JPH0514553Y2 - - Google Patents
Info
- Publication number
- JPH0514553Y2 JPH0514553Y2 JP1987112033U JP11203387U JPH0514553Y2 JP H0514553 Y2 JPH0514553 Y2 JP H0514553Y2 JP 1987112033 U JP1987112033 U JP 1987112033U JP 11203387 U JP11203387 U JP 11203387U JP H0514553 Y2 JPH0514553 Y2 JP H0514553Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- mounting hole
- hole
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は印刷配線板の取付穴構造に関するもの
である。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a mounting hole structure for a printed wiring board.
（従来の技術）
第２図ａ，ｂは従来例を示すもので、第２図ａ
は印刷配線板の断面斜視図、第２図ｂは印刷配線
板の取付状態を示す断面図である。同図において
２１は印刷配線板、２２ａ，２２ｂは印刷配線板
２１の両面に対向して設けられたランド、２３は
前記ランド２２ａ，２２ｂの中央に位置し、印刷
配線板２１を電子機器の筐体２４にネジ２５を用
いて取付けるために設けられた取付穴、２６は前
記取付穴２３の内壁面に設けられ、且つ前記ラン
ド２２ａ，２２ｂを相互に接続するスルーホー
ル、２７は印刷配線板２１に実装された電子部品
２８のアース端子とランド２２ａとを接続する導
体路である。(Prior art) Figures 2a and b show conventional examples, and Figure 2a
2 is a cross-sectional perspective view of the printed wiring board, and FIG. 2b is a sectional view showing the printed wiring board in an attached state. In the figure, 21 is a printed wiring board, 22a and 22b are lands provided opposite to each other on both sides of the printed wiring board 21, and 23 is located in the center of the lands 22a and 22b, and the printed wiring board 21 is connected to a housing of an electronic device. 26 is a through hole provided on the inner wall surface of the mounting hole 23 and connects the lands 22a and 22b to each other; 27 is a through hole for connecting the lands 22a and 22b; This is a conductor path that connects the ground terminal of the electronic component 28 mounted on the land 22a.
即ち、前記印刷配線板２１ではネジ２５を取付
穴２３に挿着し筐体２４に締結することによつ
て、前記電子部品２８のアース端子を導体路２
７、ランド２２ａ、スルーホール２６及びランド
２２ｂを介して筐体２６に電気的に接続すること
ができるようになつている。 That is, in the printed wiring board 21, the ground terminal of the electronic component 28 is connected to the conductor path 2 by inserting the screw 25 into the mounting hole 23 and fastening it to the housing 24.
7. It can be electrically connected to the casing 26 via the land 22a, through hole 26, and land 22b.
ところで、印刷配線板に多数の電子部品を実装
する場合には、一般に生産性の面から溶けたはん
だ浴中に印刷配線板の片面を浸して電子部品の端
子と導体層とを一括してはんだにより接続する、
所謂デイツプはんだ付けと称されるはんだ付け方
法が採用されている。しかし、前記印刷配線板２
１でこの方法を採用すると、第２図ｃの工程説明
図に示すように片面全体がはんだ浴２９に触れる
と、スルーホール２６の内側にはんだが侵入して
付着し、取付穴２３がはんだ３０で塞がれてしま
う。 By the way, when mounting a large number of electronic components on a printed wiring board, generally from the viewpoint of productivity, one side of the printed wiring board is immersed in a molten solder bath and the terminals and conductor layers of the electronic components are soldered all at once. connect by,
A soldering method called dip soldering is used. However, the printed wiring board 2
If this method is adopted in step 1, as shown in the process diagram of FIG. It gets blocked by.
したがつて、従来ではこれを防止するためにデ
イツプはんだ付けを行なう前にランド２２ｂに取
付穴２３を覆うようにして耐熱テープを貼り付け
ている。 Therefore, conventionally, in order to prevent this, a heat-resistant tape is pasted to the land 22b so as to cover the mounting hole 23 before dip soldering.
（考案が解決しようとする問題点）
しかしながら、前記方法でははんだ付け前の耐
熱テープ貼り付け工程及びはんだ付け後の耐熱テ
ープ取り外し工程が必要となるため作業に手間が
かかり生産効率が悪く、またコストアツプになる
という問題点があつた。(Problems to be solved by the invention) However, the above method requires a process of applying heat-resistant tape before soldering and a process of removing heat-resistant tape after soldering, which is time-consuming, poor production efficiency, and increases costs. There was a problem with becoming.
本考案は前記問題点に鑑みなされたもので、デ
イツプはんだ付けを採用しても取付穴がはんだで
塞がれることがない印刷配線板の取付穴構造を提
供することを目的とする。 The present invention was devised in view of the above-mentioned problems, and it is an object of the present invention to provide a mounting hole structure for a printed wiring board in which the mounting holes are not blocked with solder even when dip soldering is employed.
（問題点を解決するための手段）
本考案は前記問題点を解決するために、取付穴
の両端開口の周辺部分各々に導体層を設け、該導
体層を相互に接続する少なくとも１個のスルーホ
ールを前記取付穴以外の部分に設けたものであ
る。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a conductor layer at each peripheral portion of the opening at both ends of the mounting hole, and at least one through hole connecting the conductor layers to each other. Holes are provided in areas other than the mounting holes.
（作用）
本考案によれば、ネジ等が挿着される取付穴の
内壁面に導体部分が存在しないため、デイツプは
んだ付けを行なつても取付穴の内壁面にはんだが
付着し取付穴が塞がれてしまうことがない。ま
た、印刷配線板の両面に設けられた導体層はスル
ーホールによつて相互に接続される。(Function) According to the present invention, since there is no conductor part on the inner wall surface of the mounting hole into which screws etc. are inserted, even if dip soldering is performed, solder will adhere to the inner wall surface of the mounting hole and the mounting hole will become clogged. It never gets blocked. Further, the conductor layers provided on both sides of the printed wiring board are connected to each other by through holes.
（実施例）
第１図ａ，ｂ，ｃは本考案の一実施例を示すも
ので、第１図ａは印刷配線板の断面斜視図、第１
図ｂは印刷配線板の拡大上面図である。同図にお
いて、１は印刷用配線板、２は印刷配線板１に設
けられたネジ挿着用の取付穴であり、前記取付穴
２の両端開口の周辺部分各々には取付穴２の径ｒ
よりも大きな径Ｒの穴３ａ，３ｂを有する矩形の
導体層４ａ，４ｂが取付穴２と中心を一致し、且
つ対向して設けられている。また、前記印刷配線
板１には導体層４ａ，４ｂの角部分に対応して計
４個の貫通孔５が設けられている。また、前記貫
通孔５の内壁面には導体層４ａ，４ｂと同材質の
導体が付着しており、導体層４ａ，４ｂを相互に
接続するスルーホール６として構成されている。
７は印刷配線板１に実装された電子部品（図示せ
ず）のアーム端子と一方の導体層４ａを接続する
導体路である。(Example) Figures 1a, b, and c show an example of the present invention, and Figure 1a is a cross-sectional perspective view of a printed wiring board;
Figure b is an enlarged top view of the printed wiring board. In the figure, 1 is a printed wiring board, 2 is a mounting hole provided in the printed wiring board 1 for inserting a screw, and each of the peripheral parts of the openings at both ends of the mounting hole 2 has a diameter r.
Rectangular conductor layers 4a and 4b having holes 3a and 3b with a diameter R larger than that of the mounting hole 2 are provided so that their centers coincide with the mounting hole 2 and are opposed to each other. Further, a total of four through holes 5 are provided in the printed wiring board 1, corresponding to the corner portions of the conductor layers 4a and 4b. Further, a conductor made of the same material as the conductor layers 4a, 4b is attached to the inner wall surface of the through hole 5, and is configured as a through hole 6 that connects the conductor layers 4a, 4b to each other.
A conductor path 7 connects an arm terminal of an electronic component (not shown) mounted on the printed wiring board 1 and one conductor layer 4a.
次に前記印刷配線板１の作用について第１図ｃ
の工程説明図を参照して説明する。デイツプはん
だ付けを行なうに際して印刷配線板１の片面全体
がはんだ浴８に触れると、スルーホール６及び取
付孔２の内側にはんだが侵入し、スルーホール６
は内壁面に付着するはんだで塞がれてしまう。一
方、取付穴２の内壁面には導体部分が何ら存在し
ないため、該内壁面にはんだが付着することがな
いことは勿論、取付穴２がはんだで塞がれてしま
うことがない。 Next, regarding the function of the printed wiring board 1, FIG.
This will be explained with reference to the process diagram. When one side of the printed wiring board 1 comes into contact with the solder bath 8 during dip soldering, the solder enters the inside of the through hole 6 and the mounting hole 2, and the through hole 6
is blocked by solder that adheres to the inner wall surface. On the other hand, since no conductor portion exists on the inner wall surface of the mounting hole 2, solder does not adhere to the inner wall surface, and the mounting hole 2 is not blocked with solder.
このように前記実施例では、デイツプはんだ付
けを行なつてもネジ挿着用の取付穴２がはんだで
塞がれることがないので、従来のように耐熱テー
プを使用する必要がない。また、印刷配線板１の
両面に設けられた導体層４ａ，４ｂは取付穴２以
外の部分に設けられたスルーホール６により相互
に接続されているため、電子部品のアース端子を
導体路７、導体層４ａ、スルーホール６及び導体
層４ｂを介して電子機器の筐体に電気的に接続す
ることができる。更に、導体層４ｂには、取付穴
２の径ｒよりも大きな径Ｒの穴３ｂが設けられて
いるので、デイツプはんだ付けを行なう際、穴３
ｂの内壁面に付着したはんだが取付穴２に挿着さ
れるネジ等の挿入を防げることがない。 In this manner, in the embodiment described above, even when dip soldering is performed, the mounting holes 2 for inserting screws are not blocked with solder, so there is no need to use heat-resistant tape as in the conventional case. Further, since the conductor layers 4a and 4b provided on both sides of the printed wiring board 1 are connected to each other by the through hole 6 provided in the part other than the mounting hole 2, the ground terminal of the electronic component can be connected to the conductor path 7, It can be electrically connected to the housing of an electronic device via the conductor layer 4a, through hole 6, and conductor layer 4b. Furthermore, since the conductor layer 4b is provided with a hole 3b having a diameter R larger than the diameter r of the mounting hole 2, when performing dip soldering, the hole 3b is
The solder adhering to the inner wall surface of b will not prevent the insertion of screws or the like into the mounting holes 2.
尚、前記スルーホール６は少なくとも１個あれ
ば用をなすものであり、また、スルーホール６は
メツキ等の種々手段で形成することができる。ま
た、前記導体層４ａ，４ｂは矩形に限らず、種々
形状が採用できる。 It should be noted that at least one through hole 6 is sufficient, and the through hole 6 can be formed by various methods such as plating. Furthermore, the conductor layers 4a and 4b are not limited to rectangular shapes, and can have various shapes.
（考案の効果）
以上説明したように本考案によれば、取付穴の
両端開口の周辺部分各々に導体層を設け、該導体
層を相互に接続する少なくとも１個のスルーホー
ルを前記取付穴以外の部分に設けたので、印刷配
線板の両面に設けられた導体層は取付穴以外の部
分に設けられた前記スルーホールによつて相互に
接続され、しかもネジ等が挿着される取付穴の内
壁面に導体部分が存在せず、よつてデイツプはん
だ付けを行なつても取付穴の内壁面にはんだが付
着し該取付穴がはんだで塞がれてしまうことがな
い。(Effects of the invention) As explained above, according to the invention, a conductor layer is provided in each peripheral portion of the opening at both ends of the mounting hole, and at least one through hole connecting the conductor layers is provided outside the mounting hole. Since the conductor layers provided on both sides of the printed wiring board are connected to each other by the through holes provided in the parts other than the mounting holes, and in addition, the conductor layers provided on both sides of the printed wiring board are connected to each other by the through holes provided in the parts other than the mounting holes. There is no conductor portion on the inner wall surface, so even if dip soldering is performed, solder will not adhere to the inner wall surface of the mounting hole and the mounting hole will not be blocked by solder.
第１図ａ，ｂ，ｃは本考案の一実施例を示すも
ので、第１図ａは印刷配線板の断面斜視図、第１
図ｂは印刷配線板の拡大上面図、第１図ｃはデイ
ツプはんだ付けの工程説明図、第２図ａ，ｂ，ｃ
は従来例を示すもので、第２図ａは印刷配線板の
断面斜視図、第２図ｂは印刷配線板の取付状態を
示す断面図、第２図ｃはデイツプはんだ付けの工
程説明図である。
１……印刷配線板、２……取付孔、４ａ，４ｂ
……導体層、６……スルーホール。
Figures 1a, b, and c show one embodiment of the present invention; Figure 1a is a cross-sectional perspective view of a printed wiring board;
Figure b is an enlarged top view of the printed wiring board, Figure 1 c is an explanatory diagram of the dip soldering process, and Figures 2 a, b, and c.
2 shows a conventional example, FIG. 2a is a cross-sectional perspective view of a printed wiring board, FIG. 2b is a cross-sectional view showing the printed wiring board in an attached state, and FIG. 2c is an explanatory diagram of dip soldering process. be. 1...Printed wiring board, 2...Mounting hole, 4a, 4b
...Conductor layer, 6...Through hole.
Claims (1)
け、 該導体層を相互に接続する少なくとも１個のス
ルーホールを前記取付穴以外の部分に設けた ことを特徴とする印刷配線板の取付穴構造。[Claims for Utility Model Registration] A conductor layer is provided in each peripheral portion of the opening at both ends of the mounting hole, and at least one through hole for interconnecting the conductor layers is provided in a portion other than the mounting hole. Mounting hole structure of printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987112033U JPH0514553Y2 (en) | 1987-07-22 | 1987-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987112033U JPH0514553Y2 (en) | 1987-07-22 | 1987-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6416686U JPS6416686U (en) | 1989-01-27 |
| JPH0514553Y2 true JPH0514553Y2 (en) | 1993-04-19 |
Family
ID=31350612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987112033U Expired - Lifetime JPH0514553Y2 (en) | 1987-07-22 | 1987-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514553Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007519003A (en) * | 2004-01-21 | 2007-07-12 | ベンタイラ ファーマスーティカルズ．インク． | Sensor that detects air flow |
| CN103369812A (en) * | 2012-04-02 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6221440B2 (en) * | 2013-07-11 | 2017-11-01 | オムロン株式会社 | Printed wiring board and switch for electric tool provided with the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610790A (en) * | 1979-07-06 | 1981-02-03 | Nec Corp | Signal decision system |
| JPS6146786B2 (en) * | 1980-06-03 | 1986-10-16 | Toyo Electric Mfg Co Ltd |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51130054U (en) * | 1975-04-10 | 1976-10-20 | ||
| JPS6146786U (en) * | 1984-08-31 | 1986-03-28 | シャープ株式会社 | Printed board |
| JPH0346517Y2 (en) * | 1984-12-28 | 1991-10-01 | ||
| JPS61188375U (en) * | 1985-05-15 | 1986-11-25 | ||
| JPS61201365U (en) * | 1985-06-04 | 1986-12-17 |
-
1987
- 1987-07-22 JP JP1987112033U patent/JPH0514553Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610790A (en) * | 1979-07-06 | 1981-02-03 | Nec Corp | Signal decision system |
| JPS6146786B2 (en) * | 1980-06-03 | 1986-10-16 | Toyo Electric Mfg Co Ltd |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007519003A (en) * | 2004-01-21 | 2007-07-12 | ベンタイラ ファーマスーティカルズ．インク． | Sensor that detects air flow |
| CN103369812A (en) * | 2012-04-02 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6416686U (en) | 1989-01-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0514553Y2 (en) | ||
| JPH08203629A (en) | Printed wiring device | |
| JPH02148878A (en) | Through hole terminal | |
| JP3237734B2 (en) | Mounting structure of printed circuit board and method of manufacturing the same | |
| JP2591766Y2 (en) | Printed board | |
| JPH06349561A (en) | Method of soldering lead terminal to wiring board | |
| JPH0397958U (en) | ||
| JPH021907Y2 (en) | ||
| JPS6141272Y2 (en) | ||
| JPH0143877Y2 (en) | ||
| JPS5935957Y2 (en) | Printed board wiring pattern common connection piece | |
| JPS5867099A (en) | Electronic equipment | |
| JPS5910768Y2 (en) | Printed board | |
| JPS62243393A (en) | Printed board | |
| JPH073661Y2 (en) | Printed board | |
| JPS6025821Y2 (en) | Printed wiring board equipment | |
| JPS635260Y2 (en) | ||
| JPS6054493A (en) | Multilayer pattern type printed board | |
| JPH04116995A (en) | Parts packaging substrate and method of shielding the same | |
| JPS59185872U (en) | Reinforcing material for conductive foil peeling on printed wiring boards | |
| JPS63178586A (en) | Method of forming through-hole in printed circuit board | |
| JPS59101460U (en) | Grounding structure of electronic components | |
| JPS60164389A (en) | Printed board | |
| JPS5972196A (en) | Part mounting device | |
| JPS63146491A (en) | Printed wiring board |