JPS58102597A - Electronic circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a circuit board having a predetermined circuit pattern.
Soldering, in which leadless components are directly soldered, is related to the shape of the conductor portion of the electrotactic circuit board in which the conductor portion is formed.

Recently, electronic components such as resistors, capacitors, diodes, etc.
As shown in FIG. 1 or 2, a so-called leadless component has been proposed in which a component body 1 is formed into a cylindrical or square shape, and conductor electrodes 2 are formed at both ends of the component body 1. By directly soldering such leadless components to electronic circuit boards, it is possible to improve component mounting density and increase integration, and also to improve equipment manufacturing and assembly efficiency by automating component mounting. can be improved.

Conventionally, this type of electronic circuit board, as shown in FIG.
A conductor portion 4 for soldering electronic components is formed on the insulating substrate 3. Then, solder cream 5 is supplied to the conductor s4 in advance by printing method, and the component 7 is applied on top of it.
If you place it and heat it, the solder cream 5 will melt and
Pole 2 is soldered.

However, in conventional circuit boards, during the soldering process, components often become misaligned, as shown in FIG. 4. This rounding and sufficient soldering do not provide enough strength, and in extreme cases, there is a drawback that even electrical connection cannot be made. In order to prevent the above-mentioned misalignment, it is necessary to place the components in accurate positions on the board, but especially when the components are placed by automatic machines, misalignment may occur in the direction of rotation of the components, such as front, back, left, and right. It is difficult to solder components with high soldering strength.

An object of the present invention is to solve the above-mentioned conventional drawbacks and to provide an electronic circuit board on which electronic components can be easily and reliably mounted with high coverage.

The circuit board of the present invention is an electronic circuit board having a conductor portion for soldering leadless components on an insulating substrate, and is characterized in that the conductor portion is formed concentrically in a fan shape.

Next, the present invention will be explained in detail with reference to the drawings.

FIG. 5 is a partial plan view showing an embodiment of the present invention.

That is, two conductor parts 4 for soldering are formed on a part of the wiring conductor (not shown) on the insulating substrate 3. The soldering conductor 1154 is formed into a fan shape on a concentric circle centered on the center point 6 of the component mounting position by thick film printing technology. Of course, the distance between the two conductor portions 4 is approximately equal to the distance between the electrodes of the component.

FIG. 6 shows a state in which solder cream 5 is applied by printing to the conductor portion 4 on the board of this embodiment, and a component 7 is mounted thereon with its center aligned with the center point 6 of the component mounting position on the board. shows. Since six center points on the board have been determined, it is easy to align the center of the component 7 with the point 6 and place it on the board using an automatic machine. At this time, even if the component 7 is placed slightly rotated clockwise or counterclockwise around the point 6, the conductor portion 4 is formed on a concentric circle, so it can be soldered with sufficient strength. Is possible. Furthermore, as shown in FIG. 7, even if the component 7 is placed at a position slightly shifted from front to back or left to right, the surface tension of the solder during melting of the solder will cause the conventional example shown in FIG. The larger the correction effect, the better soldering with reduced positional deviation can be obtained.

As described above, according to the present invention, it is possible to easily and accurately steal electronic components. Therefore, there is an effect that the reliability of placement, etc. is improved.

[Brief explanation of the drawing]

1 and 2 are perspective views showing an example of a leadless component, FIG. 3 is a side view showing a state in which an IJ-dress component is mounted on a conventional electronic circuit board, and FIG. 4 is a plan view thereof. Fig. 5 is a partial plan view showing an embodiment of the present invention, Fig. 6 is a plan view showing a state in which a leadless component is mounted on the board of the above embodiment, and Fig. 7 is a partial plan view showing a state in which leadless components are mounted on the board of the above embodiment. FIG. In the figure, 1... Leadless component body, 2... Electrode, 3... Insulating board, 4... Conductor part for soldering, 5
... Solder cream, 6... Center point of component mounting position,
7...Leadless parts. Agent Patent Attorney Sumi 1) Toshi So Figure 1, Figure 3, Figure 4, Figure 2, Figure 5, Figure 6, Figure 7

Claims (1)

[Claims] Soldering of leadless components on an insulating board is possible in an electronic circuit board having a conductor part, where the conductor part is placed on a concentric circle.
An electronic circuit board characterized by being formed into a shape.