JPH0397958U - - Google Patents
Info
- Publication number
- JPH0397958U JPH0397958U JP740190U JP740190U JPH0397958U JP H0397958 U JPH0397958 U JP H0397958U JP 740190 U JP740190 U JP 740190U JP 740190 U JP740190 U JP 740190U JP H0397958 U JPH0397958 U JP H0397958U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- small diameter
- diameter part
- wiring board
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図は本考案の実施例における電子回路装置
の構成図、第２図ａ〜ｃは同電子回路装置の組立
工程を示す構成図、第３図は従来の電子回路装置
の構成図である。
４……面実装用部品、１０，１３……プリント
配線板、１１，１４，１５……導電パターン、１
２，１７，１８……半田、１６……接続ピン、１
９……接続孔、２０……接着剤、２１……半田層
。
FIG. 1 is a block diagram of an electronic circuit device according to an embodiment of the present invention, FIGS. 2 a to c are block diagrams showing the assembly process of the same electronic circuit device, and FIG. 3 is a block diagram of a conventional electronic circuit device. . 4... Surface mounting component, 10, 13... Printed wiring board, 11, 14, 15... Conductive pattern, 1
2, 17, 18...Solder, 16...Connection pin, 1
9... Connection hole, 20... Adhesive, 21... Solder layer.
Claims (1)
を備え、このプリント配線板間に一端に小径部を
備えその小径部の上端に半田層を形成した半田付
可能な金属よりなる接続ピンを配置し、この接続
ピンの小径部を一方のプリント配線板の接続孔に
挿入して半田層を溶融して一方のプリント配線板
の導電パターンに接続するとともに接続ピンの他
端を他方のプリント配線板の導電パターン上に半
田付してなる電子回路装置。 It is equipped with a plurality of printed wiring boards on which various electronic components are mounted, and connecting pins made of a solderable metal having a small diameter part at one end and a solder layer formed on the upper end of the small diameter part are arranged between the printed wiring boards, The small diameter part of this connection pin is inserted into the connection hole of one printed wiring board and the solder layer is melted to connect it to the conductive pattern of one printed wiring board, and the other end of the connection pin is connected to the conductive pattern of the other printed wiring board. An electronic circuit device that is soldered onto a pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740190U JPH0397958U (en) | 1990-01-29 | 1990-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740190U JPH0397958U (en) | 1990-01-29 | 1990-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397958U true JPH0397958U (en) | 1991-10-09 |
Family
ID=31511058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP740190U Pending JPH0397958U (en) | 1990-01-29 | 1990-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397958U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224533A (en) * | 1993-01-27 | 1994-08-12 | Ibiden Co Ltd | Printed wiring board assembly |
| JP2002118384A (en) * | 2000-08-01 | 2002-04-19 | Mitsubishi Electric Corp | Electronic equipment |
| JP2006186144A (en) * | 2004-12-28 | 2006-07-13 | Daikin Ind Ltd | Power module and air-conditioner |
| JP2014183126A (en) * | 2013-03-18 | 2014-09-29 | Fujitsu Ltd | High frequency module |
-
1990
- 1990-01-29 JP JP740190U patent/JPH0397958U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224533A (en) * | 1993-01-27 | 1994-08-12 | Ibiden Co Ltd | Printed wiring board assembly |
| JP2002118384A (en) * | 2000-08-01 | 2002-04-19 | Mitsubishi Electric Corp | Electronic equipment |
| JP2006186144A (en) * | 2004-12-28 | 2006-07-13 | Daikin Ind Ltd | Power module and air-conditioner |
| JP4513560B2 (en) * | 2004-12-28 | 2010-07-28 | ダイキン工業株式会社 | Power module and air conditioner |
| JP2014183126A (en) * | 2013-03-18 | 2014-09-29 | Fujitsu Ltd | High frequency module |
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