JPS6236300Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid integrated circuit device including a substrate having a plurality of connection electrodes on both surfaces thereof which are connected to external connection terminals by soldering.

In a conventional hybrid integrated circuit device, as shown in FIG. 1, a plurality of mounted components 4 such as active elements and passive elements are mounted on a circuit board 3, and these mounted components 4 and external circuits are mounted on a circuit board 3. (not shown), external connection electrodes 2 are formed on the peripheral portions of both sides of the substrate. Further, the electrode 2 and the column-mounted component 4 are connected via printed wiring.
The electrode 2 has bifurcated connecting portions 1a and 1b.
A clip-type external connection terminal 1 having a diameter is connected by soldering.

The connection terminal 1 can improve the connection strength between the board and the terminal and simplify the terminal connection work, so it is suitable for hybrid integrated circuits that have the electrodes on both sides of the board and require simultaneous connection of circuits on both sides. Often used in equipment.

When connecting the electrode 2 and an external circuit using such a clip-type external connection terminal 1, as shown in FIG. 2a, the connection parts 1a and 1b of the external connection terminal 1 are 2a and 2
Solder 6a so that it is located approximately in the center of
Ideally, the connections should be made through 6b and 6b.
However, in reality, the positions of the circuit patterns on both sides of the board may be misaligned due to the accuracy of alignment during circuit pattern molding, the accuracy of board dimensions, etc.
As shown in FIG. b, there is a risk that an unnecessary short-circuit portion 5 may occur due to soldering between the external connection terminal electrode 2b and the adjacent external connection terminal 1b. For this reason, when forming a circuit pattern, the electrodes 2a and 2b on both sides of the substrate must be precisely aligned, resulting in a drawback that a reduction in the number of man-hours cannot be achieved.

SUMMARY OF THE INVENTION An object of the present invention is to provide a hybrid integrated circuit device that eliminates the above-mentioned drawbacks.

The device of the present invention has a substrate having a plurality of external connection electrodes formed on both sides to be connected to external connection terminals by soldering, and the external connection electrodes on at least one side of the substrate are arranged in an electrode arrangement direction. It is divided into a plurality of parts, and the interval between each divided part is smaller than the width of the external connection terminal.

Next, the present invention will be explained in detail with reference to the drawings.

3a to 3c are cross-sectional views showing one embodiment of the present invention.

In figures a to c, a plurality of external connection electrodes 2a are formed on the front surface of the substrate 3, and corresponding external connection electrodes are formed adjacent to each other on the back surface, and further correspond to the electrodes 2a on the front surface. The electrode on the back surface is divided into a plurality of parts along the electrode arrangement direction. Each of these divided portions (hereinafter referred to as divided electrodes) 2
The spacing A between the terminals c in the arrangement direction is smaller than the width C of the connecting portion 1b of the clip-type external connecting terminal 1. Further, the width B of each divided electrode 2c is also smaller than the width C of the connection portion 1b of the external connection terminal 1.

At the time of connection, the connection parts 1a and 1b and the electrodes 2a and 2c are connected by solders 6a and 6b with the connection parts 1a and 1b of the external connection terminal 1 in contact with the electrodes 2a and 2c on both sides of the substrate, respectively.

At this time, as shown in FIGS. 3a to 3c, even if there is a relative shift in the formation positions between the electrodes 2a and 2c on both sides of the substrate, the divided electrodes 2c constituting the electrodes on the back side are kept in a predetermined position relative to each other. Therefore, when soldering the connection portion 1b of the external connection terminal 1 to the specific electrode, the solder 6b
will not flow to adjacent electrodes and cause a short circuit between adjacent external connection terminals.

Furthermore, since the interval A between each divided electrode 2c is smaller than the width C of the connecting part 1b of the external connection terminal 1, the connecting part 1b always comes into contact with the divided electrode 2c, and as a result,
Reliable soldering is performed.

4a to 4c are cross-sectional views showing another embodiment of the present invention, in which the external connection electrode on the back side of the board is divided into two parts, and the width B' of the divided electrode 2d is the connecting part 1b of the external connection terminal. The width C is larger than the width C.

In this embodiment as well, it is possible to prevent short circuits between adjacent external connection terminals due to relative misalignment of the electrodes formed on both sides of the substrate.

As described above, the present invention can achieve reliable soldering by eliminating short circuits between adjacent connection terminals caused by relative misalignment between the positions of external connection electrodes formed on both sides of the board, and This has the effect of reducing the number of man-hours because strict alignment is not required when forming circuit patterns.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a conventional hybrid integrated circuit device, FIGS. 2a and b are sectional views of the soldered portions of external connection terminals in the device shown in FIG. 1, and FIGS. 3a to 4c and 4a -c are sectional views showing one embodiment and another embodiment of the present invention, respectively. In the figure, 1...external connection terminal, 1a, 1
b, 1c, 1d...Connection part, 2a, 2b...External connection electrode, 2c, 2d...Divided electrode, 3...Circuit board, 4...Mounted component, 5...Short circuit part, 6a,
6b...Solder metal.

Claims (1)

[Scope of utility model registration request] In a hybrid integrated circuit device including a substrate having a plurality of external connection electrodes on both surfaces that are connected to external connection terminals by soldering, each of the external connection electrodes on at least one surface of the substrate is divided into a plurality of electrodes in an electrode arrangement direction. A hybrid integrated circuit device characterized in that the interval between each divided portion is smaller than the width of the external connection terminal.