JPH0419780Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a multi-circuit feedthrough capacitor in which a plurality of circuits each including a feedthrough capacitor can be handled as one component.

[Prior Art] Many types of feedthrough capacitors have been proposed in the past, and among them, a feedthrough capacitor chip 1 as shown in FIG. 11 is one that can be handled as a chip component.

The feedthrough capacitor chip 1 includes a main body 2 constructed as a laminate of dielectric ceramic, for example. This main body 2 includes a ceramic layer 4 with internal electrodes 3 extending vertically across it as shown in FIG. 12, and a ceramic layer 4 with internal electrodes 5 extending horizontally across it as shown in FIG. 6 are alternately stacked.

As shown in FIG. 11, the main body 2 has external electrodes 7 formed on both ends thereof, and external electrodes 8 formed on both sides thereof. One external electrode 7 is electrically connected to the aforementioned internal electrode 3 on both end surfaces of the main body 2, and the other external electrode 8 is electrically connected to the internal electrode 5 on both side surfaces of the main body 2. Although not shown in FIG. 11, these external electrodes 7 and 8 are formed to extend to the lower surface of the main body 2, respectively.

The feedthrough capacitor chips 1 as described above were mounted one by one on, for example, a printed circuit board and soldered. Therefore, in a circuit that requires a large number of feedthrough capacitors, a large number of feedthrough capacitor chips 1 are required, and the number of mounting and soldering steps described above increases accordingly, resulting in an increase in cost.

The first method that can eliminate these drawbacks is
Multi-circuit feedthrough capacitor chip 1 as shown in Figure 4
1 has been proposed. This multi-circuit feedthrough capacitor chip 11 also includes a main body 12 made of a dielectric ceramic laminate. The main body 12 has a 15th
A plurality of internal electrodes 13 extending in a band shape as shown in the figure.
A ceramic layer 17 in which electrodes 16 to 16 are formed across in the vertical direction and a ceramic layer 19 in which one internal electrode 18 is formed in a horizontal direction as shown in FIG. 16 are laminated alternately. exists.

External electrodes 20 to 24 are provided on the outer surface of the main body 12.
are formed in pairs, respectively. Then, the external electrode 20 is connected to the internal electrode 13, the external electrode 21 is connected to the internal electrode 14, the external electrode 22 is connected to the internal electrode 15,
The external electrode 23 is electrically connected to the internal electrode 16, and the external electrode 24 is electrically connected to the internal electrode 18. Although the external electrodes 20 to 24 are not shown in FIG. 14, they are each formed to extend to the lower surface of the main body 12.

Such a multi-circuit feedthrough capacitor chip 11
is each of internal electrodes 13 to 16 and internal electrode 1
8 to form a circuit including four feedthrough capacitors.

Therefore, such a multi-circuit feedthrough capacitor chip 11 has the advantage that it can be handled as a single component even though it includes a plurality of feedthrough capacitors.

[Problems to be solved by the invention] However, the conventional multi-circuit feed-through capacitor chip 11 has the disadvantage that the main body 12 is exposed, so it is susceptible to the influence of the surrounding environment such as humidity, and is inferior in reliability. Ta.

Furthermore, each time the number of circuits requiring feedthrough capacitors or the conditions of each circuit change, a feedthrough capacitor chip of a different design must be prepared. This is extremely disadvantageous in terms of manufacturing costs when demands are diverse.

Therefore, this invention aims to provide a multi-circuit feed-through capacitor that is less susceptible to ambient influences such as humidity, has high reliability, and allows for easy design changes while maintaining the advantage of being able to be handled as a single component. It is something to do.

[Means for Solving the Problems] In order to solve the above-mentioned problems, the multi-circuit feedthrough capacitor according to the present invention is configured as follows.

In other words, multiple feedthrough capacitor chips are
One external electrode of each feedthrough capacitor chip is connected in common to a ground terminal provided outside the package, and the other external electrode of each feedthrough capacitor chip is connected to the outside of the package. The terminals are respectively connected to provided hot terminals.

[Operations and Effects of the Invention] In this invention, the feedthrough capacitor chip that forms the multi-circuit feedthrough capacitor is built into the package, so it is less susceptible to the influence of surroundings such as humidity.
It becomes highly reliable.

Furthermore, since a plurality of feedthrough capacitor chips are housed in one such package to form a multi-circuit, the feedthrough capacitor chip 1 of one circuit as shown in FIG. High-density mounting is possible compared to individual mounting. Furthermore, when mounting or soldering to a printed circuit board, the multi-circuit feed-through capacitor of this invention can be handled as a single component.
Implementation efficiency is improved and costs can be expected to be reduced.

Further, since a feedthrough capacitor chip, which is a feedthrough capacitor in a chip state, is used in the package, the package can also be made smaller due to the small size of the feedthrough capacitor chip itself.

Furthermore, even if the number of circuits requiring feedthrough capacitors or the conditions of each circuit change, such changes can be easily accommodated by simply changing the number and type of feedthrough capacitor chips incorporated in the package. . For example, feedthrough capacitor chips with different capacitances can be assembled into a package in any order.

[Embodiment] FIGS. 1 to 3 show a first embodiment of this invention. This embodiment has an equivalent circuit as shown in FIG. 3, and is disassembled as shown in FIG. 1 and assembled as shown in FIG. 2.

As shown in Figure 2, the multi-circuit feedthrough capacitor 3
1 includes a package 32, from which a plurality of terminals 33, 34 are drawn out. Here, terminal 3
3 serves as a ground terminal, and terminal 34 serves as a hot terminal.

The package 32 is composed of a cap 35 and a substrate 36, as shown in FIG. Cap 35 and substrate 36 are made of resin or ceramic, for example.

The cap 35 has a recess formed on its lower surface, and a cutout 37 for receiving the tip of the ground terminal 33 described above is formed at both ends.

Preferably, a positioning groove 38 is formed on the upper surface of the substrate 36 to receive the base end portions of the plurality of hot terminals 34 described above. Furthermore, a ground connection electrode 39 is formed on the upper surface of the substrate 36 by, for example, printing. Although not clearly shown in FIG. 1, the base end portion of each hot terminal 34 maintains a predetermined distance from the ground connection electrode 39. Along the line along which the earth connection electrode 39 extends,
For example, six feedthrough capacitor chips 1 are arranged. These feedthrough capacitor chips 1 are similar to those shown in FIG. 11 described above. Each feedthrough capacitor chip 1 is positioned corresponding to the position of the hot terminal 34. In this position, one of the external electrodes 8 of the feedthrough capacitor chip 1 is commonly connected to the earth connection electrode 39, for example by soldering. The other external electrode 7 of the feedthrough capacitor chip 1 is connected to the respective hot terminal 34, for example by soldering.

The earth connection electrode 39 may be formed to extend continuously from one end to the other end of the substrate 36, or may be cut into pieces below each feedthrough capacitor chip 1. Even in the latter case, due to the presence of the internal electrode 5 (FIG. 13), the external electrodes 8 of the respective feedthrough capacitor chips 1 are commonly connected via the earth connection electrode 39.

The ground terminal 33 is provided along the lower surface of the substrate 36, and rising portions 40 are formed at both ends thereof. These rising portions 40
are in contact with both end surfaces of the substrate 36. In this embodiment, in order to ensure electrical connection between the ground terminal 33 and the ground connection electrode 39, a claw 41 is formed that extends inward from the upper end of each of the pair of rising parts 40. . Each nail 4
1 contacts the upper surface of the substrate 36 to ensure soldering with the ground connection electrode 39.

Note that the earth connection electrode 39 may be formed to extend to the end surface of the substrate 36, and in this case, the claw 41 formed on the earth terminal 33 is not particularly necessary.

In the state shown in FIG. 1, after the ground terminal 33 is attached to the substrate 36, the cap 35 is joined to the substrate 36 by, for example, adhesive. The multi-circuit feedthrough capacitor 31 configured in this manner has an equivalent circuit as shown in FIG. Third
In the figures, by assigning the reference numbers used for each element shown in Figs. 1 and 2, the correspondence relationship between the equivalent circuit and the mechanical configuration shown in Figs. 1 and 2 is made clear. do.

4 to 6 show a second embodiment of this invention. These FIGS. 4, 5, and 6 correspond to the aforementioned FIGS. 1, 2, and 3, respectively.

This illustrated embodiment differs from the first embodiment described above in the configuration of the ground terminal. That is, as shown in FIG. 5, in the completed multi-circuit feedthrough capacitor 31a, the package 3
Among the plurality of terminals pulled out from the opposing sides of the terminal 2a, the terminals 33a located at both ends serve as ground terminals.

As shown in FIG. 4, such a ground terminal 33a is, for example, composed of a metal plate extending in an H-shape as a whole, and is embedded in a similarly H-shaped positioning groove 42 formed on the upper surface of the substrate 36a. maintained in the state.

Note that the cap 35a used in this embodiment is
Notch 3 as formed in the cap 35 described above
7.

Since the other configurations are substantially the same as those in the first embodiment, corresponding parts will be given the same reference numerals and their explanation will be omitted.

According to this second embodiment, a multi-circuit feedthrough capacitor 31a having an equivalent circuit as shown in FIG.
is obtained. In FIG. 6 as well, like FIG. 3 described above, reference numerals indicating each element shown in FIGS. 4 and 5 are attached to corresponding elements.

In the first and second embodiments described above,
Although the hot terminal 34 was directly connected to the external electrode 7 of the feedthrough capacitor chip 1,
6a, first, an electrode connected to the external electrode 7 may be formed by printing or the like, and the hot terminal 34 may be connected to this electrode. Also, regarding the ground terminal 33a in the second embodiment, an electrode connected to the external electrode 8 of the feedthrough capacitor chip 1 is formed on the substrate 36a by printing or the like, and each ground terminal 33a is connected to this electrode. It may be configured so that

FIGS. 7 to 10 each show a modification of the terminal that can be pulled out from the package. These modified examples are the first and second examples described above.
This applies to any of the embodiments, but
For convenience of explanation, reference numbers used in the first embodiment will be used for corresponding parts, and only characteristic configurations will be explained.

The terminal 34a shown in FIG. 7 forms an end portion that extends in a direction away from the package 32 after being pulled out from the package 32. The end of the terminal 34a forms a surface extending parallel to the lower surface of the package 32.

The terminal 34b shown in FIG. 8 extends downwardly from the package 32 and has a substantially uniform width.

The terminal 34c shown in FIG.
After being pulled out, it is bent to approach the bottom surface of the package 32.

In addition, in FIGS. 7 to 9, the ground terminal 33 shown in FIG. 2 is shown with an imaginary line.
This means that such a ground terminal 33 is provided when combined with the first embodiment. When combined with the second embodiment, as described above, no ground terminal is provided at this position, and the ground terminals are located at both ends of each of the terminals 34a, 34b, and 34c.

The terminal 34d shown in FIG. 10 is composed of a metal film formed by printing, for example. Therefore, although not shown, this terminal 34d is connected to the board 36.
and is connected to the external electrode 7 or 8 of the feedthrough capacitor chip 1. In addition, the 10th
When applying the terminal 34d shown in the figure to the first embodiment, as shown by the imaginary line, the ground terminal 33b
It is also preferable to use a metal film formed by printing or the like. This ground terminal 33b is connected to the board 36
Earth connection electrode 39 (first
(Figure).

Although this invention has been explained above in connection with several embodiments, the number of feedthrough capacitor chips included in the multi-circuit feedthrough capacitor according to this invention is arbitrary, and therefore the number of hot terminals also varies accordingly. can be changed.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of the first embodiment of this invention, FIG. 2 is a perspective view showing the state after assembly, and FIG. 3 is a diagram showing an equivalent circuit. . FIG. 4 is an exploded perspective view showing a second embodiment of the invention, FIG. 5 is a perspective view showing the assembled state, and FIG. 6 is a diagram showing an equivalent circuit. . FIG. 7, FIG. 8, FIG. 9, and FIG. 10 are perspective views of a multi-circuit feedthrough capacitor showing modified examples of the shape of the terminals, respectively.
11 to 13 are diagrams for explaining the structure of a conventional feedthrough capacitor chip 1. FIG. 14 to 16 are diagrams for explaining the structure of a conventional multi-circuit feedthrough capacitor chip 11. FIG. In the figure, 1 is a feedthrough capacitor chip, 7,
8 is an external electrode, 31, 31a is a multi-circuit feedthrough capacitor, 32, 32a is a package, 33, 33
a, 33b are ground terminals, 34, 34a, 34
b, 34c, 34d are hot terminals, 35, 35a
is a cap, 36 and 36a are substrates, and 39 is a ground connection electrode.

Claims (1)

[Scope of utility model registration request] A plurality of feedthrough capacitor chips are assembled in one package, and one external electrode of each feedthrough capacitor chip is connected to a ground terminal provided outside the package while being commonly connected to each other. A multi-circuit feedthrough capacitor whose other external electrodes are respectively connected to hot terminals provided on the outside of the package.