JPS5979592A - Panel mounting type electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a surface-mounted electronic component that is mounted on a printed circuit board and whose electrode portions are fixed to the printed circuit board with solder or the like.

As a surface-mounted electronic component, a cylindrical leadless diode 10 as shown in the exploded cross-sectional view of FIG. 1 is conventionally known. As shown in the figure, this leadless diode 10 is constructed by inserting stepped shaft-shaped PE-Ni-Cu electrodes 3 and 4 into the upper and lower end openings 5 and 6 of a glass sleeve 9, and inserting a diode pellet between the electrodes. A heat treatment is performed while the electrodes 8 are sandwiched, and a sleeve 9 is welded to each electrode 3.4VC. In the figure, 1 indicates the large diameter part, 2 indicates the small diameter part, and 7 indicates the bump electrode. When mounting this cylindrical leadless diode, each header part (electrode ) and the conductive pattern of the printed circuit board by a solder depth to form an electrical, electrical and mechanical connection between the two.

By the way, I noticed that the following problem occurred when mounting on a printed circuit board.

(1) The glass sleeve 9 and electrodes 3 and 4 have round outer diameters, resulting in poor stability when mounted on a printed circuit board. (2) Similarly, since the diode is cylindrical, it is in line contact with the printed circuit board, resulting in poor stability. Therefore, the present invention improves the stability when supplying the electronic component by providing a flat portion on the outer periphery of the surface-mounted electronic component, and also improves the electrical and mechanical connection between the electronic component and the printed circuit board. The purpose is to improve the quality of the products.

The present invention will be explained below with reference to Examples.

FIGS. 2(a) and 2(b) are a perspective view and a plan view showing a surface-mount type i'less diode according to an embodiment of the present invention. This leadless diode (hereinafter referred to as
Also simply called a diode. ) 10 has the same structure as the conventional structure shown in FIG. 1, but the outer shapes of the glass sleeve 9 and the electrodes 3 and 4 are all squares of the same size, and there are four flat parts on the outer periphery. It has 11.

When such a diode 10 is placed on a printed circuit board during surface mounting, surface mounting is easy because it does not roll, and the flat portion 11, which has a larger area than before, can be stacked on the conductor layer of the printed circuit board. Therefore, even when fixing by soldering, the bonding strength is increased and the reliability of mounting is improved. Therefore, the stability is good even in the supply work during mounting on a printed circuit board, making it easier to supply and improving work efficiency.

Note that the present invention is not limited to the above embodiments. That is,
Figure 3 (a), (b), Figure 4 (a), (bl,
Figure 5 (al.

(As shown in bl, a structure in which at least part of the electrodes 3 and 4 or the glass sleeve 9 has a flat part 11 is sufficient. 12. A square cylindrical sleeve 13 having a circular hole, a cylindrical sleeve 14, a square electrode 15 having a prismatic small diameter part shown in FIGS. 7(a) to (C), a square electrode 16 carrying the cylindrical small diameter part, a small diameter part and a circular electrode 17 whose large diameter portion is both circular.

The present invention can also be applied to electronic components such as diodes and resistors.

As described above, according to the present invention, it is possible to provide a surface-mounted electronic component that is stable and does not move even when placed on a flat surface.

[Brief explanation of the drawing]

Figure 1 is an exploded sectional view of a conventional leadless diode, Figures 2(a) and (b) are perspective and front views of a leadless diode according to an embodiment of the present invention, and Figure 3. (a
l, (bl is a perspective view and a front view of a diode of another example, FIG. 4 (at, (bl is a perspective view and a front view of a diode of another example), FIG. A perspective view and a front view of the diode of the example, FIGS. 6(a) to (cl) are perspective views of the glass sleeve used in the example, and FIGS. 7(al to (C) are perspective views of the electrodes used in the example) 3.4... Electrode, pellet... 9... Glass sleeve, 10... Leadless diode, 11... Plane part. Fig. 1 Fig. 2 Fig. 4 Fig. 5 Fig. 5 6 Figure 7

Claims (1)

[Claims] 1 Package σ) In a surface-mounted electronic component that has electrodes at both ends with an outer diameter approximately the same as the outer diameter of the package, at least one on the outer periphery of the package or electrode to prevent the electronic component from rolling. A surface-mounted electronic component characterized by being provided with the above flat portion.