JPH0113378Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped electronic component, and more specifically, to a lead-out structure for a terminal connected to an electronic component element.

This type of electronic component can be directly bonded to a flat conductor pattern on a printed circuit board, meeting the requirements for high-density mounting, and has a uniform external shape that allows for automatic mounting and ease of mounting when mounted on a printed circuit board. It has excellent features such as being easy to assemble, and is widely used in various electronic devices as an important component that plays a role in making circuits thicker and more modular.

The general structure of chip-shaped electronic components is to cover the electronic component elements, which are passive or active elements such as inductance elements, capacitor elements, and resistors, with an insulating resin, etc., and then cover the end face of the exterior body made of the insulating resin, etc. , has a structure in which terminals are led out to be electrically connected to the electronic component element. As shown in FIG. 1, the conventional terminal lead-out structure for electronic components embeds an electronic component element 1 inside a square exterior body 2, and
The metal terminals 3, 3 connected to the electrodes, etc. of the electronic component element 1 were led out from approximately the middle part of the side end surfaces 2a, 2b of the exterior body 2, and bent to the bottom 2c, which becomes the mounting end surface. It had become a structure.

By the way, in order to increase the mounting density of these chip-shaped electronic components on printed circuit boards etc., it goes without saying that the overall shape should be made as small as possible, but the terminal 3 and the printed circuit board It is also important to minimize the spread and spread area of the solder that adheres between the conductor pattern and the conductor pattern. As the solder diffusion area increases, the second
This is because, as shown in the figure, solder bridges 7 occur between the chip-shaped electronic components 6-6 soldered adjacently on the conductor pattern 5 of the printed circuit board 4, resulting in a short circuit between them. FIG. 3 is a graph showing the relationship between the height h of the terminal and the gap G between the conductor patterns (FIG. 2) which can prevent the formation of solder bridges at that time. As shown in Figure 3, the pattern gap G required to prevent solder bridging is:
Closely related to the height h of terminal 3, the height h of terminal 3
The higher the value, the larger the value. Therefore, in order to reduce the pattern gap G required to prevent solder bridging and contribute to high-density packaging, it is effective to make the height h of the terminal 3 as small as possible.

However, as mentioned above, conventional electronic components
The terminals 3, 3 are led out from approximately the middle of the side end surfaces 2a, 2b of the exterior body 2, and the bottom portion 2c serves as a mounting end surface.
Since the terminals 3, 3 have a bent structure, the height h of the terminals 3, 3 is approximately half of the total height H of the exterior body 2, which is the dimension from the bottom part 2c, which is the mounting end face, to the lead-out part on the side end faces 2a, 2b. The problem was that the solder was deferred and the solder diffusion area became large. For this reason, when the electronic component is mounted on a printed circuit board, the pattern gap G between the conductor pattern and each electronic component must be increased, which inevitably leads to a reduction in packaging density. Incidentally, in conventional electronic components,
When the total height H of the exterior body 2 is 3.2 mm, the height h of the terminal 3 is 1.6 mm, and there is approximately 2 mm between the electronic components.
It is necessary to provide a pattern gap.

Moreover, this terminal 3 is soldered, so
It must extend to the bottom 2c, and its height h
Another drawback was that it could not be adjusted freely.

The present invention eliminates the above-mentioned drawbacks of the conventional technology, and has a chip-like structure that allows the height of the terminal to be adjusted freely, reduces the solder deferred and the diffusion area, and improves the mounting density on printed circuit boards, etc. The purpose is to provide electronic components.

In order to achieve the above object, an electronic component according to the present invention is an electronic component in which a terminal conductive to the electronic component element is led out to an end face of an insulating exterior body in which an electronic component element is built, wherein the terminal is connected to the exterior body. It is characterized by being led out from the bottom side, which is the mounting end surface of the body, and bent toward the side end surface.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples. FIG. 4 is a front sectional view of the electronic component according to the present invention. In the figure, the same reference numerals as in FIG. 1 indicate the same components. In this embodiment, a pair of metal terminals 3, 3 that are electrically connected to the electronic component element 1 are led out from the bottom 2c, which is the mounting end surface of the exterior body 2, and the tips are connected from the bottom 2c to the side end surface 2a, It has a structure that is bent toward 2b.

With such a structure, the side end surface 2 of the exterior body 2
By adjusting the positions of the tip edges of the terminals 3, 3 in a, 2b, the height h from the bottom 2c to the tip edges of the terminals 3, 3 can be freely adjusted. For this reason,
When mounted on a printed circuit board, it is possible to reduce the amount of solder and the solder diffusion area, prevent the formation of solder bridges, and increase the mounting density. Incidentally, if the height H of the exterior body 2 is 3.2 mm,
In the conventional device, the height h of the terminal 3 had to be 1.6 mm, and it was necessary to form a pattern gap of about 2 mm between adjacent electronic components. The height h of 3 is 0.5mm, and the pattern gap is the same as the conventional 2.
Can be reduced from mm to 0.7mm.

Further, since the terminals 3, 3 are led out from the bottom part 2c which serves as a mounting surface, when mounted on a printed circuit board, the terminals 3, 3 directly contact the conductor pattern and are reliably soldered. Moreover, since the terminals 3, 3 are bent from the bottom 2c to the side end surfaces 2a, 2b, the soldering condition of the terminals 3, 3 can be visually checked from the outside, unlike when they are provided only on the bottom 2c. , it is possible to prevent a decrease in soldering reliability.

In the above embodiment, an inductance element in which a coil 1b is wound around a core 1a and end electrodes 8, 8 are provided at both ends of the core 1a in the axial direction is used as the electronic component element 1.
It has a structure in which the terminals 3, 3 are conductively connected to the end electrodes 8, 8. As shown in FIG. 5, the terminals 3, 3 have a structure in which a pair of terminal pieces 3b, 3b, which receive the inductance element 1, are arranged at intervals on both sides of an electrode connecting piece 3a protruding from the center. It is becoming.

As described above, the present invention provides an electronic component in which a terminal electrically connected to the electronic component element is led out from the end face of an insulating exterior body in which the electronic component element is built-in.
The terminal is characterized in that it is led out from the bottom side, which is the mounting end surface of the exterior body, and is bent toward the side end surface, so that the height of the terminal can be easily adjusted, and the solder backing and diffusion area can be reduced. However, it is possible to provide a chip-shaped electronic component that can improve the packaging density on a printed circuit board or the like.

[Brief explanation of the drawing]

Figure 1 is a front sectional view of a conventional chip-shaped electronic component, Figure 2 is a diagram showing the drawbacks of conventional electronic components in use, and Figure 3 is a diagram showing the height of the terminal and the pattern gap necessary to prevent solder bridging. FIG. 4 is a front cross-sectional view of the electronic component according to the present invention, and FIG. 5 is a perspective view of the connecting portion of the terminal. 1...Electronic component element, 2...Exterior body, 3...Terminal.

Claims (1)

[Scope of utility model registration request] In an electronic component in which a terminal that is electrically connected to the electronic component element is led out from an end face of an insulating exterior body in which an electronic component element is built-in, the terminal is led out from the bottom side, which is the mounting end face of the exterior body, and the terminal is led out from the bottom side, which is the mounting end face of the exterior body, and An electronic component characterized by being bent.