WO1989001873A1 - Integrated circuit device and method of producing the same - Google Patents

Integrated circuit device and method of producing the same

Info

Publication number
WO1989001873A1
WO1989001873A1 PCT/JP1988/000842 JP8800842W WO8901873A1 WO 1989001873 A1 WO1989001873 A1 WO 1989001873A1 JP 8800842 W JP8800842 W JP 8800842W WO 8901873 A1 WO8901873 A1 WO 8901873A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
circuit
integrated
device
metal
surface
Prior art date
Application number
PCT/JP1988/000842
Other languages
French (fr)
Japanese (ja)
Inventor
Tatsuro Kikuchi
Yoshitsugu Uenishi
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/45Associating two or more layers
    • B42D25/465Associating two or more layers using chemicals or adhesives
    • B42D25/47Associating two or more layers using chemicals or adhesives using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/36Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373Metallic materials
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • HELECTRICITY
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B42D2033/00Structure or construction of identity, credit, cheque or like information-bearing cards
    • B42D2033/10Metallic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
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    • B42D2033/00Structure or construction of identity, credit, cheque or like information-bearing cards
    • B42D2033/32Other material
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B42D2033/00Structure or construction of identity, credit, cheque or like information-bearing cards
    • B42D2033/44Structure or construction of identity, credit, cheque or like information-bearing cards combined with other objects
    • B42D2033/46Structure or construction of identity, credit, cheque or like information-bearing cards combined with other objects with electrical circuitry
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
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    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/45Associating two or more layers
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
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    • H01L2924/18301Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Abstract

An integrated circuit device used for IC cards and the like, and a method of producing the same. The object is to provide a thin integrated circuit device that can be manufactured maintaining high dimensional accuracy and highly efficiently. To achieve the object, an integrated circuit element (12) is mounted on one side of a thin metal plate (11), the other side of which includes a plurality of terminals (11a) for connection to external units, and the integrated circuit element (12) is covered with a sealing resin (15) on said one side.

Description

Specification

The title of the invention

Integrated circuit device and manufacturing method thereof

Technical field

The invention IG Ca example - to a method of manufacturing an integrated circuit device Oyo patron used like de.

BACKGROUND

In recent years, microphone B co down Manipulator chromatography data is becoming so-called IC force de of onboard or built in the integrated circuit element plastic-made card, such as a memo Li is practically.

The IC card is different from the magnetic scan Bok la I Puka one de which is already used in large amounts, and a this storage capacity is excellent in size rather crime prevention, of a conventional magnetic striped force de applications it has been thought to be used in a wide variety of applications of identification, such as a fool]? a rather than.

In time and, IC force de is the plastic-made card, such as vinyl chloride resin, configuration der the integrated circuit device is mounted with a connection terminal with rie Da 'La Lee data, First external device the integrated circuit device, it is required to configure the extremely thin.

There are many kinds to the IC card, but the standardization of IG cards of the same dimensions as a conventional magnetic be sampled live card has been studied in the IS 0 (International Organization for Standardization). -

Hereinafter, a conventional IG force - de and will be described with reference to the accompanying drawings integrated circuits device used in this card.

The first o Figure is a perspective view of I c Ca ^ de, first 1 Figure A that put the first o Figure - sectional der], cross-sectional view showing the periphery of the integrated circuit device, the first Fig. 2 of the prior art it is a longitudinal sectional view of an integrated circuit device using a circuit board. Conventionally, numerous methods have been performed in the production method and the configuration of the IC force de, for example, first o Figure, as shown in the first FIG. 1, collected by having a thickness of 7 6 0 ^ about m a thin plastic card made 1, by using a d emissions de mil or preparative beam source emissions mold, a hole 2 in the size of the integrated circuit device 3 0 provided, slightly thinner by plastic-made card 1 insert the thickness Mino integrated circuit device 3 O into the bore 2, it is adhered and fixed in a state of exposing the external connection terminals 3 2.

Conventional integrated circuit device 3 O is was by UniNatsu Tei shown in the first 2 FIG. This U.S. Patent No. 4 2 6 4 9 1 der what was § "shown in the specification '] 3, full I Lum shaped insulation緣基plate 3 the external connection terminal pattern 3 2 1, circuit Noda down 3 3 and to a le ^ to form a circuit conductor of the hole 3 4, etc. to form a thin circuit board 3 1 a. and die integrated circuit device 35 in the thin-type circuit board 3 1 a. Bondi Ngushi, by the this integrated circuit device 35 of the input and output electrodes and circuit patterns down 3 3 Toowa I Young Bondi ring system and the like!) are connected by the metal wire 3 6. the sealing resin antirunning during resin encapsulation provided by bonding a frame 3 Y to the thin circuit board 3 1 a, by the sealing material 3 S such as an epoxy resin]) collecting product circuit element 3 5 the sealed by forming an integrated circuit device 3 O that not are you.

Meanwhile integrated circuit device 3 O mounted in IG card - Oite simultaneously with the thinning, it is required high reliability, a further low cost Bok high dimensional accuracy. However, in the Integrated Circuit device 3 O as described above, scan le over ho thin circuit board 3 1 A is use is have been conducted under the connection to the through-hole 3 4 forming a circuit conductor on both sides of Zerroku substrate 3 1 > "because it is double-sided circuit board with Le has a Do not Let Yo the following problems.

For IG cards is the thickness of the conventional magnetic scan tri Buka over de same § 6 and 0 soil so / m is required, the thickness of the integrated circuit device 30 to be embedded is subjected to rather large constraint. For example, plastic-made force as shown in FIG. 1 - is the case of the configuration IG card of the integrated circuit device 3 O in de 1 is embedded, remaining at the bottom of the hole 2 of the plastic-made card 1! ) Part ® of thickness, including the adhesive, for example 1 1 0 ± 5 0 // case of a m, the integrated circuit device 3 O is 6 5 O ± 3 0 // m thick which is embedded in the hole 2 it is necessary to limit to. As the basic dimensions for determining the thickness of the integrated circuit device 3 o, the sealing frame 3 7 of the first 2 view ® dimensions including meta thin circuit board 3 1 A is Ru critical and ¾. Its • Dimensions range with a ® dimension in manufacturing thin circuit board 3 1 A in order, for example, high accuracy is Ru require der be in the range of 6 5 0 ± 3 0 111, may this good Rukoto is very difficult der i to manufacture a thin circuit board 3 1 a of precision such? , Expensive flat-panel circuit board as a conclusion

3 has been a 1 A. As a result the thin circuit board 3 1 integrated circuit device equipped with A 3 O is also rather accurate thickness dimension difficulty obtained, and expensive ones and Tsuteita.

'Disclosure of the invention

The present invention has been made in view of the above problems, aims to be manufactured with high dimensional accuracy and high efficiency, inexpensively der]), to provide a thin integrated circuit device suitable for ic card it is an.

In order to solve the above problems, an integrated circuit device of the present invention, rather small one surface and the and ivy metal sheet also terminal part a plurality of external connection, onboard integrated on the other surface of the sheet metal and a circuit element, together with the other surface and are electrically connected to the metal sheet input and output electrodes of said integrated circuit device, the other surface side of said metal sheet, said integrated circuit device even without low, and this and electrical connection between the other surface of the integrated circuit element and the thin metal plate is obtained by those covered with the sealing resin. The external connection terminal is IG force - is obtained by the de of the input and output electrodes.

The present invention, it by the configuration described above, without the need for expensive precision circuit board which has been conventionally used, very common Re de full record over beam shape processed sheet metal in low cost can be used, inexpensive and Rubaka as an integrated circuit device]? Deruku, as a thin integrated circuit device suitable for IG card, Do and that can be produced with high dimensional accuracy and high efficiency o

BRIEF DESCRIPTION OF THE DRAWINGS

Plan view of an integrated circuit device in the first embodiment of Figure 1 the present invention, longitudinal sectional view of an integrated circuit device in the first embodiment of FIG. 2 the present invention, the first Figure 3 is the invention longitudinal sectional view for explaining a method of manufacturing an integrated circuit device in the embodiment of a longitudinal sectional view of an integrated circuit device of the second embodiment of FIGS. 4 and 5 present invention, FIG. 6 and 7 Figure is a longitudinal sectional view of an integrated circuit device in the embodiment of the present invention, FIG. 8 is a plan view of an integrated circuit device in the fourth embodiment of the present invention, the fourth embodiment of FIG. 9 is the invention longitudinal sectional view of the integrated circuits device in, first 1 O view is a perspective view of the IC card, fragmentary cross-sectional view of a first Figure 1 is an IC card, the first Fig. 2 a longitudinal sectional view of a conventional integrated circuit device is there. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of an integrated circuit device of the present invention will be described with refer to the accompanying drawings.

Plane Zudea of ​​the integrated circuit device in the first embodiment of Figure 1 the present invention! ), A sealing resin for explanation illustrates only external shape by a broken line. Figure 2 is a longitudinal sectional view of the first longitudinal section der of the integrated circuit device in the embodiment, of FIG. 1 B- lines of the present invention. In FIGS. 1 and 2, 1 1 metal sheet, 1 2 integrated circuit element, 1 3 adhesive, 1 4 metal wire, 1 5 is a sealing resin.

The configuration of the integrated circuit device of this embodiment will be described in detail below and its manufacturing method and monitor.

First, the thickness 0 1 5 «of the metal blank punched or off of copper alloy带状O DOO etching the Gyotsu -., The desired Li one de off Re

^ A "beam shape, the surface of the one external connection terminal 1 1 a The external connection terminal 1 1 a is, IC Ca -. Keru Contact to de integrated circuit device which serves as an external connection terminal der] ?, on one side, subjected to two Tsu underlying main luck and gold-edge of Kell, on the other side, in order to connect the metal wire 1 4 by the Waiyabo Ndi ring method, the two Tsu Kell partially subjected to Ginme luck only to the connecting portion after the underlying main luck, by the above-described process |.) have created a thin metal plate 1 1 us, is a strip of metal material, iron Ya in addition to the copper alloy iron-nickel alloy, such as a number of re-Waldorf-les-^ "metal for the beam material can be used, main Tsu key of the external connection terminal surface, platinum as a contact terminal in addition to the gold reliability can be ensured, mouth Jiu-time it may be subjected to a precious metal of the main luck and the like.

Then, the other surface 1 1 b of the metal sheet 1 1, was bonded and fixed to the integrated circuit device 1 2 using the adhesive 1 3 ing an insulating resin. The as the adhesive 1 3 using insulating resin, the position of the external connection terminals, integrated with respect to dimension the circuit element 1 2 is large Figure 1 Kute, solve plurality of thin metal plates 1 1 of FIG. 2 der to prevent electrical short circuit when mounted across, by the being use the adhesive 1 3 made of an insulating resin) integrated circuit device 1 2 of dimensional constraints and sheet metal 1 to be mounted 1 position, constraints on size, are both greatly reduced. ,

Next, the metal wire 1 4 using a metal thin wire having a diameter of 2 5 beta, the Wa Iyabonde by the I ring method j ?, integrated circuit device 1 2 O Denteko

And 1 2 a and the other surface 1 1 b of the metal sheet 1 1 were electrically connected. This electrical connection, in addition to the connection by a metal wire, by the word Lee Young-less Bondi packaging methods, such as unfavorable Ppuchi'-flops scheme or off Lee Lum key spear § system]? Can also be carried out.

After the necessary electrical connection between the integrated circuit device 1 2 of the input and output electrodes 1 2 a thin metal plate 1 1, molded in preparative lance off § molding using the sealing molding material such as epoxy resin by the sealing resin 1 5 J? to cover and protect the integrated circuits element 1 2 preliminary metal wire 1 4. This was cut and removed unnecessary portions of rie de frame (not shown). I to]) In this example of FIGS. 1 and 2 of the integrated circuit device is obtained.

Details tool described further with reference to Figure 3 a method for forming the above-mentioned sealing resin 1 5. Mounting the integrated circuit device 1 2 is bonded and fixed, the metal sheet 1 1 KoTsutari over Zadoff les over beam shape required electrical connections by metallic wires 1 4, heated to the molding temperature was collected by lance off the lower mold 1 6 a of the mold 1 et § molding is brought into close contact with the external connection terminal surface 1 1 a was brought into contact. Then after the clamping of the lower mold 1 6 a upper mold 1 et b, curing agent as a main component an epoxy resin, charge 塡剤 and sealing the molding material heating and pressing that from the other additives O direction of the arrow II in the mold 1 6 in a state]) injected and held fixed time for curing. Then DOO lance off § mold 1 6 Yo out preparative to give the integrated circuit device of FIG. 1 is cut remove the unnecessary portions of the rie de full record over beam shape. The external connection terminal surface 1 1 a is brought into close contact with preparative lance off § molding of the molding die 1 6 lower mold 1 6 a of the abutted is sealed to the external connection terminal surface 1 1 a der to prevent the flow of sealing resin, as a way to adhere, by the method of the air suction in the direction of arrow I After contact with the external connection terminals face to the lower mold '? been. Contact, 1 6 G Te 3 FIG smell Ah in Eabe down Bok for air ½ discharge of the mold 1 6 0

Dimensions of the integrated circuit device of the present embodiment of FIGS. 1 and 2, the data Te 1 O dew ® co 1 2, the four corners of the curvature radius of 1, 5 dew, thickness 0, 65 ∞ der] ?, extremely dimensional accuracy is good, Barakki of size was small der following · ± 1 o / m in thickness. Various dimensions of thickness, O elsewhere, the sheet metal 1 1 O · 1 5 dragon, the adhesive 1 3 O. 03 騮, integrated circuit device 1 2 Omicron. 2 5 騮, on the integrated circuit device 1 2 encapsulating resin 1 5 Omicron. Atsuta 2 2 thigh.

Further, sea urchin I shown in FIG. 2, co Na partial 1 5 a of the sealing resin 1 5 opposite to the surface 1 1 a Ru preparative external connection terminals at the integrated circuit device of this embodiment, the radius of curvature of about O . was 2 dragon of the curved surface. This integrated circuit device in the case of forming an IC card with 揷入 bonded into the hole of the plastic forces de, when bent IC power Dogaori] 9, a corner portion of an integrated circuit device ]) holes thin portion of the lower plastic-made card is to prevent from being broken. To the corner portions and curved surface, the Integrated Circuit device using a conventional circuit board while processing has been made complicated der difficult, the present embodiment

According 5, because it is molded using a mold, it can very easily formed

O

Further, as shown in FIG. 2, an integrated circuit device of this embodiment, the sealing was exposed around the external connection terminals and a surface 1 1 a Ru preparative external connection terminals of the metal sheet 1 1 the resin 1 Chino surface, is substantially flush with l O. This is 1 5 I one side 1 1 a sealing resin]? If allowed to protrude, at the time when carrying and using the IG card using the integrated circuit device, is external protrusion susceptible to power, this'll go-between sheet metal 1 1 剝離 Ya falling off, etc. is likely to occur the problem of whether we - are. Also when retracted by the sealing resin 1 5 one side 1 1 a

1 to 5, IC card of rie Da 'Writer - because prone to contact failure between the contact pin strips of the external device such as was each tool substantially the same surface of the above in order to avoid this .

Note that the method of forming the sealing resin 1 5, describes preparative La Nsufu § molding method using a sealing and molding material for the epoxy resin as a main component

There were 20, In addition, it rather it may also be used full eno Lumpur based resin as a sealing molding material, also be carried out by the injection molding method using a thermoplastic resin. - Next, a description integrated circuit device Ni'ite the second embodiment of the present invention, the FIGS. 4 and 5 Te use. FIGS. 4 and 5, the first

25 1 view of B - longitudinal section der at a portion corresponding to the line, but the structure with improved • the cross-sectional shape of the second view. Contact, Figure 2 the same marks Reference numerals "are the same or corresponding parts.

In Figure 4, the metal sheet 1 1 cross-sectional shape, Hopogogata preparative Ru O urchin, the area of the other surface side 1 1 of the external connection terminals, the external

5 by the area of ​​the surface of the connection terminal 1 1 a are rather large. Sheet metal

1 machining a first cross-section substantially the shape Gogata is the etching grayed rate of co emissions Toro Lumpur from both sides at the time of devising or E single switch ring processing with punch 抜金 type size and droplet exclusion method Method] )It can be carried out.

The In Figure 5, the metal sheet 1 1 is processed up by the less processing] off O over l O Mi ring, the external connection terminals exposed by the sealing resin 1 5 D

The area of ​​the other surface side 1 1 b of 1 1 a, by the area of ​​the surface of the sealing resin 1 5 exposed external connection terminal 1 1 a]) is rather large.

Uni I shown in FIGS. 4 and 5, the integrated circuit device of the second embodiment of the present invention, the area of ​​the other surface side of the metal sheet 1 1,

1 5 by the area of the external connection terminal 1 1 a are rather large. By the this area it is embedded in the encapsulating resin 1 5 of the sheet metal 1 1, since dew out externally ^ O area of the connecting terminal 1 1 a size Kunar, embedded in the encapsulating resin 1 5 It has been of the sheet metal 1 1, 剝離 from the sealing resin, projecting, leaving the like can be prevented.

0 Next, the integrated circuit device of the third embodiment of the present invention will be described with reference to FIGS. 6 and 7. Figure 6 and the § diagrams, FIG. 1 of B - is an improvement of the surface condition of the longitudinal 跻面 Figure der] ?, metal sheet of FIG. 2 Contact and Figure 4 at a portion corresponding to the line is there. Contact - Figure 2 the same marks marks ^ in the figure, abbreviated as 5 a] 9 described by the same or corresponding parts. In FIG. 6 and FIG. 7, the surface 1 1 b which is embedded in the encapsulating resin 1 5 of the sheet metal 1 1 is roughened. Roughening, • chemical light E Tsu quenching, by the physical processing such as off La Mesh-plated or San Dov Las door]) can be carried out. By the surface roughening treatment, further improves the adhesion between the metal thin plate 1 1 and the sealing resin 1 5,剝離from the sealing resin 1 5 of the sheet metal 1 1 which is embedded in the encapsulating resin 1 5 , projecting, leaving the like can be prevented.

As described above, FIG. 4, FIG. 5, the integrated circuit device of the second and third embodiments of the present invention shown in FIGS. 6 and 7, IC by using this integrated circuit device when the force ^ de, bending the IC power over de, threaded] J or IG Ca ^ "be pressurized E force by an external device such as a Li one loaders' Rye te de is applied, the sheet metal 1 1剝離 from the sealing resin 1 5, protruding, it is possible to prevent such withdrawal is the function of the integrated circuit device is unlikely impaired 搆成.

Next, the integrated circuit device of the fourth embodiment of the present invention, described? O

Figure 8 is a plan Zudea the fourth put in Example 'Ru integrated circuit device of the present invention, the encapsulating resin 1 5 for explanation are shown in broken lines only outline. Figure 9 is a longitudinal sectional view at the 4 C one CT line longitudinal sectional view der j ?, the S diagram of an integrated circuit device in the embodiment of the present invention. In Figure 8 and Figure 9, marks ^ Figure 1 in in FIG identical marks ^ is Ah at the same or corresponding parts.] 9, the manufacturing method also that not as in the first embodiment.

The configuration of the integrated circuit device of this embodiment will be described below. Uni I shown in Figure 8 and Figure 9, the integrated circuit device of the present embodiment., The planar shape of the sheet metal 1 1, in addition to the 1 1 A part for a plurality of external connection terminals, the integrated circuit device 1 2 a shape consisting of a support portion 1 1 B for mounting, mounting an integrated circuit device 1 2 in the support portion 1 1 B via the adhesives 1 3, and a configuration connected. In addition, eighth

5 As shown in Figure, in this embodiment, the support portion 1 1 B for mounting the integrated circuit device 1 2, as one of the extended portion of the ground terminal in the external connection terminal 1 1 A portion Te is provided, which is to secure the flatness of the sheet metal 1 1 overall. Contact support portion 1 1 B for mounting the integrated circuit device 1 2 may be provided independently of allowed io the external connecting terminal portions.

Mechanical strength against by the configuration described above, the integrated circuit device of this embodiment, the integrated circuit device 1 2 ¾ and to ride completely on a single sheet metal 1 1 Runode, bending of the integrated circuit device 1 2 There, a thin metal plate

Is 1 by the]) reinforcement, simultaneously pole manner ¾ response to the integrated circuit device 1 2

1 5 force concentration can be prevented, the integrated circuit device 1 2 of the destruction rather to difficulty occurs, Ruru very high integrated circuit device reliability.

Industrial Applicability

More good cormorants present invention comprises a sheet metal part also small instrument one side is Tsu Do a plurality of external connection terminals, and an integrated circuit element mounting is 0 the other surface of the sheet metal, the integrated circuit elements of the input and output electrode and the and the other surface of the sheet metal are electrically connected to the monitor, the other surface of the metals sheet, said integrated circuit device and the integrated circuit also rather Shoru since the electrical connection between the other surface of the element and the sheet metal is an integrated circuit device which is covered with the sealing resin, without requiring a 5 precise precision circuit board which has been conventionally used, quite generally inexpensive Matoru re. Zadoff les over beam shape of the sheet metal can be used, an inexpensive integrated circuit device. Moreover der what can be manufactured with high dimensional accuracy and high efficiency as a thin integrated circuit device suitable for IG card! ), Industrial value ¾ at large) Ru.

Five

l O

1 5

20

twenty five

Claims

. The scope of the claims
1. One surface least for the of the metallic thin plate became partially a plurality of external connection terminals, and a mounting integrated circuit devices on the other surface of the sheet metal, and the input and output electrodes of said integrated circuit device with other five surfaces and are electrically connected to the metal sheet, the other surface side of the metal sheet, and electrical connection between at least said integrated circuit element and the other surface of the integrated circuit element and the metal sheet There integrated circuit device which is covered with a sealing resin.
2. In the first aspect, an integrated circuit device external connection terminals of the metal sheet is input and output electrodes of the io IG card.
3. To the extent the first term or second term in the claims, a plurality of external area of ​​the other surface side of the metal sheet corresponding to each of the connecting terminals is good large area before Kigaibu connecting terminal integrated circuit device.
4. In the first term or claim 2, the integrated circuit device other surface of 1 5 Ru metal sheet Sessu the sealing resin is roughened.
5. In the first term or claim 2, the external connection terminals of the sheet metal, Integrated Circuit apparatus noble metal is formed by coating the substrate surface.
6 -. Least gold 0 genus sheet partially Tsu preparative terminal plurality of external connection also surface, and a mounting integrated circuit devices on the other surface of the sheet metal, the input and output electrodes of said integrated circuit device and with the other surface and are electrically connected to the metal sheet, wherein the other surface side of the metal sheet, electrical connections between the integrated circuit device and the other surface of the integrated circuit element and the metal sheet even rather small bets are 5 covered with a sealing resin, the sealing resin, the a plurality of between the external connection terminals or outwardly of that, the integrated circuit device which is exposed to the outside to the external connection terminal surface substantially the same plane. '
7. In the range 6 of claims, the integrated circuit device external connection terminals of the metal sheet is input and output electrodes of the IC power mode.
8. In Section 6 or Claim 7, a plurality of areas of the other surface side of the metal sheet corresponding to each of the external connection terminal is the area good sized before Kigaibu connecting terminal integrated circuit device .
9. In paragraph 6 or Claim 7, integrated circuit device other surface of the sheet metal that Sessu the sealing resin is roughened.
In 1 O. Range Section 6 or the § section according, external connection terminals sheet metal, a noble metal is formed by coating the substrate surface
1 1 -. With least even with the ivy sheet metal part terminal plurality of external connection surface and a mounting integrated circuit devices on the other surface of the metal sheet, the input and output electrodes of said integrated circuit device with the other surface and are electrically connected to the metal sheet, the other surface side of the metal sheet, and electrical connection between at least said integrated circuit element and the other surface of the integrated circuits element and the sheet metal We covered with the sealing resin, the sealing resin is co over Na portion of the opposite surface of the external connection terminal is a curved surface integrated circuit device.
. 1 2 Contact the first 1 wherein the claims, the external connection pin of sheet metal IG force - is an input-output electrode of de integrated circuit device.
1 3. In our the first 1 wherein the claims or the first two terms, the area of the other surface side of the metal sheet corresponding to each of the plurality of external connection terminals, the area of the external connection terminal] ? it is a large integrated circuit device.
. 4. In the first first term or the first two terms claims, the integrated circuit device other surface of the metal sheet in contact with the sealing resin is roughened.
1 5. In the range first first term or the first two terms of the claims, formation of the external connection terminals of the sheet metal, the noble metal on the substrate surface is coated
5 integrated circuit device.
1 6. And less of a surface even with the ivy sheet metal part terminal plurality of external connection, while being mounted on the other surface of the sheet metal, the input and output electrodes of that is electrically to the other surface of the sheet metal and connected integrated circuit elements, the other surface side of the metal sheet, a sealing resin covering even rather small and the electrical connection portion between io the integrated circuit device and the other surface of the input-output electrode and the metal sheet with the door, the integrated circuit device when it is mounted in One straddle the other surface of the plurality of metal thin plate together, electrical Ze' means between the other surface of the metal sheet and the integrated circuit device in the mounting portion integrated circuit device is provided.
1 5 In 1 completion. The first 6 wherein the claims, the integrated circuit device external connection pin of the sheet metal are the input and output electrodes of the IG force de.
In 1 8. The first item 6 or the first item 7 claims, the area of the other surface side of the metal sheet corresponding to each of the plurality of external connection terminals, the area of the external connection terminal! ) University and is an integrated circuit device.
O 1 9. In the first item 6 or the first item 7 claims, the integrated circuit device other surface of the metal sheet in contact with the sealing resin is roughened.
2 O. In the first item 6 or the first item 7 claims, the external connection terminals of the sheet metal, the integrated circuit device in which the noble metal is formed by coating the substrate surface.
5 2 1. In claims range '囲第1 item 6 or the first § section, electrically insulated • means and electrically insulating resin is used in an integrated circuit device.
2 2 -. Least even to partially ¾ ivy sheet metal with a plurality of external connection terminals of the surface, while being mounted on the other surface of the sheet metal, the input and output electrodes of its electricity to the other surface of the sheet metal connected to the collector
And 5 product circuit elements, the other surface side of the metal sheet, provided with the integrated circuit elements at least, and a sealing resin covering the electrical connection between the other surface of the input-output electrode and the metal sheet, the integrated circuits devices, integrated circuit devices mounted on the support portion of the sheet metal disposed between the plurality of external connection terminals.
In l O 2 3. The second item 2 claims, external connection pin of the sheet metal integrated circuit device is an input-output electrode of the IG card.
2 4. In the second item 2 or the second three-term claims, the area of the other surface side of the metal sheet corresponding to each of the plurality of external connection terminals, the I area of the external connection terminal 1? Large in a integrated circuit device.
1 5 2 5. In the second item 2 or the second three-term claims, the integrated circuit device other surface of the metal sheet in contact with the sealing resin is roughened.
2 6. In the second item 2 or the second three-term claims, the external connection terminals of the sheet metal, the integrated circuit device in which the noble metal is formed by coating the substrate surface.
In 20 2 §. The second item 2 or the second three-term claims, the support portion integrated circuit device is mounted, integrated circuit device according to any one of the extended portion of the plurality of external connection terminals.
2 8 -. Least a part of the surface is mounted an integrated circuit device on the other side of the sheet metal became more external connection terminals, then the integrated times
And another surface of the input-output electrode and the metal thin plate 25 channel element are electrically connected, • then after brought into close contact with the external connection terminal surface of the sheet metal in the molding die surface, small Ku Tomoko metal method of manufacturing an integrated circuit device to cover the electrical connection between the other surface side of the integrated circuit element and the other surface of the integrated circuit element and the sheet metal of the sheet in the sealing resin.
5 2 9. To the extent the second 8 of claims, method of manufacturing an integrated circuit device to come into close contact with the molding die surface by sucking external connection terminal surface.
l O
1 5
0
Five
PCT/JP1988/000842 1987-08-26 1988-08-25 Integrated circuit device and method of producing the same WO1989001873A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP62/212085 1987-08-26
JP21208587A JPS6455291A (en) 1987-08-26 1987-08-26 Integrated circuit device
JP63/38081 1988-02-19
JP3808188A JPH01210393A (en) 1988-02-19 1988-02-19 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR890070727A KR920008509B1 (en) 1987-08-26 1988-08-25 Integration circuits apparatus and manufacturing method

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WO (1) WO1989001873A1 (en)

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JPS6015786A (en) * 1983-07-06 1985-01-26 Dainippon Printing Co Ltd Ic card and its production
JPS61222715A (en) * 1985-03-28 1986-10-03 Mitsubishi Electric Corp Manufacture of resin molded body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993025978A1 (en) * 1992-06-09 1993-12-23 Gec-Avery Limited An integrated circuit card

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