JPH0325274U - - Google Patents
Info
- Publication number
- JPH0325274U JPH0325274U JP8585189U JP8585189U JPH0325274U JP H0325274 U JPH0325274 U JP H0325274U JP 8585189 U JP8585189 U JP 8585189U JP 8585189 U JP8585189 U JP 8585189U JP H0325274 U JPH0325274 U JP H0325274U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- small metal
- wiring board
- metal rod
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す金属の小棒を
挿着する前の部分断面側面図、第２図は同第１図
の透孔に金属の小棒を半田付固着した状態の部分
断面側面図、第３図は同第２図に示した金属の小
棒の斜視図、第４図は従来例を示す両面スルーホ
ール印刷配線基板の部分断面側面図、第５図は同
第４図の透孔に電子部品のリード線を半田付固着
した状態の部分断面側面図である。
１……印刷配線基板、２……パターンランド、
３……金属の小棒、４……突起部、５……透孔、
６……半田付部、７……ソルダーレジスト膜、８
……クリーム状半田（ペースト半田）を用いた半
田付部、９……通常の半田を用いた半田付部、２
１……印刷配線基板、２２……パターンランド、
２３……透孔、２４……スルーホールメツキ、２
５……半田付部、２６……ソルダーレジスト膜、
２７……電気部品のリード線、２８……通常の半
田を用いた半田付部。
Fig. 1 is a partial cross-sectional side view showing an embodiment of the present invention before a small metal rod is inserted, and Fig. 2 shows a state in which the small metal rod is soldered and fixed in the through hole shown in Fig. 1. 3 is a perspective view of the small metal rod shown in FIG. 2, FIG. 4 is a partial sectional side view of a conventional double-sided through-hole printed wiring board, and FIG. 5 is a perspective view of the small metal bar shown in FIG. FIG. 5 is a partially sectional side view of a state in which lead wires of an electronic component are soldered and fixed to the through holes in FIG. 4; 1...Printed wiring board, 2...Pattern land,
3...Small metal rod, 4...Protrusion, 5...Through hole,
6...Soldering part, 7...Solder resist film, 8
... Soldered part using cream solder (paste solder), 9... Soldered part using normal solder, 2
1...Printed wiring board, 22...Pattern land,
23...Through hole, 24...Through hole plating, 2
5...Soldering part, 26...Solder resist film,
27...Lead wire of electrical parts, 28...Soldering part using normal solder.
Claims (1)
た印刷配線基板にあつて、前記表裏両面のパター
ンランドの領域で前記印刷配線基板に透孔を設け
、側面の一部に同側面の周囲に沿つて突起部を備
えた金属の小棒を前記透孔に挿通し、前記突起部
を有する側の金属の小棒は表面の前記パターンラ
ンドに設けた半田付部にクリーム状半田を用いて
半田付固着し、前記透孔より突出した前記金属の
小棒の先端部は裏面の前記パターンランドに設け
た半田付部に半田付固着してなる印刷配線基板接
続装置。 In a printed wiring board in which pattern lands are formed on both the front and back surfaces of an insulating substrate, a through hole is provided in the printed wiring board in the region of the pattern land on both the front and back surfaces, and a protrusion is formed on a part of the side surface along the periphery of the same side surface. A small metal rod with a projection is inserted into the through hole, and the small metal rod on the side having the protrusion is soldered and fixed to a soldering portion provided in the pattern land on the surface using cream solder. and a printed wiring board connecting device in which the tip of the small metal rod protruding from the through hole is soldered and fixed to a soldering portion provided on the pattern land on the back surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8585189U JPH0325274U (en) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8585189U JPH0325274U (en) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325274U true JPH0325274U (en) | 1991-03-15 |
Family
ID=31635195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8585189U Pending JPH0325274U (en) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325274U (en) |
-
1989
- 1989-07-21 JP JP8585189U patent/JPH0325274U/ja active Pending
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