JPS58197909A - Mounting structure of chip-like piezo-electric oscillation part - Google Patents

Abstract

PURPOSE:To improve mounting density by forming conductive films at the corners of a plate-like piezo-electric oscillator and mounting the oscillator perpendicularly on a base plate. CONSTITUTION:A resonator, a filter, a discriminator or the like can be applied as a piezo-electric oscillation unit 101. The piezo-electric oscillator unit 101 is sandwiched by two insulating plates 11. Notched parts are formed at least at two portions of the insulating plates 11 such as corner parts to be coated with conductive films. The number of the notched parts required is equivalent to the number of electrodes included in the piezo-electric oscillator unit 101. If the notched parts are required on the three positions, it is sufficient to provided additionally are notched part on the central part of the insulating plates 11. When the piezo-electric oscillator unit 101 formed by said method is soldered on the base plate together with other parts, the plate-like chip part is perpendicularly formed on the base plate so that the area occupied by the plate-like chip part is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting structure for a chip-shaped piezoelectric vibrating component in which a plate-shaped insulator and a piezoelectric vibrating conite are laminated.

Traditionally, piezoelectric vibrating components such as resonators, oscillators, filters, and FM discriminators have been made using ceramic filters with a relatively low frequency band of several hundred KZ due to the characteristics of the vibration mode used by each piezoelectric vibrating unit. Now, there are case-type ones in which a piezoelectric vibration unit is housed in a box-shaped exterior case made of resin, etc.
Ceramic filters in the frequency band from Z to several tens of MHz are of the so-called dip-coated type, in which an exterior resin is attached to the area excluding the vibration area of the energy-trapped piezoelectric vibration unit, or dip-coated or hermetic filters are used for surface wave elements. Piezoelectric vibrating parts having a shield case are generally known, but all of these piezoelectric vibrating parts are of a lead terminal type having lead terminals.

By the way, in recent years, with the miniaturization of electronic devices, various efforts have been made to increase the density of electronic component mounting. Since the vibration unit is covered with an exterior member and a plurality of lead terminals protrude from the exterior member, there is a drawback that the shape is large and the packaging density is low.

The present invention has been made in view of the above-mentioned circumstances regarding conventional piezoelectric vibrating components.The purpose of the present invention is to form a piezoelectric vibrating component into a chip with a structure suitable for mass production, so that it can be mounted on a board on which the piezoelectric vibrating component is mounted. The objective is to directly attach the device, improve the mounting density, and simplify the manufacturing process.

For this reason, the present invention provides notches in at least two places of at least one plate-shaped insulator to serve as a cover, and provides chip components on at least the wall surface of the insulator in the thickness direction of these notches. A conductive film to be an external connection terminal electrode should be formed, the above insulating material and a piezoelectric vibration unit should be laminated, and the extraction electrode of the piezoelectric vibration unit should be electrically connected to the above conductive film to be integrated. The feature is that it can be mounted upright on a board.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, for convenience of explanation, things that do not belong to the present invention have also been described.

In FIGS. 1(a) and 1(b), 11 is a rectangular plate-shaped insulator made of synthetic resin material or alumina, which is often used as a printed circuit board or a through-hole plating board, and 12 is a surface wave element. This is a piezoelectric vibration unit.

The insulator 11 has, for example, circular arc-shaped notches 13a, 13b, 13c, and 13d at each of its four corners, and these notches 13a, 13b, 13c
Wall surface 14a in the thickness direction of the insulator 11 of 113d
, 14b, 14c, 14d and insulator 11
The cutout portions 13a, 13b, 13c on the surface of
, conductive films 15a, 15b near 13d
, 15c, and 15d, respectively.

On the other hand, the piezoelectric vibration unit 12 has substantially the same dimensions as the insulator 11, and has, for example, fan-shaped extraction electrodes 17, 18, 19, and 20 formed at the four corners of one main surface, respectively.

The extraction electrodes 11 and 18 are the input terminal and ground terminal of the human body i#il (human flesh acoustic wave) element 21,
The extraction electrodes 19 and 20 are connected to the surface wave element 2, respectively.
These are the two output terminals of 1.

In order to ensure the vibration of the surface wave element 21 portion of the piezoelectric vibration unit 12, the insulating material 11 having a concave portion 22 provided on one main surface thereof is laminated, and both are bonded with an adhesive. The lead electrodes 17, 18, 19 and 20 of the surface wave element 21 and the conductive films 15a, 15b, 15c and ISd of the insulator 11 are soldered 26 by the dip method or the like.

By doing as described above, a chip-shaped surface acoustic wave component 23 as shown in FIG. 2 can be obtained.

When mounting the surface acoustic wave component 23 on a printed circuit board, as shown in FIG. Figure 3 shows extraction electrode 1 as a representative.
9 and conductive@15c, the extraction electrodes 17, 18, 19, 20, the conductive films 15a, 15b, 1
The surface acoustic wave component 23 is mounted on the printed circuit board 24 with the three copper foils 5c, 15d and the four copper foils 25 corresponding thereto being electrically connected to each other.

In addition, when shielding the surface acoustic wave element 12 portion of the surface acoustic wave component 23, as shown in FIGS. 4 and 5, a shield electrode S is formed on the other main surface of the insulator 11, The shield electrode S may be connected to the extraction electrode 18 (earth terminal) via the conductor 15b.

Chip-shaped surface acoustic wave component 23 having the above configuration
To obtain this, as shown in FIG. 6(a), first, an insulating base material 31 preferably made of synthetic resin, which is often used as a printed circuit board material or a through-hole plating board material, is prepared, and the insulating base material 31 is prepared. For example, a round hole or a semi-circular hole 32 at the edge of the insulator base material 31 at a position where the distance between the front and back and the left and right is equal to the inside and length of the surface acoustic wave component 23 to be manufactured.・
..., 32 is provided, and by the through-hole plating method,
As shown in FIG. 7, the circular hole 32. . . , 32, and electrodes 9933 .・・・
, 33 are formed, and the recesses 22 are provided, for example, by cutting, and preferably, the electrodes on the peripheral edge of the opening end surface on the side that contacts the piezoelectric vibration unit base material 34 are removed by polishing.

On the other hand, as shown in FIG. 6(b'), the piezoelectric vibration unit base material 3 is formed by molding the piezoelectric material into a plate shape and firing it.
4, and a circular or semicircular lead-out electrode corresponding portion 35.4 is formed on one main surface thereof at a position corresponding to the round hole or semicircular hole 32 of the insulator base material 31 by a method such as printing. ...
, 35 and these extraction electrode equivalent parts 35
．． . . , 35 are provided with interdigital electrodes connected to the surface acoustic wave elements 21 . ....

21 is formed.

Next, the round hole or semi-round hole 32 of the insulator base material 31,
. . , 32 and a portion 35 corresponding to the extraction electrode of the piezoelectric vibration unit base material 34. .

In the above state, the round hole or semi-round hole 32 of the insulator base material 31,
. . , 32 and the extraction electrode equivalent portion 35 of the piezoelectric vibration unit base material 34. ..., a line 36 passing through the center of 35.・
....

36.37. ..., the insulator base material 31 along 37
After cutting the piezoelectric vibration unit base material 34, the round or semi-circular holes 32. ..., the electrode formed on 32 [ll33゜..., the conductive film 1 formed by processing 33
5a to 15d, and the extraction electrode equivalent portion 35. ..., 35
By soldering the processed lead electrodes 17 to 20, a surface acoustic wave component 23 shown in FIG. 2 can be obtained. Such a manufacturing method can also be applied to the following examples.

By doing the above, a large number of surface acoustic wave components 23 can be mass-produced by simply adhering one insulator base material 31 and one piezoelectric vibration unit base material 34 to each other and cutting them. I can do it. Moreover, as the insulating base material 31, a commercially available material or an easily manufactured and inexpensive material manufactured in accordance with the commercially available material can be used.

When the excitation electrode is formed only on one surface of the piezoelectric plate, such as the above-mentioned surface acoustic wave component, the extraction electrode can be easily connected to the conductive film that becomes the external connection terminal electrode of the chip component. In a bulk wave component using an energy confinement type thickness vibration mode in which excitation electrodes are provided on the opposing main surfaces of a piezoelectric plate as described above, the extraction electrode of one excitation electrode is connected to the first electrode that is to become the external connection terminal electrode of the chip component. Although it can be easily connected to the conductive film, the extraction electrode of the other excitation electrode must be connected to the second conductive film on the same plane as the first conductive film by going around the piezoelectric plate using some means. If this is not done, the structure will not be able to perform phase bonding. Below, we will discuss countermeasures for phase bonding with energy-confined bulk wave components.

First, examples of bulk wave energy confinement type two-terminal resonators are shown in FIGS. 8, 9, and 10.

In this example, as shown in FIG. 8, the piezoelectric vibration unit 41 includes circular electrodes 43.44 formed on one main surface of the piezoelectric substrate 42 and circular electrodes 43.44 formed on the other main surface of the piezoelectric substrate 42. A circular electrode 4 formed opposite to 44
The electrodes 43, 44 of these two-terminal resonators 47, 48 are mounted on a piezoelectric substrate so that they have no directionality and are convenient to handle. The electrodes 49 and 50 are formed at two diagonal corners of one main surface of the electrode 42, respectively, and the electrodes 45 and 46 are connected to each other. Further, as will be described later, when mounting it vertically on a board to be mounted, for example, an extraction electrode 50 is formed at the lower right corner in the figure and connected to the electrode 44. Then, when mounting vertically, the lead electrode 49.5 is placed on the surface of the mounting board.
0 will be in contact with each other, making soldering easier.

As shown in FIG. 10, the piezoelectric unit 41 has a circuit configuration in which: terminal resonators 47 and 48 are connected in series between extraction electrodes 49 and 50, but equivalently, one A two-terminal resonator is constructed. With this kind of configuration,
Since both extraction electrodes 49 and 50 are present on one side of the piezoelectric substrate 42, the piezoelectric vibration unit 41 includes an insulator 11.
11 are laminated and bonded together as shown in FIG. 9, and the extraction electrodes 49 and 50 are soldered to the conductive films 15b and 15c of one of the insulators 11 using solder 26, thereby forming a chip-shaped bulk. A two-terminal resonator with wave energy confinement can be obtained. In this case, the insulator 11 on the electrode 45, 46 side may be replaced with an ordinary insulating plate having only the four parts 22 and no notches at the corners. This means that
The following examples also apply:

Next, when using a three-terminal resonator Conit, by interposing a capacitor between the ground side common electrode and its lead electrode, the ground side common electrode's lead electrode can be connected to the input/output electrode's lead electrodes. It is placed on the surface of the piezoelectric substrate.

In the examples shown in FIGS. 8 to 10 above, if the piezoelectric vibration unit 51 having the electrode configuration as shown in FIG. A chip-shaped bulk wave energy confinement type three-terminal resonator is connected to the divided electrodes 55 and 54 of the three-terminal resonator 54, and a capacitor C1 is connected between the electrode 57 and the common electrode 58 of the three-terminal resonator 54. Obtainable. With such a structure, the lead-out electrode 57 of the electrode 5B is located in the same direction as the lead-out electrodes 52 and 53. It should be noted that if a similar capacitor C1 is provided at a corner diagonally opposite to the electrode 51, the piezoelectric vibration unit 51 will have no directionality and will be convenient to handle.

In the examples shown in FIGS. 8 to 12 above, the oscillator, F
It can be used as an M discriminator unit, filter, etc.

Furthermore, if the Tsujiden vibration unit 61 having the electrode configuration as shown in FIG. 13 is used, a three-terminal resonator 54, a capacitor C1 and a Three-terminal resonator 54', capacitor C'
Two sets of circuits having exactly the same configuration as shown in FIG.
A capacitor C is connected between one of the divided electrodes of 4′ and the common electrode.
2 is connected to obtain a chip-shaped bulk wave energy confinement type filter.

One electrode 64 of the capacitor C1 and one electrode 65 of the other capacitor C2 are connected to each other outside the filter. In addition, as a modified example of this, the 14th
If connections such as those shown by dotted lines in the figure are added, the one shown in Fig. 13 also has no directionality and is convenient to handle.

Next, an example of a non-energy confinement type filter is shown in the 15th example.
16(a) and (b).

In Fig. 15, 71.71 is a non-energy confined type 0 resonant element.
A divided electrode 13°7 is provided on one main surface of each piezoelectric substrate 72.
3 is formed, a common electrode 14 is formed on the other main surface, and $175 is formed between the divided electrodes 73 and 73 to utilize the length vibration mode.

On the other hand, reference numeral 76 indicates a substrate made of ceramic such as alumina or synthetic resin for mounting the resonant elements 71 and 71, and an extraction electrode 77 which is on the ground side is formed on the substrate 16. [Resonant element 71] with elastic anisotropic or isotropic conductive sheets 78, 78 in between.
．． 71 is placed and fixed, and its common electrodes 74 and 74 are electrically connected to the extraction electrode 71.

The above-mentioned resonant element 71.71 and the substrate 16 are connected to each other, for example in FIG.
A piezoelectric vibration unit corresponding to the piezoelectric vibration unit 12 of b) is constructed.

Above the resonant element 71.71, an anisotropically conductive sheet 79.79 having elasticity is basically placed.
), and the insulator 11' and the substrate are bonded to each other.

The insulator 11- has recesses 22', 22- (which may be one common recess) for accommodating the resonant elements 71, 71, and the inner wall surfaces of these recesses 22', 22- are as follows: Resonant element 71.7 through anisotropic conductive sheet 79.79
A connection electrode 80 is formed that connects each one of the divided electrodes 73.73 of the resonance element 71.71 to each other, and a connection electrode 81 that connects the other divided electrode 73.73 of the resonant element 71.71 to the conductive films 15a and 15d, respectively. .81 is formed.

By doing as above, the piezoelectric substrate 7 of the resonant element 71.71
2.72 is fixed between elastic conductive sheets 78 and 79 to ensure its vibration, while the other divided electrode 73.
73 is a conductive film 15a passing through the anisotropic conductive sheet 19.
, 15d, and the common electrodes 74, 74
Also, through the conductive sheets 78 and 78, the light is drawn out from the extraction electrode 77 to the conductive films 15b and 15c formed at positions different from the conductors 1115a and 15d.

In the embodiment shown in FIG. 15, for example, FIG.
) and as shown in FIG. 16(b), bonding wire 90 is used to connect the other divided electrode 73.7.
3 may be electrically connected to the conductors 1115a and 15d.

As described above, a filter in which three-terminal resonators using a non-energy-confined single vibration mode are cascaded in two stages can also be made into a chip. The number of stages connected in cascade is arbitrary. Furthermore, the present invention can also be applied to a two-terminal or three-terminal type oscillator or FM discriminator using - non-energy-confined single-vibration t-modes. It goes without saying that the mode of use and the type of non-single energy confinement type vibration element are not limited to the above.

Next, a case will be described in which a piezoelectric vibration unit of the energy confinement type C1, which was conventionally used with a lead attached, is used. FIG. 17 shows the basic piezoelectric vibration unit in this case. In the figure, 101 is a piezoelectric substrate;
Reference numerals 102 and 103 designate a pair of excitation electrodes, and reference numerals 104 and 105 designate extraction electrodes provided on the front and back sides of corners of the piezoelectric substrate 101 on one diagonal line, respectively. This piezoelectric vibration unit is covered with an insulator 11.1-1 from above and below.
Shown in the diagram! The lead electrode 104 and the conductive film 15a in contact therewith are soldered together, and the lead electrode 105 and the conductive layer 4915c of the lower insulator 11 in contact therewith are soldered. At the same time, the U-shaped metal clip 106 is passed between the conductive film 15C of the lower insulator 11 and the conductive film 15d of the upper insulator 11, and the two are soldered. With such a structure, the self-oscillating electrode 1
02.103 is the conductive WA15a of the upper insulator 11,
15d, respectively. The connection may be made with a wire instead of the U-shaped metal clip. Further, the function of a U-shaped metal clip or wire may be provided by placing the electrode along the side surface of the piezoelectric substrate, or by forming a hole in the corner of the piezoelectric substrate to form an electrode film. Such a structure can be applied not only to the two-terminal resonator as described above, but also to a three-terminal resonator, a filter, and other piezoelectric vibration units.

The above examples are about various ways to mount a piezoelectric vibrating component face down on the board to be mounted. For example, in the case related to FIGS. 1 to 7, when the conductive films 15b and 15d are placed in contact with the substrate to be mounted, an appropriate lead pattern is formed on the insulator 11 and the conductive films 1115a 115C should be pulled out so as to be in contact with the board to be mounted.Things related to FIGS. 8 to 10 are as described above.Things related to FIGS. 11 to 16(b) are as shown in FIG. ～・It can be mounted on the board to be mounted using the same measures as in the case of Fig. 7. 1st
In the case of a two-terminal resonator using the energy trapping thickness vibration mode as shown in Figure 7, for example, the piezoelectric vibrating component can be placed upright on the board to be mounted by bringing the extraction electrode 104 to the lower left corner in the figure. It can be attached. In other words, in FIG. 19, when the extraction electrode 104 of the excitation electrode 102 is brought to the lower left corner in the figure, the excitation electrode 102 is connected to the conductive layer 111 of the upper insulator 11.
Conducts with 5b. Further, the excitation electrode 103 is electrically connected to the conductive film 15C of the lower insulator 11. In this example, cutouts 13a, 13c, 13d of the upper insulator 11
, cutout portions 13a, 13b13 of lower insulator 11
d is not necessarily required.

FIG. 20 shows an example in which the excitation electrode 102 in FIG. 19 is replaced by divided electrodes 102a and 102b, and the divided electrode 102a is replaced by the divided electrodes 102a and 102b. The divided electrode 102b is connected to an extraction electrode 104 provided at the lower left corner, and the divided electrode 102b is connected to an extraction electrode 106 provided at the lower right corner in the figure. The excitation electrode 103 is connected to an extraction electrode 105 provided on the back side in the figure at the center of one side where the extraction electrodes 104 and 106 are provided. On the other hand, the upper and lower insulators 11 are provided with half-round notches 13e and 13f, compared to the example shown in FIG. Conductive film 1 extending near the notch portion of
The difference is that 5e 115f is provided. Therefore, in the example shown in FIG. 20, the divided electrode 1028 is electrically connected to the conductive film 15b of the upper insulator 11. Split electrode 102b
is electrically connected to the conductive film 15d of the upper insulator 11. The excitation electrode 103 is electrically connected to the conductive film 1513 of the lower insulator 11. In this example, the notch 15 of the upper insulator 11
a, -13c, 15e, 15f.

Notches 15a, 15b of the lower insulator 11,
15c, 15d, and 15f are not necessarily required.

In this way, there are two or three extraction electrodes,
Even if these extraction electrodes are drawn out on the front and back sides of the main plane of the piezoelectric substrate, mounting is easy if the piezoelectric substrate is mounted vertically on the M& to be mounted. Moreover, mounting it upright like this further increases the packaging density. It goes without saying that the present invention is applicable not only to the piezoelectric vibrating unit as described above, but also to conventionally known piezoelectric vibrating units based on the idea of mounting the piezoelectric vibrating unit vertically. Note that FIGS. 21(a) and 21(b) show the state in which the two-terminal piezoelectric vibrating component is mounted, with the viewing direction changed. Second
Similarly, FIGS. 2(a) and 2(b) show a state in which a three-terminal type piezoelectric vibrating component is mounted.

In the case of a two-terminal type piezoelectric vibrating component, as shown in Fig. 23, the extraction electrode portion may be covered with a covering electrode 110, 111 like a conventional chip capacitor and solder plated if necessary. good.

As is clear from the detailed explanation above, the present invention provides an insulating plate having at least two notches and a conductive film formed thereon, which is laminated on a piezoelectric vibrating unit, and the lead-out electrode The piezoelectric vibrating component was made into a chip by making it conductive to the above-mentioned conductive film, and this piezoelectric vibrating component was stood up and attached to the mounting board. Large quantities of piezoelectric vibrating parts can be easily obtained by simply cutting them. ■ The simple manufacturing process means lower prices, fewer defective products, and improved product reliability. ■ Lead wires The structure is similar to that of chip-shaped resistors and capacitors, so it is easy to mount on circuit boards such as printed circuit boards, and conductive films can be easily formed using through-hole plating. In addition to this effect, the piezoelectric vibrating unit having a counter electrode on a piezoelectric substrate can be made into a chip with the conventionally known electrode structure, without having to create a special structure. .
! In addition, the second
The 3rd, 5th, 9th, 15th, 16th (b), and 18th drawings are for clarifying the connection relationship of each part, and the cross sections are at appropriate locations, so they are so-called cross sections. Please note that this may differ from the illustration.

[Brief explanation of drawings]

FIG. 1(a) is a perspective view of an insulator of an example of a piezoelectric vibrating component, FIG. 1(b) is a perspective view of a Jl electric vibration unit of the piezoelectric vibrating component of FIG. 1(a), and FIG. Fig. 1(a) and Fig. 1(b) are structural explanatory diagrams of piezoelectric vibrating parts using the insulator and piezoelectric vibrating unit, and Fig. 3 is an explanatory diagram of mounting the piezoelectric vibrating parts of Fig. 2 on a circuit board. , FIG. 4 is a perspective view of the insulator shown in FIG. 1(a) with a shield electrode provided thereon, FIG. 5 is an explanatory diagram of the structure of a piezoelectric vibrating component using the insulator shown in FIG. 4, and FIG. (a) is a perspective view of the insulator base material, Figure 6 (b)
is a perspective view of the piezoelectric vibration unit base material, and FIG. 7 is a perspective view of the piezoelectric vibration unit base material, and FIG.
), Figure 8 is a perspective view of a piezoelectric vibration unit of a two-terminal resonator that confines bulk wave energy, and Figure 9 is a structural explanation of a three-terminal resonator that confines pulse wave energy. Figure 10 is an equivalent circuit diagram of the resonator in Figure 9, Figure 11 is a perspective view of a piezoelectric vibration unit of a three-terminal resonator of bulk wave energy confinement type, and Figure 12 is an equivalent circuit diagram of the resonator in Figure 11.
Figure 13 is a perspective view of the piezoelectric vibration unit of the bulk wave energy trap type filter, Figure 14 is the equivalent circuit diagram of Figure 13, and Figure 15 is a structural explanation of the non-energy trap type filter. 16(a) and 16(b) are respectively a plan view B of a piezoelectric vibration unit of a modified example of the filter in FIG. 15 and an explanatory diagram of the structure of the filter, and FIG. 17 is an energy trapping type resonator. FIG. 18 is a vAyli explanatory diagram of a resonator using the unit shown in FIG. 11, FIG. 19 is an exploded perspective view of a two-terminal piezoelectric vibrating component, and FIG. Disassembled @ inspection drawing of terminal type piezoelectric vibrating component, Figures 21 (a) and (b) are perspective views of the mounted state, Figures 22 (a) and (b) are perspective views of the mounted state, and Figure 23 is the deformed state. FIG. 3 is a perspective view of an example. 11.11-... Insulator, 12... Piezoelectric vibration unit, 13... Notch, 15a,
15b, 15c, 15d, 15e, 15f...
... Conductive film, 17.18, 19, 20. 104.
105. 106... Extraction electrode, 26...
...Solder, 31...Insulator base material, 34...
...Piezoelectric vibration unit base material, 41,51.61...
... Piezoelectric vibration unit, 11 ... Resonance element, 76 ... Substrate, 101 ... Piezoelectric substrate, 102.103 ... Excitation electrode, 102a10
2b...Divided electrode. Patent application Person Murata Manufacturing Co., Ltd. ) Article 22 [] (a) (I))

Claims (1)

[Claims] A plate-shaped insulator is provided with notches in at least two places, a conductive film is formed on the wall surface of the insulator in the thickness direction of these notches, and the insulator and the piezoelectric vibration unit are laminated to generate the piezoelectric vibration. A mounting structure for a chip-shaped piezoelectric vibrating component, characterized in that the chip-shaped piezoelectric vibrating component, characterized in that an extraction electrode of the unit is electrically connected to the conductive film, is mounted vertically on a board to be mounted.