JPH1131207A - Non-contact ic card and its reading method in emergency - Google Patents

Abstract

PROBLEM TO BE SOLVED: To read recorded data even at the time of emergency such as the damage of one part of a non-contact IC card. SOLUTION: An IC module 5 arranged inside a card substrate is provided with plural memory IC chips 7 and a control IC chip 6 for allowing those memory IC chips 7 to store the same data. Thus, even when the damage of any part of this card is present, there is large possibility that any memory IC chip 7 is left normal. The IC module 5 is provided with terminals 9 for emergent reading so that recorded data can be read from any memory IC chip 7 in a contact reading system.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC
The present invention relates to a non-contact type IC card having a module and a coupling means for transmitting and receiving, and an emergency reading method thereof.

[0002]

2. Description of the Related Art IC cards have been put to practical use, for example, as external storage means of computers, or as credit cards, ID cards, cash cards, and the like.
Of these, for non-contact type IC cards, data can be written into the card in a non-contact manner by electromagnetic waves or light emitted from an external writing device, and the recorded data also uses electromagnetic waves or light. It can be read by an external transmitting / receiving device. Therefore, there are advantages that a contact failure of the communication terminal is avoided, a data read / write device can be simplified, and remote communication is possible.

The internal structure of an electromagnetic induction type non-contact type IC card comprises a part called an IC module having a microprocessor for processing data and a memory unit for storing data, and an antenna for transmitting and receiving electromagnetic waves. . The IC module and the antenna are embedded in a plastic card base to form a non-contact IC card. As a standard for a non-contact type IC card, there is ISO 10536, in which the thickness of the card is
It is specified as 0.76 mm. Therefore, the buried I
There is a limit to the thickness of the C module and the antenna.

[0004]

In the IC module, an IC chip having a microprocessor and a memory function is mounted on a printed circuit board.
The chip is covered with epoxy resin.
The terminals of the IC chip are connected to wiring patterns on the printed circuit board by bonding wires or the like. The IC chip is thinly processed for incorporation into a card, and has a thickness of about 300 μm. Due to such thinning, the IC chip is brittle, and may be cracked by receiving stress upon impact. Also, the wire connecting the terminal of the IC chip and the wiring pattern on the printed board may be damaged, cut or peeled off by the impact. Covering the IC chip with an epoxy resin or the like improves the mechanical strength of the IC module, but still cannot completely prevent the IC chip or wire from being broken, cut or peeled.

[0005] Further, the antenna is provided as a winding coil in which a conductive wire is wound in a coil shape, or provided by forming a spiral pattern on a printed circuit board. The reason why the loop is formed in this way is to use the induced electromagnetic field for communication, and from such a viewpoint,
The larger the loop area of the antenna, the better for communication. However, the thickness of the antenna can be made smaller than that of the IC chip by devising the number of windings of the winding coil, the winding method, or using a printed circuit board. The antenna is more resistant to impacts than an IC chip, and can be more resistant to pressure and temperature than those using a conductive wire, particularly when a printed circuit board is used. Therefore, non-contact I
In a C card, a failure due to damage to an IC chip is more likely to occur than an antenna.

[0006] JP-A-6-183190 discloses an IC.
There is disclosed a technique of covering a module with a foamed resin and protecting the IC module by a buffer action of the foamed resin. Further, Japanese Patent Application Laid-Open No. Hei 3-121583 discloses a technique for reinforcing an IC module with a reinforcing sheet. However, none of these techniques can completely prevent breakage of the IC chip or disconnection of the wiring.

[0007] Japanese Patent Application Laid-Open No. 62-227795 discloses that
In a contact type IC card, a technique has been disclosed in which a plurality of IC chips are mounted on a flexible substrate to reduce stress applied to each IC chip. However, even with this technology, IC
It is impossible to completely prevent breakage of disconnection of a chip or wiring. Further, in this technique, since one application is assigned to each IC chip, if one IC chip is destroyed, the application corresponding to that IC chip cannot be executed.

If the IC chip is damaged or the wiring is broken, it has been impossible to read data recorded on the IC module. Many IC cards are used in the financial industry and the like, and there is a demand for the development of a technique for reading recorded valuable data.

The present invention has been made in view of the above circumstances, and provides a non-contact type IC card capable of reading recorded data even in the event of an emergency such as a breakage of a part of the card. It is intended to provide a reading method.

[0010]

In order to solve the above-mentioned problems, a non-contact type IC card according to the present invention comprises: a card base; an IC module having an IC chip disposed inside the card base; A non-contact type IC card which is provided inside a base and which is connected to the IC module and is provided with coupling means for transmitting and receiving between the IC module and an external device, wherein the IC base is provided inside the card base. A read connection terminal capable of reading data recorded on the chip by electrical contact is provided.

The IC module preferably has an IC chip dedicated to data recording and an IC chip for data processing and communication control. Alternatively, the IC module comprises: an IC chip dedicated to recording at least two data;
It is preferable to have an IC chip for data processing and communication control for recording the same data on each of the data recording IC chips. Alternatively, the IC module includes an IC chip dedicated to data recording and an IC chip for data recording, processing, and communication control, and the IC chip for data recording, processing, and communication control includes the IC chip for data recording. The same data may be recorded in each of the recording, processing and communication control IC chip and the data recording IC chip.

In the emergency readout method for a non-contact type IC card, a connection terminal of an external device is pierced into the card base of the non-contact type IC card, and the connection terminal of the external device is brought into contact with the read connection terminal. Then, the data recorded on the IC chip is read. In this case, it is preferable that the tip of the connection terminal piercing the card base is sharpened in a needle shape.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing components of a non-contact type IC card according to an embodiment of the present invention.
This IC card includes a flat front sheet 1 and a rear sheet 2 which are laminated with each other, and an inlet 3 interposed therebetween. The front sheet 1 and the back sheet 2 are joined by a hot press (thermal lamination method) or an adhesive, whereby a flat card base S is formed as shown in FIG. It is arranged inside the base S.

Examples of the material of the card substrate S include PVC (polyvinyl chloride), ABS (acrylonitrile-butadiene-styrene copolymer), PET (polyethylene terephthalate), PC (polycarbonate), PI (polyimide) and epoxy. In addition to synthetic resin, IC
A known material used for the substrate of the card is used. The synthetic resin may contain glass fiber, glass beads, titanium oxide, calcium carbonate, or the like for adjusting the strength and color. In addition, any sheet material such as synthetic paper or paper can be used as a material for the card base S.

Depending on the thickness of the inlet 3, the card base S
An intermediate layer having a thickness equivalent to the thickness of the inlet 3 may be provided between the front sheet 1 and the back sheet 2 so as not to cause irregularities on the front surface or the back surface. The intermediate layer can be formed of a synthetic resin sheet, a filler, an adhesive, or the like. Further, at least one of the surfaces of the front sheet 1 and the back sheet 2 facing each other may be formed with a groove or a recess for fitting the inlet 3 to prevent the occurrence of irregularities on the front surface or the back surface of the card base S. Although the card base S is constituted by two sheets 1 and 2 in the drawing, the card base S may be constituted by a larger number of sheets.

Although the card base S is formed by stacking sheets in the drawing, it may be formed by injection molding. In this case, the inlet 3 is placed in a mold, and a thermoplastic resin as a material of the card base S is injected into the mold.

On the front or back surface of the card base S, an IC
A picture or character corresponding to the use of the card may be printed, and a protective layer for protecting the printed portion may be provided. The protective layer may be provided by bonding a sheet-like material, or may be provided by coating and solidifying a synthetic resin. A label or image receiving layer that can be printed with, for example, a polyester resin or the like may be provided on the front surface or the back surface of the card base S in order to add information with visible characters and symbols during use of the card.

The inlet 3 has an antenna (coupling means) 4
And an IC module 5. In the example shown in FIG. 1, the antenna 4 is provided as a coil wound in a coil shape or a spiral shape. It should be noted that a winding method other than that shown in FIG. 1 may be used as long as it functions as an antenna. If the antenna 4 is formed using a flat conducting wire having a rectangular cross section, the aspect ratio of the cross section is good even if the antenna 4 is curved in a coil shape or a spiral shape.

A spiral antenna pattern similar to that shown in FIG. 1 may be formed on a substrate (not shown), and this antenna pattern may be used as the antenna 4. In this case, the antenna 4 is collectively formed with a printed wiring board 8 described later.
Is sandwiched between the front sheet 1 and the back sheet 2.
Such antenna patterns include etching, plating,
Although the antenna may be formed by any of printing, the antenna formed by these methods has a small thickness.

The material of the antenna 4 is not particularly limited as long as it has sufficient conductivity, but is preferably made of copper because it is inexpensive. In addition, gold, silver, aluminum, carbon and the like may be used. If the DC resistance is large, the communication characteristics are degraded. Therefore, it is necessary to determine the material in consideration of the resistance value. If provided by printing, a conductive powder mixed with a paste-like ink may be used. The antenna 4 is formed so as to form a loop, and its specific shape is changed according to the wavelength of an electromagnetic wave used for communication. In order to efficiently input and output electromagnetic waves, the larger the loop shape, the more advantageous.

The IC module 5 includes a printed wiring board 8, and the printed wiring board 8 includes one control IC chip 6 having a microprocessor function and two memory IC chips 7 having a memory function. Has been implemented.
The control IC chip 6 controls data processing and communication, while the memory IC chip 7 is dedicated to data recording. The printed wiring board 8 is made of glass epoxy in which glass fiber is impregnated with epoxy resin. However, PI
Metals used for films and IC lead frames may be used. In addition, any material such as PVC or PET used for a normal printed wiring board can be used as a material for the printed wiring board 8.

In FIGS. 3 and 4, a mesh portion indicates a wiring pattern on the printed wiring board 8. The wiring pattern is formed of copper foil, but other conductive materials such as silver and aluminum may be used. Two connection terminals 10 for electrical connection between the antenna 4 and the control IC chip 6 are formed on the printed wiring board 8.

The connection terminal 10 is connected to the control IC chip 6
Are the thick portions at the ends of the two wiring patterns connected to. The connection between the both ends of the antenna 4 and the connection terminal 10 may be performed by fixing the both with a conductive adhesive, soldering, crimping, or the like, or may be performed simply by contacting the two. In the case where the two are brought into contact without being fixed, a conductive rubber connector or a spring may be provided at both ends of the antenna 4 and at least one of the connection terminals 10 to ensure the connection. By the connection between the two, signals can be transmitted and received between the control IC chip 6 and an external non-contact type writing / reading device via the antenna 4. Transmission and reception are performed in a non-contact manner using electromagnetic waves.

The control IC chip 6 and the memory IC chip 7 are mounted using a CO using a wire bonding method.
The B method, the flip chip method in which the pattern surface of the IC chip is opposed to and contacts the wiring pattern of the printed wiring board 8, or the TAB method is used. 3 to 5
Indicates a flip-chip method. In this manner, the connection between the connection terminal 10 and the input / output terminal of the control IC chip 6 is established, and the control IC chip 6 and each memory IC are connected.
The terminals of the C chip 7 are also connected to each other.

The control IC chip 6 and the memory IC chip 7 thus mounted are sealed and protected by a synthetic resin such as an epoxy resin (not shown). As a sealing method, a potting method, a transfer molding method, or the like is used.

Note that a capacitor (not shown) may be mounted on the printed wiring board 8 in order to match the resonance frequency of the antenna 4 with the frequency of an electromagnetic wave used for communication with an external writing / reading device. . In this case, the capacitor is preferably a ceramic chip capacitor.

The IC module 5 has two types of IC chips 6 and 7. Memory IC
The chip 7 is used exclusively for storing data. Control IC
The chip 6 has a microprocessor function,
An arithmetic process is performed based on a reception signal supplied from an external non-contact type writing / reading device via the antenna 4, and data obtained as a result of the arithmetic operation is stored in both memory IC chips 7.
To memorize. Thus, the same data is always stored in the memory IC chip 7. The control I
C chip 6 is one or both memory IC chips 7
Is read out, and this data is transferred to the above-mentioned non-contact type writing / reading device via the antenna 4. At the time of transmission / reception, the control IC chip 6 may perform data encryption processing.

The control IC chip 6 performs the above-described function based on a program stored in any one of the memory IC chips 7. It may be realized by logic. In the illustrated example, the number of control IC chips 6 is one. However, a plurality of control IC chips 6 may be provided to share the above functions.

The memory section of the memory IC chip 7 is EEP
A ROM is preferable, but if a battery for supplying power to the IC module 5 is provided inside the IC card, S
RAM may be used. Ferroelectric memories can also be used. In the illustrated example, the number of the memory IC chips 7 is two, but more memory IC chips 7 may be provided. In this case, the control IC chip 7 is
The C chip 6 may store the same data, or the control IC chip 6 may store the same data in some memory IC chips 7.

As described above, in this contactless IC card, the data processing and communication control function and the memory function are assigned to separate chips. Further, in the IC module 5, since a plurality of chips 6 and 7 are provided, when a load is applied to the non-contact type IC card,
The stress applied to each chip 6, 7 is reduced,
7 can be reduced.

Now, as shown in FIG. 4, a plurality of emergency read terminals (read connection terminals) 9 are provided on the printed wiring board 8.
Are formed. Each emergency read terminal 9 is a thick portion at the end of the wiring pattern connected to the read terminal of each memory IC chip 7. That is, each read terminal of the memory IC chip 7 is connected not only to the control IC chip 6 but also to the emergency read terminal 9 on the printed wiring board 8.

Therefore, if the control IC chip 6 is damaged by an impact or a large load, the antenna 4 is damaged, the space between the chips 6 and 7 or between the chip 6 and the antenna 4
If a disconnection occurs between the two, the data stored in the memory IC chip 7 can be read through the emergency read terminal 9 by the contact read method. The effects described above can be similarly achieved even when the number of the memory IC chips 7 is one. That is, the present invention can be realized if there is at least one memory IC chip 7.

Further, in this embodiment, since the same data is stored in a plurality of memory IC chips 7, it is assumed that any one of the memory IC chips 7 is damaged in addition to any of the above problems. Also other memory I
The C chip 7 may remain normal. Therefore, also in this case, it is possible to read data stored in the memory IC chip 7 by a contact read method via the emergency read terminal 9 corresponding to any valid memory IC chip 7. In this way, it is possible to read even the stored data which had to be given up before in the past.

As a specific reading method, the card base S
And an electrode (connection terminal) of the contact reader is brought into contact with the emergency readout terminal 9. Alternatively, as shown in FIG. 6, the electrode (connection terminal) 1 of the contact-type reader
1 may be pierced into the card base S, and the electrode 11 may be brought into contact with the emergency readout terminal 9 to read data stored in the memory IC chip 7. In this case, the material of the electrode 11 may be conductive and harder than the card base S. Electrode 11
It is preferable that the tip of is sharpened in a needle shape.

The position of the emergency reading terminal 9 is a non-contact type IC.
Since the card manufacturer or the person to whom the information has been provided knows, it is possible for these persons to specify the position of the emergency readout terminal 9 covered with the card base S. . Therefore, data can be read out without damaging the memory IC chip 7 necessary for reading. And thus, the card base S
The non-contact type IC card in which the electrode 11 is pierced and the hole is pierced can be visually judged to be unusable, so that it can be easily distinguished from the usable card. it can.

In FIG. 4, the emergency readout terminal 9 is provided near the periphery of the printed wiring board 8, but is not limited to this, and the control IC chip 6 and the memory IC chip 7 are not limited to this.
Or between the memory IC chips 7. In this case, the emergency readout terminal may also serve as a wiring pattern for connection between the chips.

7 to 9 show modifications of the above embodiment. In the IC module 5 shown in these figures, the arrangement of components on the printed wiring board 8 and the wiring pattern are different from those in the above embodiment. However, it is essentially the same as the above-described embodiment, and the same reference numerals are given to the same components, and the description thereof will be omitted.

In the above embodiment, the transmission and reception of data between the IC module 5 and the external non-contact type writing / reading device are performed by electromagnetic waves via the antenna 4.
However, the present invention is not limited to this, and may be performed by light using optical mediating means. For example, reception from the writing / reading device may be performed by an optical sensor, and transmission to the writing / reading device may be performed by a light emitting element such as an LED.

In the above-described embodiment, the control IC chip 6 only controls data processing and communication. Instead, the control IC chip 6 can store data in addition to the data processing and communication control functions. A simple IC chip may be provided. In this case, it is preferable that the IC chip itself records the same data as the memory IC chip 7. According to this, the same data is recorded on the IC chip for data recording, processing and communication control and the IC chip for memory. Therefore, even if one of the chips is damaged, data can be read from another chip. Is possible. The memory IC chip 7 may be one.

[0040]

EXAMPLE A non-contact type IC card corresponding to the above embodiment was actually manufactured. The arrangement of components on the printed wiring board 8 and the wiring pattern were in accordance with FIGS. The antenna 4 was formed by winding a copper wire four times in a loop. Antenna 4 and IC
The connection with the connection terminals 10 of the module 5 was performed by soldering.

The printed wiring board 8 was made of glass epoxy, the wiring pattern thereon was formed of copper foil, and the thickness of the wiring pattern was 35 μm. In the wiring pattern, portions connected to the terminals of the IC chips 6 and 7 were plated with nickel, and further plated with gold. As a mounting method of the IC chips 6 and 7,
A COB method using a wire bonding method was adopted. A gold wire was used as a wire for wire bonding.

The memory IC chip 7 was provided with an EEPROM as a memory unit. The IC chips 6 and 7 were sealed with an epoxy resin using a potting method.

The inlet 3 formed as described above was sandwiched between the front sheet 1 and the back sheet 2, and the sheets 1 and 2 were joined by a heat lamination method to produce a non-contact type IC card. The front sheet 1 and the back sheet 2 were each made of white PVC to a thickness of 380 μm.

The electrode 11 of the contact type writing / reading device is pierced into the card base S of the non-contact type IC card manufactured as described above, and is brought into contact with the emergency readout terminal 9 to directly transfer data to the memory IC chip 7. I wrote it. Then, while the electrode 11 was in contact with the emergency readout terminal 9, the written data was read from the memory IC chip 7 by the same writing / reading device as described above. This electrode 11 is 18-
It was formed of SUS302, which is an 8 series stainless steel.

In this test, it was possible to write data directly to the two memory IC chips 7 and to read data directly from the memory IC chips 7. Although the control IC chip 6 was not used for writing data,
The utility of the present invention has been proven. Since the card base S of the non-contact type IC card is perforated by the electrode 11,
It could be easily visually distinguished from other non-contact IC cards.

[0046]

As described above, according to the present invention,
The recorded data can be read even in an emergency such as when the card is partially damaged. In addition, by employing a contact-type reading method in an emergency, a card read by this method can be easily visually distinguished from other cards.

[Brief description of the drawings]

FIG. 1 is a perspective view showing components of a non-contact type IC card according to an embodiment of the present invention.

FIG. 2 is a sectional view showing the contactless IC card in a completed state.

FIG. 3 is a plan view showing an inlet of the non-contact type IC card.

FIG. 4 is an enlarged plan view showing an IC module of the inlet shown in FIG. 3;

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is an enlarged view of part A of FIG. 2 showing a process of reading data from the non-contact type IC card in a contact manner.

FIG. 7 is a plan view showing an inlet used in a non-contact type IC card according to a modification of the embodiment.

8 is an enlarged plan view showing an IC module of the inlet shown in FIG. 7;

FIG. 9 is a sectional view taken along line IX-IX of FIG. 8;

[Explanation of symbols]

1 front sheet, 2 back sheet, 3 inlet, 4
... antenna (coupling means), 5 ... IC module, 6 ... control IC chip, 7 ... memory IC chip, 8 ... printed wiring board, 9 ... emergency read terminal (read connection terminal), 1
0: connection terminal, 11: electrode (connection terminal), S: card base

Claims (6)

[Claims] 1. An IC module having a card base, an IC chip disposed inside the card base, and an IC module disposed inside the card base, connected to the IC module and connected to the IC module and an external device. A non-contact type IC card comprising: a connection means for transmitting and receiving data; and a read connection terminal capable of reading data recorded on the IC chip by electrical contact inside the card base. A non-contact type IC card, comprising: 2. The non-contact type IC card according to claim 1, wherein the IC module has an IC chip dedicated to data recording and an IC chip for data processing and communication control. 3. The IC module according to claim 1, wherein the IC module has at least two dedicated data recording IC chips, and a data processing and communication control IC chip for recording the same data on each of the dedicated data recording IC chips. The non-contact type IC card according to claim 1, wherein: 4. The IC module has an IC chip dedicated to data recording and an IC chip for data recording, processing and communication control. The IC chip for data recording, processing and communication control comprises: An IC chip for recording, processing and communication control of the data, and an I dedicated to recording the data
2. The non-contact type IC card according to claim 1, wherein the same data is recorded on each of the C chips. 5. A connection terminal of an external device is pierced into the card base of the non-contact type IC card according to claim 1, and the connection terminal of the external device is brought into contact with the connection terminal for reading. And reading data recorded on the IC chip. 6. The terminal according to claim 5, wherein a tip of said connection terminal which pierces said card base is needle-shaped.
The method described in.