JPH073661Y2 - Printed board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a printed circuit board having improved connection means between patterns formed on both surfaces of a substrate body.

[Prior Art] In a printed circuit board in which patterns are formed on both sides of the board body, when mounting a jumper wire that connects the patterns on both sides, a hole (through hole) is formed in the board body,
This is done by providing lands in the upper and lower openings of the hole and soldering both ends of the jumper wire penetrating the hole to the land.

However, when jumper wires are to be soldered, if one land is soldered and then the other land is soldered, the gas generated by the solder will flow out from the inside of the hole. It was not possible to perform good soldering due to voids or bubbles in the solder.

In order to solve this problem, a printed circuit board used in recent years has a structure as shown in FIG.

That is, in the figure, 8 is a substrate body, and two holes 9 and 10 for connecting jumper wires are formed. Reference numeral 11 is an upper surface land provided on the upper opening edge of the hole 9, and 12 is a lower surface land provided on the lower opening edge of the hole 10. Reference numeral 13 is a jumper wire that connects the patterns on both sides of the substrate body 8, and is formed in a U shape so that both ends are inserted into the holes 9 and 10, respectively. 7 is solder, which connects the jumper wire 13 to the upper surface land 11 and the lower surface land 12.

In this way, the upper surface lands 11 and the lower surface lands 12 are provided in separate holes so that they are not affected by the gas generated by soldering.

[Problems to be Solved] As described above, in the conventional printed circuit board, two holes had to be formed in order to connect the lands on the upper surface. Therefore, the electronic component mounting area or the pattern area of the board body becomes narrow, and as a result, there is a problem that the mounting density cannot be increased.

The present invention has been made in consideration of the above-mentioned problems,
It is an object of the present invention to provide a printed circuit board in which the electronic component mounting area or pattern area can be widened and the mounting density can be increased.

[Means for Solving the Problems] In order to achieve the above object, a printed circuit board according to the present invention is provided with a hole for connecting a jumper wire which is provided penetrating a board body, and for connecting the jumper wire which is provided at upper and lower openings of the hole. And a gas vent hole formed so as to be continuous with the hole and penetrate the substrate body and extend to the outside of the land.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a partially enlarged sectional view of a printed circuit board according to this embodiment, and FIG. 2 is a plan view of the same.

In these drawings, 1 is a substrate body having patterns formed on both sides, the upper surface is a component mounting surface, and the lower surface is a terminal soldering surface. Reference numeral 2 is a hole (through hole) for penetrating the substrate body 1 for connecting a jumper wire. Denoted at 3 is a gas vent hole formed continuously with the hole and penetrating the substrate body.
It is provided so as to extend to the outside of 4,5, and the gas generated during soldering is released to the outside of the hole 2. 4 is a land for connecting the upper surface pattern provided at the upper opening edge of the hole 2, 5 is the hole 2
Is a land for connecting the lower surface pattern provided on the lower opening edge, and the portion corresponding to the gas vent hole 3 is cut out.

FIG. 3 is a partially enlarged sectional view showing a state in which jumper wires are mounted on the printed circuit board of this embodiment.

In the figure, 6 is a jumper wire inserted in the hole 2 of the substrate body 1. Both ends of the jumper wire 6 are connected to the upper surface pattern connection land 4 and the lower surface pattern connection land 5 at the opening edge of the hole 2 with solder 7.

According to the printed circuit board having the above-described configuration, the gas vent hole 3 is formed continuously with the hole 2. Therefore, for example, when the printed circuit board is assembled, the upper surface pattern connection land 4 is formed.
Even when the jumper wire 6 is soldered to the bottom surface and then the lower surface pattern connection land 5 is soldered in the solder dip bath, the gas generated during the soldering is removed from the gas vent hole 3
Can be released to the outside, so that soldering can be performed without being adversely affected by gas.

Further, since the gas vent hole 3 extends to the outside of the lands 4 and 5, the gas vent hole 3 is not blocked by a solder bridge or the like.

With this, the connection between the patterns formed on both surfaces of the substrate body can be performed by one hole.

[Advantages of the Invention] As described above, according to the printed circuit board of the present invention, the gas generated during soldering can be reliably discharged to the outside of the hole (through hole), and highly reliable soldering can be realized.

[Brief description of drawings]

FIG. 1 is a partially enlarged sectional view of a printed circuit board according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a partially enlarged sectional view showing a state in which jumper wires are similarly mounted, and FIG. FIG. 6 is a partially enlarged cross-sectional view showing a state in which jumper wires are mounted on the printed circuit board of FIG. 1: Board body 2: Hole (through hole) 3: Gas vent hole 4: Top pattern connection land 5: Bottom pattern connection land 6: Jumper wire 7: Solder

Claims (1)

[Scope of utility model registration request] 1. A hole for connecting a jumper wire provided penetrating the board body, a land for connecting the jumper wire provided at upper and lower openings of the hole, and a hole penetrating the board body continuously to the hole. And a gas vent hole formed to extend to the outside of the land.