JPH0458587A - Chip packaging structure - Google Patents

Abstract

PURPOSE:To make compact the structure of an electronic circuit by bringing each chip into close contact with each other so that they may be integrally mounted where outer electrode for a plurality of chips are electrically connected with each other. CONSTITUTION:Chips 2 are integrally mounted with a board 1 under close contact where mounting electrodes 3 are installed to mount the chips 2. Outer electrodes 4 which constitute the circuit are electrically connected with each other and their end faces are brought into close contact with each other under the condition stated above. Since the chips 2 can be mounted with the board 1 with high packaging density, it is possible to make compact the structure of the electrode circuit. Furthermore, the chips 2 themselves are provided with wiring functions, which can eliminate the board 1. Or the chips 2 can be produced more easily on a modular basis or a unit basis by standardizing the outside dimension of the chips 2, and the formation and positions of the outer electrode 4.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounting structure for chip components constituting various electronic circuits.

The unsurpassed progress! 1. Conventionally, chip components have been mounted by attaching various chip components 32 to the surface of a mounting board 31 separately, as shown in FIG. Therefore, a circuit pattern 30 is required to connect the chip components, and a mounting board 31 with a large area must be used, which is one of the obstacles in constructing a compact electronic circuit.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a mounting structure for chip components that allows an electronic circuit to be configured compactly.

Means for Solving the Problems In order to solve the problems above, the chip component mounting structure according to the present invention includes a plurality of chip components each having a plurality of external electrodes. , the chip components are integrally mounted in close contact with each other with the external electrodes constituting the circuit electrically connected to each other.

The external electrodes that make up the working circuit are electrically connected to each other, and each chip component is mounted in close contact with each other, which eliminates the need to route circuit patterns, which was conventionally necessary to connect external electrodes to each other. The area of the mounting board becomes smaller. In particular, if the external electrodes of all chip components are directly connected to each other, a mounting board is not necessarily required.

Embodiments of the mounting structure for chip components according to the present invention will be described below with reference to the accompanying drawings.

[First Embodiment, FIG. 1] As shown in FIG. 1, chip components 2 are integrally attached to the upper surface of a mounting board 1 in close contact with each other. Mounting board 1 has electrodes 3 for mounting chip components 2.
is provided. Each chip component 2 is provided with a plurality of external electrodes 4 on its end surface. The size and position of the external electrode 4 can be determined depending on the chip components 2 that can be combined.

Each chip component 2 is allowed to be integrally assembled into a block shape with the end surfaces of the external electrodes 4 in close contact with each other, with the external electrodes 4 constituting the circuit being electrically connected to each other. The external electrodes 4 are connected to each other by soldering, by sandwiching a conductive sheet, or by using an interconnector.

The mounting board 1 on which the chip components 2 are mounted in this manner is used by being incorporated into a radio receiver or the like.

In this embodiment, since the method of directly connecting the external electrodes of all the chip components 2 to each other is adopted, no circuit pattern other than the electrodes 3 is formed on the mounting board 1. That is,
The chip components themselves have a structure that also has wiring functions.

In this way, the chip components 2 on the mounting board 1 can be mounted with high density, so that the electronic circuit can be configured compactly.

In order to protect the chip components, it is preferable to apply a protective cover or resin coating to the chip components 2 after mounting, since reliability and safety can be further improved.

[Second Embodiment, Figures 2 and 3] This embodiment is an example in which an oscillation circuit is constructed by combining two chip components. As shown in FIG. 2, the mounting board 1
On the top surface of 1 is a piezoelectric resonator 1 with a built-in three-terminal capacitor.
2 and a two-terminal chip resistor 13 are attached by soldering with their end faces in close contact. On the mounting board 11, an external electrode 12a of the oscillator 12 is provided.

The mounting for attaching electrodes 12b and L2c is electrode 17a,
17b.

1000 circuit patterns 18a, 18b, and 18c are provided to connect to the military poles 17a, 17b, and 17c. External electrodes 12a and 12c of the oscillator 12 are resistors 13
It is electrically connected to external electrodes 13a and 13b by soldering. An equivalent electrical circuit of the oscillation circuit thus obtained is shown in FIG. A resistor R and an oscillator are connected in parallel between electrodes 17g and 17c, and capacitors C1 and C2 are inserted between electrodes 17a and 17b and between electrodes 17c and 17b.

[Other Embodiments] Note that the mounting structure of the chip component according to the present invention is not limited to the above-mentioned embodiments, and can be variously modified within the scope of the gist.

In the first embodiment, the mounting board 1 may not be used in an environment where sufficient mechanical strength can be guaranteed only by the adhesion between the chip components.

Further, the close contact between chip components is not limited to planar bonding, and as shown in FIG.
A plurality of chip components 21 may be stacked on the top surface of the device, and three-dimensional bonding may be performed using the external electrodes 22.

Furthermore, it is not necessary that the chip components are in close contact with each other without any gaps, and they may have some empty areas 23 as shown in the second row from the top in FIG.

In the present invention, the external IE poles of a plurality of chip components are electrically connected and each chip component is mounted in close contact with each other, so there is no need to route circuit patterns. Chip components can be mounted with high density, and electronic circuits can be configured compactly. In particular, if the external electrodes of all chip components are directly connected to each other, a mounting board can be omitted, and further compactness can be achieved.

Furthermore, by standardizing the external dimensions of chip components, the formation positions of external electrodes, etc., it becomes easy to modularize and unitize chip components, and it is possible to apply the present invention to high value-added products such as IC card radios.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a mounting structure of a chip component according to a first embodiment of the present invention. 2 and 3 show a second embodiment of the present invention, in which FIG. 2 is a perspective view showing a mounting structure of chip components constituting an oscillation circuit, and FIG. 3 is an electrical equivalent circuit diagram. FIG. 4 is a front view showing another embodiment of the present invention. FIG. 5 is a perspective view showing a conventional chip component mounting structure. 2... Chip component, 4... External electrode, 12... Chip component (piezoelectric resonator), 12a, 12b, 12cm external electrode, 13... Chip component (chip resistor), 13a
, 13b... External electrode, 21... Chip component, 2
2...External electrode. Patent applicant Murata Manufacturing Co., Ltd.

Claims (1)

[Claims] 1. A plurality of chip components each having a plurality of external electrodes are assembled, and each chip component is integrally brought into close contact with the external electrodes of each chip component that make up the circuit electrically connected to each other. A mounting structure for a chip component, characterized in that the chip component is mounted using the same method.