JP2561023Y2 - High frequency circuit device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency circuit device.

[0002]

2. Description of the Related Art FIG. 2 is a perspective view of a dielectric filter having a metal case, in which a filter element using a dielectric resonator 1 is made of a metal box-shaped case (hereinafter referred to as a metal case) 2.
It is stored in.

When soldering such a high-frequency circuit device on a circuit board, as shown in a perspective view of FIG. 4 and input / output terminals 5 derived from the filter element are soldered to connection electrodes 7 arranged at corresponding positions on the circuit board 6.

[0004]

In the high frequency circuit component shown in FIG. 2, the bottom of the metal case is as shown in FIG. 4 (a), and FIG. 4 (b) is a side view of the component. The ground terminal 4 and the component body are on the same plane so that

FIG. 5 shows a high frequency circuit component provided with a metal case 2 containing a dielectric filter element, for example.
FIG. 9 is a cross-sectional view when soldering is connected to the upper connection electrode 7,
The melted solder 8 transfers from the connection electrode 7 on the circuit board 6 to the component body side through the metal case bottom 3 having good solder wettability, and only a small amount of solder for connection remains.
There has been a problem that the connection strength between the circuit board and the component is weakened.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a high-frequency circuit device having a metal case having a ground terminal and having a sufficient connection strength when soldered to a circuit board. is there.

[0007]

As a result of research to achieve the above object, the present inventor has found that at least a region on the bottom surface of a metal case adjacent to the base of the ground terminal has solder wettability such as insulating resin. It has been found that the above problem can be solved by providing a coating layer having a low melting point as a solder blocking layer to prevent the molten solder from migrating along the bottom surface of the metal case to solve the above-mentioned problem.

Accordingly, the present invention provides a high-frequency circuit device including a metal box-like case which houses a high-frequency circuit element and has a ground terminal integrally projecting from a lower edge of a side surface, wherein at least the ground terminal is provided. And a solder blocking layer having low solder wettability is formed in a region on the bottom surface of the case adjacent to the base.

[0009]

In the high-frequency circuit device of the present invention, a metal piece for connection on the bottom of the metal case, for example, an area in contact with a ground terminal,
By forming a coating layer having low solder wettability as a solder blocking layer, the molten solder attached to the metal piece for connection is prevented from migrating to the bottom surface of the metal case, and a sufficient amount of solder is formed on the metal piece and the substrate. Is attached to the connection electrode.

[0010]

Embodiment 1 FIG. 1A is a plan view showing a solder blocking layer formed on the periphery of the bottom of a metal case of a high-frequency circuit component in this embodiment, and FIG. 1B is a plan view showing a ground terminal on a circuit board. FIG. 6 is a side sectional view showing a relationship with a solder blocking layer when soldering to a connection electrode; FIG. 6 is a solder blocking layer formed in a U-shape on the periphery of the bottom of the metal case; All are plan views showing the solder blocking layer formed over the entire area, and the following description will be made with reference to these figures.

In a high-frequency circuit component in which a filter element using a dielectric resonator is housed in a metal case, a paste-like insulating resin (resist) is applied to the peripheral portion of the bottom surface of the metal case and then cured by infrared rays. Thus, a solder blocking layer 9 was formed [FIG. 1 (a)].

As shown in FIG. 1B, such a high-frequency circuit component was mounted on a circuit board 6 and subsequently subjected to a reflow process and soldered.

The solder 8 applied to the connection electrode 7 on the circuit board 6 is repelled by the solder blocking layer 9 having low solder wettability, so that its progress is prevented and the solder 8 does not shift to the bottom of the metal case, and the ground terminal 4 And the connection electrode 7 could be connected with sufficient strength.

[0014] As shown in FIG.
May be formed in a U-shape except for the edge portion where the ground terminal is not protruded, and as shown in FIG. You can give it.

As shown in FIGS. 8A and 8B, considering the thickness of the solder blocking layer, the ground terminal 4 is folded downward so that the ground terminal does not float from the surface of the circuit board. Alternatively, it may be processed into a crank shape.

[0016]

Embodiment 2 According to the procedure of Embodiment 1, instead of applying the insulating resin, a heat-resistant seal that can withstand the reflow treatment is adhered to the periphery of the bottom surface of the metal case to form a solder blocking layer. 1, the ground terminal and the connection electrode could be reliably connected.

If a conductive heat-resistant seal having conductivity is used for the heat-resistant seal, the bottom can be grounded even on the main body side, and the component characteristics can be improved.

[0018]

As described above, in the high-frequency circuit device of the present invention, a coating-like solder blocking layer having low solder wettability is formed on the bottom surface of the metal case at least in a region in contact with the ground terminal. Therefore, when the reflow soldering is performed on the circuit board, the grounding terminal can be securely soldered.

[Brief description of the drawings]

FIG. 1A is a plan view showing a solder blocking layer formed on a peripheral portion of a bottom surface of a metal case of a high-frequency circuit component according to an embodiment of the present invention, and FIG. FIG. 6 is a side cross-sectional view showing a relationship between a ground terminal and a solder blocking layer provided on the bottom surface when the ground terminal is connected to a connection electrode on a circuit board.

FIG. 2 is a perspective view showing a high-frequency circuit component using a dielectric resonator.

FIG. 3 is a perspective view showing a state in which a ground terminal and an input / output terminal of the high-frequency circuit component are connected to connection electrodes formed on a circuit board, respectively.

4A is a plan view showing a bottom surface of a metal case of the high-frequency circuit component shown in FIG. 2, and FIG. 4B is a side view of the metal case.

FIG. 5 is a side cross-sectional view showing a state in which solder moves to the bottom of a metal case when a ground terminal of a conventional high-frequency circuit component is soldered to a connection electrode on a circuit board.

FIG. 6 is a plan view showing a U-shaped solder blocking layer formed on the periphery of the bottom surface of the metal case in the high-frequency circuit component of the present invention.

FIG. 7 is a plan view showing the solder blocking layer formed over the entire bottom surface of the metal case in the high-frequency circuit component of the present invention.

FIG. 8 (a) is a side view showing a ground terminal folded down in consideration of the thickness of a solder blocking layer formed on the bottom of a metal case of a high-frequency circuit component, and FIG. 8 (b) is the same. FIG. 6 is a side view showing a ground terminal processed into a crank shape.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 dielectric resonator 2 metal case 3 bottom of metal case 4 ground terminal 5 input / output terminal 6 circuit board 7 connection electrode 8 solder 9 solder blocking layer

Claims (2)

(57) [Scope of request for utility model registration] 1. A high-frequency circuit device comprising a metal box-shaped case for housing a high-frequency circuit element and having a ground terminal integrally protruded from a lower edge of a side surface, wherein at least a base portion of the ground terminal is provided. A high-frequency circuit device, wherein a solder blocking layer having low solder wettability is formed in a region on the bottom surface of the adjacent case. 2. The high-frequency circuit device according to claim 1, wherein the solder blocking layer is formed by applying an insulating resin or attaching a heat-resistant seal.