JPH0737337Y2 - Circuit parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention attaches a plurality of electronic components to the surface of an insulating substrate on which a conductive pattern is formed, and coats these insulating substrate and electronic components with an insulating material. The present invention relates to a circuit component that is configured and stored in a cylindrical magazine stick in a line.

(Prior Art) Conventional circuit components of this type include a chip capacitor attached as an electronic component on an insulating substrate surface on which a conductive pattern is formed, a chip inductor in addition to a chip capacitor, a resistor, and the like. In addition to these passive components, there are those with active components such as transistors and ICs attached. For example, FIG. 3 shows a circuit component in which a chip capacitor and a resistor are attached. That is, a conductive pattern 22 such as a wiring pattern or an electrode pattern is formed on the surface of a non-flexible insulating substrate 21 such as alumina, and a chip capacitor 23 and a thick film resistor 24 are attached to the conductive pattern 22. . Although not shown, a predetermined conductive pattern is formed on the back surface side of the insulating substrate 21 in this circuit component so that a predetermined circuit is formed on the front and back surfaces of the insulating substrate 21. Further, in this circuit component, a plurality of lead terminals 25 are attached to the conductive pattern 22 forming the conductive pattern, and the insulating substrate 21, the chip capacitor 23, and the thick film resistor 24 are shown by the phantom line insulating material 26.
It is covered with. The insulating material 26 is formed by immersing the insulating substrate 21 in a liquid resin and curing it.

(Problems to be Solved by the Invention) The conventional circuit component having the above-described configuration is housed in a cylindrical magazine stick and mounted on a printed wiring board by an automatic mounting machine. In this way, when the circuit components are stored in the magazine stick, the side of the side of the insulating substrate 21 where the lead terminals 25 are attached is the direction along the axis of the magazine stick.

However, in the circuit component shown in FIG. 3, the end face portion of the lead terminal 25 of the insulating substrate 21 in the column direction (longitudinal direction of the insulating substrate 21) is the storage direction in the magazine stick, as is clear from the figure. Since the chip capacitor 23 is not attached, the appearance covered with the insulating material 26 has a shape as shown in FIG. That is, while the thickness of the insulating material 26 becomes thicker in the portion of the insulating substrate 21 where the chip capacitor 23 exists, the chip capacitor 23 becomes thicker.
The thickness of the insulating material 26 is thin at the end face portions on both sides where 23 does not exist. Therefore, when a plurality of circuit components are arranged in a row in a magazine stick and accommodated, as shown in FIG. 5, the adjacent circuit components are engaged with each other at the thin portion of the insulating material 26 at the end face portion of the insulating substrate 21. It is easy to be in a stuck state, which makes it difficult to move the circuit component in the magazine stick 27, or causes the circuit component to be taken out of the magazine stick in an inclined state.

The present invention has been made in view of the above problems, and when a plurality of circuit components are arranged and stored in a line in a cylindrical magazine stick, adjacent circuit components do not mesh with each other. An object is to provide a circuit component that can be stored in a normal state.

(Means for Solving the Problems) In order to achieve such an object, the present invention forms a conductive pattern on an insulating substrate surface and solders a plurality of electronic parts constituting a predetermined circuit to the conductive pattern. In addition, in the circuit component formed by coating the insulating substrate and the electronic component with an insulating material, the surface of the insulating substrate to which the electronic component is soldered, the end surface of the portion where the electronic component does not exist. Forms a dummy conductive pattern that is circuitally independent of the conductive pattern, and a dummy component is soldered on the dummy conductive pattern, and the thickness of the insulating material at the end face portion is set to the dummy component. It is thickened by its existence.

(Operation) Since the dummy component is attached to the end face portion of the insulating substrate forming the circuit component as described above, the thickness of the insulating material covering the insulating substrate and the electronic component is increased even at the end face portion. Therefore, the engagement of adjacent circuit components in the magazine stick is prevented.

Embodiment An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1, reference numeral 1 is an inflexible rectangular insulating substrate made of alumina or the like, and a conductive pattern 2 for forming a wiring pattern or an electrode pattern is formed on the surface thereof. This conductive pattern 2 is formed by printing Ag-Pd paste and baking it. A plurality of chip capacitors 3 and resistors 4 are attached to the surface of the insulating substrate 1 so as to be connected to the conductive patterns 2. The chip capacitor 3 is soldered to the conductive pattern 2, and the resistor 4 is provided, for example, by printing and baking a cermet resistor paste. A dummy component 5 is attached to one end face portion of the surface of the insulating substrate 1 along which the chip capacitor 3 is not attached, in the longitudinal direction. As the dummy component 5, a chip capacitor having the same structure as the chip capacitor 3 is used in this embodiment. That is, as shown in FIG. 2, when the conductive pattern 2 is formed, a pair of dummy conductive patterns 6 for soldering the dummy parts 5 at the same time as the conductive pattern 2 are circuit independent from the conductive pattern 2. The chip capacitor 3 is soldered to the dummy conductive pattern 6 of the dummy component 5 in the same manner when soldering the chip capacitor 3. Although not shown, in this embodiment, a predetermined conductive pattern is also formed on the back surface of the insulating substrate 1, and a predetermined circuit is formed on the front and back surfaces of the insulating substrate 1. A lead terminal 7 is attached to each of the conductive patterns 2 forming a plurality of electrode patterns provided along the longitudinal direction of the insulating substrate. As described above, the insulating substrate 1 to which the chip capacitor 3, the resistor 4, the dummy component 5, and the lead terminal 7 are attached is immersed in the liquid resin except the tip portion of the lead terminal 7 and pulled up, and then cured. , The insulating substrate 1, the chip capacitor 3, the resistor 4 and the dummy component 5 are covered with the insulating material 8 indicated by a virtual line. In the circuit component thus configured, the chip capacitor 3 on the end surface of the insulating substrate 1
The thickness of the insulating material 8 formed in the portion where the chip capacitor 3 does not exist is as thick as the portion where the chip capacitor 3 exists because the dummy component 5 exists.

In the above embodiment, the dummy component 5 uses a chip capacitor having the same configuration as the chip capacitor 3. However, if the dummy capacitor 5 has electrodes at both ends similarly to the chip capacitor 3, it may be a chip resistor or a chip inductor. It may be another chip component, or may have no function as an electronic component at all. As described above, when the dummy component 5 having electrodes at both ends is used similarly to the chip capacitor 3 and the like, the dummy component 5 can be mounted in the same step when mounting the electronic component such as the chip capacitor 3 and the circuit component. The assembly of is extremely advantageous. Further, in the above embodiment, the dummy component 5 is attached only to one end face portion, but it may be attached to both end face portions. Although only the chip capacitor 3 and the resistor 4 are used as the electronic components constituting the circuit component in the above embodiment, various electronic components constituting the circuit component may be used depending on the contents of the circuit. At the same time, it can be attached to the back side of the insulating substrate. When mounting electronic components on the back surface side of the insulating substrate, dummy components may be mounted as necessary. Furthermore, the circuit component in the above embodiment is of the SIP type in which the lead terminals are provided only on one side edge portion side of the insulating substrate, but of the DIP type in which the lead terminals are provided on both side edge portions. It can also be one.

(Effect) As is apparent from the above description, according to the present invention,
The thickness of the insulating material on the end surface of the insulating substrate where there are no electronic components is increased due to the presence of dummy components, and even when multiple circuit components are stored side by side in a cylindrical magazine stick, adjacent circuit components This has an excellent effect of preventing mutual engagement.

[Brief description of drawings]

FIG. 1 is a plan view of a circuit component according to an embodiment of the present invention, FIG. 2 is a view showing a conductive pattern of a main part thereof, FIG. 3 is a plan view of a conventional circuit component, and FIG. 4 is a top view thereof. FIG. 5 is a view showing a state where conventional circuit components are housed in a magazine stick. DESCRIPTION OF SYMBOLS 1 ... Insulating substrate, 2 ... Conductive pattern, 3 ... Chip capacitor, 4 ... Resistor, 5 ... Dummy part, 6 ... Dummy conductive pattern, 7 ... Lead terminal, 8 ... Insulating material.

Claims (1)

[Scope of utility model registration request] 1. A conductive pattern is formed on the surface of a non-flexible insulating substrate, a plurality of electronic parts constituting a predetermined circuit are soldered to the conductive pattern, and the insulating board and the electronic part are made of an insulating material. A circuit component that is formed by covering and is used by being arranged and stored in a line in a cylindrical magazine stick, wherein the electronic component of the insulating substrate is a soldered surface,
A dummy conductive pattern that is circuit-independent of the conductive pattern is formed on a portion of the end face where the electronic component does not exist, and a dummy component is soldered on the dummy conductive pattern, and an insulating material of the end face portion is formed. A circuit component characterized in that the thickness is increased by the presence of the dummy component so that adjacent circuit components in the cylindrical magazine stick do not mesh with each other.