JPS6018555U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6018555U JPS6018555U JP11114383U JP11114383U JPS6018555U JP S6018555 U JPS6018555 U JP S6018555U JP 11114383 U JP11114383 U JP 11114383U JP 11114383 U JP11114383 U JP 11114383U JP S6018555 U JPS6018555 U JP S6018555U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- abstract
- leads
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の平面透視図、第２図はＡ−
Ａ’線に沿った断面図である。第３図は本考案の一実施
例を示す半導体装置の平面透視図、第４図はそのＡ−Ａ
’線に沿った断面図である。
１・・・接地用リード、２，３・・・電極用リード。Figure 1 is a plan perspective view of a conventional semiconductor device, and Figure 2 is an A-
It is a sectional view along the A' line. FIG. 3 is a plan perspective view of a semiconductor device showing an embodiment of the present invention, and FIG. 4 is an A-A of the semiconductor device.
FIG. 1... Grounding lead, 2, 3... Electrode lead.
Claims (1)
するように配置された半導体装置において、前記第１お
よび第２のリードの先端部分に突起部が設けられている
ことを特徴とする半導体装置。A semiconductor device in which first and second leads are arranged to face each other with a third lead in between, characterized in that protrusions are provided at tip portions of the first and second leads. semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11114383U JPS6018555U (en) | 1983-07-18 | 1983-07-18 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11114383U JPS6018555U (en) | 1983-07-18 | 1983-07-18 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6018555U true JPS6018555U (en) | 1985-02-07 |
Family
ID=30258198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11114383U Pending JPS6018555U (en) | 1983-07-18 | 1983-07-18 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6018555U (en) |
-
1983
- 1983-07-18 JP JP11114383U patent/JPS6018555U/en active Pending
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