JPH0155606B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a chip-shaped piezoelectric vibrating component in which a plate-shaped insulator and a piezoelectric vibrating unit are laminated and can be face-bonded.

Conventionally, piezoelectric vibrating components such as resonators, oscillators, filters, and FM discriminators have been
The following types of piezoelectric vibration units are well known, depending on the characteristics of the vibration mode in which each piezoelectric vibration unit is used. That is, among ceramic filters for a relatively low frequency band of several hundred kilohertz, there is a case type in which a piezoelectric vibrating unit is housed in an outer case made of resin or the like into a box shape. Furthermore, among ceramic filters with high frequencies ranging from several MHz to several tens of MHz, there is a so-called dip-coated type in which an exterior resin is adhered to an area other than the vibration area of the energy-trapped piezoelectric vibrating unit. moreover,
Surface wave devices are known to have a dip coating or a hermetic shield case.
All of these piezoelectric vibrating components are of a lead terminal type having lead terminals.

By the way, in recent years, with the miniaturization of electronic devices, various efforts have been made to increase the packaging density of electronic components, but the piezoelectric vibrating components of the lead terminal type described above basically do not Since the unit is covered with an exterior member and a plurality of lead terminals protrude from the exterior member,
In addition to its large size and low packaging density, it also had the drawbacks of low manufacturing efficiency because it included a process for attaching lead terminals.

The present invention has been made in view of the above-mentioned circumstances regarding conventional piezoelectric vibrating components, and its purpose is to provide a chip-shaped piezoelectric vibrating component suitable for mass production of chip-shaped piezoelectric vibrating components that have no directionality when mounted on printed circuit boards, etc. An object of the present invention is to provide a method for manufacturing a piezoelectric vibrating component.

Therefore, in the present invention, a portion corresponding to an extraction electrode is formed at a grid point position, and a piezoelectric vibrating portion is formed inside a rectangle with adjacent lattice points as vertices, and an input electrode and an output electrode of each piezoelectric vibrating portion are formed. A substrate base material and a plate-shaped insulating base material are prepared, each of which is drawn out to a portion corresponding to the lead-out electrode at the apex on the diagonal line of the quadrilateral, and each of the base materials of the insulating base material is Holes are formed at positions corresponding to the extraction electrodes, an electrode film is formed on the inner wall surface of each hole, and each hole of the insulator base material is aligned with each of the extraction electrodes of the substrate base material. After laminating the insulating base material on the substrate base material and adhering them to each other using an adhesive, the insulating base material and the substrate base material are passed through each hole in the insulator base material along the sides of the above-mentioned rectangle. It is characterized in that it is cut into chips along the lines, and the electrode film and the portion corresponding to the extraction electrode are electrically connected.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

In FIGS. 1a and 1b, 11 is a rectangular plate-shaped insulator made of alumina or resin, and 12 is a piezoelectric vibration unit constituting a surface wave element.

The insulator 11 has, for example, arc-shaped cutouts 13a, 13b, 13c, and 13d at each of its four corners, and these cutouts 13a, 13b, 13c, and
3d wall surface 14a in the thickness direction of the insulator 11,
14b, 14c, 14d and the vicinity of the notches 13a, 13b, 13c, 13d on the surface of the insulator 11, conductive films 15a, 15b, 15c, 15
d respectively.

On the other hand, the piezoelectric vibration unit 12
For example, fan-shaped extraction electrodes 17, 18, 1 are provided at the four corners of one main surface.
9 and 20, respectively.

The extraction electrodes 17 and 18 are the input terminal and the ground terminal of the surface wave (surface acoustic wave) element 21, respectively, and the extraction electrodes 19 and 20 are the two output terminals of the surface wave element 21, respectively.

In order to ensure the vibration of the surface wave element 21 portion of the piezoelectric vibration unit 12, the insulating material 11 having a recess 22 on one main surface thereof is laminated, and both are bonded with an adhesive. The extraction electrodes 17, 18, 19 and 20 of the surface wave element 21 and the conductive films 15a, 15b, 1 of the insulator 11
5c and 15d are soldered using solder 26 using a dip method or the like.

By doing the above, a chip-shaped surface acoustic wave component 23 as shown in FIG. 2 can be obtained.

When mounting the surface acoustic wave component 23 on the printed circuit board 24, as shown in FIG.
If you glue and solder using dip method etc.
FIG. 3 shows an extraction electrode 19 and a conductive film 15 as a representative.
As shown for c, the extraction electrodes 17,1
8, 19, 20, conductive films 15a, 15b, 15
c, 15d and four copper foils 2 corresponding to these
The surface acoustic wave component 23 is mounted on the printed circuit board 24 in a state where the three components 5 are electrically connected to each other.

Note that the acoustic wave element 1 of the surface acoustic wave component 23
When shielding two parts, see Figures 4 and 5.
As shown in the figure, a shield electrode S may be formed on the other main surface of the insulator 11, and the shield electrode S may be connected to the lead electrode 18 (earth terminal) via the conductive film 15b.

The chip-shaped surface acoustic wave component 23 having the above configuration is manufactured as follows.

As shown in FIG. 6a, first, an insulating base material 3 is formed by forming an insulating material such as alumina into a plate shape and firing it.
1 is prepared, and a square surface acoustic wave component 23 is manufactured on the insulator base material 31 with front and rear and left and right intervals.
For example, a round hole (or a half-round hole at the edge) 32, . . . , 32 is provided at the vertex position equal to the width and length of Electrode films 33,...33 are provided on the inner wall surfaces of 32,...,32 and the peripheral edges of both opening end faces thereof.
After forming the electrodes, preferably, the electrodes at the periphery of the opening end surface on the side in contact with the piezoelectric vibrating unit base material 34 are removed by polishing.

On the other hand, as shown in FIG. 6b, a piezoelectric vibrating unit base material 34 is formed by forming a piezoelectric material into a plate shape and firing it, and the above-mentioned insulating material is coated on one main surface of the piezoelectric vibrating unit base material 34 by a method such as printing. Circular or semicircular extraction electrode equivalent parts 35, . . . , 35 are formed at positions corresponding to the round holes (or semicircular holes) 32, .
..., 35 are provided to form surface acoustic wave elements 21, ..., 21.

Next, the round holes (or half-round holes) 32, . The object base material 31 and the piezoelectric vibrating unit base material 34 are bonded together using an adhesive (not shown).

In the above state, lines 36, ..., passing through the centers of the round holes (or half-round holes) 32, ..., 32 of the insulator base material 31 and the extraction electrode corresponding parts 35, ..., 35 of the piezoelectric vibration unit base material 34, After cutting the insulator base material 31 and the piezoelectric vibration unit base material 34 along the lines 36, 37, . . . , 37, the electrode films 33,
Conductive films 15a to 15 formed by processing ..., 33
d and the extraction electrodes 17 to 20 formed by processing the extraction electrode equivalent portions 35, . . . , 35, the surface acoustic wave component 23 shown in FIG. 2 can be obtained. Such a manufacturing method can also be applied to other embodiments of the present invention.

With the above method, a large amount of surface acoustic wave components 23 can be produced by simply gluing one insulator base material 31 and one piezoelectric vibrating unit base material 34 together and cutting them.
can be easily produced.

When the excitation electrode is formed only on one surface of the piezoelectric plate, such as the above-mentioned surface acoustic wave component, the extraction electrode can be easily connected to the conductive film that becomes the external connection terminal electrode of the chip component. In a bulk wave component using an energy confinement type thickness vibration mode in which excitation electrodes are provided on the opposing main surfaces of a piezoelectric plate as described above, the lead electrode of one excitation electrode is connected to the first electrode that is to become the external connection terminal electrode of the chip component. Although it can be easily connected to the conductive film, the extraction electrode of the other excitation electrode must be connected to the second conductive film on the same plane as the first conductive film by going around the piezoelectric plate using some means. If so, the structure will not be able to be bonded to the face.

Below, we will discuss countermeasures for face bonding with energy-confining bulk wave components.

First, an example in which the present invention is applied to a bulk wave energy confinement type two-terminal resonator is shown in FIGS. 8 and 9.
and FIG. 10.

In this embodiment, as shown in FIG. 8, the piezoelectric vibration unit 41 includes circular electrodes 43 and 44 formed on one main surface of the piezoelectric substrate 42, and circular electrodes 43 and 44 formed on the other main surface of the piezoelectric substrate 42. A two-terminal resonator 47 having circular electrodes 45 and 46 formed opposite to the electrodes 43 and 44 and vibrating independently of each other;
48. Then, these two-terminal resonators 4 were designed to eliminate directionality and make handling convenient.
The electrodes 43 and 44 of 7 and 48 are connected to the piezoelectric substrate 42.
The electrodes 49 and 50 are respectively drawn out and connected to the electrodes 45 and 46 formed at two diagonal corners of one main surface of the electrode.

The piezoelectric unit 41 has a circuit configuration in which two-terminal resonators 47 and 48 are connected in series between extraction electrodes 49 and 50, as shown in FIG. A two-terminal resonator is constructed. With such a configuration, both extraction electrodes 49,
50 is present on one side of the piezoelectric substrate 42. Therefore, the piezoelectric vibrating unit 41 is covered with an insulator 1 having exactly the same structure as that shown in FIG. 1a from above and below.
1 and 11 are laminated and bonded together as shown in FIG.
6, a chip-shaped bulk wave energy trapping type two-terminal resonator can be obtained. In this case, the insulator 11 on the electrodes 45 and 46 side
may be replaced with an ordinary insulating plate having only the recess 22 and no notches at the corners. This also applies to the examples below.

Next, when using a three-terminal resonator unit,
A capacitor is interposed between the ground-side common electrode and its lead-out electrode, so that the lead-out electrode of the ground-side common electrode is provided on the side of the piezoelectric substrate where the lead-out electrodes of the input and output electrodes are provided.

In the embodiments described in FIGS. 8 to 10 above, if the piezoelectric vibration unit 51 having the electrode configuration as shown in FIG.
A three-terminal resonator shown in FIG. 2 can be obtained. In this three-terminal resonator, extraction electrodes 52 and 53 are tangential to the divided electrodes 55 and 56 of the three-terminal resonator 54, respectively, and a capacitor _C1 is connected between the electrode 57 and the common electrode 58 of the three-terminal resonator 54. It is a connected chip-like bulk wave energy confinement type. With such a structure, the extraction electrode 57 of the electrode 58 is located on the same side as the extraction electrodes 52 and 53. Note that if a similar capacitor _C1 is provided at a corner diagonally opposite to the electrode 57, the piezoelectric vibrating unit 51 will no longer be directional, making it convenient to handle.

The devices shown in FIGS. 8 to 12 can be used as oscillators, FM discriminator units, filters, etc.

Furthermore, if a piezoelectric vibration unit 61 having an electrode configuration as shown in FIG. 13 is used, a three-terminal resonator 54, a capacitor C ₁ and a Two sets of circuits having exactly the same configuration as in FIG. 12, consisting of a three-terminal resonator 54' and a capacitor _C1 , are connected in cascade, and between one of the divided electrodes of the three-terminal resonator 54' and a common electrode. A chip-shaped bulk wave energy confinement filter is obtained by connecting a capacitor _C2 to the filter.

One electrode 64 of the capacitor C ₁ and one electrode 65 of the other capacitor C ₂ are interconnected outside the filter. Further, as a modification of this example, if a connection as shown by a dotted line in FIG. 14 is added, the connection shown in FIG. 13 also becomes directionless and is convenient to handle.

Next, an example in which the present invention is applied to a non-energy trap type filter is shown in FIG. 15, FIG. 16a,
It is shown in FIG. 16b.

In FIG. 15, reference numerals 71, 71 are non-energy-trapped resonant elements. These resonant elements 7
No. 1, 71 has divided electrodes 73, 73 formed on one main surface of each piezoelectric substrate 72, and a common electrode 74 formed on the other main surface.
A groove 75 is formed between the piezoelectric substrates 73 to utilize the length vibration mode of each piezoelectric substrate 72.

On the other hand, 76 is an alumina substrate for attaching the resonant elements 71, 71, and the alumina substrate 76 is formed with an extraction electrode 77 which is on the ground side. The resonant elements 71, 71 are mounted and fixed with isotropic conductive sheets 78, 78 in between, and their common electrodes 74, 74 are electrically connected to the extraction electrode 77.

The resonant elements 71, 71 and the alumina substrate 76
constitutes a piezoelectric vibration unit corresponding to, for example, the piezoelectric vibration unit 12 in FIG. 1b.

Above the resonant elements 71, 71, an insulating material 1 having basically the same structure as that shown in FIG.
1', and the insulator 11' and the alumina substrate 76 are bonded to each other.

The insulator 11' has recesses 22', 22' (which may be one common recess) for accommodating the resonant elements 71, 71. And these recesses 2
An anisotropic conductive sheet 7 is provided on the inner wall surfaces of 2' and 22'.
9 and 79, a connecting electrode 80 is formed which connects the divided electrodes 73 and 73 of each one of the resonant elements 71 and 71 to each other, while the other divided electrodes 73 and 73 of the resonant elements 71 and 71 are connected to each other with a conductive film. 15a,
Connection electrodes 81, 81 are formed to be electrically connected to 15b.

By doing as above, the piezoelectric substrates 72, 72 of the resonant elements 71, 71 can be replaced by the elastic conductive sheets 7
It is supported and fixed between 8 and 79 to ensure its vibration. In addition, the other divided electrodes 73, 73
The conductive film 1 is passed through the anisotropic conductive sheet 79.
5a and 15d, respectively, and the common electrodes 74 and 74 are also connected to the conductive films 15a and 15a from the extraction electrode 77 through the conductive sheets 78 and 78, respectively.
Conductive film 15a formed at a different position from 5d,
It is pulled out at 15c. This eliminates the directionality of installation.

In the embodiment shown in FIG. 15 above, the insulator 11'
For example, as shown in FIGS. 16a and 16b, without using the side anisotropic conductive sheet 79,
Using the bonding wire 90, the other divided electrode 73, 73 is connected between the conductive gaps 15a, 15b.
It may also be made to conduct.

As described above, a filter in which three-terminal resonators using a non-energy-confined single vibration mode are connected in two stages can also be made into a chip.
The number of stages to be cascaded is arbitrary. It can also be applied to a two-terminal or three-terminal oscillator or FM discriminator using one non-energy-confined single vibration mode. It goes without saying that the mode of use and the type of non-energy trapping type vibration element are not limited to those described above.

Finally, a case will be described in which the present invention is implemented using an energy trapping type piezoelectric vibration unit that has conventionally been used with a lead attached. FIG. 17 shows the basic piezoelectric vibrating unit in this case.

In FIG. 17, 101 is a piezoelectric substrate;
2 and 103 are a pair of excitation electrodes, and 104 and 105 are extraction electrodes provided on the front and back sides of corners of the piezoelectric substrate 101 on one diagonal line, respectively.
To this piezoelectric vibration unit, insulators 11 are laminated and glued from above and below as shown in FIG. The contacting conductive film 15c of the lower insulator 11 is soldered. At the same time, the U-shaped metal clip 106
is bridged between the conductive film 15c of the lower insulator 11 and the conductive film 15d of the upper insulator 11, and the two are soldered. With such a structure, both excitation electrodes 102 and 103 are connected to the conductive film 1 of the upper insulator 11.
5a and 15c, respectively. The connection may be made by wire instead of the U-shaped metal clip. Further, the function of a U-shaped metal clip or wire may be provided by placing the electrode along the side surface of the piezoelectric substrate or by forming an electrode film by providing holes in the corners of the piezoelectric substrate. Such a structure can be applied not only to the two-terminal resonator as described above, but also to those using piezoelectric vibration units such as three-terminal resonators and filters.

In addition, Fig. 2, Fig. 3, Fig. 5, Fig. 9, Fig. 1
The figures in Figure 5, Figure 16b, and Figure 18 are intended to clarify the connection relationships between each part, and the cross sections are at appropriate locations, so please note that they are different from so-called cross-sectional views. .

As described above in detail, the present invention has an extraction electrode equivalent portion formed at a grid point position, a piezoelectric vibrating part inside a rectangle with adjacent grid points as vertices, and each piezoelectric vibrating part A substrate base material and a plate-shaped insulating base material are prepared, in which the input electrode and the output electrode are respectively drawn out to the portion corresponding to the above-mentioned lead-out electrode at the vertex on the diagonal line of the above-mentioned rectangle, and the insulating base material is Holes are formed in the substrate base material at positions corresponding to the respective extraction electrodes, an electrode film is formed on the inner wall surface of each hole, and each hole in the insulator base material is connected to each of the extraction electrodes of the substrate base material. After laminating the insulating base material on the substrate base material and adhering them to each other using an adhesive, the insulator base material and the substrate base material are passed through each hole of the insulator base material and the above-mentioned This method of manufacturing a chip-shaped piezoelectric vibrating component is characterized in that the chip-shaped piezoelectric vibrating component is cut into chips along lines along the sides of a rectangle, and the electrode film and a portion corresponding to an extraction electrode are electrically connected.

According to the present invention, chip-shaped piezoelectric vibration is achieved by using a substrate base material in which the input electrode and the output electrode of each piezoelectric vibrating part are respectively drawn out to the portion corresponding to the lead-out electrode at the apex on the diagonal of the above-mentioned rectangle. Since the parts are manufactured, there is no directionality in the terminal structure of the manufactured chip-shaped piezoelectric vibrating parts, and moreover, the process of laminating the insulator base material to the piezoelectric vibrating unit base material and the cutting process require a large amount of processing. Chip-shaped piezoelectric vibrating parts can be obtained through a simple process that is suitable for Due to its simplicity, the price of the piezoelectric vibrating component is reduced, the incidence of defective products is reduced, and the reliability of the product is improved.

[Brief explanation of drawings]

FIG. 1a is a perspective view of an insulator of a chip-like piezoelectric vibrating component manufactured according to the present invention, FIG. 1b is a perspective view of a piezoelectric vibrating unit of a chip-like vibrating component manufactured according to the present invention, and FIG. A structural explanatory diagram of an example of the chip-shaped piezoelectric vibrating component manufactured according to the present invention, FIG. 3 is an explanatory diagram of the attachment of the chip-shaped piezoelectric vibrating component of FIG. 2 to a circuit board, and FIG. 4 is an illustration of the insulation of FIG. FIG. 5 is a structural explanatory diagram of a chip-shaped piezoelectric vibrating component using the insulator shown in FIG. 4. FIG. 6a is a perspective view of an insulator base material. Figure 6b is a perspective view of the piezoelectric vibration unit base material, Figure 7 is a sectional view of the insulator base material of Figure 6a, and Figure 8 is a perspective view of the piezoelectric vibration unit of the two-terminal resonator of bulk wave energy confinement type. Figure 9 is an explanatory diagram of the structure of a bulk wave energy confinement type two-terminal resonator, Figure 10 is an equivalent circuit diagram of the resonator in Figure 9, and Figure 11 is a bulk wave energy confinement type three-terminal resonator. 12 is a perspective view of the piezoelectric vibration unit of
Figure 13 is a perspective view of a piezoelectric vibration unit of another bulk wave energy trap type filter, Figure 14 is an equivalent circuit diagram of Figure 13, and Figure 15 is a non-energy trap type filter. 16a and 16b are respectively a plan view and a structural explanatory diagram of a piezoelectric vibration unit of a modified example of the filter of FIG. 15, and FIG. 17 is a piezoelectric vibration unit of an energy trap type resonator. FIG. 18 is an explanatory diagram of the structure of a resonator using the unit shown in FIG. 17. 11, 11'... Insulator, 12... Piezoelectric vibration unit, 13... Notch, 15a, 15b, 15c,
15d... Conductive film, 17, 18, 19, 20... Leading electrode, 26... Solder, 31... Insulator base material, 34...
Piezoelectric vibration unit base material, 41, 51, 61...Piezoelectric vibration unit, 71...Resonance element, 76...Alumina substrate.

Claims (1)

[Claims] 1. A part corresponding to an extraction electrode is formed at a grid point position, and a piezoelectric vibrating part is formed inside a square whose vertices are adjacent grid points, and an input electrode and an output electrode of each piezoelectric vibrating part are respectively located inside the square. Prepare a substrate base material and a plate-shaped insulator base material that are drawn out to the portions corresponding to the above-mentioned lead-out electrodes at vertices on the diagonal line, and correspond to the respective lead-out electrode-like portions of the above-mentioned base material of the insulator base material. A hole is formed at each position, an electrode film is formed on the inner wall surface of each hole, and each hole of the insulator base material is aligned with a portion corresponding to each lead electrode of the base material of the substrate, and the base material is attached to the base material using an adhesive. After laminating the insulating base material on the substrate and adhering them to each other, the insulating base material and the substrate base material are formed into chips along the lines along the sides of the rectangle through each hole in the insulating base material. A method for manufacturing a chip-shaped piezoelectric vibrating component, which comprises cutting the electrode film and electrically connecting the electrode film and a portion corresponding to the lead-out electrode.