JPH01146578U - - Google Patents
Info
- Publication number
- JPH01146578U JPH01146578U JP4363588U JP4363588U JPH01146578U JP H01146578 U JPH01146578 U JP H01146578U JP 4363588 U JP4363588 U JP 4363588U JP 4363588 U JP4363588 U JP 4363588U JP H01146578 U JPH01146578 U JP H01146578U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- insulating substrate
- conductive pattern
- soldering
- solder land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 2
- 239000006071 cream Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本案の一実施例の断面図、第２図は従
来例の断面図である。
１１…絶縁性基板、１２…導電性パターン、１
４…半田ランド部、１７…リード、１６…電気部
品、２１…孔。
FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 11... Insulating substrate, 12... Conductive pattern, 1
4... Solder land portion, 17... Lead, 16... Electrical component, 21... Hole.
Claims (1)
、該導電性パターンの半田ランド部に電気部品の
リードを半田付けするプリント板において、 前記半田ランド部に前記絶縁性基板の他面に貫
通する孔を有して成るプリント板。 (2) 前記半田付けは、前記半田ランド部に塗布
したクリーム半田をリフロー半田付けで行われる
請求項(1)に記載のプリント板。[Scope of Claim for Utility Model Registration] (1) A printed board having a conductive pattern on one surface of an insulating substrate, and in which leads of electrical components are soldered to the solder land portion of the conductive pattern, A printed board comprising a hole penetrating the other surface of the insulating substrate. (2) The printed board according to claim 1, wherein the soldering is performed by reflow soldering using cream solder applied to the solder land portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4363588U JPH01146578U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4363588U JPH01146578U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146578U true JPH01146578U (en) | 1989-10-09 |
Family
ID=31270027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4363588U Pending JPH01146578U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146578U (en) |
-
1988
- 1988-03-31 JP JP4363588U patent/JPH01146578U/ja active Pending