JPS63142891A - Chip parts mounting structure - Google Patents
Chip parts mounting structureInfo
- Publication number
- JPS63142891A JPS63142891A JP29015286A JP29015286A JPS63142891A JP S63142891 A JPS63142891 A JP S63142891A JP 29015286 A JP29015286 A JP 29015286A JP 29015286 A JP29015286 A JP 29015286A JP S63142891 A JPS63142891 A JP S63142891A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- mounting structure
- chip components
- components
- composite element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はチップ部品実装構造に関し、特にハイブリッド
ＩＣ等に実装される複数のチップ部品を一体化した複合
素子を用いるチップ部品実装構造に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip component mounting structure, and particularly relates to a chip component mounting structure using a composite element that integrates a plurality of chip components mounted on a hybrid IC or the like. be.
［従来の技術］
従来、コンデンサ、抵抗等に代表されるチップ部品はハ
イブリッドＩＣに実装されるようになっている。[Prior Art] Conventionally, chip components such as capacitors and resistors have been mounted on hybrid ICs.
この場合、ハイブリッドＩＣには複数のチップ部品が実
装されるようになフており、従来ではこれら複数個のチ
ップ部品を一個、−個、個別にハイブリッドＩＣ上に実
装していた。In this case, a plurality of chip components are mounted on the hybrid IC, and in the past, these plurality of chip components were individually mounted on the hybrid IC one by one.
［解決すべき問題点］
上述した従来のチップ部品実装構造にあっては、チップ
部品−個、−個をハイブリッドＩＣに実装する構造にな
っているので、ハイブリッドＩＣに実装される部品点数
が増え、アセンブリ工数が増えるという欠点がある。[Problems to be solved] In the conventional chip component mounting structure described above, the structure is such that chip components are mounted on a hybrid IC, so the number of components mounted on a hybrid IC increases. , the disadvantage is that the number of assembly steps increases.
［問題点の解決手段コ
本発明は、上記従来の問題点を解決するためになされた
もので、その解決手段として本発明は１、複数個のチッ
プ部品をハイブリッドＩＣ等に実装するチップ部品実装
構造において、上記複数個のチップ部品を一体化すると
共に、複数個のチップ部品の一方に共通のリード端子を
設け、他方に各チップ部品毎あるいは複数個毎のリード
端子を設けて上記複数個のチップ部品を複合素子として
形成した構成としている。[Means for solving problems] The present invention has been made in order to solve the above-mentioned conventional problems. In the structure, the plurality of chip components are integrated, and one of the plurality of chip components is provided with a common lead terminal, and the other is provided with a lead terminal for each chip component or for each plurality of chip components, so that the plurality of chip components are integrated. The structure is such that chip parts are formed as composite elements.
［実施例］ 第１図は本発明の一実施例の説明図である。[Example] FIG. 1 is an explanatory diagram of an embodiment of the present invention.
第１図中向って左側はコンデンサのチップ部品１を示し
ている。ただし、ハンダ付けを行う端子部の加工は一端
ａでは通常のチップ部品と同一形状であり、他端すでは
コンデンサのチップ部品１を重ね合わせた場合、隣接す
るコンデンサのチップ部品１と接触しない様に一方向（
片側面）に片寄った端子構造を示している。第１図中向
って右側は、第２図に示したコンデンサ接続回路に従っ
てコンデンサのチップ部品１を一体化し、はり合わせて
複合素子２として形成した構造を示している。ここで、
リード端子３，４，５．６が形成される。尚、第２図に
示したコンデンサＣＩ。The left side of FIG. 1 shows a chip component 1 of a capacitor. However, the processing of the terminal part to be soldered is such that one end a has the same shape as a normal chip component, and the other end is designed to avoid contact with the chip component 1 of an adjacent capacitor when the capacitor chip components 1 are overlapped. in one direction (
This shows a terminal structure that is offset to one side (one side). The right side of FIG. 1 shows a structure in which capacitor chip parts 1 are integrated and glued together to form a composite element 2 according to the capacitor connection circuit shown in FIG. here,
Lead terminals 3, 4, 5.6 are formed. Incidentally, the capacitor CI shown in FIG.
Ｃ２，Ｃ３は容量は異なっても良い。リード端子３は共
通端子であり、リード端子４，５．６は第２図に示され
たコンデンサ接続回路の片方のリード端子４，５．６と
なる。第３図は上記コンデンサのチップ部品１を一体化
してなる複合素子２をセラミック基板７に実装した図を
示している。C2 and C3 may have different capacities. The lead terminal 3 is a common terminal, and the lead terminals 4, 5.6 become one lead terminal 4, 5.6 of the capacitor connection circuit shown in FIG. FIG. 3 shows a composite element 2 formed by integrating the capacitor chip parts 1 described above and mounted on a ceramic substrate 7.
以上の様な複合素子２の実装構造を提案することにより
複数個のチップ部品１を一個の複合素子２で構成できる
こととなる。By proposing the mounting structure of the composite element 2 as described above, a plurality of chip components 1 can be configured with one composite element 2.
また、上記実施例においては共通リード端子と逆側に配
するリード端子を各チップ部品毎に設けることとしてい
るが、これに限らず複数個毎に形成するようにしても良
い。Further, in the embodiment described above, a lead terminal arranged on the opposite side to the common lead terminal is provided for each chip component, but the present invention is not limited to this, and a plurality of lead terminals may be provided.
［発明の効果］
以上説明したように本発明のチップ部品実装構造は、複
数のチップ部品を一体化し、その一方に共通のリード端
子、他方に各チップ部品毎又は複数個毎のリード端子を
設けて複合素子を形成することとしたため、複数のチッ
プ部品を一個の複合素子として実装することができ、従
来のように個別に実装する場合に比し、部品の実装表面
を少なくすることができ、しかもアセンブリ工数をも削
減することができるという効果がある。[Effects of the Invention] As explained above, the chip component mounting structure of the present invention integrates a plurality of chip components, and provides a common lead terminal on one side and a lead terminal for each chip component or a plurality of chip components on the other side. Since we decided to form a composite element using multiple chip components, it is possible to mount multiple chip components as one composite element, and compared to the conventional case where they are individually mounted, the mounting surface of the components can be reduced. Furthermore, there is an effect that the number of assembly steps can also be reduced.
第１図は本発明の一実施例を示す斜視図、第２図は第１
図の複合素子を説明するためのコンデンサ接続回路図、
第３図は複合部品をセラミック基板上に実装した状態を
示す斜視図である。
１：チップ部品
２：複合素子
３．４，５，６： リード端子
７：セラミック基板FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
A capacitor connection circuit diagram to explain the composite element in the figure,
FIG. 3 is a perspective view showing a composite component mounted on a ceramic substrate. 1: Chip component 2: Composite element 3.4, 5, 6: Lead terminal 7: Ceramic board
Claims (1)
チップ部品実装構造において、上記複数個のチップ部品
を一体化すると共に、複数個のチップ部品の一方に共通
のリード端子を設け、他方に各チップ部品毎あるいは複
数個毎のリード端子を設けて上記複数個のチップ部品を
複合素子として形成したことを特徴とするチップ部品実
装構造。In a chip component mounting structure in which multiple chip components are mounted on a hybrid IC or the like, the multiple chip components are integrated, a common lead terminal is provided on one of the multiple chip components, and each chip component is mounted on the other. A chip component mounting structure characterized in that the plurality of chip components are formed as a composite element by providing lead terminals for each or a plurality of chip components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29015286A JPS63142891A (en) | 1986-12-05 | 1986-12-05 | Chip parts mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29015286A JPS63142891A (en) | 1986-12-05 | 1986-12-05 | Chip parts mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63142891A true JPS63142891A (en) | 1988-06-15 |
Family
ID=17752444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29015286A Pending JPS63142891A (en) | 1986-12-05 | 1986-12-05 | Chip parts mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63142891A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0458587A (en) * | 1990-06-27 | 1992-02-25 | Murata Mfg Co Ltd | Chip packaging structure |
| US7280373B2 (en) | 2001-08-30 | 2007-10-09 | Fujitsu Limited | Printed board unit and electronic apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187088A (en) * | 1984-03-07 | 1985-09-24 | 松下電器産業株式会社 | Mountingunit of chip-shaped electronic component |
| JPS60235417A (en) * | 1984-05-08 | 1985-11-22 | 松下電器産業株式会社 | Composite electric circuit element |
-
1986
- 1986-12-05 JP JP29015286A patent/JPS63142891A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187088A (en) * | 1984-03-07 | 1985-09-24 | 松下電器産業株式会社 | Mountingunit of chip-shaped electronic component |
| JPS60235417A (en) * | 1984-05-08 | 1985-11-22 | 松下電器産業株式会社 | Composite electric circuit element |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0458587A (en) * | 1990-06-27 | 1992-02-25 | Murata Mfg Co Ltd | Chip packaging structure |
| US7280373B2 (en) | 2001-08-30 | 2007-10-09 | Fujitsu Limited | Printed board unit and electronic apparatus |
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