JPH04116995A - Parts packaging substrate and method of shielding the same - Google Patents

Abstract

PURPOSE:To save a shield case and prevent troubles caused by usage of a shield case by forming an insulating layer on the surface of a parts packaging substrate, forming a conductive layer thereon, and connecting the conductive layer to the GND terminal of the substrate. CONSTITUTION:A shield connection land 14 is made in a substrate 11, an insulating layer 20 is formed by immersing the surface of the substrate 11 in resist liquid, a conductive layer is formed thereon by immersion in paste liquid containing metallic powder, and at the same time the shield connection land 14 is connected to the conductive layer. Thereby a module can be shielded, regardless of its shape and outer dimensions, with a simple structure.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a component mounting board having electronic components mounted on its surface and a method of shielding the same.

2. Description of the Related Art In a component mounting board configured as one unit by mounting multiple electronic components on one board,
It is necessary to provide a shield to block out noise generated from the outside and noise generated from the own circuit, and conventionally this has been done using a shield case.

Hereinafter, such a conventional shielding method for a component mounting board will be explained using FIGS. 8 to 11.

In FIGS. 8 and 9, 1 is a module which is a component mounting board, and resistors, capacitors, etc. are mounted on both sides of the board 2.
Electronic components 3 such as semiconductors are mounted. 4 is a connection terminal, and 5 is a GND terminal.

10 and 11, reference numeral 6 denotes a shield case used for the module 1, which is a metal case having an insulating plate 7 inside, and this shield case 6 surrounds the entire module l. 6 is connected to the GND terminal 5 of the module 1 with a wire 8 to obtain a shielding effect.

Problems to be Solved by the Invention However, the conventional module shielding method described above uses a shielding case, and therefore has the following problems. Firstly, the shield case cannot be machined into the same shape as the module's external shape, so the entire module including the shield case becomes very large.Secondly, the shield case is made to fit each module's external dimensions. Thirdly, it must be made as follows.
The walls that make up the shield case are completely connected to each other without any gaps.Fourth, the assembly of the shield case and module is complicated.Fifth, the shield case and the GND terminal must be connected. For example, separate parts such as wire rods are required.

The present invention solves these conventional problems,
It is an object of the present invention to provide an excellent component mounting board that can obtain a shielding effect with a simple configuration, and a method for shielding the same.

Means for Solving the Problems In order to achieve the above object, the present invention forms an insulating layer on the surface of a board on which electronic components are mounted, and further forms a conductive layer thereon to connect the GND terminals of the board. It was designed to connect with.

The present invention also provides a shield connecting land connected to a GND terminal on the substrate, an insulating layer is formed to remove the shield connecting runt, and a conductive layer is formed simultaneously with the shield connecting land. The conductive layer is connected to the conductive layer.

Therefore, according to the present invention, shielding can be provided with a simple configuration regardless of the shape or external dimensions of the component mounting board.

Embodiment FIGS. 1 to 7 show a component mounting board (hereinafter referred to as
It's called a module. ) shows an example of the shielding method. Fig. 1 is a front view showing the module before shielding, Fig. 2 is a side view thereof, Fig. 3 is a partially omitted enlarged front view of the board in the same module before electronic components are mounted, Figs. The figure is a front view showing the shielding process in the same module, and FIGS. 5 and 7 are side views of FIGS. 4 and 6, respectively.

1 and 2, reference numeral 11 is a board constituting the module, and as shown in FIG. 3, a wiring pattern 12 is printed according to a preset layout, and components are mounted between A and B in the figure. A component mounting land 13 is provided in a predetermined area as a range, a shield connection land 14 which is a connection part with the GND terminal 19 of the board is provided between B and C, and a connection terminal land 15 is provided between C and D. . In addition,
The surface of the substrate 11 is coated with a resist 16 except for each land 13, 14, and 15 to form a wiring pattern 12.
is insulated. Reference numeral 17 designates electronic components such as resistors, capacitors, and semiconductors, which are attached to the component mounting lands 13 of the board 11 by soldering. 18 is a connection terminal for connecting other circuits, and 19 is a GND terminal, each of which is attached to the connection terminal runt 15 of the board 11 by soldering.

Next, a method of shielding the module as described above will be explained with reference to FIGS. 4 to 7. first,
By masking the shield connection land 14 of the board 11 and immersing the part A-8, which is the component mounting range, in a resist solution of epoxy resin or glass coating material, the area shown in FIGS. 4 and 5 is coated. As such, the insulating layer 20
Form and solder insulate the parts. After the resist solution is dried and solidified, the area between A and C is immersed in an epoxy resin paste solution containing metal powder, so that the insulating layer 20 is coated as shown in FIGS. 6 and 7. A conductive layer 21 is formed including the shield connection land 14. As a result, the module is covered with the insulating layer 20 and the conductive layer 21, and the conductive layer 21 is connected to the GND terminal 19 through the shield connection land 14.

As described above, according to the above embodiment, the shield connecting runt 14 is provided on the substrate 11 in advance, and the insulating layer 20 is formed by immersing the surface of the substrate 11 in the resist solution.
Next, the conductive layer 21 is formed by immersing the top in a paste solution containing metal powder, and at the same time, the shield connection land 14 is connected to the conductive layer 21, so that it can be easily applied regardless of the shape and external dimensions of the module. This configuration allows the module to be shielded.

In the above embodiments, the module is immersed in a resist solution as a means for forming the insulating layer 20, but coating may also be used.
1 may be formed by applying a paste solution containing metal powder, or by electroless plating, sputtering, or the like.

In addition, in the above embodiment, almost the entire surface of the module was shielded, but if only a part of the module requires shielding, only a part can be coated with an insulating layer and a conductive layer. .

Effects of the Invention As is clear from the above embodiments, the present invention forms an insulating layer on the surface of a component mounting board and further forms a conductive layer thereon to connect to the GND terminal of the board. Regardless of the shape or external dimensions of the module, shielding can be applied along the module surface or to areas of the module surface that require shielding. Therefore, there is no need for a conventional shield case, and there are various problems associated with the use of this shield case, namely, the inability to process the shield case into the same shape as the module external shape, which increases the size of the entire module including the shield case. With a simple configuration, it is possible to eliminate the problems of having to make a shield case according to the external dimensions of each module, and that assembling the shield case and module is complicated.

In addition, by providing a connecting land for shielding on the surface of the module, it is possible to connect the connecting land and the conductive layer at the same time as forming the conductive layer, so the shield case can be electrically Separate parts such as wires for connection can be made unnecessary.

[Brief explanation of drawings]

Fig. 1 is a front view showing a module before shielding to which a shielding method according to an embodiment of the present invention is applied, Fig. 2 is a side view thereof, and Fig. 3 is a view of a board before mounting electronic components in the same module. 4 is a front view showing the shielding process in the module, FIG. 5 is a side view, FIG. 6 is a front view of the module, FIG. 7 is a side view, and FIG. 8 is a front view showing the shielding process in the module. FIG. 9 is a perspective view of a conventional module, FIG. 9 is a side view thereof, FIG. 10 is a perspective view showing a conventional module shielding method, and FIG. 11 is a side view thereof. 11... Board, 12... Wiring pattern, 14...
Land for shield connection, 17...Electronic component, 18...
- Connection terminal, 19... GND terminal, 20... Insulating layer, 21... Conductive layer. Name of agent Patent attorney Akira Koeji Two idiots Fig. fig. fig. I Fig. Fig. Fig. Fig! ! Figure 5 Figure 5

Claims (3)

[Claims] (1) Connecting a board on which electronic components are mounted, an insulating layer covering the surface of the board, a conductive layer further covering the insulating layer, and the conductive layer and the GND terminal of the board. A component mounting board with a connection part. (2) A method of shielding a component-mounted board in which an insulating layer is formed on the surface of the board on which electronic components are mounted, and a conductive layer is further formed on the insulating layer and connected to the GND terminal of the board. (3) A shield connection land connected to the GND terminal is provided on the substrate, an insulating layer is formed so as to exclude this shield connection land, and at the same time as the conductive layer is formed, the shield connection land and the 3. The method of shielding a component mounting board according to claim 2, wherein the shielding method further comprises connecting a conductive layer to a conductive layer.