JP4590054B2 - Shield case mounting structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting structure of a shield case, and particularly relates to the shape of a connection portion of a shield case that is directly mounted on a printed wiring board.
[0002]
[Prior art]
Conventionally, there have been the following technologies in such fields.
[0003]
FIG. 6 is a perspective view showing the mounting structure of such a conventional shield case.
[0004]
As shown in FIG. 6, a shield case 3 is mounted on a ground (GND) pattern 2 on a printed wiring board 1 using solder 4. That is, an arbitrary position on the side surface 3 a of the shield case 3 and the GND pattern 2 on the printed wiring board 1 are connected by the solder 4.
[0005]
[Problems to be solved by the invention]
In mounting the above-described conventional shield case with solder, as shown in FIG. 7, the side surface 3a of the shield case 3 is flat. Therefore, when the shield case 3 is mounted on the printed wiring board 1, it is necessary to adhere the solder 4 to both the printed wiring board 1 [ground (GND) pattern 2] and the side surface 3 a of the shield case 3.
[0006]
At this time, since the thermal resistance of the printed wiring board 1 and the shield case 3 is small , the heat of the soldering iron 5 is dispersed and the temperature of the solder 4 tends to be lowered, and the shield case 3 and the printed wiring board 1 are connected. Requires a large heat capacity soldering iron 5.
[0007]
However, when a large heat capacity soldering iron 5 is used, this heat is also transmitted to the periphery of the GND pattern 2 of the printed wiring board 1, and the solder of electronic components already mounted by solder, chip components such as resistors and capacitors, etc. There is a problem that these parts move when melted.
[0008]
Moreover, since the melted solder 4 spreads to the side surface 3a of the shield case 3, a large amount of solder is required for solder connection.
[0009]
It is an object of the present invention to eliminate the above-mentioned problems and to satisfactorily connect a shield case to be mounted on a printed wiring board with solder.
[0010]
[Means for Solving the Problems]
The present invention, in order to achieve the above object, in the mounting structure of the shield case, the solder connection portion of the side surface of the shield case of mounting by soldering on a printed circuit board, and the printed wiring board and the lower surface of the shield case A shape portion including a hollow shape portion is provided such that a linear locus having a line width as a thickness of a side surface of the shield case at a contacting portion has a linear shape and a curved shape protruding inward of the shield case . In order to achieve the above object, according to the present invention, in the shield case mounting structure, the printed wiring board and the lower surface of the shield case are connected to the solder connection portion of the side surface of the shield case mounted on the printed wiring board by solder. And a shape portion including a protruding shape portion so that a linear trajectory having a line width as a thickness of a side surface of the shield case at a portion in contact with a straight line and a curved shape protruding outward from the shield case To do.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0012]
FIG. 1 is a configuration diagram of the main part of a shield case mounting structure according to a first embodiment of the present invention, FIG. 1 (a) is a perspective view of the main part of the shield case mounting structure, and FIG. It is a figure (figure seen from the bottom) which shows the shape of the hollow of the mounting structure of a shield case.
[0013]
In this embodiment, the solder connection portion of the side surface 11a of the shield case 11 is formed as a hollow portion 12 as shown in FIG. The shape is a hollow shape with roundness. Reference numeral 10 denotes a printed wiring board.
[0014]
According to this embodiment, the heat of solder (not shown) tends to concentrate on the hollow portion 12 and the temperature of the solder is difficult to decrease.
[0015]
FIG. 2 is a block diagram of the main part of the shield case mounting structure according to the second embodiment of the present invention. FIG. 2 (a) is a perspective view of the main part of the shield case mounting structure, and FIG. It is a figure (view seen from the bottom) which shows the projection shape of the mounting structure of a shield case.
[0016]
In this embodiment, the solder connection portion of the side surface 21a of the shield case 21 is a protrusion-shaped portion 22 as shown in FIG. Reference numeral 20 denotes a printed wiring board.
[0017]
According to this embodiment, the heat of solder (not shown) tends to concentrate on the protrusion-shaped portion 22, and the temperature of the solder is difficult to decrease.
[0018]
FIG. 3 is a perspective view of an essential part of a shield case mounting structure showing a third embodiment of the present invention.
[0019]
In this embodiment, the solder connection portion of the side surface 31a of the shield case 31 is a perforated portion (small dents are lined up) 32 as shown in FIG. Reference numeral 30 denotes a printed wiring board.
[0020]
According to this embodiment, since the perforated portion 32 is present, the solder tends to gather at the inner portion of the perforated portion 32, and the heat of the solder is not dispersed throughout the shield case 31.
[0021]
FIG. 4 is a perspective view of an essential part of a shield case mounting structure showing a fourth embodiment of the present invention.
[0022]
In this embodiment, the solder connection portion of the side surface 41a of the shield case 41 is formed as a solder plated portion 42 as shown in FIG. That is, the solder-plated portion 42 is formed by performing solder plating on the solder connection portion. Reference numeral 40 denotes a printed wiring board.
[0023]
According to this embodiment, solder (not shown) is likely to adhere to the solder plating shape portion 42.
[0024]
As described above, according to the present invention, since the heat of the soldering iron is easily concentrated on the solder, the temperature of the solder is difficult to be lowered. It becomes easy to gather at the inner part of the perforated portion 32, and the connection between the shield cases 11, 21, 31, 41 and the substrates 10, 20, 30, 40 becomes easy.
[0025]
Further, solder connection is possible even if the heat capacity of the soldering iron (not shown) is small.
[0026]
Furthermore, in the said Example, the example which makes a solder connection part the structure of the hollow shape part 12, the protrusion shape part 22, and the perforation shape part 32, and the example of the structure of solder plating processing were shown separately for the solder connection part. However, as shown in FIG. 5, the solder plating shape portion 42 of the fourth embodiment is applied to each of the shape portions 12, 22, and 32 of the solder connection portions of the first to third embodiments. You may do it. In FIG. 5, 51 is a shield case, 51 a is a side surface of the shield case, and 52 is a solder connection portion, which is composed of a perforated shape portion 32 and a solder plating shape portion 42.
[0027]
In addition, this invention is not limited to the said Example, A various deformation | transformation is possible based on the meaning of this invention, and these are not excluded from the scope of the present invention.
[0028]
【The invention's effect】
As described above in detail, according to the present invention, since the shape portion where the solder concentrates is formed at the solder connection portion of the shield case, the heat of the soldering iron is easily concentrated on the solder, and the temperature of the solder is It becomes difficult to lower, and good solder connection can be performed.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a main part of a shield case mounting structure according to a first embodiment of the present invention;
FIG. 2 is a configuration diagram of the main part of a shield case mounting structure showing a second embodiment of the present invention;
FIG. 3 is a perspective view of an essential part of a shield case mounting structure showing a third embodiment of the present invention;
FIG. 4 is a perspective view of an essential part of a shield case mounting structure showing a fourth embodiment of the present invention;
FIG. 5 is a perspective view of an essential part of a shield case mounting structure showing a fifth embodiment of the present invention;
FIG. 6 is a perspective view showing a conventional shield case mounting structure;
FIG. 7 is a perspective view showing a conventional shield case mounting process.
[Explanation of symbols]
10, 20, 30, 40, 50 Printed circuit board 11, 21, 31, 41, 51 Shield case 11a, 21a, 31a, 41a, 51a Side surface 12 of shield case Recessed portion (solder connection portion)
22 Protrusion-shaped part (solder connection part)
32 Perforated part 42 Solder plated part 52 Solder connection part (perforated part + solder plated part)

Claims (3)

A linear connection with the thickness of the side surface of the shield case at the portion where the printed circuit board and the lower surface of the shield case are in contact with the solder connection portion of the side surface of the shield case mounted by solder on the printed circuit board A shield case mounting structure comprising a shape portion including a hollow shape portion so that a locus is formed of a linear shape and a curved shape protruding inward of the shield case. A linear connection with the thickness of the side surface of the shield case at the portion where the printed circuit board and the lower surface of the shield case are in contact with the solder connection portion of the side surface of the shield case mounted by solder on the printed circuit board A shield case mounting structure comprising a shape portion including a protruding shape portion so that a locus is formed of a linear shape and a curved shape protruding outward from the shield case. 3. The shield case mounting structure according to claim 1, wherein the shape portion is subjected to solder plating.

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