JP2009157743A - Ic non-mounted external connecting terminal substrate type dual ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC non-mounted external connecting terminal substrate type dual IC card having a highly reliable connecting part between an IC non-mounted external connecting terminal substrate and an antenna pattern. <P>SOLUTION: In the IC non-mounted external connecting terminal substrate type dual IC card in which a recessed part (4) is formed in a card substrate (3) in which an antenna sheet (2) having a contact/noncontact IC chip (1) is embedded, and an IC non-mounted external connecting terminal substrate (6) is embedded in and fixed to the recessed part (4) to electrically connect and fix an external connecting terminal (7) of the substrate (6) to an antenna pattern (5), the IC non-mounted external connecting terminal substrate (6) is formed of a double-faced substrate, and a connecting part of a connecting land (pad) (9) of the substrate (6) to a connecting pattern (5A) of the antenna pattern (5) is provided on the inside out of an external connecting terminal area (14) determined in ISO7816 on the center side of the substrate (6). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a dual IC card (contact / non-contact shared IC card) on which an antenna pattern and an IC non-mounted external connection terminal board are mounted, and more specifically, an external connection terminal board (IC) on which no IC is mounted. The present invention relates to an IC non-mounting external connection terminal board type dual IC card in which the joint portion between the non-mounting external connection terminal board) and the connection pattern of the antenna pattern arranged on the antenna sheet is excellent in reliability.

  Conventionally, in the fields of credit cards, cash cards, etc., as an alternative to a magnetic card, an IC card having an IC module including an IC memory such as a microprocessor (MPU) or a data memory on a card substrate has an information storage capacity. Is attracting attention because it is very large and has high security.

  In particular, in recent years, the amount of information on IC cards is much larger than that of magnetic cards, and security is also high, which has led to rapid growth in the financial, distribution, transportation, administrative, and communications fields. The use of IC cards has been studied or put into practical use in various fields.

  The types of IC cards are also diversified. For example, classification can be made based on whether or not a CPU (central processing unit) is built in the IC card, or by a method of transmitting and receiving data between an IC chip mounted on the IC card and an external device. .

  In an IC card, an IC chip is embedded in a plastic card made of a material and shape similar to that of a magnetic card. Since the IC chip incorporates a CPU and has an arithmetic function, it is possible to determine whether or not access is correct when reading and writing data, thereby realizing high security.

  In order to read and write data in the IC chip, an interface with the outside is necessary. Further, since the IC card does not contain a battery, it is necessary to supply power for operating the IC chip from the outside.

  For this reason, in addition to the classification based on the presence or absence of a CPU, the IC card includes a contact IC card and a non-contact IC card due to a difference due to an interface with an external device such as a reader / writer.

  Contact type IC cards are the most common type of IC cards that receive power supply by directly contacting the external connection terminals exposed on the card surface with the terminals on the reader / writer side, or perform data communication with external devices. It is a kind.

  On the other hand, the non-contact type IC card is an IC card that has been rapidly spread in recent years. There is no external connection terminal for exchanging data with an external device on the card surface, and an IC chip and a coil antenna are built in the card so that information can be exchanged with a reader / writer by radio waves.

  The non-contact type IC card has not only a built-in antenna in the IC card but also a built-in antenna in the reader / writer. The IC card is supplied with power using radio waves from the reader / writer and also has data etc. Exchange information.

  By the way, recently, as an IC card having both functions of a contact IC card and a non-contact IC card, for example, two IC chips for a contact type and a non-contact type are mounted, and a coil antenna is provided. Dual IC cards (combination type IC cards) having a so-called 1-chip 2 interface, which is a hybrid IC card or an IC card equipped with a contact type and non-contact type IC chip and equipped with a coil antenna or the like. However, there is a growing demand for the latter dual IC card, and an IC chip having both functions for this card is being developed and commercialized.

  A dual IC card having a one-chip and two-interface in which a contact type and a non-contact type IC chip are mounted on one card has an external connection terminal board arranged at an arbitrary position on the card board, and a loop in advance. The antenna connection terminal of the antenna made of copper wire embedded in a shape, and the antenna connection terminal and an IC module embedded in a recess cut to a predetermined depth at an arbitrary position of the card substrate are connected. ing.

  That is, such a dual IC card exhibits a function by connecting an externally connected terminal board with an antenna that performs non-contact communication with an IC module incorporating a contact type and non-contact type IC chip. This connection method and structure is a point in manufacturing a durable dual IC card.

  More specifically, as one form of commercialization in an IC card using the IC chip, an IC chip is mounted on an antenna sheet, and an antenna pattern (coil) is provided on the antenna sheet for a non-contact card function. For the contact type card function, an IC non-mounting external connection terminal board that can guarantee the position of the external connection terminal defined in ISO7816 is provided, and a connection land is provided on the IC non-mounting external connection terminal board to Although a method of electrically connecting has been developed, the biggest problem here is to ensure the reliability of the connection.

  Therefore, as a prior example of a method for ensuring the reliability of connection of such a dual IC card, a dual interface card and a manufacturing method thereof have been proposed. (For example, refer to Patent Document 1).

  As the contents of this proposal, a technique of a dual IC card using a tab board (IC non-mounted external connection terminal board) is disclosed. As shown in FIGS. 17 and 18, a means for ensuring connection reliability is disclosed. As described above, the bump (36) provided on the tab substrate (35) is melted by ultrasonic waves and electrically connected to the antenna substrate (31). The tab substrate (35) is connected to the card body (34) by a two-component adhesive. Adhesive fixing to.

  Conventionally, as an electrical connection method, a conductive resin is used, and as a method of bonding a tab substrate, various methods such as using a hot melt adhesive are conceivable. Is how to ensure the reliability of the electrical connection.

  However, in the above-mentioned preceding case, the technology about the configuration and manufacturing method of the dual IC card is disclosed. However, if the connection part is arranged on the outer peripheral part, the joint starts to peel once due to bending stress or the like. It may suddenly proceed and the wire may be completely disconnected, leaving uncertainties in connection reliability.

Prior art documents are shown below.
Japanese Patent Laid-Open No. 2004-13855

  The present invention is intended to solve such a problem of the prior art, and is applied to a connection land (pad) of an external connection terminal board (IC non-mounted external connection terminal board) on which an IC is not mounted and an antenna sheet. It is an object of the present invention to provide an IC non-mounted external connection terminal board type dual IC card in which the joint portion between the arranged antenna pattern and the connection pattern is excellent in reliability.

  The present invention has been made to solve the above problems, and the invention according to claim 1 of the present invention provides an IC chip (1) having a function of a contact type and a non-contact type with an antenna pattern. (Antenna coil) Mounted on an antenna sheet (film) (2) having (5), embedded in a card base (3), and then simultaneously formed with a recess (4) in the card base (3) The pattern (5) is exposed, and the IC non-mounted external connection terminal board (6) is embedded and fixed in the recess (4) of the card base (3), and at the same time, the outside of the IC non-mounted external connection terminal board (6). IC non-mounting in which the connection terminal (7) and the antenna pattern (5) arranged on the antenna sheet (2) are electrically connected and fixed via a conductor (conductive resin, cream solder, etc.) (8) For external connection terminal board type dual IC card The IC non-mounting external connection terminal board (6) is a double-sided board, and is disposed on the connection land (pad) (9) of the IC non-mounting external connection terminal board (6) and the antenna sheet (2). An IC characterized in that the joint portion of the antenna pattern (5) with the connection pattern (5A) is provided outside the external connection terminal region (14) defined in ISO7816 on the center side of the substrate (6). This is a non-mounted external connection terminal board type dual IC card.

  The invention according to claim 2 of the present invention is the IC non-mounted external connection terminal board type dual IC card according to claim 1, wherein the total thickness of the IC non-mount external connection terminal board (6) is 0.2-0. An IC non-mounted external connection terminal board type dual IC card characterized by being in a range of 4 mm.

  The invention according to claim 3 of the present invention is the IC non-mounting external connection terminal board type dual IC card according to claim 1 or 2, wherein the antenna pattern (5) is formed on the back side of the IC non-mounting external connection terminal board (6). The IC non-mounting external connection terminal board type dual IC card characterized in that a part of the IC card is disposed.

  The IC non-mounting external connection terminal board type dual IC card according to the present invention has an IC chip having a contact type and a non-contact type function mounted on an antenna sheet (film) having an antenna pattern (antenna coil), After embedding in the card base, forming a recess in the card base and simultaneously exposing the antenna pattern, and fixing the IC non-mounted external connection terminal board in the recess of the card base and at the same time the non-IC external connection IC non-mounting external connection terminal board type dual IC card in which the external connection terminals of the terminal board and the antenna pattern arranged on the antenna sheet are electrically connected and fixed via a conductor (conductive resin, cream solder, etc.) The IC non-mounting external connection terminal board is a double-sided board, and the connection land (pad) of the IC non-mounting external connection terminal board and the above-mentioned Even when bending stress is applied to the card, the joint portion of the antenna pattern arranged on the antenna sheet and the connection pattern of the antenna pattern is provided inside the external connection terminal area defined by ISO 7816 on the center side of the substrate. Since the joint is excellent in reliability and is hardly affected by the pressing force of the reader / writer for communication with an external device, the connection reliability of the joint can be improved.

Also, by thickening the non-IC external connection terminal board consisting of double-sided boards in the range of 0.2 to 0.4 mm, the rigidity of the board is increased, and even when bending stress is applied to the card, the bending stress is externally connected. Because the deformation of the external connection terminal board is alleviated by absorbing the card base around the terminal board inferior in rigidity, it is possible to improve the reliability of the connection at the joint of the connection land with the connection pattern group of the antenna sheet. it can.

  Furthermore, by arranging a part of the antenna pattern on the back side of the IC non-mounting external connection terminal board, the degree of freedom in designing the antenna pattern in the antenna sheet is increased, for example, providing a jumper circuit in the antenna sheet, This eliminates the need for double-sided wiring to the antenna sheet and through-hole connection, and has the advantage that the product can be produced at low cost.

  An embodiment of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a plan view showing one embodiment of a state in which a partially lacking antenna pattern is provided on an antenna sheet constituting an IC non-mounted external connection terminal board type dual IC card according to the present invention. FIG. 3 is an explanatory view for explaining the operating state of a partially lacking antenna pattern provided on an antenna sheet constituting an IC non-mounted external connection terminal board type dual IC card according to the present invention, and FIG. 3 is an IC according to the present invention. Side cross-section showing one embodiment of a state before an IC chip is mounted on an antenna sheet having a partially lacking antenna pattern constituting a non-mounted external connection terminal board type dual IC card, and then sandwiched between card substrates and stacked FIG. 4 is a diagram showing an antenna pattern having a partially lacking antenna pattern constituting an IC non-mounted external connection terminal board type dual IC card according to the present invention. FIG. 5 is a side cross-sectional view showing an embodiment of a laminated body that is sandwiched and stacked between card substrates after mounting an IC chip on a tena sheet, and FIG. 5 is an IC non-mounted external connection terminal board type dual IC card according to the present invention. FIG. 6 is a plan view illustrating a state in which a position where an IC non-mounting external connection terminal board is disposed is milled to expose each connection terminal of the antenna sheet, and FIG. 6 is a cross-sectional view taken along line AA in FIG. 7 is a side sectional view taken along line BB in FIG. 5, and FIG. 8 is a side sectional view of an IC non-mounted external connection terminal board constituting an IC non-mounted external connection terminal board type dual IC card according to the present invention. 9 is a plan view showing the state of the surface of an IC non-mounted external connection terminal board constituting the IC non-mounted external connection terminal board type dual IC card according to the present invention, and FIG. 10 is an IC non-mounted according to the present invention. External connection terminal group FIG. 11 is a plan view showing the state of the back surface of the IC non-mounted external connection terminal board constituting the type dual IC card, and FIG. 11 is an IC non-mounted external connection in the IC non-mounted external connection terminal board type dual IC card according to the present invention. FIG. 12 is a plan view illustrating a state in which the antenna pattern of the terminal board and the antenna pattern of the antenna sheet are connected, FIG. 12 is a cross-sectional view taken along line AA in FIG. 11, and FIG. FIG. 14 is an explanatory diagram for explaining the bending stress state of the IC non-mounted external connection terminal board in the IC non-mounted external connection terminal board type dual IC card according to the present invention, and FIG. A state in which an antenna pattern is provided as a jumper pattern on the back surface of an IC non-mounting external connection terminal board constituting the IC non-mounting external connection terminal board type dual IC card according to the present invention. FIG. 16 is a plan view showing a state where the antenna pattern of the IC non-mounted external connection terminal board type dual IC card is provided as a jumper pattern in the IC non-mounted external connection terminal board type dual IC card according to the present invention. is there.

An IC non-mounted external connection terminal board type dual IC card (A) according to one embodiment of the present invention includes an IC chip (1) having a contact type and a non-contact type function, and an antenna pattern (antenna coil) (5). Is mounted on an antenna sheet (film) having (2) and embedded in a card substrate (3), and then a recess (4) is formed in the card substrate (3) and at the same time the antenna pattern (5) is exposed. The IC non-mounting external connection terminal board (6) is embedded and fixed in the recess (4) of the card base (3), and at the same time, The non-IC external connection terminal board type dual in which the antenna pattern (5) arranged on the antenna sheet (2) is electrically connected and fixed via a conductor (conductive resin, cream solder, etc.) (8) Before IC card The IC non-mounting external connection terminal board (6) comprises a double-sided board, and the antenna pattern (9) disposed on the connection land (pad) (9) of the non-IC mounting external connection terminal board (6) and the antenna sheet (2) ( 5) The connection portion (5A) to the connection pattern (5A) is provided outside the external connection terminal region (14) defined by ISO 7816 on the center side of the substrate (6). This is a connection terminal board type dual IC card.

  The structure and constituent materials of the IC non-mounted external connection terminal board type dual IC card will be described in detail.

  First, the antenna sheet (2) includes, for example, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), acrylonitrile-butadiene-styrene copolymer (ABS), acrylic resin, polycarbonate (PC), An insulating sheet (film) such as polyvinyl chloride (PVC) can be used alone or in combination. The thickness of the antenna sheet (film) (2) is preferably in the range of 15 to 200 μm.

  After bonding a copper foil or aluminum foil having a thickness of 15 to 50 μm provided on such an antenna sheet (2), an antenna pattern (5) formed by etching was disposed.

  The antenna sheet (2) includes a first connection pattern group for connection to a connection land (pad) of an IC chip (1) and a connection land (pad) (9) of an IC non-mounted external connection terminal board (6). And a second connection pattern group for connection.

  The IC chip (1) is anisotropically conductive between a first connection pattern group of the antenna sheet (2) and a bump (projection electrode) provided on a connection land (pad) of the IC chip (1). And mounted on the antenna sheet (2) face down with an adhesive sheet (ACF) interposed.

  As shown in FIG. 3, the antenna sheet (2) having the above structure is sandwiched between upper and lower insulating card bases (3, 3), thermoformed, and as shown in FIG. An 8 mm laminate is formed.

  The card substrate (3) can be made of the same material as the antenna sheet (2) described above. For example, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), acrylonitrile-butadiene-styrene An insulating sheet (film) such as a polymer (ABS), an acrylic resin, polycarbonate (PC), or polyvinyl chloride (PVC) can be used alone or as a composite. The thickness of the card substrate (3) is preferably in the range of 0.1 to 0.3 mm.

  As shown in FIGS. 5 to 7, a recess (4) for embedding an IC non-mounting external connection terminal substrate (6) is formed in the laminate by milling, and at the same time, a second connection pattern group of the antenna sheet (2) To expose.

  On the other hand, as shown in FIGS. 8 to 10, the IC non-mounting external connection terminal board (6) becomes an external connection terminal (7) on one side of an insulating substrate (glass epoxy base) (10) such as glass epoxy. Form a conductor. The external connection terminal (7) has a configuration in which nickel plating and gold plating are performed after a predetermined pattern is formed by etching a copper foil bonded to a glass epoxy substrate.

  The total thickness of the IC non-mounted external connection terminal board (6) is preferably in the range of 0.2 to 0.4 mm. In general, a substrate of 0.2 mm or less is often used.

  The IC non-mounting external connection terminal board (6) is electrically connected to the surface of the glass epoxy base (10) through the external connection terminal (7) and the through hole (11) through the glass epoxy base (10). A conductor made of a plurality of copper foils is formed, and after the connection land (9) is formed at a position corresponding to the second connection pattern group of the antenna sheet (2), nickel plating and gold plating are formed on the conductor. It has been subjected.

  The connection land (9) is provided in the vicinity of the center of the IC non-mounting external connection terminal board (6). Further, on the surface of the glass epoxy base material (10) of the IC non-mounted external connection terminal board (6), an antenna forming circuit pattern (5B) which becomes a part of the antenna pattern (5) of the antenna sheet (2) and a connection land (9) is formed by performing nickel plating and gold plating on the copper foil.

  As shown in FIG. 11, the antenna pattern (5) of the IC non-mounting external connection terminal board (6) and the antenna pattern (5) of the antenna sheet (2) are connected, whereby the antenna of this card (A) is connected. Pattern (5) is completed. As shown in FIGS. 12 and 13, the IC non-mounting external connection terminal board (6) temporarily fixes an adhesive tape (12) made of a hot melt sheet or the like at a predetermined position on the outer periphery of the board (6). Then, it is placed and fixed in a predetermined recess (4) of the card substrate (3).

  At the same time, the connection element between the connection land (9) of the IC non-mounted external connection terminal board (6) and the second connection pattern group of the antenna sheet (2) is a conductive material such as cream solder or silver conductive resin. It is electrically connected and fixed through the body (8).

  The specific method of connecting and fixing is to press and heat from the external connection terminal surface of the IC non-mounting external connection terminal board (6) to melt the cream solder or to cure the silver conductive resin, The connection land (9) provided on the mounting external connection terminal board (6) and the second connection pattern group of the antenna sheet (2) are joined.

  In the IC non-mounted external connection terminal board type dual IC card constituted by the above means, in the present invention, the IC non-mount external connection terminal board (6) is a double-sided board, and the IC non-mount external connection terminal board ( 6) The connection land (pad) (9) and the connection pattern (5A) of the antenna pattern (5) arranged on the antenna sheet (2) are connected to ISO 7816 on the center side of the substrate (6). The point of the invention is that it is provided inside the external connection terminal region (14) to be defined.

  That is, by using a double-sided board as the IC non-mounting external connection terminal board (6), (1) the second connection pattern group of the antenna sheet (2) on the center side of the external connection terminal board (6) and Connection lands (9) can be provided. The region is inside the external connection terminal region (14) defined in ISO7816. As an effect, the outer peripheral portion of the external connection terminal board (6) can be securely bonded and fixed to the concave portion (4) of the card, and it is difficult to peel off due to bending stress applied from the outside. Reliability can be improved. In addition, since the terminal area defined in ISO7816 is avoided, the connection reliability of the joint is improved because it is hardly affected by the pressing force of the connection terminal (not shown) of the reader / writer for communication with an external device. Can be made.

  (2) The total thickness of the external connection terminal board (6) is increased to 0.2 to 0.4 mm. (In general, a substrate of 0.2 mm or less is often used). As shown in FIG. 14, the effect is that the rigidity of the board (6) is increased, and even when bending stress is applied to the card, the bending stress is inferior to the rigidity around the external connection terminal board (6). Since the deformation of the external connection terminal board (6) is alleviated by absorbing the material, the connection reliability at the joint portion of the connection land (9) with the connection pattern group of the antenna sheet (2) can be improved. . That is, the curvature of the terminal portion is large at the time of bending (not much bent), the curvature of the card base material portion is small, and the base material portion absorbs bending stress, thereby improving the reliability of the terminal portion.

  (3) A part of the antenna pattern (5) can be disposed on the back side of the external connection terminal board (6). As an effect thereof, as shown in FIGS. 15 and 16, the antenna pattern (5) in the antenna sheet (2) is designed by providing a part of the antenna pattern (5) on the back side of the substrate (6). For example, by providing the antenna pattern (5) of the IC non-mounted external connection terminal board (6) as a jumper pattern, the jumper pattern of the antenna sheet (2) can be eliminated, and only on one side An antenna pattern (5) can be formed. Therefore, there is no need to provide a jumper pattern on the antenna sheet (2), or to connect the through-hole (11) by double-sided wiring to the antenna sheet (2), so that the product can be produced at low cost.

  Next, a technique that reflects the contents listed in the above points of the invention will be described more specifically.

  As shown in FIGS. 1 and 2, an antenna pattern (a part of the antenna pattern (5) is missing at a position corresponding to the IC non-mounted external connection terminal board (6) on the antenna sheet (2)). 5) is provided. In this state, the antenna pattern (5) is lacking between the two points, so that non-contact external communication cannot be performed.

  9 and 10 show the IC non-mounting external connection terminal board (6) side, this missing part (13) is shown as the antenna pattern (5) of the board (6) in FIG. . As will be described later, the missing portion (13) is formed as a circuit by connecting and disposing the IC non-mounted external connection terminal substrate (6) with cream solder.

  By providing such an antenna pattern (5), as shown in FIG. 2, even if the IC chip (1) is mounted on the antenna sheet (2), the antenna pattern (5) is partially absent. However, non-contact communication cannot be performed, but the functional inspection after mounting the IC chip (1) can be performed with the missing part (13) short-circuited.

  After mounting the IC chip (1) on the antenna sheet (2) provided with the antenna pattern (5) partially lacking as described above, as shown in FIG. 3, the IC chip (1) is sandwiched and thermoformed. Then, as shown in FIG. 4, a laminate is formed.

  As shown in FIGS. 6 and 7, the laminated body formed by thermoforming is coated with a cream solder conductor (8) on the exposed connection pattern, and the IC non-mounting exterior as shown in FIG. A connection terminal board (6) is arranged. The external connection terminal board surface of the IC non-mount external connection terminal board (6) is pressurized and heated to melt the solder, and as shown in FIGS. 12 and 13, the IC non-mount external connection terminal board (6) Each connection land (9) and each connection pattern (5A) of the antenna pattern (5) are joined. The conductor (8) may be made of silver conductive resin instead of solder.

As shown in FIGS. 15 and 16, the antenna pattern (5) provided on the IC non-mounting external connection terminal board (6) can be provided as a jumper pattern.

  As described above, the IC non-mounted external connection terminal board type dual IC card (A) according to one embodiment of the present invention has an IC chip (1) having a contact type and non-contact type function, and an antenna pattern (antenna After mounting on the antenna sheet (film) (2) having the coil (5) and embedding in the card base (3), the concave portion (4) is formed on the card base (3) and the antenna pattern ( 5) is exposed, and the IC non-mounting external connection terminal board (6) is embedded and fixed in the recess (4) of the card base (3), and at the same time, external connection of the IC non-mounting external connection terminal board (6) is performed. An IC non-mounting external in which the terminal (7) and the antenna pattern (5) arranged on the antenna sheet (2) are electrically connected and fixed via a conductor (conductive resin, cream solder, etc.) (8) Connection terminal board type dual IC car The IC non-mounting external connection terminal board (6) is a double-sided board, and is disposed on the connection land (pad) (9) of the IC non-mounting external connection terminal board (6) and the antenna sheet (2). Since the joint portion of the antenna pattern (5) with the connection pattern (5A) is provided outside the external connection terminal region (14) defined in ISO 7816 on the center side of the substrate (6), it is bent to the card. Even when stress is applied, since the joint is excellent in reliability and is hardly affected by the pressing force of the reader / writer for communication with an external device, the connection reliability of the joint can be improved.

  Also, when the IC non-mounting external connection terminal board (6) made of a double-sided board is made thick within the range of 0.2 to 0.4 mm, the board becomes rigid and bending stress is applied to the card (A). However, since the bending stress is absorbed by the card base (3) inferior in rigidity around the external connection terminal board (6) and the deformation of the external connection terminal board (6) is relieved, the connection pattern of the antenna sheet (2) It is possible to improve the connection reliability at the joint portion of the connection land (9) with the group.

  Furthermore, by arranging a part of the antenna pattern (5) on the back side of the IC non-mounted external connection terminal board (6), the degree of freedom in designing the antenna pattern (5) in the antenna sheet (2) is increased. For example, there is no need to provide a jumper pattern on the antenna sheet (2) or to connect through holes by double-sided wiring to the antenna sheet (2), so that the product can be produced at low cost.

It is a top view which shows one Example of the state which provided the antenna pattern partially missing on the antenna sheet | seat which comprises the IC non-mounting external connection terminal board | substrate type dual IC card which concerns on this invention. It is explanatory drawing explaining the operation state of the antenna pattern partially lacked provided on the antenna sheet | seat which comprises the IC non-mounting external connection terminal board | substrate type dual IC card which concerns on this invention. An embodiment of a state before an IC chip is mounted on an antenna sheet having a partially lacking antenna pattern constituting an IC non-mounted external connection terminal board type dual IC card according to the present invention, and is then sandwiched between card substrates and stacked. It is a sectional side view which shows an example. One Example of Stacked Laminate After IC Chip is Mounted on Antenna Sheet Having Partially Missing Antenna Pattern to Configure IC Non-Mounting External Connection Terminal Board Type Dual IC Card According to the Present Invention FIG. FIG. 6 is a plan view for explaining a state in which a position where an IC non-mounting external connection terminal board is arranged is milled to expose each connection terminal of the antenna sheet in the IC non-mounting external connection terminal board type dual IC card according to the present invention. . It is the sectional view on the AA line side of FIG. FIG. 6 is a side sectional view taken along line BB in FIG. 5. It is a sectional side view of the IC non-mounting external connection terminal board constituting the IC non-mounting external connection terminal board type dual IC card according to the present invention. It is a top view which shows the state of the surface of the IC non-mounting external connection terminal board | substrate which comprises the IC non-mounting external connection terminal board type | mold dual IC card based on this invention. It is a top view which shows the state of the back surface of the IC non-mounting external connection terminal board which comprises the IC non-mounting external connection terminal board type dual IC card which concerns on this invention. FIG. 6 is a plan view for explaining a state in which the antenna pattern of the IC non-mounted external connection terminal board and the antenna pattern of the antenna sheet are connected in the IC non-mounted external connection terminal board type dual IC card according to the present invention. It is the sectional view on the AA line side of FIG. It is the BB line sectional view of FIG. FIG. 5 is an explanatory diagram for explaining a bending stress state of an IC non-mounted external connection terminal board in the IC non-mount external connection terminal board type dual IC card according to the present invention. It is a top view which shows the state which provided the antenna pattern as a jumper pattern in the back surface of the IC non-mounting external connection terminal board which comprises the IC non-mounting external connection terminal board type dual IC card concerning this invention. FIG. 6 is a plan view showing a state where the antenna pattern of the IC non-mounted external connection terminal board is provided as a jumper pattern in the IC non-mount external connection terminal board type dual IC card according to the present invention. It is process sectional drawing explaining the manufacturing method of the conventional IC non-mounting external connection terminal board type | mold dual IC card. It is a top view which shows one Example of the conventional IC non-mounting external connection terminal board type | mold dual IC card.

Explanation of symbols

A ... IC non-mounted external connection terminal board type dual IC card 1 ... IC chip 2 ... Antenna sheet (film)
3 ... Card base material 4 ... Recess 5 ... Antenna pattern (antenna coil)
5A ... Antenna pattern connection pattern 5B ... Antenna forming circuit pattern 6 ... Non-IC external connection terminal board 7 ... External connection terminal 8 ... Conductor 9 ... Connection land (pad)
10 ... Insulating substrate (glass epoxy base material)
DESCRIPTION OF SYMBOLS 11 ... Through-hole 12 ... Adhesive tape 13 ... Missing part 14 ... External connection terminal area prescribed | regulated to ISO7816 31 ... Antenna board 34 ... Card body 35 ... Tab board 36 ... -Bump 37a ... Wiring pattern 41 ... IC chip

Claims (3)

  When an IC chip having a contact type and a non-contact type function is mounted on an antenna sheet (film) having an antenna pattern (antenna coil) and embedded in a card base, a concave portion is formed in the card base. At the same time, the antenna pattern is exposed, and the IC non-mounted external connection terminal board is embedded and fixed in the recess of the card base, and at the same time, the external connection terminals of the IC non-mounted external connection terminal board and the antenna pattern arranged on the antenna sheet , In an IC non-mounted external connection terminal board type dual IC card, which is electrically connected and fixed via a conductor (conductive resin, cream solder, etc.), the IC non-mounted external connection terminal board comprises a double-sided board, The connection land (pad) of the external connection terminal board not mounted with the IC and the connection pattern of the antenna pattern arranged on the antenna sheet Part central portion side IC non-mounting the external connection terminal board type dual IC card, characterized in that provided inside the outer external connection terminal area provided for in ISO7816 of the substrate.   2. The IC non-mounting external connection terminal board type dual IC card according to claim 1, wherein the total thickness of the non-IC mounting external connection terminal board is in a range of 0.2 to 0.4 mm.   3. The IC non-mounting external connection terminal board type dual IC card according to claim 1, wherein a part of the antenna pattern is disposed on the back side of the IC non-mounting external connection terminal board.