JPS6347265B2 - - Google Patents
Info
- Publication number
- JPS6347265B2 JPS6347265B2 JP57020917A JP2091782A JPS6347265B2 JP S6347265 B2 JPS6347265 B2 JP S6347265B2 JP 57020917 A JP57020917 A JP 57020917A JP 2091782 A JP2091782 A JP 2091782A JP S6347265 B2 JPS6347265 B2 JP S6347265B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- chip
- view
- cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004382 potting Methods 0.000 claims description 12
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 10
- 239000004800 polyvinyl chloride Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- -1 salt vinyl acetate Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
この発明は、ICチツプを装着もしくは内蔵し
たICカードに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC card equipped with or having an IC chip installed therein.
近年マイクロコンピユータ、メモリ等のICチ
ツプを装着もしくは内蔵したチツプカード、メモ
リカード、マイコンカード、電子カード等と呼ば
れるカード（以下、単にICカードとする）の研
究がなされている。 In recent years, research has been carried out on cards called chip cards, memory cards, microcomputer cards, electronic cards, etc. (hereinafter simply referred to as IC cards) that are equipped with or have built-in IC chips such as microcomputers and memories.
かかるICカードは従来の磁気ストライプカー
ドに比べ、その記憶容量が大きいことから、銀行
関係では預金通帳に代り預貯金の履歴、クレジツ
ト関係では買物等の取引履歴を記憶させようと考
えられている。このようなICカードは、必然的
にIC回路と外部のデータ処理装置等を電気的か
つ機械的に接続するための接続用電極を有し、こ
の接続用電極の設置方法としては、カード表面に
設ける方法と、カード端面に設ける方法とが考え
られている。しかしながら、後者の方法ではカー
ド基材内部に回路パターンを形成する必要があ
り、製造工程を不必要に複雑化させると共に、外
部データ処理装置の接続端子との電極接触面積が
充分にとれず、信頼性に乏しいという欠点を有し
ているため、ICカードにおける接続端子の設置
方法としては、接続用の電極面をカード表面に設
けることが望しい。 Since such IC cards have a larger storage capacity than conventional magnetic stripe cards, banks are considering storing the history of deposits and savings in place of passbooks, and credit cards are being used to store the history of transactions such as shopping. Such IC cards necessarily have connection electrodes for electrically and mechanically connecting the IC circuit to an external data processing device, etc., and the method for installing these connection electrodes is to place them on the card surface. Two methods are being considered: one method is to provide the card, and the other method is to provide it on the end face of the card. However, in the latter method, it is necessary to form a circuit pattern inside the card base material, which unnecessarily complicates the manufacturing process, and does not provide enough electrode contact area with the connection terminal of an external data processing device, making it unreliable. Therefore, as a method for installing connection terminals in an IC card, it is desirable to provide a connection electrode surface on the card surface.
このように、接続端子がカード表面に設けられ
たICカードにおいても、ICチツプをカード基材
内に完全に埋没させ、ICチツプの周囲をカード
基材で完全に包囲し、カード基材内部に電極を取
出すための導電性のパターンを加工形成すること
により、外部との接続用電極とICチツプとを接
続した形態のICカードが考えられている。しか
しながら、カード基材との一体成形の熱及び圧力
により、ICチツプ及びICチツプと回路パターン
との接続に対する信頼性が低下し、一体成形を行
なわない場合にはカードの層間剥離強度が低下し
たり、あるいはカードにそりが発生しやすい等の
問題があり、ICカードの製造ないしは構造とし
ては望しくない。 In this way, even in the case of an IC card in which connection terminals are provided on the card surface, the IC chip is completely buried in the card base material, the IC chip is completely surrounded by the card base material, and the IC chip is completely buried inside the card base material. An IC card is being considered in which an electrode for connection with the outside and an IC chip are connected by processing and forming a conductive pattern for taking out the electrode. However, the heat and pressure of integral molding with the card base material lowers the reliability of the IC chip and the connection between the IC chip and the circuit pattern, and if integral molding is not performed, the delamination strength of the card may decrease. Otherwise, there are problems such as warping of the card, which is not desirable for the manufacture or structure of IC cards.
この発明はICカード内に設けるべきICチツプ、
回路パターンを含めた全ての電気的要素をモジユ
ール化することにより、信頼性の高いICカード
を提供することを目的としている。また、ICモ
ジユール部のみ剛性が増大してカードの柔軟性が
阻害され、カードが変形された場合にカードの破
損ならびにICモジユールの破損や断線などの発
生し易い用途を考慮して、カード基材自体の剛性
度を増加せしめたICカードを提供することをも
目的としている。 This invention describes an IC chip that should be installed in an IC card.
The aim is to provide highly reliable IC cards by modularizing all electrical elements, including circuit patterns. In addition, in consideration of applications where the rigidity of only the IC module increases and the flexibility of the card is inhibited, and the card is likely to be damaged if the card is deformed, as well as IC module damage or wire breakage, the card base material is Another purpose is to provide an IC card with increased rigidity.
以下にこの発明を説明する。 This invention will be explained below.
この発明はICカードに関し、ポツテイング枠
を硬質ポリ塩化ビニールとし、電極回路基板に
ICチツプをボンデイング装着すると共に、ポツ
テイング枠内をエポキシ樹脂のモールドにより一
体加工したICモジユールを、硬質ポリ塩化ビニ
ールで成るカード基体へ装着したものである。 This invention relates to an IC card, in which the potting frame is made of hard polyvinyl chloride and the electrode circuit board is
The IC chip is bonded and the inside of the potting frame is integrally molded with epoxy resin, and the IC module is attached to a card base made of hard polyvinyl chloride.
すなわち、第１図はこの発明によるICモジユ
ールの断面を示すものであり、第２図Ａはその上
部斜視図、同図Ｂはその下部斜視図、同図Ｃはそ
のモールド加工後の斜視図を示している。しかし
て、まず厚さ0.1mm程度のガラスエポキシフイル
ム基板１に、35μm厚の銅箔をラミネートしたプ
リント配線用フイルムを用いて所望のパターンを
得るためにエツチングした後、ニツケル及び金メ
ツキを行ない、外部との接続用電極パターン２及
び回路パターン３を形成した後、所望の大きさに
打抜く。接続用電極パターン２と回路パターン３
とは必要箇所においてスルーホール４により電気
的に接続する。そして、この回路パターン３上の
所定位置にICチツプ５をダイボンデングし、IC
チツプ５上の電極６と回路パターン３を導体７に
より、ワイヤボンデイング方式により接続する
（第２図Ｂ参照）。この部分はワイヤを使用しない
フエイスボンデング方式で実施することもでき、
その場合にはより薄いICモジユールを得ること
ができる。ICチツプ５と回路パターン３との必
要な接続を行なつた後に、エポキシ樹脂ポツテイ
ング時の流れ止め用に硬質ポリ塩化ビニールの材
質のポツテイング枠８をたとえばエポキシ系、ア
クリル系の接着剤等でガラスエポキシフイルム基
板１に取付け、エポキシ樹脂９を流し込んでモー
ルドする（第２図Ｃ参照。）
このとき、比較的粘度が高い（105CPS程度）
エポキシ樹脂でまずスルーホール４を隠し、充分
硬化したことを確認した後に、低粘度（103CPS
程度）のエポキシ樹脂を流し込む方法をとれば、
スルーホール４を通してポツテイング用のエポキ
シ樹脂９が表面となる接続用電極パターン２側に
出ることを防ぐことができる。 That is, FIG. 1 shows a cross section of the IC module according to the present invention, FIG. 2A is a top perspective view, FIG. 2B is a bottom perspective view, and FIG. It shows. First, a glass epoxy film substrate 1 with a thickness of about 0.1 mm is etched using a printed wiring film laminated with a 35 μm thick copper foil to obtain a desired pattern, and then nickel and gold plating is performed. After forming the electrode pattern 2 for external connection and the circuit pattern 3, punching is performed to a desired size. Connection electrode pattern 2 and circuit pattern 3
It is electrically connected to through holes 4 at necessary locations. Then, the IC chip 5 is die-bonded to a predetermined position on this circuit pattern 3, and the IC chip 5 is
The electrodes 6 on the chip 5 and the circuit pattern 3 are connected by a conductor 7 using a wire bonding method (see FIG. 2B). This part can also be performed using the face bonding method, which does not use wires.
In that case, a thinner IC module can be obtained. After making the necessary connections between the IC chip 5 and the circuit pattern 3, a potting frame 8 made of hard polyvinyl chloride is glued to the glass with an epoxy or acrylic adhesive, etc., to prevent the epoxy resin from flowing when potting it. It is attached to the epoxy film substrate 1, and the epoxy resin 9 is poured in and molded (see Figure 2 C). At this time, the viscosity is relatively high (about 10 5 CPS).
First, hide the through hole 4 with epoxy resin, and after confirming that it is sufficiently cured, use a low viscosity resin (10 3 CPS).
If you use the method of pouring epoxy resin of
It is possible to prevent the epoxy resin 9 for potting from coming out through the through hole 4 to the side of the connection electrode pattern 2 which is the surface.
以上に述べた方法によりICカード用のICモジ
ユール１０を得ることができるが、回路パターン
３及び接続用電極パターン２を形成する方法や
ICチツプ５をボンデイングする方法を含めて、
ここで述べた方法のそれぞれは現在の関連業界に
おける技術で対応可能なものである。 Although the IC module 10 for an IC card can be obtained by the method described above, the method for forming the circuit pattern 3 and the connection electrode pattern 2 and
Including the method of bonding IC chip 5,
Each of the methods described herein is compatible with current technology in the relevant industry.
一方、このICモジユール１０を使用し、目的
のICカードを得るには以下の方法による。すな
わち、カード基材に硬質ポリ塩化ビニールを用い
た場合について述べると、第３図はICカードの
平面図であり、第４図は第３図のＡ―Ａ断面図で
ある。カード基材は0.56mm厚の乳白硬質ポリ塩化
ビニールで成るセンタコア１１にオフセツト印刷
またはシルクスクリーン印刷で表裏に所望の絵柄
１４を印刷した後、0.1mm厚の透明の硬質ポリ塩
化ビニールで成るオーバーシート１２を表裏に当
てがい、ステンレス等の鏡面に仕上げられた２枚
の金属板に挾持せしめ、温度150℃、圧力25Kg／
cm2、時間20分というラミネート条件で加熱加圧せ
しめて、0.76mm厚の硬質ポリ塩化ビニール積層体
（カード基材）を得ることができる。 On the other hand, the following method can be used to obtain a desired IC card using this IC module 10. That is, referring to the case where hard polyvinyl chloride is used as the card base material, FIG. 3 is a plan view of the IC card, and FIG. 4 is a sectional view taken along line AA in FIG. 3. The card base material is a center core 11 made of 0.56 mm thick opalescent hard polyvinyl chloride, and after printing the desired pattern 14 on the front and back sides by offset printing or silk screen printing, an oversheet made of 0.1 mm thick transparent hard polyvinyl chloride is used. 12 on the front and back, and sandwiched between two mirror-finished metal plates such as stainless steel, at a temperature of 150℃ and a pressure of 25kg/
A hard polyvinyl chloride laminate (card base material) with a thickness of 0.76 mm can be obtained by heating and pressing under the laminating conditions of cm 2 and 20 minutes.
また、磁気記録体／３を有するカード基材を得
るには、上述のセンタコア１１の表裏に積層する
オーバーシート１２のいずれかに、予め熱転写も
しくはストライプ塗工により磁気記録体１３付き
オーバーシートを作成し、所望の絵柄と位置合せ
をした後、上述と同様のラミネート条件により磁
気記録体硬質ポリ塩化ビニール積層体を得る。こ
の積層体をパターン化された所望寸法の抜型によ
り打抜くことによりカードを得る。しかして、カ
ードを得た後、ICモジユール１０と平面寸法が
同一もしくは若干大きく、かつICモジユール厚
と同等もしくは0.05mm程度深い凹部をエンドミル
もしくは彫刻機で切削し、ICモジユール１０の
装着部を形成する。 Moreover, in order to obtain a card base material having a magnetic recording body /3, an oversheet with a magnetic recording body 13 is prepared in advance by thermal transfer or stripe coating on either of the oversheets 12 to be laminated on the front and back sides of the center core 11 described above. After alignment with the desired pattern, a magnetic recording body hard polyvinyl chloride laminate is obtained under the same laminating conditions as described above. A card is obtained by punching this laminate using a patterned cutting die having a desired size. After obtaining the card, use an end mill or engraving machine to cut a recess that has the same planar dimensions as the IC module 10 or is slightly larger than the IC module 10, and is about 0.05 mm deep or the same as the IC module thickness, to form an attachment part for the IC module 10. do.
次に、凹部低面及び側面に２液硬貨型アクリル
樹脂接着剤１５、たとえばバーサロツク（ソニー
ケミカル社製）を用いてICモジユール１０を凹
部に固着される。かくして第３図に示すような
ICカードを作成することができる。 Next, the IC module 10 is fixed to the recess using a two-component coin-type acrylic resin adhesive 15, such as Versalock (manufactured by Sony Chemical), on the lower and side surfaces of the recess. Thus, as shown in Figure 3.
You can create an IC card.
一方、第５図はこの発明の他の実施例を示すも
のであり、表裏のオーバシート１２のセンタコア
１１側面に予め接着剤（塩酢ビ等）１６を塗布
し、印刷済センタコア１１をICモジユール１０
の大きさの寸法で打抜き穴を設ける。同様に、表
面用オーバシート１２にもICモジユール１０の
大きさの寸法の穴を設け、ICモジユール１０の
側面に上述と同様の接着剤１７を予め塗布してお
き、裏面オーバシート１２を含めて３層構成と
し、打抜き穴部へICモジユール１０を装着した
ものである。この場合、温度100℃、圧力30Kg／
cm2、時間20分の条件でラミネート一体化する。ま
た、ICモジユール１０の装着後に、予めその周
辺のみもしくはICモジユール１０を除く全体を
超音波ウエルダ加工しても良い。さらに、接着剤
１６，１７を使用せず、温度150℃、圧力25Kg／
cm2、時間15分のラミネート条件で熱融着して一体
化することも可能である。なお、第５図のような
場合、ICモジユール１０はオーバシート１２を
１枚（表用）、コアシート１２を１枚加えた厚さ
と同じ厚さとすれば良い。 On the other hand, FIG. 5 shows another embodiment of the present invention, in which an adhesive (salt vinyl acetate, etc.) 16 is applied in advance to the sides of the center core 11 on the front and back oversheets 12, and the printed center core 11 is attached to an IC module. 10
Punch holes with dimensions of . Similarly, a hole with the size of the IC module 10 is provided in the front oversheet 12, and the same adhesive 17 as described above is applied to the side surface of the IC module 10 in advance. It has a three-layer structure, and an IC module 10 is attached to the punched hole. In this case, the temperature is 100℃, the pressure is 30Kg/
cm 2 and laminated for 20 minutes. Further, after the IC module 10 is installed, only the periphery thereof or the entire IC module 10 except for the IC module 10 may be subjected to ultrasonic welding in advance. Furthermore, without using adhesives 16 and 17, at a temperature of 150℃ and a pressure of 25Kg/
It is also possible to heat-fuse and integrate under lamination conditions of cm 2 and 15 minutes. In the case shown in FIG. 5, the IC module 10 may have the same thickness as the sum of one oversheet 12 (for the front) and one core sheet 12.
一方、第６図Ａ，Ｂはポツテイング枠８Ａを電
極回路基板２より大きくした例であり、この場合
のICカードの製作は次のようにして行なう。す
なわち、カード基材のセンタコア１１にポツテン
グ枠８Ａと同じ大きさの穴を明け、オーバシート
１２に電極回路基板２と同じ大きさの穴を明け
る。そして、第５図の場合と同様に３層構成と
し、ICモジユール１０Ａを設置して熱圧ラミネ
ート（温度150℃、圧力25Kg／cm2、時間15分）も
しくは超音波ウエルダ加工により第７図に示すよ
うなICカードを構成する。なお、オーバシート
１２に接着剤を予め塗布してある場合は、温度
100℃、圧力30Kg／cm2、時間20分と熱条件は低温
でも良い。このICカードによれば表オーバシー
ト１２がICモジユール１０の一部を覆つて一体
化され、ICモジユール１０がカード基体から外
れる心配は極めて少ない。この場合のICカード
の平面図は、第８図に示すような構造となる。 On the other hand, FIGS. 6A and 6B show an example in which the potting frame 8A is larger than the electrode circuit board 2, and the IC card in this case is manufactured as follows. That is, a hole the same size as the potting frame 8A is made in the center core 11 of the card base material, and a hole the same size as the electrode circuit board 2 is made in the oversheet 12. Then, as in the case of Fig. 5, a three-layer structure is formed, and the IC module 10A is installed, followed by heat-pressure lamination (temperature 150°C, pressure 25 kg/cm 2 , time 15 minutes) or ultrasonic welding to form the structure shown in Fig. 7. Configure the IC card as shown. Note that if adhesive is applied to the oversheet 12 in advance, the temperature
The heat conditions may be as low as 100°C, pressure 30Kg/cm 2 , and time 20 minutes. According to this IC card, the front oversheet 12 covers a part of the IC module 10 and is integrated, so there is very little fear that the IC module 10 will come off from the card base. A plan view of the IC card in this case has a structure as shown in FIG.
また、第９図に示すICカードは上述第６図の
ICモジユール１０Ａを用いて作成したものであ
り、ICモジユール１０Ａのポツテイング枠８Ａ
の厚さ及び外形に合せて、その深さや大きさの凹
部を形成して第１凹部を成すと共に、さらにオー
バシートの厚さ分の深さと上記第１凹部の大きさ
よりも大きい第２凹部２０を設け、内方向に２段
形状の凹部を形成している。そして、この２段凹
部内にICモジユール１０Ａを装着し、第２凹部
の外形の大きさで内形は電極回路基板２の大きさ
に打抜かれたリング状のオーバシート１２Ａを重
ね、表面及び裏面から超音波ウエルダ加工を行な
つて一体化したものである。この場合のICカー
ドの平面図は第１０図に示すような構造となる。 In addition, the IC card shown in Figure 9 is the one shown in Figure 6 above.
It was created using IC module 10A, and potting frame 8A of IC module 10A.
A recess 20 having a depth and size corresponding to the thickness and outer shape of the oversheet is formed to form the first recess, and a second recess 20 having a depth equivalent to the thickness of the oversheet and a size larger than the first recess. A two-stage recess is formed inward. Then, the IC module 10A is installed in this two-stage recess, and a ring-shaped oversheet 12A punched out with the external size of the second recess and the internal size of the electrode circuit board 2 is overlapped, and the front and back surfaces are stacked. It was integrated by ultrasonic welding. A plan view of the IC card in this case has a structure as shown in FIG.
以上のようにこの発明のICカードによれば、
ポツテイング枠とカード基材が同一材質となつて
いることから加工が特に良好であり、接着強度も
従来に比べて一段と大きくなる。また、超音波ウ
エルダや熱圧着ラミネートが可能であり、接着強
度が向上すると共に、装着作業が容易であるとい
つた利点がある。 As described above, according to the IC card of this invention,
Since the potting frame and the card base material are made of the same material, processing is particularly good, and the adhesive strength is even greater than in the past. In addition, ultrasonic welding and thermocompression lamination are possible, which has the advantage of improved adhesive strength and easy installation work.
なお、上述の各実施例ではICカードに埋設す
るICチツプないしはICモジユールの数を１個と
しているが、これら埋設するICモジユールの数
は任意であり、ICモジユールの形状も任意であ
る。また、ICモジユール用に埋設するICチツプ
ないしは穴の形状も方形状、円形状でも良く、そ
の他任意の形状とすることが可能である。 In each of the embodiments described above, the number of IC chips or IC modules embedded in the IC card is one, but the number of embedded IC modules is arbitrary, and the shape of the IC module is also arbitrary. Furthermore, the shape of the IC chip or hole buried for the IC module may be square, circular, or any other shape.
第１図はこの発明に用いるICモジユールの断
面図、第２図Ａ〜Ｃはその上部斜視図、下部斜視
図及びそのモールド加工後の下部斜視図、第３図
はこの発明のICカードの平面図、第４図はその
Ａ―Ａの断面図、第５図はこの発明の他の実施例
によるICカードの断面図、第６図Ａ及びＢはこ
の発明に用いるICモジユールの他の例を示す上
部斜視図及び下部斜視図、第７図はこのICモジ
ユールを用いたICカードの断面図、第８図はそ
のICカードの平面図、第９図は第６図Ａ及びＢ
のICモジユールを用いたこの発明の他の実施例
を示すICカードの断面図、第１０図はそのICカ
ードの平面図である。
１…ガラスポキシフイルム基板、２…接続用電
極パターン、３…回路パターン、４…スルーホー
ル、５…ICチツプ、６…電極、７…導体、８，
８Ａ…ポツテイング枠、１０，１０Ａ…ICモジ
ユール。
FIG. 1 is a sectional view of an IC module used in the present invention, FIGS. 2A to C are an upper perspective view, a lower perspective view, and a lower perspective view after molding, and FIG. 3 is a plan view of an IC card of this invention. 4 is a cross-sectional view taken along line A-A, FIG. 5 is a cross-sectional view of an IC card according to another embodiment of the present invention, and FIGS. 6A and B are other examples of IC modules used in the present invention. 7 is a cross-sectional view of an IC card using this IC module, FIG. 8 is a plan view of the IC card, and FIG. 9 is a diagram of FIGS. 6A and B.
FIG. 10 is a cross-sectional view of an IC card showing another embodiment of the present invention using an IC module, and FIG. 10 is a plan view of the IC card. DESCRIPTION OF SYMBOLS 1...Glass poxy film board, 2...Connection electrode pattern, 3...Circuit pattern, 4...Through hole, 5...IC chip, 6...Electrode, 7...Conductor, 8,
8A...Potting frame, 10,10A...IC module.
Claims (1)
し、電極回路基板にICチツプをボンデング装着
すると共に、前記ポツテイング枠内をエポキシ樹
脂のモールドにより一体加工したICモジユール
を、硬質ポリ塩化ビニールで成るカード基体へ装
着したことを特徴とするICカード。1 The potting frame was made of hard polyvinyl chloride, an IC chip was attached to the electrode circuit board by bonding, and the IC module, which was integrally processed inside the potting frame by epoxy resin molding, was attached to the card base made of hard polyvinyl chloride. An IC card that is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57020917A JPS58138057A (en) | 1982-02-12 | 1982-02-12 | Integrated circuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57020917A JPS58138057A (en) | 1982-02-12 | 1982-02-12 | Integrated circuit card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58138057A JPS58138057A (en) | 1983-08-16 |
| JPS6347265B2 true JPS6347265B2 (en) | 1988-09-21 |
Family
ID=12040571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57020917A Granted JPS58138057A (en) | 1982-02-12 | 1982-02-12 | Integrated circuit card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138057A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0380359U (en) * | 1989-12-07 | 1991-08-16 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5914084A (en) * | 1982-07-15 | 1984-01-24 | Toppan Printing Co Ltd | Production of card incorporating ic or the like |
| DE3235650A1 (en) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | INFORMATION CARD AND METHOD FOR THEIR PRODUCTION |
| DE3248385A1 (en) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | ID CARD WITH INTEGRATED CIRCUIT |
| JPS60126864U (en) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | IC card |
| JPS60126863U (en) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | IC card |
| JPS6121097U (en) * | 1984-03-09 | 1986-02-06 | ソニー株式会社 | circuit device |
| JPS611850U (en) * | 1984-06-08 | 1986-01-08 | 松島工業株式会社 | semiconductor element |
| FR2599893B1 (en) * | 1986-05-23 | 1996-08-02 | Ricoh Kk | METHOD FOR MOUNTING AN ELECTRONIC MODULE ON A SUBSTRATE AND INTEGRATED CIRCUIT CARD |
| JPS63132460A (en) * | 1986-11-21 | 1988-06-04 | Mitsubishi Electric Corp | Thin semiconductor module substrate |
| US4943708A (en) * | 1988-02-01 | 1990-07-24 | Motorola, Inc. | Data device module having locking groove |
| JPH03114789A (en) * | 1989-09-29 | 1991-05-15 | Mitsubishi Electric Corp | Semiconductor-device card |
| EP0431493A3 (en) * | 1989-12-04 | 1992-01-08 | Konica Corporation | Method of preparing an ic card, and the apparatus for preparing the same |
| KR950704758A (en) * | 1993-10-18 | 1995-11-20 | 가나미야지 준 | IC module using it on data carrier |
| FR2838850B1 (en) * | 2002-04-18 | 2005-08-05 | Framatome Connectors Int | METHOD FOR PACKAGING ELECTRONIC MICROCIRCUITS FOR A CHIP CARD AND ELECTRONIC MICROCIRCUIT THUS OBTAINED |
-
1982
- 1982-02-12 JP JP57020917A patent/JPS58138057A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0380359U (en) * | 1989-12-07 | 1991-08-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58138057A (en) | 1983-08-16 |
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