JP2859221B2 - Terminal structure of electronic components - Google Patents
Terminal structure of electronic componentsInfo
- Publication number
- JP2859221B2 JP2859221B2 JP8274607A JP27460796A JP2859221B2 JP 2859221 B2 JP2859221 B2 JP 2859221B2 JP 8274607 A JP8274607 A JP 8274607A JP 27460796 A JP27460796 A JP 27460796A JP 2859221 B2 JP2859221 B2 JP 2859221B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- solder
- terminal
- connection
- terminal structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば、基板に表
面実装するのに好適な電子部品の端子構造に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal structure of an electronic component suitable for, for example, surface mounting on a substrate.
【０００２】[0002]
【従来の技術】一般に、電気機器に使用される電子部品
の多くは、基板に形成されたスルーホールにリード端子
を挿入してハンダ付け接続されている。ところが、近年
の電気機器の小型化、薄型化に伴い、基板の表面に形成
されたランド（導体面）に電極端子（端子）を当接して
ハンダ付け接続をする、いわゆる表面実装により電子部
品を接続する方法が広く用いられるようになっている。2. Description of the Related Art Generally, most electronic components used in electric equipment are connected by soldering by inserting lead terminals into through holes formed in a substrate. However, with the recent miniaturization and thinning of electrical equipment, electronic components are connected by soldering by contacting electrode terminals (terminals) with lands (conductor surfaces) formed on the surface of the substrate, that is, by so-called surface mounting. The connection method has been widely used.
【０００３】図５および図６は、従来の電極端子を有す
る電子部品と基板とをハンダ付け接続する一例である。
図５に示すように、符号１は電子部品であり、符号２は
基板である。基板２の一面には、ランド９が形成されて
おり、このランド９にはハンダ３により電子部品１が接
続されている。FIGS. 5 and 6 show an example in which a conventional electronic component having electrode terminals and a substrate are connected by soldering.
As shown in FIG. 5, reference numeral 1 denotes an electronic component, and reference numeral 2 denotes a substrate. A land 9 is formed on one surface of the substrate 2, and the electronic component 1 is connected to the land 9 by solder 3.
【０００４】電子部品１は、半導体素子等の電子部品本
体４と、電子部品本体４を封止するカバー５と、これら
を搭載する電子部品搭載基板６とから構成されている。
電子部品搭載基板６の一方の側の接続面１０上には、銅
箔に金メッキ処理等を施した電極端子８が形成されてい
る。この電極端子８は電子部品搭載基板６の側面１１上
および他方の側の接続面１２上にも延設され、電子部品
本体４の接続部７に接続することにより、ハンダ３を介
して、電子部品本体４と基板２に形成されたランド９と
を導通可能にするものである。The electronic component 1 includes an electronic component main body 4 such as a semiconductor element, a cover 5 for sealing the electronic component main body 4, and an electronic component mounting board 6 on which these are mounted.
On the connection surface 10 on one side of the electronic component mounting board 6, an electrode terminal 8 formed by applying a gold plating process or the like to a copper foil is formed. The electrode terminals 8 extend on the side surface 11 of the electronic component mounting board 6 and also on the connection surface 12 on the other side. The component body 4 and the lands 9 formed on the substrate 2 are made conductive.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述し
たような従来の電子部品の端子構造には、以下のような
問題が存在する。電子部品１の小型化に伴い電極端子８
も小型化されており、また、図６に示すように、電極端
子８は平面的に形成されているだけなので、ハンダ付け
接続に十分なハンダとの接触面積を確保することが困難
になっている。この状態において、例えば、振動や衝撃
などが加われば、ハンダが剥離してしまうこともある。However, the conventional terminal structure of an electronic component as described above has the following problems. Electrode terminals 8 with miniaturization of electronic component 1
Also, as shown in FIG. 6, since the electrode terminal 8 is formed only in a plane as shown in FIG. 6, it is difficult to secure a sufficient contact area with solder for soldering connection. I have. In this state, if, for example, vibration or impact is applied, the solder may be peeled off.
【０００６】本発明は、以上のような点を考慮してなさ
れたもので、ハンダとの十分な接触面積を有し、ハンダ
付け接続強度の高い電子部品の端子構造を提供すること
を目的とする。The present invention has been made in view of the above points, and has as its object to provide a terminal structure of an electronic component having a sufficient contact area with solder and high soldering connection strength. I do.
【０００７】[0007]
【課題を解決するための手段】上記の目的を達成するた
めに本発明は、以下の構成を採用している。請求項１記
載の電子部品の端子構造は、基板の一面に導体面が形成
され、該導体面にハンダ付け接続される電子部品搭載基
板の一方の側の接続面上に端子を具備してなり、該端子
が前記電子部品搭載基板の側面および他方の側の接続面
上に延設された電子部品の端子構造であって、前記一方
の側の接続面上の端子には、前記電子部品搭載基板の側
面から離間して前記ハンダ付け接続するときに該ハンダ
が溶着する凹部が設けられていることを特徴とする。In order to achieve the above object, the present invention employs the following constitution. 2. The terminal structure for an electronic component according to claim 1, wherein a conductor surface is formed on one surface of the substrate, and the electronic component mounting base is connected to the conductor surface by soldering.
Ri Na comprises a pin on one side of the connection surface of the plate, the terminal
Are the side surfaces of the electronic component mounting board and the connection surface on the other side.
A terminal structure of an electronic component which extends above the one
The terminal on the connection surface of the side, the side of the electronic component mounting board
A recess is provided in which the solder is welded when the soldering connection is made apart from the surface .
【０００８】従って、本発明の電子部品の端子構造にお
いては、端子にハンダが溶着する凹部が設けられている
ので、ハンダとの接触面積が増加することにより接続強
度が大きくなる。Therefore, in the terminal structure of the electronic component of the present invention, since the terminal is provided with the concave portion to which the solder is welded, the contact area with the solder is increased, so that the connection strength is increased.
【０００９】請求項２記載の電子部品の端子構造は、請
求項１記載の電子部品の端子構造において、前記凹部内
には、該凹部内の底面から外側へ向けて突部が設けられ
ていることを特徴とする。According to a second aspect of the present invention, there is provided the terminal structure of the electronic component according to the first aspect, wherein a protrusion is provided in the concave portion from a bottom surface inside the concave portion to the outside. It is characterized by the following.
【００１０】従って、本発明の電子部品の端子構造にお
いては、端子にハンダが溶着する凹部および凹部内に突
部が設けられているため、一層ハンダとの接触面積が増
加し、接続強度もより大きくなる。Therefore, in the terminal structure of the electronic component according to the present invention, since the terminal is provided with the concave portion where the solder is welded and the protrusion in the concave portion, the contact area with the solder is further increased, and the connection strength is further improved. growing.
【００１１】請求項３記載の電子部品の端子構造は、請
求項１または２記載の電子部品の端子構造において、前
記凹部内の側面と前記電子部品搭載基板の一方の側の接
続面との交叉する部分には、接続強度の低下を防止する
ために応力集中を回避するようにハンダを補強する湾曲
面からなる補強面が設けられていることを特徴とする。According to a third aspect of the present invention, there is provided a terminal structure of an electronic component according to the first or second aspect, wherein a side surface in the recess and one side of the electronic component mounting board are connected. Prevents a drop in connection strength at the intersection with the connecting surface
For this purpose, a reinforcing surface comprising a curved surface for reinforcing the solder so as to avoid stress concentration is provided.
【００１２】従って、本発明の電子部品の端子構造にお
いては、電子部品と基板とをハンダ付け接続したとき
に、凹部内面と接続面との交叉する部分のハンダに応力
が集中することを回避することにより接続強度の低下を
防止できる。Therefore, in the terminal structure of the electronic component according to the present invention, when the electronic component and the board are connected by soldering, stress is prevented from being concentrated on the solder at the intersection of the inner surface of the recess and the connection surface. This can prevent a decrease in connection strength .
【００１３】[0013]
【発明の実施の形態】以下、本発明の電子部品の端子構
造の第１の実施の形態を、図１および図２を参照して説
明する。これらの図において、従来例として示した図５
および図６と同一の構成要素については同一符号を付
し、その説明を省略する。本発明の電子部品の端子構造
の第１の実施の形態が、従来例と異なる点は電極端子の
構造である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a terminal structure for an electronic component according to the present invention will be described below with reference to FIGS. In these figures, FIG.
The same components as those in FIG. 6 are denoted by the same reference numerals, and description thereof will be omitted. The first embodiment of the terminal structure of the electronic component of the present invention differs from the conventional example in the structure of the electrode terminal.
【００１４】図１に示すように、電子部品１は、ハンダ
３により基板２に形成されたランド９に接続されてい
る。図２に示すように、電子部品１の電極端子８には、
一方の側の接続面１０側に、電子部品搭載基板の側面１
１から離間した位置に円形の凹部１３が設けられてい
る。凹部１３内には、底面１４と側面１５とが形成され
ており、側面１５と接続面１０とが交叉する部分には、
その断面形状が側面１５と接続面１０との両方に接する
湾曲部１６（補強面）が形成されている。As shown in FIG. 1, the electronic component 1 is connected to a land 9 formed on the substrate 2 by solder 3. As shown in FIG. 2, the electrode terminals 8 of the electronic component 1 include:
A side surface 1 of the electronic component mounting board is provided on one connection surface 10 side.
A circular concave portion 13 is provided at a position separated from 1 . A bottom surface 14 and a side surface 15 are formed in the recess 13, and a portion where the side surface 15 and the connection surface 10 intersect is
A curved portion 16 (reinforcement surface) whose cross-sectional shape is in contact with both the side surface 15 and the connection surface 10 is formed.
【００１５】この構成において、ハンダ付け接続により
電子部品１と基板２は接続される。このとき、ハンダ３
は、電子部品１の接続面１０と基板２のランド９との間
で溶着すると共に、電極端子８に設けられた凹部１３内
においても溶着する。そして、凹部１３には、側面１５
が形成されているため、その表面積分、ハンダ３と電極
端子８との接触面積が増加する。また、電極端子８に形
成された湾曲部１６の形状が、ハンダ３に転写されるた
め、ハンダ３にも湾曲部１６ａが形成される。In this configuration, electronic component 1 and substrate 2 are connected by soldering connection. At this time, solder 3
Is welded between the connection surface 10 of the electronic component 1 and the land 9 of the substrate 2 and also in the recess 13 provided in the electrode terminal 8. The recess 13 has a side surface 15.
Is formed, the surface integral thereof and the contact area between the solder 3 and the electrode terminal 8 increase. Further, since the shape of the curved portion 16 formed on the electrode terminal 8 is transferred to the solder 3, the curved portion 16 a is also formed on the solder 3.
【００１６】本実施の形態の電子部品の端子構造によれ
ば、電極端子８に凹部１３が設けられているため、ハン
ダ付け接続の際、ハンダ３と電極端子８との接触面積が
増加する。そのため、電子部品１と基板２との接続強度
が大きくなるという効果を生む。また、ハンダ３にも湾
曲部１６ａが形成されるため、その部分の応力集中が回
避され、従って、接続強度の低下を防止できる。According to the terminal structure of the electronic component of the present embodiment, since the concave portion 13 is provided in the electrode terminal 8, the contact area between the solder 3 and the electrode terminal 8 at the time of soldering connection increases. Therefore, an effect of increasing the connection strength between the electronic component 1 and the substrate 2 is produced. Further, since the bent portion 16a is also formed in the solder 3, stress concentration at that portion is avoided, and therefore, a decrease in connection strength can be prevented.
【００１７】図３および図４は、本発明の電子部品の端
子構造の第２の実施の形態を示す図である。これらの図
において、図１および図２に示す第１の実施の形態の構
成要素と同一の要素については同一符号を付し、その説
明を省略する。第２の実施の形態と第１の実施の形態と
が異なる点は、電極端子８の凹部１３内に突部１７が設
けられていることである。FIGS. 3 and 4 are views showing a second embodiment of the terminal structure of an electronic component according to the present invention. In these figures, the same elements as those of the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. The difference between the second embodiment and the first embodiment is that a projection 17 is provided in the recess 13 of the electrode terminal 8.
【００１８】即ち、図４に示すように、凹部１３内に
は、凹部１３の底面１４から外側に向かって円柱状の突
部１７が垂設している。また、図３に示すように、この
突部１７の先端面１８と垂設面１９との交叉する部分に
は、その断面形状が先端面１８と垂設面１９との両方に
接する湾曲形状２０が形成されている。That is, as shown in FIG. 4, a columnar projection 17 is provided in the recess 13 so as to extend outward from the bottom surface 14 of the recess 13. Further, as shown in FIG. 3, at a portion where the tip surface 18 and the hanging surface 19 intersect with each other, a cross-sectional shape of the projecting portion 17 is a curved shape 20 which is in contact with both the tip surface 18 and the hanging surface 19. Are formed.
【００１９】この構成において、ハンダ付け接続により
電子部品１と基板２は接続される。このとき、ハンダ３
は、電子部品１の接続面１０と基板２のランド９との間
で溶着すると共に、電極端子８に設けられた凹部１３内
においても溶着する。そして、凹部１３には、側面１５
および突部１７の垂設面１９が形成されているため、そ
の表面積分、ハンダ３と電極端子８との接触面積が増加
する。また、電極端子８に形成された湾曲部１６および
湾曲形状２０の形状が、ハンダ３に転写されるため、ハ
ンダ３にも湾曲部１６ａおよび湾曲形状２０ａが形成さ
れる。In this configuration, the electronic component 1 and the substrate 2 are connected by soldering connection. At this time, solder 3
Is welded between the connection surface 10 of the electronic component 1 and the land 9 of the substrate 2 and also in the recess 13 provided in the electrode terminal 8. The recess 13 has a side surface 15.
In addition, since the vertical surface 19 of the projection 17 is formed, the surface integral thereof and the contact area between the solder 3 and the electrode terminal 8 increase. Further, since the shapes of the curved portion 16 and the curved shape 20 formed on the electrode terminal 8 are transferred to the solder 3, the curved portion 16 a and the curved shape 20 a are also formed on the solder 3.
【００２０】本実施の形態の電子部品の端子構造によれ
ば、電極端子８に凹部１３が設けられ、また、凹部１３
内に突部１７が設けられているため、ハンダ付け接続の
際、ハンダ３と電極端子８との接触面積が一層増加す
る。そのため、電子部品１と基板２との接続強度がより
大きくなるという効果を生む。また、ハンダ３にも湾曲
部１６ａおよび湾曲形状２０ａが形成されるため、その
部分の応力集中が回避され、従って、接続強度の低下を
一層防止可能となる。According to the terminal structure of the electronic component of the present embodiment, the electrode terminal 8 is provided with the concave portion 13 and the concave portion 13 is provided.
The contact area between the solder 3 and the electrode terminal 8 at the time of soldering connection is further increased because the projection 17 is provided inside the inside. Therefore, an effect of increasing the connection strength between the electronic component 1 and the substrate 2 is produced. In addition, since the curved portion 16a and the curved shape 20a are also formed in the solder 3, stress concentration at that portion is avoided, and therefore, a reduction in connection strength can be further prevented.
【００２１】なお、上記実施の形態において、凹部を円
形とし突部を一つの円柱状としたがこの構成に限らず、
例えば、凹部、突部とも断面矩形とする形状で、突部が
複数設けられる構成であってもよい。また、電極端子を
電子部品搭載基板に形成する構成としたが、この構成に
限らず、例えば、電子部品本体に直接電極端子を設ける
構成であってもよい。In the above embodiment, the concave portion is circular and the projecting portion is formed as one column. However, the present invention is not limited to this configuration.
For example, a configuration in which both the concave portion and the protrusion have a rectangular cross section and a plurality of protrusions may be provided. In addition, the electrode terminals are formed on the electronic component mounting board. However, the present invention is not limited to this configuration. For example, the electrode terminals may be provided directly on the electronic component body.
【００２２】[0022]
【発明の効果】以上説明したように、請求項１に係る電
子部品の端子構造によれば、基板にハンダ付け接続され
る電子部品の端子に、ハンダが溶着する凹部が設けられ
る構成となっている。これにより、端子とハンダとの接
触面積が増加し、従って、電子部品と基板とのハンダに
よる接続強度が大きくなり、その信頼性が向上するとい
う優れた効果を奏する。As described above, according to the terminal structure of the electronic component according to the first aspect, the terminal of the electronic component connected to the board by soldering is provided with the concave portion where the solder is welded. I have. As a result, the contact area between the terminal and the solder is increased, and therefore, the connection strength of the electronic component and the board by the solder is increased, and an excellent effect of improving the reliability is exhibited.
【００２３】請求項２に係る電子部品の端子構造によれ
ば、端子の凹部内に突部が設けられる構成となってい
る。これにより、端子とハンダとの接触面積が一層増加
し、従って、電子部品と基板とのハンダによる接続強度
がより大きくなるという優れた効果を奏する。According to the terminal structure of the electronic component according to the second aspect, the projection is provided in the recess of the terminal. As a result, the contact area between the terminal and the solder is further increased, so that an excellent effect that the connection strength between the electronic component and the substrate by the solder is further increased is exhibited.
【００２４】請求項３に係る電子部品の端子構造によれ
ば、凹部内の側面と接続面との交叉する部分に、ハンダ
を補強する湾曲面からなる補強面が設けられる構成とな
っている。これにより、電子部品と基板とをハンダ付け
接続したときに、補強面がハンダに転写されハンダにも
補強面が形成される。従って、凹部内面と接続面との交
叉する部分のハンダに応力が集中することを回避し、接
続強度の低下を防止するという優れた効果を奏する。According to the terminal structure of the electronic component according to the third aspect, a reinforcing surface composed of a curved surface for reinforcing the solder is provided at a portion where the side surface in the concave portion and the connecting surface intersect. Thereby, when the electronic component and the board are connected by soldering, the reinforcing surface is transferred to the solder, and the reinforcing surface is also formed on the solder. Therefore, it is possible to prevent the stress from being concentrated on the solder at the portion where the inner surface of the concave portion intersects with the connection surface, thereby providing an excellent effect of preventing the connection strength from being reduced.
【図１】 本発明の第１の実施の形態を示す図であっ
て、電子部品と基板とがハンダにより接続されている断
面図である。FIG. 1 is a view showing a first embodiment of the present invention, and is a cross-sectional view in which an electronic component and a substrate are connected by solder.
【図２】 本発明の第１の実施の形態を構成する電子部
品の斜視図である。FIG. 2 is a perspective view of an electronic component constituting the first embodiment of the present invention.
【図３】 本発明の第２の実施の形態を示す図であっ
て、電子部品と基板とがハンダにより接続されている断
面図である。FIG. 3 is a view showing a second embodiment of the present invention, and is a cross-sectional view in which an electronic component and a substrate are connected by solder.
【図４】 本発明の第２の実施の形態を構成する電子部
品の斜視図である。FIG. 4 is a perspective view of an electronic component constituting a second embodiment of the present invention.
【図５】 従来技術の電子部品と基板とがハンダにより
接続されている断面図である。FIG. 5 is a cross-sectional view in which a conventional electronic component and a substrate are connected by solder.
【図６】 従来技術の電子部品の斜視図である。FIG. 6 is a perspective view of a conventional electronic component.
１ 電子部品 ２ 基板 ３ ハンダ６ 電子部品搭載基板 ８ 電極端子（端子） ９ ランド（導体面） １０ 一方の側の接続面１１ 電子部品搭載基板の側面 １２ 他方の側の接続面 １３ 凹部 １４ 底面 １５ 側面 １６，１６ａ 湾曲部（補強面） １７ 突部REFERENCE SIGNS LIST 1 electronic component 2 substrate 3 solder 6 electronic component mounting substrate 8 electrode terminal (terminal) 9 land (conductor surface) 10 connection surface 11 on one side 11 side surface 12 of electronic component mounting substrate 12 connection surface 13 on the other side concave portion 14 bottom surface 15 Side surface 16, 16a Curved portion (reinforcement surface) 17 Projection
Claims (3)
方の側の接続面上に端子を具備してなり、該端子が前記
電子部品搭載基板の側面および他方の側の接続面上に延
設された電子部品の端子構造であって、 前記一方の側の接続面上の端子には、前記電子部品搭載
基板の側面から離間して前記ハンダ付け接続するときに
該ハンダが溶着する凹部が設けられていることを特徴と
する電子部品の端子構造。A conductive surface formed on one surface of the substrate; and an electronic component mounting substrate connected to the conductive surface by soldering.
Square Ri Na comprises a terminal on the side of the connecting surface on, the terminal is said
Extending on the side surface of the electronic component mounting board and the connection surface on the other side.
A terminal structure of the provided electronic component, wherein the terminal on the connection surface on the one side has the electronic component mounted thereon.
A terminal structure for an electronic component, characterized in that a concave portion is provided in which the solder is welded when the soldering connection is made apart from the side surface of the substrate .
いて、 前記凹部内には、該凹部内の底面から外側へ向けて突部
が設けられていることを特徴とする電子部品の端子構
造。2. The terminal structure for an electronic component according to claim 1, wherein a protrusion is provided in the recess from a bottom surface in the recess to an outside. .
構造において、 前記凹部内の側面と前記電子部品搭載基板の一方の側の
接続面との交叉する部分には、接続強度の低下を防止す
るために応力集中を回避するようにハンダを補強する湾
曲面からなる補強面が設けられていることを特徴とする
電子部品の端子構造。3. The terminal structure for an electronic component according to claim 1, wherein a connection is formed at a portion where a side surface in the concave portion and a connection surface on one side of the electronic component mounting board intersect. Prevent strength loss
A terminal structure for an electronic component, comprising: a reinforcing surface having a curved surface for reinforcing solder so as to avoid stress concentration .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8274607A JP2859221B2 (en) | 1996-10-17 | 1996-10-17 | Terminal structure of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8274607A JP2859221B2 (en) | 1996-10-17 | 1996-10-17 | Terminal structure of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10126030A JPH10126030A (en) | 1998-05-15 |
| JP2859221B2 true JP2859221B2 (en) | 1999-02-17 |
Family
ID=17544098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8274607A Expired - Fee Related JP2859221B2 (en) | 1996-10-17 | 1996-10-17 | Terminal structure of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2859221B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4590054B2 (en) * | 2000-01-18 | 2010-12-01 | キヤノン株式会社 | Shield case mounting structure |
| JP4777745B2 (en) * | 2005-11-01 | 2011-09-21 | セイコーインスツル株式会社 | Piezoelectric vibrator, oscillator including the same, radio clock, and electronic device |
| US9825273B2 (en) * | 2013-09-06 | 2017-11-21 | Johnson Controls Technology Company | Systems, methods, and devices for constant current relay control of a battery module |
-
1996
- 1996-10-17 JP JP8274607A patent/JP2859221B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10126030A (en) | 1998-05-15 |
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