JPS63153574U - - Google Patents
Info
- Publication number
- JPS63153574U JPS63153574U JP4640287U JP4640287U JPS63153574U JP S63153574 U JPS63153574 U JP S63153574U JP 4640287 U JP4640287 U JP 4640287U JP 4640287 U JP4640287 U JP 4640287U JP S63153574 U JPS63153574 U JP S63153574U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- conductive pattern
- printed circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案に係るプリント基板実装構体の
側断面図、第2図は底面図、第3図は本考案に係
る導電パターンの形状を示す底面図、第4図乃至
第6図はプリント基板実装構体の従来例を示す側
断面図、第7図は導電パターンの従来例を示す底
面図、第8図は空心コイルを調整する時の状態を
示す側断面図である。
20……プリント基板実装構体、21……プリ
ント基板、21a,21b……リード挿通部、2
2……リード付電子部品、22a,22b……リ
ード部、23……チツプ状電子部品、23a,2
3b……電極、26……導電パターン、26a…
…リード半田付け部(第1のパターン部)、26
b……電極半田付け部(第2のパターン部)、2
6c……接続パターン部、27……半田。
FIG. 1 is a side sectional view of the printed circuit board mounting structure according to the present invention, FIG. 2 is a bottom view, FIG. 3 is a bottom view showing the shape of the conductive pattern according to the present invention, and FIGS. 4 to 6 are printed circuit boards. FIG. 7 is a bottom view showing a conventional example of a conductive pattern, and FIG. 8 is a side sectional view showing a state when adjusting an air-core coil. 20...Printed board mounting structure, 21...Printed board, 21a, 21b...Lead insertion portion, 2
2... Electronic component with lead, 22a, 22b... Lead portion, 23... Chip-shaped electronic component, 23a, 2
3b... Electrode, 26... Conductive pattern, 26a...
...Lead soldering part (first pattern part), 26
b...Electrode soldering part (second pattern part), 2
6c...Connection pattern section, 27...Solder.
Claims (1)
ード挿通孔を穿設したプリント基板に、リード付
電子部品のリード部を挿入し、リード突出部近傍
の導電パターン上にチツプ状電子部品を配置して
、上記リード部とチツプ状電子部品の電極とを上
記導電パターンに半田付けしたプリント基板実装
構体に於いて、一つの導電パターン上のリード半
田付け部とチツプ状電子部品の電極半田付け部と
を接続する接続パターン部の幅を狭小にしたこと
を特徴とするプリント基板実装構体。 The lead portion of the leaded electronic component is inserted into a printed circuit board with lead insertion holes drilled in the main part of the conductive pattern formed on the surface of the insulating substrate, and the chip-shaped electronic component is placed on the conductive pattern near the lead protrusion. In the printed circuit board mounting structure in which the lead portion and the electrode of the chip-shaped electronic component are soldered to the conductive pattern, the lead soldering portion on one conductive pattern and the electrode soldering portion of the chip-shaped electronic component are combined. A printed circuit board mounting structure characterized in that the width of the connection pattern portion for connecting the is narrowed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4640287U JPS63153574U (en) | 1987-03-27 | 1987-03-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4640287U JPS63153574U (en) | 1987-03-27 | 1987-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63153574U true JPS63153574U (en) | 1988-10-07 |
Family
ID=30866032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4640287U Pending JPS63153574U (en) | 1987-03-27 | 1987-03-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63153574U (en) |
-
1987
- 1987-03-27 JP JP4640287U patent/JPS63153574U/ja active Pending
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