JPS611850U - semiconductor element - Google Patents

semiconductor element

Info

Publication number
JPS611850U
JPS611850U JP8539084U JP8539084U JPS611850U JP S611850 U JPS611850 U JP S611850U JP 8539084 U JP8539084 U JP 8539084U JP 8539084 U JP8539084 U JP 8539084U JP S611850 U JPS611850 U JP S611850U
Authority
JP
Japan
Prior art keywords
semiconductor element
external lead
package
integrated circuit
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8539084U
Other languages
Japanese (ja)
Inventor
和成 市瀬
Original Assignee
松島工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松島工業株式会社 filed Critical 松島工業株式会社
Priority to JP8539084U priority Critical patent/JPS611850U/en
Publication of JPS611850U publication Critical patent/JPS611850U/en
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体素子の斜視図。 第２図は本考案の実施例を示す断面図。 第３図は本考案の実施例を示す斜視図。 第４図は本考案の使用例を示す斜視図。 第５図は本考案に関する系統図。３・・・集積回路、４
・・・電極、５・・・外部取出し電極、５ａ・・・外部
取出し電極５の端部、７・・・パッケージ、８・・・本
考案の半導体。 第６図は本考案の半導体素子収納部の平面図、第７図は
第６図の断面図。FIG. 1 is a perspective view of a conventional semiconductor device. FIG. 2 is a sectional view showing an embodiment of the present invention. FIG. 3 is a perspective view showing an embodiment of the present invention. FIG. 4 is a perspective view showing an example of use of the present invention. Figure 5 is a system diagram related to the present invention. 3... integrated circuit, 4
...electrode, 5...external lead-out electrode, 5a...end of external lead-out electrode 5, 7...package, 8...semiconductor of the present invention. FIG. 6 is a plan view of the semiconductor element housing portion of the present invention, and FIG. 7 is a sectional view of FIG. 6.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路に有する複数個の電極と各々に接続する外部取
出し電極とを１個のパッケージとして構成し、該外部取
出し電極の端部を該パッケージの表面近傍に配したこと
を特徴とする半導体素子。1. A semiconductor device comprising a plurality of electrodes included in an integrated circuit and external lead-out electrodes connected to each of them as a single package, and an end of the external lead-out electrode arranged near the surface of the package.
JP8539084U 1984-06-08 1984-06-08 semiconductor element Pending JPS611850U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8539084U JPS611850U (en) 1984-06-08 1984-06-08 semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8539084U JPS611850U (en) 1984-06-08 1984-06-08 semiconductor element

Publications (1)

Publication Number Publication Date
JPS611850U true JPS611850U (en) 1986-01-08

Family

ID=30635741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8539084U Pending JPS611850U (en) 1984-06-08 1984-06-08 semiconductor element

Country Status (1)

Country Link
JP (1) JPS611850U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196548A (en) * 1981-05-28 1982-12-02 Toshiba Corp Plastic chip carrier
JPS58138057A (en) * 1982-02-12 1983-08-16 Dainippon Printing Co Ltd Integrated circuit card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196548A (en) * 1981-05-28 1982-12-02 Toshiba Corp Plastic chip carrier
JPS58138057A (en) * 1982-02-12 1983-08-16 Dainippon Printing Co Ltd Integrated circuit card

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