JPS6063953U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6063953U
JPS6063953U JP15379983U JP15379983U JPS6063953U JP S6063953 U JPS6063953 U JP S6063953U JP 15379983 U JP15379983 U JP 15379983U JP 15379983 U JP15379983 U JP 15379983U JP S6063953 U JPS6063953 U JP S6063953U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
mold part
resin mold
metal electrodes
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15379983U
Other languages
Japanese (ja)
Other versions
JPS6336696Y2 (en
Inventor
仙田 孝雄
Original Assignee
日本インター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インター株式会社 filed Critical 日本インター株式会社
Priority to JP15379983U priority Critical patent/JPS6063953U/en
Publication of JPS6063953U publication Critical patent/JPS6063953U/en
Application granted granted Critical
Publication of JPS6336696Y2 publication Critical patent/JPS6336696Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、従来のメルフ型半導体装置の斜視図、第2図
ないし第5図は本考案のメルフ型半導体装置の斜視図で
ある。 11 a、  11 by  11 c=樹脂モールド
部、12a、  12bt  12’ at  12’
 b=金属電極。
FIG. 1 is a perspective view of a conventional Melf-type semiconductor device, and FIGS. 2 to 5 are perspective views of Melf-type semiconductor devices of the present invention. 11 a, 11 by 11 c=resin mold part, 12a, 12bt 12' at 12'
b = metal electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレットが内蔵された樹脂モールド部の両端に前
記ペレットの金属電極を有する半導体装置において、前
記金属電極又は前記樹脂モールド部両端の径を互いに異
ならしめたことを特徴とする半導体装置。
1. A semiconductor device having metal electrodes of the pellet at both ends of a resin mold part in which a semiconductor pellet is embedded, characterized in that the metal electrodes or the resin mold part have different diameters at both ends.
JP15379983U 1983-10-05 1983-10-05 semiconductor equipment Granted JPS6063953U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15379983U JPS6063953U (en) 1983-10-05 1983-10-05 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15379983U JPS6063953U (en) 1983-10-05 1983-10-05 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS6063953U true JPS6063953U (en) 1985-05-07
JPS6336696Y2 JPS6336696Y2 (en) 1988-09-28

Family

ID=30340164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15379983U Granted JPS6063953U (en) 1983-10-05 1983-10-05 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6063953U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737238U (en) * 1980-08-11 1982-02-27
JPS58137241A (en) * 1982-02-10 1983-08-15 Hitachi Ltd Semiconductor device and preparation thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152364A (en) * 1978-05-19 1979-11-30 Toshiba Corp Power source device for electric-discharge lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737238U (en) * 1980-08-11 1982-02-27
JPS58137241A (en) * 1982-02-10 1983-08-15 Hitachi Ltd Semiconductor device and preparation thereof

Also Published As

Publication number Publication date
JPS6336696Y2 (en) 1988-09-28

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