JPH0346522Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to the structure of an outer case for a hybrid integrated circuit.

(Prior Art) FIG. 2 is a perspective view showing a dual-line hybrid integrated circuit. Various electronic components 3 are mounted on the board 1.
are mounted, and lead terminals 2 are arranged in parallel on two parallel sides of the substrate 1. In such hybrid integrated circuits, in order to reduce external pressure and shock, etc., and protect the electrodes of the electronic components 3 from chemical effects such as corrosion, the external connection portions of the lead terminals are left uncoated with an insulating material. There is a need.

Although there are various methods for this coating, FIG. 3 shows a cross-sectional view of a hybrid integrated circuit package using a conventional method using an outer case. In the figure, 4 indicates an insulating material, and 5 indicates an exterior case.
FIG. 4 is a perspective view showing the inside of the outer case 5. FIG. Four protrusions 6 are provided inside the outer case 5 to hold the board 1 of the hybrid integrated circuit. FIG. 5 is a partially enlarged view showing details of the vicinity of the protrusion 6, and the protrusion 6 is provided with a rectangular second stopper 8 similar to the rectangular first stopper 7. The two types of stoppers must be formed accurately so that the lead terminals 2 of the hybrid integrated circuit can be accurately inserted into the through holes of the external board, etc. In FIG. The distance between the second stoppers 8 in the B direction is adjusted to be slightly larger than the length along one side of the board 1, and the distance between the second stoppers 8 is adjusted to be slightly larger than the length along the side adjacent to the side of the board 1. has been done.

As shown in FIG. 3, the hybrid integrated circuit is housed in the outer case 5 by fitting the board 1 into the stopper, and then the insulating material 4 is filled between the outer case 5 and the board 1. was cured to obtain a hybrid integrated circuit package.

(Problem to be solved by the invention) However, in the case with the above structure, the stopper is formed so that the board can be fitted with only a small margin, so the hybrid integrated circuit cannot be inserted into the case. The problem was that using an automatic insertion machine could cause cracks or chips in the board.

(Means for Solving the Problem) In order to guide the board of the hybrid integrated circuit to a predetermined position, in the stopper part of the protruding part provided on the inner surface of the outer case, the surface of the stopper part that guides the board is replaced with a stopper part. The part was formed into a tapered shape.

(Function) When the hybrid integrated circuit is inserted into the outer case, the board hits the tapered surface of the stopper part, and when it is further inserted, the board moves along the tapered surface and is guided to a predetermined position. .

(Embodiment) FIG. 1 is a perspective view showing an embodiment of the present invention, in which four platform-shaped protrusions 9 are provided on the inner surface of the outer case 5 on which the peripheral portion of the board is placed and held. ing. FIG. 6 is a partially enlarged view showing details of the vicinity of the protrusion 9, in which the protrusion 9 is provided with a tapered stopper portion 10. The stopper part 10 is divided into two tapered parts, and the first tapered part 10a is formed so that the play in the A direction disappears as the board 1 is inserted in order to guide the board 1 to a predetermined position. Second taper part 1
0b is formed so that the play in the B direction disappears as the substrate 1 is inserted to guide the substrate 1 to a predetermined position.

FIG. 7 is a cross-sectional view of a hybrid integrated circuit package in which the hybrid integrated circuit is inserted and fitted into an exterior case 5 having a protruding portion with a tapered portion 10, and is filled and coated with an insulating material 4.

(Effects of the invention) As explained in detail above, by making the outer case have a structure in which a protruding portion with a tapered portion is provided on the inner surface, it is possible to easily insert and fit the hybrid integrated circuit into the outer case. It is expected that this process will be accurate and will prevent cracks or chips from forming on the board.

[Brief explanation of drawings]

Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a perspective view of a hybrid integrated circuit, Fig. 3 is a cross section of a conventional hybrid integrated circuit package, and Fig. 4 is a perspective view showing the inside of a conventional external case. 5 is a partially enlarged view of FIG. 4, FIG. 6 is a partially enlarged view of the embodiment of the present invention, and FIG.
The figure is a cross-sectional view of a hybrid integrated circuit package using an embodiment. 1... Board, 2... Lead terminal, 3... Electronic component, 4... Insulating material, 5... Exterior case, 6, 9...
...Protruding portion, 10...Tapered portion.

Claims (1)

[Scope of Claim for Utility Model Registration] In the structure of an outer case in which a board on which a hybrid integrated circuit is mounted is housed in an outer case and coated, as the hybrid integrated circuit board is inserted into the outer case on the inner surface of the outer case, A plurality of tapered parts are tapered in the vertical and horizontal directions to eliminate play and fix the board in a predetermined position, and the peripheral part of the board positioned by the tapered parts is placed on the bottom of the tapered part and held. A structure of an exterior case for a hybrid integrated circuit, characterized in that a table-shaped protrusion is provided.