JP2538631Y2 - Chip device network device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electronic device, particularly to a chip-like element network device.

[Conventional technology]

FIG. 8 to FIG. 10 show a conventional chip element network device.

As shown in FIG. 9, the chip-like element network device 1 has a ceramic substrate 3 having a conductive pattern 2 formed on the surface thereof, and a plurality of chip-like elements 4 mounted on the substrate 3. ing. The substrate 3 is provided with a plurality of lead terminals 5 electrically connected to the chip-like element 4 via the conductive pattern 2 as shown in FIG. further,
The substrate 3 and the chip-shaped element 4 are entirely covered with an exterior sealing portion 6 made of resin.

The right end in FIG. 9 of the conductive pattern 2 is a common electrode.
2a, and the chip-shaped element 4 is not arranged in that portion. As a result, the portion corresponding to the common electrode 2a is:
The thickness is reduced as shown in FIG.

[Problems to be solved by the invention]

The network devices 1 described above are housed side by side in a magazine 7 as shown in FIG. At this time, as shown in FIG. 10, there is a case where the thin portion of the network device 1 enters the adjacent network device 1 side, and it becomes difficult to put the network device 1 in and out of the magazine 7.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip-like element network device that is hard to be inserted into an adjacent device when stored in a case.

[Means for solving the problem]

The chip-like element network device according to the present invention comprises:
A common pattern is formed on one long side of the substrate on the surface of the rectangular insulating substrate, and this common pattern is led to a common electrode pattern formed on an end on the other long side, and the other long side is formed. A plurality of individual patterns are formed on the side, a chip element is arranged between the common pattern and the individual pattern, and a chip member having the same height as the chip element is provided between the common pattern and the common electrode pattern. And the substrate, the chip-shaped element and the chip member are covered with an exterior resin.

As the chip member, for example, a member having the same outer shape as the chip element or another chip element can be adopted.

[Action]

The chip-like element network device according to the present invention comprises:
In addition to the chip-shaped element, it has a chip member mounted on an end of the substrate. As a result, the thickness of the end of the device is enlarged by the chip member, and is aligned with the center. As a result, it is possible to solve the problem that the thin portion of the device end portion is hardly inserted into the adjacent device side in the case.

〔Example〕

In FIG. 1 showing an embodiment of the present invention, a chip-like element network device 10 includes a substrate 12 having a conductive pattern 11 formed on the surface thereof, a plurality of chip-like elements 13 mounted on the substrate 12, It mainly includes an exterior sealing portion 14 that covers the substrate 12 and the chip-shaped element 13.

The conductive pattern 11 is made of, for example, a thick-film conductor obtained by printing a silver-palladium-based conductive paste in a thick film, drying and firing. The substrate 12 is, for example, an alumina ceramic substrate. The chip-like element 13 is, for example, a multilayer ceramic capacitor and has external electrodes at both ends. The exterior sealing portion 14 is formed, for example, by fluid immersion conformal coating of a powder thermosetting epoxy resin.

The conductive pattern 11 on the substrate 12 includes a common pattern 11a extending parallel to one long side of the substrate 12, an individual pattern 11b and a common electrode pattern 11c formed independently on the other long side. It is composed of The external electrodes of the chip-shaped element 13 are connected to the common pattern 11a and the individual patterns 11b by solders 15, respectively.

The common electrode pattern 11c is disposed at an end on the short side of the substrate 12. A rectangular parallelepiped chip member 16 having the same outer shape as the chip element 13 is arranged between the right end of the common pattern 11a in FIG. 1 and the common electrode pattern 11c. The chip member 16 is formed by applying a thick film conductor to the surface of a rectangular parallelepiped member, and for example, a so-called jumper is used. Solder 18 is connected between both ends of the chip member 16 and the common pattern 11a and the common electrode pattern 11c.

As is clear from FIG. 2 showing a state in which the exterior sealing portion 14 has been removed, eight chip-like elements 13 are arranged at equal intervals, and a chip member 16 is arranged on the right side of FIG.
As shown in FIG. 1, a Y-type lead terminal 17 is fixed to each of the individual patterns 11b and the common electrode pattern 11c. Extending parallel to As the lead terminal 17,
For example, a frame in which iron is plated with copper underlayer and solder is used.

FIG. 3 shows an equivalent circuit of the network device 10 described above. In FIG. 3, C is a capacitor, and O is a terminal.

In the above-described network device 10, the chip-like element 13
The chip member 16 having the same outer shape as that of the common electrode pattern 11c is arranged at a portion corresponding to the common electrode pattern 11c. For this reason,
Network devices are also used for common electrode patterns.
The thickness of 10 is the same as the other portions, and no dent occurs in the common electrode pattern portion. Therefore, the network device 10 having this configuration is connected to the network device 10 shown in FIGS.
Even if the network devices 10 are housed in a magazine as shown in the figure, meshing does not occur between the network devices 10, and the network devices 10 can be smoothly inserted into and removed from the magazine.

Further, since the common pattern 11a and the common electrode pattern 11c are connected by the chip member 16, the arrangement of the other chip-like elements 13 and the chip member 16 is simply changed, and the common electrode The position of the terminal (lead terminal 17) can be changed freely.

[Other embodiments]

(A) In the above embodiment, the common electrode pattern 11c is provided only at one end, but the present invention can be similarly implemented using two chip members 16 in a configuration provided at both ends.

(B) As shown in FIGS. 4 and 5, each chip-shaped element
The present invention can be similarly implemented in a configuration in which each of 13 has a pair of independent electrode patterns. In the configuration shown in FIG. 4, the chip-like elements 13 are disposed at both ends by changing the arrangement pattern of the chip-like elements 13 without using the chip members 16.
Are arranged to make the thickness of the network device 10 uniform. That is, in this example, the chip-shaped element 13 arranged at one end also serves as a chip member for adjusting the height. FIG. 5 is an equivalent circuit diagram of the network device 10 shown in FIG.

(C) In a configuration having a common electrode pattern similar to the common electrode 2a shown in FIG. 9, the present invention can be similarly implemented by disposing the tip member 16 at one end of the common electrode. However, in this case, the position of the common electrode cannot be freely changed. In this case, the chip member does not have to have conductivity.

(D) Although the above-described embodiment is a capacitor network device using a capacitor as the chip element 13,
The present invention is not limited to this. For example, a network device with a network of chip resistors,
The present invention can be similarly implemented in a network device in which chip diodes are networked. Further, the present invention can be similarly applied to a network device constituting a composite component network as shown in FIGS. 6 and 7.

6 and 7, R is a resistor, C is a capacitor, and O is a terminal.

(E) Instead of the chip member 16 in the above-described embodiment, a chip member having the same outer shape as the chip element 13 may be integrally provided on the lead terminal 17 fixed to the common electrode pattern 11c. In this case, the lead terminal 17 and the chip member can be integrally formed by press molding or the like.

[Effect of the invention]

The chip-like element network device according to the present invention comprises:
Since a chip member for adjusting the height is mounted at the end of the substrate, the loading and unloading of the magazine can be performed smoothly.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of one embodiment of the present invention, FIG. 2 is a plan view of a state in which an exterior sealing portion and lead terminals are removed, FIG. 3 is an equivalent circuit diagram thereof, and FIG. Is a diagram corresponding to FIG. 2 of another embodiment, FIG. 5 is an equivalent circuit diagram of the embodiment of FIG. 4, FIGS. 6 and 7 are equivalent circuit diagrams of still another embodiment, and FIG. FIG. 9 is a perspective partial view of a conventional example, FIG. 9 is a plan partial view of the conventional example, and FIG. 10 is a partial sectional view taken along line XX of FIG. 10 Network device, 11 Conductive pattern,
12 ... substrate, 13 ... chip-shaped element, 14 ... exterior sealing part,
16 ... Tip member.

Claims (1)

(57) [Scope of request for utility model registration] 1. A common pattern is formed on the surface of a rectangular insulating substrate on one long side of the substrate, and the common pattern is led to a common electrode pattern formed on an end of the other long side. And forming a plurality of individual patterns on the other long side, disposing a chip-like element between the common pattern and the individual pattern, and providing a chip-like element between the common pattern and the common electrode pattern. A chip-like element network device comprising a chip member having a height, wherein the substrate, the chip-like element and the chip member are covered with an exterior resin.