JPS63142891A - Chip parts mounting structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip component mounting structure, and particularly relates to a chip component mounting structure using a composite element that integrates a plurality of chip components mounted on a hybrid IC or the like. be.

[Prior Art] Conventionally, chip components such as capacitors and resistors have been mounted on hybrid ICs.

In this case, a plurality of chip components are mounted on the hybrid IC, and in the past, these plurality of chip components were individually mounted on the hybrid IC one by one.

[Problems to be solved] In the conventional chip component mounting structure described above, the structure is such that chip components are mounted on a hybrid IC, so the number of components mounted on a hybrid IC increases. , the disadvantage is that the number of assembly steps increases.

[Means for solving problems] The present invention has been made in order to solve the above-mentioned conventional problems. In the structure, the plurality of chip components are integrated, and one of the plurality of chip components is provided with a common lead terminal, and the other is provided with a lead terminal for each chip component or for each plurality of chip components, so that the plurality of chip components are integrated. The structure is such that chip parts are formed as composite elements.

[Example] FIG. 1 is an explanatory diagram of an embodiment of the present invention.

The left side of FIG. 1 shows a chip component 1 of a capacitor. However, the processing of the terminal part to be soldered is such that one end a has the same shape as a normal chip component, and the other end is designed to avoid contact with the chip component 1 of an adjacent capacitor when the capacitor chip components 1 are overlapped. in one direction (
This shows a terminal structure that is offset to one side (one side). The right side of FIG. 1 shows a structure in which capacitor chip parts 1 are integrated and glued together to form a composite element 2 according to the capacitor connection circuit shown in FIG. here,
Lead terminals 3, 4, 5.6 are formed. Incidentally, the capacitor CI shown in FIG.

C2 and C3 may have different capacities. The lead terminal 3 is a common terminal, and the lead terminals 4, 5.6 become one lead terminal 4, 5.6 of the capacitor connection circuit shown in FIG. FIG. 3 shows a composite element 2 formed by integrating the capacitor chip parts 1 described above and mounted on a ceramic substrate 7.

By proposing the mounting structure of the composite element 2 as described above, a plurality of chip components 1 can be configured with one composite element 2.

Further, in the embodiment described above, a lead terminal arranged on the opposite side to the common lead terminal is provided for each chip component, but the present invention is not limited to this, and a plurality of lead terminals may be provided.

[Effects of the Invention] As explained above, the chip component mounting structure of the present invention integrates a plurality of chip components, and provides a common lead terminal on one side and a lead terminal for each chip component or a plurality of chip components on the other side. Since we decided to form a composite element using multiple chip components, it is possible to mount multiple chip components as one composite element, and compared to the conventional case where they are individually mounted, the mounting surface of the components can be reduced. Furthermore, there is an effect that the number of assembly steps can also be reduced.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
A capacitor connection circuit diagram to explain the composite element in the figure,
FIG. 3 is a perspective view showing a composite component mounted on a ceramic substrate. 1: Chip component 2: Composite element 3.4, 5, 6: Lead terminal 7: Ceramic board

Claims (1)

[Claims] In a chip component mounting structure in which multiple chip components are mounted on a hybrid IC or the like, the multiple chip components are integrated, a common lead terminal is provided on one of the multiple chip components, and each chip component is mounted on the other. A chip component mounting structure characterized in that the plurality of chip components are formed as a composite element by providing lead terminals for each or a plurality of chip components.