JPS5984852U - Leadless hybrid integrated circuit components - Google Patents
Leadless hybrid integrated circuit componentsInfo
- Publication number
- JPS5984852U JPS5984852U JP16538483U JP16538483U JPS5984852U JP S5984852 U JPS5984852 U JP S5984852U JP 16538483 U JP16538483 U JP 16538483U JP 16538483 U JP16538483 U JP 16538483U JP S5984852 U JPS5984852 U JP S5984852U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- leadless
- circuit components
- hybrid integrated
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図Aは従来の混成集積電子面路の1例を示゛す平面
図、第1図Bは同側面図、第2図Aは本考案の混成集積
電子回路の平面図、第2図Bは同側面図、第3図Aは本
考案め1実施例による接続端子部の斜視図、第3図Bは
同側面図、及び第4図は本考案のリードレス集積電子回
路をメインプリント基板へ取付ける方法を示す部分断面
図である。
図中主な部材は次の通りである。1・・・・・・アルミ
ナ基板、2・・・・・・プリント配線、8・・・・・・
外部端子、8′・・・・・・外部端子。FIG. 1A is a plan view showing an example of a conventional hybrid integrated electronic circuit, FIG. 1B is a side view of the same, and FIG. 2A is a plan view of the hybrid integrated electronic circuit of the present invention. B is a side view of the same, FIG. 3A is a perspective view of the connection terminal section according to the first embodiment of the present invention, FIG. 3B is a side view of the same, and FIG. 4 is a main print of the leadless integrated electronic circuit of the present invention. FIG. 3 is a partial cross-sectional view showing a method of attaching to a board. The main members in the figure are as follows. 1...Alumina board, 2...Printed wiring, 8...
External terminal, 8'...External terminal.
Claims (1)
接続した集積回路部品において、前記配線を前記基板の
平面状端面を有する周辺部に引出して該絶縁体基板の周
辺部縁の上面から端面を経て裏面まで薄膜状の外部端子
を形成したことを特徴とするリードレス混成回蕗部品。 □[Claims for Utility Model Registration] In an integrated circuit component in which a conductive wiring number is formed on an insulating substrate and connected to an integrated circuit component, the wiring is drawn out to the periphery of the substrate having a planar end surface and the insulation is applied. 1. A leadless hybrid incubator component characterized in that a thin film-like external terminal is formed from the upper surface of the peripheral edge of the body substrate to the back surface through the end surface. □
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16538483U JPS5984852U (en) | 1983-10-27 | 1983-10-27 | Leadless hybrid integrated circuit components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16538483U JPS5984852U (en) | 1983-10-27 | 1983-10-27 | Leadless hybrid integrated circuit components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5984852U true JPS5984852U (en) | 1984-06-08 |
Family
ID=30362349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16538483U Pending JPS5984852U (en) | 1983-10-27 | 1983-10-27 | Leadless hybrid integrated circuit components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5984852U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS544360B2 (en) * | 1974-10-22 | 1979-03-06 | ||
JPS5525340B2 (en) * | 1973-11-16 | 1980-07-05 |
-
1983
- 1983-10-27 JP JP16538483U patent/JPS5984852U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5525340B2 (en) * | 1973-11-16 | 1980-07-05 | ||
JPS544360B2 (en) * | 1974-10-22 | 1979-03-06 |
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