JPH0351989Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a pattern shape of a soldering land that can save the amount of solder and fix circuit components in a printed wiring board, and is particularly applicable to soldering of chip-type electronic components. It is suitable for attaching.

[Technical background of the invention]

Chip-shaped circuit components are cylindrical or square prisms.
It is a micro component with a length of mm, and can be fixed to a printed wiring board without forming holes for inserting the lead legs.

FIGS. 7a, b, and c are diagrams illustrating a method of fixing a chip-shaped circuit using a conventional pattern shape,
A is a plan view showing a state before a chip-shaped circuit component (hereinafter simply referred to as a chip component) is fixed, b is a plan view showing a state in which the chip component is fixed, and c is a side view of b.

In each figure, symbols 1 and 2 are soldering lands 3,
4 is a conductive pattern formed on the surface thereof, actual soldering land surfaces 3a of soldering lands 3, 4,
Solder resist 5 is printed except for 4a.
6 is a chip component, with electrodes 6a and 6b at both ends.
are aligned with the soldering lands 3 and 4 and fixed with solder 7. In addition, 8 is an adhesive for temporary fixing, and 9 is a substrate.

[Problems with background technology]

Conventional soldering lands 3 and 4 are used to absorb the positional deviation of the chip component 6 and the positional deviation until the adhesive 8 hardens, and to increase the solder leakage surface to the electrodes 6a and 6b. The areas of the land surfaces 3a and 4a are configured to be larger than the planar size of the electrodes 6a and 6b. However, with such wide actual soldering land surfaces 3a and 4a, there is no problem with a square chip component ₆₁ as shown in FIG. 8, but with a cylindrical chip component as shown in FIG. In the part ₆₂ , there was a problem that the amount of solder 7 used was large because the solder entered the lower side of the cylinder. This problem was such that the larger the number of chip components 6 used, the greater the difference in the amount of solder used compared to conventional components with lead legs.

[Purpose of invention]

This invention was made in view of the above points,
To provide a pattern shape of a soldering land which can reduce the amount of solder used and fix chip parts without impairing the reliability of soldering.

[Summary of the invention] In order to achieve the above object, the present invention, for example, in a two-electrode chip component, uses a pattern on the actual land surface on which no solder resist is formed of the soldering land formed corresponding to each electrode as a soldering land. It is formed diagonally with respect to the direction in which the comrades face each other.

[Example of idea]

Hereinafter, the present invention will be explained with reference to the illustrated embodiments.

Here, FIG. 1 is a plan view showing an example of a pattern shape according to the present invention, FIG. 2 is an enlarged perspective view showing a state in which a chip component is fixed to the pattern of FIG. 1, and FIG. FIG. 3 is a plan view seen from above in FIG. 2;

First, in FIG. 1, the same parts as those in FIG. The actual soldering land surface 8 is an adhesive for temporary fixing, and the actual soldering lands 11 and 12 each have a longitudinal direction, and this direction is the opposite direction of the soldering lands 3 and 4 (see arrow A). ) are configured to be oblique at a predetermined angle with respect to each other. In addition, the actual soldering land surface 1
1 and 12 are formed with a smaller area than the conventional actual soldering land surfaces 3a and 4a shown by dotted lines (FIG. 1).

Soldering lands 3 and 4 with such a pattern shape
According to the invention, when a chip-shaped circuit component, for example, a cylindrical chip component ₆₂ , is fixed, the solder 7 is soldered from the small-area real soldering land surfaces 11 and 12 according to the present invention, as shown in FIGS. 2 and 3. The amount of adhered solder 7 that does not spread and enters the lower side of the cylinder is greatly reduced. Also, like this, the actual soldering surface land 1
Even if the area of 1 and 12 is reduced, soldering defects will not occur because the actual soldering land surface 1
1 and 12 have a longitudinal direction, and this direction is an oblique direction that includes both X and Y components when the direction of displacement of the chip component ₆₂ is expressed by X and Y orthogonal coordinate components. Therefore, the electrodes 6a and 6b do not come off the actual soldering land surfaces 11 and 12.

Note that the shape of the actual soldering land surfaces 11 and 12 is not limited to that shown in FIG. 1, but may be, for example, the shape shown in FIGS. 4 and 5. FIG. 4 shows the actual soldering land surfaces 11 and 12 formed in a dogleg shape, and FIG. 5 shows them formed in a semicircular band shape.
In addition, in FIG. 1, an example of a pattern having soldering lands 3 and 4 that can be clearly distinguished from the conductive patterns 1 and 2 was explained, but as shown in FIG. The actual soldering land surface 1 according to the present invention is applied to the conductive patterns 1 and 2.
1 and 12 may be formed. Furthermore, the present invention is applicable not only to chip parts of two-electrode type but also to three-electrode type parts.

[Effect of idea]

As explained above, according to the present invention, the pattern of the actual soldering land surface is formed to be long in the diagonal direction so as to absorb the positional deviation of the chip components, so it is possible to save the amount of solder while maintaining soldering reliability. There is an effect.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing an example of the pattern shape according to the present invention, Fig. 2 is a perspective view showing a state in which chip parts are soldered on the same pattern, and Fig. 3 is a view of Fig. 2 from above. 4 and 5 are plan views showing other pattern shapes of the present invention, and FIG. 6 is a plan view showing still other pattern shapes of the present invention,
FIG. 7 is an explanatory diagram for explaining the conventional pattern shape and the fixed state of chip components, and FIGS.
The figure is an explanatory diagram for explaining the difference between a square chip part and a cylindrical chip part. 1, 2... Conductive pattern, 3, 4... Soldering land, 5... Solder resistor, 6... Chip component, 6a, 6b... Electrode, 7... Solder, 9... Board, 11, 12... ...Actual soldering land surface.

Claims (1)

[Claims for Utility Model Registration] A soldering land provided on a conductive pattern, on which a cylindrical chip component having electrodes at both ends is disposed, and an electrode of the cylindrical chip component provided within the soldering land. A pattern shape of a soldering land, characterized in that it is set narrower than the width and is composed of an actual soldering land surface arranged obliquely to a part of the electrode.