JPS5834764U - hybrid integrated circuit - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

Figure 1 is a circuit example of a multiple feedback type bandpass filter, Figure 2 is a circuit example of a state variable type bandpass filter, and Figure 3 is a circuit example of a state variable type bandpass filter.
Figure 4 is a block diagram of a hybrid IC of the present invention having the same circuit as Figure 3, and Figure 5 is a diagram of a conventional thin film resistor array. A cross-sectional view of a chip, FIG. 6A is a cross-sectional view of a chip equipped with a semiconductor IC of the present invention and a thin film resistor array;
FIG. 6B is a part of the circuit of A.

Claims (1)

[Scope of utility model registration request] No. 1 hybrid integrated circuit configured by connecting a semiconductor integrated circuit, a thin film resistor formed on a silicon wafer, a multilayer capacitor, an external connection terminal, etc. to a conductive circuit or a resistance circuit formed on a printed wiring board or a ceramic substrate; A hybrid integrated circuit characterized in that a semiconductor integrated circuit and a thin film resistor formed on the silicon wafer are formed on the same silicon wafer, and are mounted on the substrate together with the multilayer capacitor, external connection terminals, etc.