl alcohol adhesive. , A thermosetting adhesive such as a polyamide adhesive, a thermoplastic adhesive, or an ordinary adhesive. From the practicality, it is preferable to use an instant adhesive such as cyanoacrylate for convenience of processing.

The non-contact type IC card of the present invention has a structure in which the IC module 14 (or the antenna 15) or the IC module inlet 17 is not brought into close contact with the resin layer 12.
Because they can be displaced in the resin layer, when a shock such as pressure is applied to the card from the outside or the card is bent, the stress generated on the card is not directly transmitted to the IC chip, and Dispersion of stress is achieved, thereby reducing the possibility of destruction or peeling of the IC chip or its electrical connection, and significantly improving the reliability of the card.

Next, a method for manufacturing a non-contact type IC card (thermal lamination method) of the present invention will be described. As shown in the manufacturing process diagram of FIG. 3, (1) an IC chip 22 is mounted on a substrate 21 and an antenna 2
An IC module 14 electrically connected to the IC module 4 is formed, and a release layer 16 of the IC module 14 is formed. (2) A melted resin is applied to one surface of each of the base material 11 and the back base material 13 by using a T-die 18, and the resin layers 12a and 12b
To form (3) The IC module 14 of (1) between the resin layers 12a and 12b of the base material 11 and the back base material 13 of (2).
And the antenna 15 are placed and bonded by thermal lamination to form the non-contact type IC card 2 in which the resin layer 12 containing the IC module 14 and the antenna 15 is formed.

It should be noted that the I having the release layer formed as in (1)
Use C module, IC module inlet,
Alternatively, it is possible to select whether to use a resin having poor adhesion to them. Alternatively, a sheet formed in advance between the base material 11 and the back base material 13 may be used, or the resin layer may be used as the base material 11,
After being provided on one of the backing substrates 13 (single layer), (3)
After the IC module 14 or the IC module inlet 17 is disposed between the base material 11 and the back base material 13 in the step (3), the non-contact type IC card 2 is formed in the step (3). Is also good.

As another manufacturing method, in the injection method, an IC module or an IC module inlet is fixed in a mold on one of a base material and a back base material, a thermoplastic resin is injected, and the IC module or the IC module inlet is connected to a resin. And a non-contact type IC card can be manufactured. In this method, the IC module or the IC module inlet may be directly arranged without using the base material and the back base material. In the resin injection method, an IC module or an IC module inlet is placed between the base material 11 and the back base material 13, and a liquid material of a thermoplastic resin, a thermosetting resin, or a UV-curable resin is injected. By filling and curing, a non-contact type IC card can be manufactured.

[0032]

The present invention will be described below with reference to examples.

<Embodiment 1> JIS standard size 86
The surface of a polyvinyl chloride sheet having a size of 54 mm and a thickness of 0.1 mm was subjected to a plasma easy-adhesion treatment to obtain a substrate 11 and a back substrate 13. An IC module with an antenna manufactured by MIKRON is attached to one of the base material and the back base material, and the base material and the back base material are arranged in a mold, respectively, and the polypropylene PP resin is injected after binding the molds. The non-contact type IC card 1 was obtained by forming the resin layer 12 containing the IC module 14 therein.
The resin layer 12 of the non-contact type IC card 1 and the IC chip of the IC module 14 are not in close contact with each other, have good surface properties, have a good appearance, and perform a communication test. It was confirmed that it could work properly.

Example 2 Size 10 cm × 10 cm
0.1mm thick polyethylene terephthalate (PE
T) Using a sheet, the surface of the sheet was subjected to an easy adhesion treatment by corona discharge to obtain a base material 11 and a back base material 13. M
A silicone resin was coated to a thickness of 10 μm on the surface of an IC chip of an IC module with an antenna manufactured by IKRON and a substrate (flexible printed circuit) on which the IC chip was mounted to form a release layer 16. Then, the reactive PUR hot melt resin of the base material 11 and the back base material 13 was formed as resin layers 12a and 12b to a thickness of 350 μm. Substrate 11, resin layer 12a, 12b of back substrate 13
And the card thickness is 760μm by hot pressing
Then, the non-contact type IC card 2 having the resin layer 12 containing the IC module 14 was obtained. The resin layer 12 of the non-contact type IC card 2 and the IC chip of the IC module 14 are not in close contact with each other, have good surface properties, have a good appearance, and perform a communication test. It was confirmed that it could work properly.

<Comparative Example> Polyethylene terephthalate (PET) having a size of 10 cm × 10 cm and a thickness of 0.1 mm
Using a sheet, the surface of the sheet was subjected to an easy-adhesion treatment by corona discharge to obtain a base material 46, respectively. MIKRO
An IC module 43 with an antenna manufactured by Company N is fixed to one of the substrates 46 with a cyanoacrylate instant adhesive,
A resin layer 45 having a thickness of 600 μm was formed from an epoxy resin. Then, the remaining base material 46 is attached, and the card thickness is 7
The sheet was passed through a thickness setting device (nip roll) so as to have a thickness of 60 μm, and was press-laminated at 80 ° C. to obtain a non-contact type IC card 40. The resin layer 45 of the non-contact type IC card 5 and the IC chip 41 of the IC module 42 were in close contact.

Noncontact ICs of Examples 1 and 2 and Comparative Example 1
When the card was tested by a bending characteristic test specified in ISO / IEC 7816-1, the non-contact type IC cards of Example 1 and Example 2 were able to communicate without any trouble in a communication test, and operated normally. However, it was confirmed that the IC chip of the non-contact type IC card of the comparative example was broken and the communication test could not be performed.

[0037]

As described above, the non-contact type I of the present invention is used.
According to the C card and the method for manufacturing the same, the non-contact type IC card of the present invention is used for the IC module 14 (or the antenna 15).
Alternatively, since the IC module inlet 17 is not brought into close contact with the resin layer 12, they can be displaced in the resin layer. Therefore, when an external impact such as pressure is applied to the card, or when the card is bent, the card is damaged. The generated stress is not transmitted directly to the IC chip, and the stress due to the displacement is dispersed, thereby reducing the possibility of destruction and peeling of the IC chip and its electrical connection, and significantly improving the reliability of the card. Can be done.

[Brief description of the drawings]

1 (a) and 1 (b) are cross-sectional views showing the configuration of a non-contact type IC card of the present invention, and FIG. 1 (c) is a plan view of the non-contact type IC card of the present invention.

FIG. 2A is a plan view showing an example of an IC module used in the non-contact type IC card of the present invention and an antenna connected to the IC module, and FIG. 2B is a plan view showing an example of an IC module inlet.

FIG. 3 is a sectional view showing another configuration of the non-contact type IC card of the present invention.

FIG. 4 is a manufacturing process diagram showing a method for manufacturing a non-contact type IC card of the present invention.

FIG. 5 is a cross-sectional view showing a configuration of a conventional non-contact type IC card.

[Explanation of symbols]

 1, 2, 3 Non-contact type IC card 11 Base material 12 Resin layer 12a, 12b Resin layer 13 Back base material 14 IC module 15 Antenna 16 Release layer 17 IC module inlet 18 T die 21 Substrate 22 IC chip 23 Electronic circuit parts 24 antenna terminal 31 substrate 32 IC chip 33 electronic circuit component 34 antenna 35 antenna terminal 40 non-contact type IC card 41 IC chip 42 substrate 43 IC module 44 antenna 45 resin layer 46 base material

Claims (3)

[Claims] An IC module comprising at least a substrate, a resin layer, an integrated circuit connected to a coil or an antenna in a layer adhered on a substrate, or an IC having a coil or an antenna and an integrated circuit connected thereto A resin layer having a module inlet and a backing substrate are sequentially laminated,
A non-contact type IC card, wherein an adhesive strength between a module or an IC module inlet and a resin constituting a resin layer is 50 g / 25 mm or less. 2. The non-contact type IC card according to claim 1, further comprising a release layer between the IC module or the IC module inlet and the resin layer, wherein the release layer does not adhere to each other. 3. A release layer is formed around an IC module having an integrated circuit connected to a coil or an antenna, or an IC module inlet having a coil or an antenna and an integrated circuit connected thereto on a substrate. A method for manufacturing a non-contact type IC card, comprising: mounting an IC module between a base material and a back base material; and filling a resin to form a filling layer.