JPS6138774U - Grounding mechanism of electronic component case - Google Patents
Grounding mechanism of electronic component caseInfo
- Publication number
- JPS6138774U JPS6138774U JP1984123255U JP12325584U JPS6138774U JP S6138774 U JPS6138774 U JP S6138774U JP 1984123255 U JP1984123255 U JP 1984123255U JP 12325584 U JP12325584 U JP 12325584U JP S6138774 U JPS6138774 U JP S6138774U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component case
- case
- grounding mechanism
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第４図はこの考案の実施例を示し、第１図は
その実施、に使用されるケースの断面図、第２図、第３
図は同回路基板の裏面図ミ第４図はこの考案の１実例を
示す電子部品ケースの接地機＊’７＋’，ｌ１ｆｒＭ琴
２ｔウ，、６．−。
あ．ウ、８：接地パターン、１１：導電性接着剤、１４
・一１５・１６：電子部品。Figures 1 to 4 show an embodiment of this invention, with Figure 1 being a sectional view of a case used in its implementation, Figures 2 and 3.
The figure is a back view of the same circuit board. Figure 4 shows an example of this invention, a grounding device for an electronic component case. −. a. C, 8: Grounding pattern, 11: Conductive adhesive, 14
・115/16: Electronic parts.
Claims (1)
スにおいて、 前記ケースに、前記回路基板に対し、突出する段部を設
けるとともに、この段部に接触する前記回路基板の少な
くとも一部に接地パターンを設け、かつ前記ケーズめ段
部と前記回路基板の接地パターンとを接着固定する導電
性接着剤層を設けてなることを特徴とする電子部品ケー
スの接地機３構。[Claims for Utility Model Registration] In an electronic component case that stores electronic components to be mounted on a circuit board, the case is provided with a step that protrudes from the circuit board, and the circuit contacts the step. A grounding device 3 for an electronic component case, characterized in that a grounding pattern is provided on at least a part of a board, and a conductive adhesive layer is provided for adhesively fixing the step part of the case and the grounding pattern of the circuit board. Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984123255U JPS6138774U (en) | 1984-08-10 | 1984-08-10 | Grounding mechanism of electronic component case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984123255U JPS6138774U (en) | 1984-08-10 | 1984-08-10 | Grounding mechanism of electronic component case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6138774U true JPS6138774U (en) | 1986-03-11 |
Family
ID=30682006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984123255U Pending JPS6138774U (en) | 1984-08-10 | 1984-08-10 | Grounding mechanism of electronic component case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138774U (en) |
-
1984
- 1984-08-10 JP JP1984123255U patent/JPS6138774U/en active Pending
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