JPS6336696Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention relates to semiconductor devices, and in particular, provides directionality to the external shape of the semiconductor device, and when assembling surface-mounted electronic equipment by automatic machinery, the electrical The present invention relates to a semiconductor device in which polarity can be easily aligned.

[Prior Art] There is a method for assembling so-called surface-mount electronic devices in which a conductor pattern is printed on a ceramic substrate and active elements such as diodes and transistors and passive elements such as resistors and capacitors are mounted on the conductor pattern.
It is being used in place of conventional printed circuit boards.

In semiconductor devices and the like used in so-called surface-mounted electronic devices, metal electrodes 2a and 2b are provided at both ends of a resin molded part 1, as shown in FIG. It is mounted on the conductor pattern and fixed by melting solder etc.

[Problems to be solved by the invention] When the Melf type as described above is adopted for a semiconductor device having directionality such as an anode and a cathode of a diode, the diameters D of the metal electrodes 2a and 2b are equal, and Since the external shapes are almost the same, parts feeders used in automatic machines for surface-mounted electronic equipment cannot supply the parts with the polarities aligned in a fixed direction.

Conventionally, the polarity of semiconductor devices is checked in advance, the polarity is aligned in one direction, and the device is stored in a tray until it is mounted. However, this requires an electrical polarity check process, a storage process, etc. There were problems in that it required a lot of man-hours and that it was not easy to visually confirm that it was mounted in the wrong direction during mounting.

[Purpose of the invention] This invention was made to solve the above-mentioned problems, and it has an external shape that allows the polarity of the semiconductor device to be easily aligned in one direction, and also improves the appearance.
It is an object of the present invention to provide a semiconductor device whose polarity can be clearly distinguished, which facilitates assembly and eliminates assembly errors, and which improves the quality and reliability of electronic equipment.

[Means for Solving the Problems] The semiconductor device of this invention is a surface-mount type semiconductor device having metal electrodes of the resin molded portion at both ends of the resin molded portion in which a semiconductor pellet is embedded. They have different diameters.

[Function] In the semiconductor device of this invention, since the diameters of both ends of the resin molded portion are made different from each other, if it is a diode, the anode or cathode can be determined based on one diameter side. This makes it possible to easily align the polarities of objects and identify the polarities.

[Example] Hereinafter, an example of this invention will be described based on FIGS. 2 to 4.

What is shown in FIGS. 2 and 3 is an embodiment in which the external shapes of resin molded parts 11a and 11b are tapered to indicate directionality, and the diameters of both ends are made different.

In addition, the tapered resin mold part 11
Metal electrodes 12a, 12b, 12'a, 12'a, 12a, 12b, 12'a, 12a, 12b, 12'a, 12'a, 12b, 12'a, 12a, 12a, 12a, 12a, 12a, 12a, 12a, 11b, have different diameters D ₁ , D ₂ , respectively.
12'b.

The difference between the one shown in FIG. 2 and the one shown in FIG. 3 is that, as is clear from the illustration, the one shown in FIG. In contrast, the one shown in FIG. 3 has a resin molded part 11b.
and the metal electrodes 12'a and 12'b at both ends thereof are shaped like square tubes.

Note that the resin molded parts 11a and 11b contain semiconductor pellets that have been subjected to a predetermined treatment, and the semiconductor pellets and the metal electrodes 12a and 12b or 12'a and 12'b are electrically connected.

Further, metal electrodes 12a, 12b, 12'a, 1
The outer shape of 2'b is the same as that of resin molded resin parts 11a, 1
The second
It is preferable to have a circular shape as shown in the figure or a substantially square shape as shown in FIG.

Next, the embodiment shown in FIG. 4 will be described.

In this embodiment, the metal electrodes 12a and 12b have the same diameter D and the same outer shape, but
The resin molded portion 11a is tapered to indicate its directionality.

[Effects of the invention] As described above, this invention makes the two ends of the resin mold part different, or gives the resin mold part a taper that indicates directionality, so that the polarity of these semiconductor devices can be easily aligned in one direction. This improves work efficiency when assembling electronic equipment, effectively prevents assembly of semiconductor devices in the wrong direction, and improves the quality and reliability of the equipment.

Further, due to the taper of the resin molded portion, the polarity of the semiconductor device can be more clearly recognized.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional Melf-type semiconductor device, and FIGS. 2 to 4 are perspective views of the Melf-type semiconductor device of this invention. 11a, 11b...resin mold part, 12a,
12b, 12'a, 12'b...metal electrodes.

Claims (1)

[Scope of utility model registration request] 1. A surface-mounted semiconductor device having a resin molded portion containing a semiconductor pellet and metal electrodes of the pellet at both ends thereof, wherein the diameters of both ends of the resin molded portion are made different from each other.