JPS60183465U - Structure of hybrid IC - Google Patents

Structure of hybrid IC

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Publication number
JPS60183465U
JPS60183465U JP7083884U JP7083884U JPS60183465U JP S60183465 U JPS60183465 U JP S60183465U JP 7083884 U JP7083884 U JP 7083884U JP 7083884 U JP7083884 U JP 7083884U JP S60183465 U JPS60183465 U JP S60183465U
Authority
JP
Japan
Prior art keywords
hybrid
substrate
electronic circuit
printed
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7083884U
Other languages
Japanese (ja)
Inventor
羽広　哲雄
Original Assignee
東洋通信機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋通信機株式会社 filed Critical 東洋通信機株式会社
Priority to JP7083884U priority Critical patent/JPS60183465U/en
Publication of JPS60183465U publication Critical patent/JPS60183465U/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ及びｂは本考案の一実施例を示す正面図及び側
面図、第２図ａ及びｂは従来のハイブリッドＩＣのシー
ルド方法を示す断面図、第３図は本考案に係るハイブリ
ッドＩＣの実装例を示す断面図、第４図ａ及びｂは本考
案の他の効用を示す図である。 １・・・・・・プリント基板、２・・・・・・樹脂コー
ト、３及び７，７．・・・・・・リード端子、５・・・
・・・部品面、６・・・・・・シールドパターン面、８
・・・・・・導体バタン、１１・・・・・・コンデンサ
を形成する小導体バタン。 補正　昭５９．９．１９ 図面の簡単な説明を次のように補正する。 図面の簡単な説明 第１図は本考案に係かるノ飄イブリッドＩＣの一実施例
を示す構造図であって、ａはその背面図及びｂはそのＡ
−Ａ’に於ける側面断面図、第２図ａ及びｂは従来のハ
イブリッドＩＣのシールド方法を示す断面図、第３図は
本考案に係かるノ１イブリッドＩＣの実装例を示す断面
図、第４図は本考案の他の実施例を示す図であってａは
斜視構造図及びｂはその側面図である。 １・・・・−・・プリント基板、２・・・・・・樹脂コ
ート、３及び７，７．・・・・・・リード端子、５・・
・・・・部品面、６・・・・・・シールドパターン面、
８・・・・・・導体バタン、１１・・・・・・コンデン
サを形成する小導体バタン。Figures 1a and b are front and side views showing an embodiment of the present invention, Figures 2a and b are sectional views showing a conventional hybrid IC shielding method, and Figure 3 is a hybrid IC according to the present invention. FIGS. 4a and 4b are cross-sectional views showing an implementation example of the present invention. 1... Printed circuit board, 2... Resin coat, 3 and 7, 7. ...Lead terminal, 5...
...Component side, 6...Shield pattern side, 8
...Conductor button, 11...Small conductor button that forms a capacitor. Amendment September 19, 1980 The brief description of the drawing is amended as follows. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a structural diagram showing an embodiment of the hybrid IC according to the present invention, in which a is a rear view of the IC and b is a rear view thereof.
- A side sectional view at A', FIGS. 2 a and b are sectional views showing a conventional hybrid IC shielding method, and FIG. 3 is a sectional view showing an example of mounting a hybrid IC according to the present invention; FIG. 4 is a diagram showing another embodiment of the present invention, in which a is a perspective structural view and b is a side view thereof. 1... Printed circuit board, 2... Resin coat, 3 and 7, 7. ...Lead terminal, 5...
...Component side, 6...Shield pattern side,
8...Conductor button, 11...Small conductor button forming a capacitor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アルミナ基板或はエポキシ基板等のプリント基板の片面
又は両面に部品を付し若しくは導電パターンを配して電
子回路を構成するハイブリッドＩＣに於いて、前記基板
の余白部分に導電薄膜を印刷或は蒸着等によって形成す
ると共に該部分を接地することによってその裏面に位置
する電子回路或は部品を外来ノイズから遮弊せしめたこ
とを特徴とするハイブリッドＩＣの構造。In a hybrid IC, in which an electronic circuit is constructed by attaching components or arranging a conductive pattern to one or both sides of a printed circuit board such as an alumina substrate or an epoxy substrate, a conductive thin film is printed or vapor-deposited on the margin of the substrate. 1. A structure of a hybrid IC characterized in that an electronic circuit or a component located on the back side of the IC is shielded from external noise by forming the IC using the same method as above and grounding the part thereof.
JP7083884U 1984-05-15 1984-05-15 Structure of hybrid IC Pending JPS60183465U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7083884U JPS60183465U (en) 1984-05-15 1984-05-15 Structure of hybrid IC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7083884U JPS60183465U (en) 1984-05-15 1984-05-15 Structure of hybrid IC

Publications (1)

Publication Number Publication Date
JPS60183465U true JPS60183465U (en) 1985-12-05

Family

ID=30607784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7083884U Pending JPS60183465U (en) 1984-05-15 1984-05-15 Structure of hybrid IC

Country Status (1)

Country Link
JP (1) JPS60183465U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63163698A (en) * 1986-12-26 1988-07-07 ホーチキ株式会社 Scattered light type smoke sensor
JPH04116995A (en) * 1990-09-07 1992-04-17 Matsushita Electric Ind Co Ltd Parts packaging substrate and method of shielding the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314151B2 (en) * 1973-03-06 1978-05-15
JPS5651376B2 (en) * 1975-05-30 1981-12-04
JPS5837169B2 (en) * 1978-02-01 1983-08-15 大森機械工業株式会社 Contact packaging method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314151B2 (en) * 1973-03-06 1978-05-15
JPS5651376B2 (en) * 1975-05-30 1981-12-04
JPS5837169B2 (en) * 1978-02-01 1983-08-15 大森機械工業株式会社 Contact packaging method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63163698A (en) * 1986-12-26 1988-07-07 ホーチキ株式会社 Scattered light type smoke sensor
JPH04116995A (en) * 1990-09-07 1992-04-17 Matsushita Electric Ind Co Ltd Parts packaging substrate and method of shielding the same

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