JPH04159704A - Electric double-layer condenser - Google Patents
Electric double-layer condenserInfo
- Publication number
- JPH04159704A JPH04159704A JP2284841A JP28484190A JPH04159704A JP H04159704 A JPH04159704 A JP H04159704A JP 2284841 A JP2284841 A JP 2284841A JP 28484190 A JP28484190 A JP 28484190A JP H04159704 A JPH04159704 A JP H04159704A
- Authority
- JP
- Japan
- Prior art keywords
- electric double
- double layer
- electrode lead
- layer capacitor
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 25
- 238000005476 soldering Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気二重層コンデンサに関し、特に電気二重層
コンデンサのリード端子の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electric double layer capacitor, and particularly to the structure of a lead terminal of an electric double layer capacitor.
従来電気二重層コンデンサは、第７図（ａ）〜（ｅ）に
示す如く、種々の構造の製品が製造されている。第７図
（ａ）は電気二重層コンデンサ素子を複数個積層接続し
てカンケース５内に収容し一方向より断面角形の（＋）
（−）電極リード１−２２を取り出した構造のもの
である。第７図（ｂ＋）（ｂｚ）は電気二重層コンデン
サ素子を複数個積層接続してカンケース５内に収容しカ
ンケース５の両方向より断面角形の電極リード１゜２を
それぞれ取り出した構造のものでカンケース５が縦型ｂ
１と横型ｌ）２の２種類のタイプが有る。第７図（ｃ）
は電気二重層コンデンサ素子を複数個接続して樹脂ケー
ス６に収容し、一方向より断面丸形の（＋） （−）
電極リード］、２を収り出した構造のものである。第７
図（ｄ）は電気二重層コンデンサ素子を１個カンケース
５内に収容し、カンケース５の一方向より断面丸形の（
＋＞ １−）電極リード１，２を取出した構造のもの
である。第７図（ｅ）はある種の電気二重層コンデンサ
素子そのものを使用するもので電極リードは備わってい
ない。図示上側１］−と下側１２がそれぞれ電極板とな
っている。Conventionally, electric double layer capacitors have been manufactured with various structures as shown in FIGS. 7(a) to 7(e). FIG. 7(a) shows a plurality of electric double layer capacitor elements stacked and connected together and housed in the can case 5.
(-) This is a structure in which the electrode lead 1-22 is taken out. Figure 7 (b+) (bz) shows a structure in which a plurality of electric double layer capacitor elements are stacked and connected, housed in a can case 5, and electrode leads 1°2 each having a rectangular cross section are taken out from both sides of the can case 5. So can case 5 is vertical type b
There are two types: 1 and horizontal type 2. Figure 7(c)
A plurality of electric double layer capacitor elements are connected together and housed in a resin case 6, and a round cross-section (+) (-) is connected from one direction.
[Electrode lead], 2. 7th
In Figure (d), one electric double layer capacitor element is housed in the can case 5, and a round cross-section (
+> 1-) This is a structure in which the electrode leads 1 and 2 are removed. FIG. 7(e) uses a certain type of electric double layer capacitor element itself and is not provided with electrode leads. The upper side 1]- and the lower side 12 in the figure each serve as an electrode plate.
このように従来の電気二重層コンデンサは、第７図（ａ
）〜（ｄ）のタイプについては、第８図（ａ）〜（ｄ）
に示す如く回路基板７の取付穴に電極リード］。、２を
挿入し半田付個所１０を半田付して実装しており第７図
（ｅ）タイプについては第８図（ｅ）に示す如くボタン
電池と同様にハネ接点８，９間に挿着して実装していた
。In this way, the conventional electric double layer capacitor is
) to (d), see Figure 8(a) to (d).
Connect the electrode leads to the mounting holes of the circuit board 7 as shown in FIG. , 2 is inserted and soldered at the soldering point 10.For the type shown in Fig. 7(e), it is inserted between the spring contacts 8 and 9 in the same way as a button battery, as shown in Fig. 8(e). and implemented it.
今日製品の小型化指向と相まって部品の小型化高密度実
装が要求されており回路基板への表面実装化が進行して
いる。しかし従来の電気二重層コンデンサには回路基板
上に表面実装が可能な構造のリード端子が備わっておら
ず、表面実装への対応は不可能であった。Today, along with the trend toward miniaturization of products, there is a demand for miniaturization and high-density mounting of components, and surface mounting on circuit boards is progressing. However, conventional electric double layer capacitors do not have lead terminals with a structure that allows surface mounting on a circuit board, making it impossible to support surface mounting.
本発明の目的は、従来の電気二重層コンデンサの電極リ
ードでは表面実装に対応不可能である欠点を除去し、回
路基板への表面実装を可能にした電気二重層コンデンサ
を提供することにある。An object of the present invention is to provide an electric double layer capacitor that can be surface mounted on a circuit board by eliminating the drawback that the electrode leads of conventional electric double layer capacitors cannot be used for surface mounting.
本発明の電気二重層コンデンサは、電気二重層コンデン
サ素子をケース内に収納し第１の電気リードと第２の電
極リードを取り出しな電気二重層コンデンサにおいて、
上記の第１の電極リードと第２の電極リードが基板表面
への半田付用の端子部を備えていることを特徴として構
成される。The electric double layer capacitor of the present invention is an electric double layer capacitor in which an electric double layer capacitor element is housed in a case and a first electric lead and a second electrode lead are taken out.
The structure is characterized in that the first electrode lead and the second electrode lead are provided with a terminal portion for soldering to the surface of the substrate.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１７図〈ａ）〜（ｄ）〜第５図（ａ）〜（ｃ）は本発
明の実施例の製品外観図であり、第６図は本発明の実施
例の表面実装状態図である。Figures 17(a) to (d) to Figures 5(a) to (c) are product external views of embodiments of the present invention, and Figure 6 is a surface mounting state diagram of the embodiments of the present invention. .
第１図（ａ）〜（ｄ）は丸形外装構造でケース５の一方
向から断面角形の電極リード１，２が導出されているタ
イプに関する実施例であり、表面実装用のリード端子３
．４が第１１図（ａ）は、（」暑 （−）それぞれが外
側向きに配置されたもの、第１１図（１つ）は、一方向
向きに配置されたもの、第１図（ｃ）は、内側向きに配
置されてたちの第１図（ｄ）は丁字形に設置されたもの
である。第２図（ａ）〜（ｄ）は丸形外装構造でケース
５の各々の側から断面角形の電極リード１，２かそれぞ
れ導出されているタイプで、かつ丸形ケ−ス５が縦形構
成であり、そのリード端子の構造は第１図（ａ）〜（ｄ
）と同様のり−Ｉ・端子３゜４配置のものである。第３
図（ａ）〜（ｄ）は、丸形外装構造でケース５の各々の
側がら断面角形の電極リード１，２がそれぞれ導出され
ているタイプでかつ丸形ケース５が横形構成であり、そ
のリード端子は第１図（ａ）〜（ｄ）と同様のリード端
子３，４配置のものである。第４図（ａ）〜（ｄ）は、
角形外装構造でケース６の一方向から断面角形の電極リ
ード１．２が導出されているタイプでそのリード端子の
構造は第１図＜ａ）〜（ｄ）と同様のリード端子３．４
配置のものである。第５図（ａ）〜（ｃ）は、丸形外装
構造でケース５の一方向から電極リード１，２が導出さ
れている構造であるが、電極リード１．２が断面丸形の
もので第５図（ａ）は、丸リードをＬ形に折曲げた表面
実装用半田付端子部３，４を有し第５図（ｂ）は、丸リ
ードをＬ形に曲げかつ、平坦に潰して表面実装用半田付
端子部３，４を形成したもの、第５図（Ｃ）は、丸リー
ドをＬ形に曲げかつ、フープ状に半田付端子部３，４を
形成したものである。FIGS. 1(a) to 1(d) show examples of a type in which electrode leads 1 and 2 with a square cross section are led out from one direction of a case 5 in a round exterior structure, and lead terminals 3 for surface mounting.
．． 4 in Figure 11 (a) is the one in which each (-) is placed facing outward, Figure 11 (one) is placed in one direction, Figure 1 (c) Fig. 1 (d) shows that the case 5 is arranged facing inward, while Fig. 1 (d) shows the case 5 installed in a T-shape. This type has electrode leads 1 and 2 each having a rectangular cross section, and the round case 5 has a vertical configuration, and the structure of the lead terminal is shown in Figs. 1(a) to (d).
) has the same glue-I terminal 3°4 arrangement. Third
Figures (a) to (d) show a type in which the case 5 has a round exterior structure and electrode leads 1 and 2 with a rectangular cross section are led out from each side of the case 5, and the round case 5 has a horizontal configuration. The lead terminals have the same arrangement of lead terminals 3 and 4 as shown in FIGS. 1(a) to 1(d). Figures 4(a) to (d) are
This type has a rectangular exterior structure and an electrode lead 1.2 with a rectangular cross section is led out from one direction of the case 6. The structure of the lead terminal is the same as the lead terminal 3.4 shown in Fig. 1<a) to (d).
It is a matter of placement. Figures 5(a) to 5(c) show a structure in which the electrode leads 1 and 2 are led out from one side of the case 5 in a round exterior structure, but the electrode leads 1 and 2 have a round cross section. Figure 5(a) shows surface mounting solder terminals 3 and 4 made by bending round leads into an L shape, and Figure 5(b) shows round leads bent into an L shape and flattened. Figure 5(C) shows a case in which a round lead is bent into an L shape and the solder terminal parts 3 and 4 are formed in a hoop shape.
又、本発明の実施例の基板への表面実装状態を第６図（
ａ）〜（ｃ）に図示する。半田付端子部３．４が基板７
上に半田付１０され表面実装となっている。Moreover, FIG. 6 (
Illustrated in a) to (c). Soldered terminal part 3.4 is on board 7
It is surface mounted by soldering 10 on top.
以上本発明の実施例を１９例あけて説明したか、その他
にも以上の実施例の組合せによる構造は勿論可能である
。Although 19 embodiments of the present invention have been explained above, other structures based on combinations of the above embodiments are of course possible.
以上説明したように本発明は電気二重層コンデンサの電
極リードに回路基板表面への半田付用端子部を設けたこ
とにより、従来の電気二重層コンデンサでは、対応でき
なかった回路基板への表面実装を可能にするものである
。As explained above, the present invention provides a terminal part for soldering to the surface of a circuit board on the electrode lead of an electric double layer capacitor, so that it can be surface mounted on a circuit board, which was not possible with conventional electric double layer capacitors. This is what makes it possible.
第１図（ａ）〜（ｄ）〜第５図（ａ）〜（ｃ）は本発明
の実施例の斜視図であり、第１図（ａ）〜（ｄ）は、丸
形構造で一方向より断面角形の電極り−ドを導出したタ
イプでの各種実施例の斜視図、第２図（ａ）〜（ｄ）は
、丸形構造でケースの各々の側から断面角形の電極り−
１・を導出したタイプてかつ、ケースが縦型ての各種実
施例の斜視図、第３図（ａ）〜（ｄ）は丸形構造でケー
スの各々の側から断面角形の電極リートを導出したタイ
プてかつ、ケースが横型ての各種実施例の斜視図、第４
図（ａ）〜（ｄ）は角形外装構造で一方向から断面角形
の電極リードを導出したタイプでの各種実施例の斜視図
、第５図（ａ）〜（ｃ）は断面丸形の電極リードを導出
したタイプでの各種実施例の斜視図、第６図（ａ）〜（
ｃ）は、本発明の実施例の表面実装状態図、第７図（ａ
）〜（ｅ）は従来の電気二重層コンデンサの各種斜視図
、第８図（ａ）〜（ｅ）は、従来の電気二重層コンデン
サの回路基板への各種実装状態図である。
］、２・・・電極リード、３，４・表面実装用半田付端
子部、５・・カンケース、６・・・樹脂ケース、７・・
・基板、８．９・・バネ接点、１０・・・半田付部、Ｊ
コ 、 １２ ・・・電極板 。1(a)-(d) to FIG. 5(a)-(c) are perspective views of embodiments of the present invention, and FIG. 1(a)-(d) is a circular structure with a uniform FIGS. 2(a) to 2(d) are perspective views of various embodiments of a type in which an electrode board with a square cross section is derived from the direction, and FIGS.
Figures 3 (a) to 3 (d) are perspective views of various embodiments of the type from which 1. was derived, and the case is vertical. Perspective views of various embodiments of horizontal type cases, No. 4
Figures (a) to (d) are perspective views of various embodiments of a type with a square exterior structure and an electrode lead with a square cross section led out from one direction, and Figures 5 (a) to (c) are electrodes with a round cross section. Perspective views of various embodiments of the type with leads drawn out, Fig. 6(a) to (
c) is a surface mounting state diagram of an embodiment of the present invention, FIG. 7(a)
) to 8(e) are various perspective views of conventional electric double layer capacitors, and FIGS. 8(a) to 8(e) are diagrams of various mounting states of conventional electric double layer capacitors on circuit boards. ], 2... Electrode lead, 3, 4. Soldering terminal part for surface mounting, 5... Can case, 6... Resin case, 7...
・Board, 8.9... Spring contact, 10... Soldering part, J
12...electrode plate.
Claims (1)
の電極リードと第２の電極リードを取り出した電気二重
層コンデンサにおいて、前記第１の電極リードと第２の
電極リードが基板表面への半田付用の端子部を備えてい
ることを特徴とする電気二重層コンデンサ。２．前記第
１の電極リードおよび第２の電極リードが前記ケースの
一方向から導出され、端子部がそれぞれ外側向に、又は
それぞれが内側向に、又は一方向に、又はＴ字型に配置
されていることを特徴とする請求項１記載の電気二重層
コンデンサ。 ３．前記第１の電極リードおよび第２の電極リードが前
記ケースの対向する面から一方向に導出され、端子部が
それぞれ外側向に、又はそれぞれが内側向に又は一方向
に、又はＴ字型に配置されていることを特徴とする請求
項１記載の電気二重層コンデンサ。 ４．前記第１の電極リードにおよび第２の電極リードが
断面円形のリード線よりなり、端子部がＬ型に形成され
るか、又は前記端子部が平坦に潰されるか又は円形のま
まフープ状に形成されていることを特徴とする請求項１
記載の電気二重層コンデンサ。[Claims] 1. The electric double layer capacitor element is housed in the case and the first
An electric double layer capacitor from which an electrode lead and a second electrode lead are taken out, characterized in that the first electrode lead and the second electrode lead are provided with a terminal portion for soldering to the surface of the substrate. Electric double layer capacitor. 2. The first electrode lead and the second electrode lead are led out from one direction of the case, and the terminal portions are arranged outwardly, respectively inwardly, in one direction, or in a T-shape. The electric double layer capacitor according to claim 1, characterized in that: 3. The first electrode lead and the second electrode lead are led out in one direction from opposing surfaces of the case, and the terminal portions are each directed outward, or each is directed inward, or in one direction, or in a T-shape. The electric double layer capacitor according to claim 1, characterized in that: 4. The first electrode lead and the second electrode lead are made of lead wires having a circular cross section, and the terminal portion is formed into an L shape, or the terminal portion is flattened or left circular in a hoop shape. Claim 1 characterized in that:
The electric double layer capacitor described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2284841A JPH04159704A (en) | 1990-10-23 | 1990-10-23 | Electric double-layer condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2284841A JPH04159704A (en) | 1990-10-23 | 1990-10-23 | Electric double-layer condenser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04159704A true JPH04159704A (en) | 1992-06-02 |
Family
ID=17683716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2284841A Pending JPH04159704A (en) | 1990-10-23 | 1990-10-23 | Electric double-layer condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04159704A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002190427A (en) * | 2000-10-11 | 2002-07-05 | Sii Micro Parts Ltd | Electric double-layer capacitor capable of being mounted by reflow soldering and its manufacturing method |
| JP2005317850A (en) * | 2004-04-30 | 2005-11-10 | Sii Micro Parts Ltd | Electrochemical cell with lead terminal |
| JP2008147541A (en) * | 2006-12-13 | 2008-06-26 | Matsushita Electric Ind Co Ltd | Capacitor |
| JP2008294002A (en) * | 2001-09-28 | 2008-12-04 | Taiyo Yuden Co Ltd | Electrochemical cell with terminal |
| JP2010251782A (en) * | 2010-06-14 | 2010-11-04 | Seiko Instruments Inc | Electrochemical cell with lead terminal |
| DE10393769B4 (en) * | 2002-11-22 | 2012-09-27 | International Rectifier Corporation | Semiconductor device with terminals for connection to external elements |
| JP2013077783A (en) * | 2011-09-30 | 2013-04-25 | Nippon Chemicon Corp | Chip type capacitor |
-
1990
- 1990-10-23 JP JP2284841A patent/JPH04159704A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002190427A (en) * | 2000-10-11 | 2002-07-05 | Sii Micro Parts Ltd | Electric double-layer capacitor capable of being mounted by reflow soldering and its manufacturing method |
| JP2012156141A (en) * | 2001-09-28 | 2012-08-16 | Taiyo Yuden Co Ltd | Electrochemical cell with terminals |
| JP2014112676A (en) * | 2001-09-28 | 2014-06-19 | Taiyo Yuden Co Ltd | Electrochemical cell with terminal |
| JP2014112543A (en) * | 2001-09-28 | 2014-06-19 | Taiyo Yuden Co Ltd | Electrochemical cell with terminal |
| JP2008294002A (en) * | 2001-09-28 | 2008-12-04 | Taiyo Yuden Co Ltd | Electrochemical cell with terminal |
| JP2008294001A (en) * | 2001-09-28 | 2008-12-04 | Taiyo Yuden Co Ltd | Electrochemical cell with terminal |
| JP2014075598A (en) * | 2001-09-28 | 2014-04-24 | Taiyo Yuden Co Ltd | Electrochemical cell with terminal |
| JP2012138373A (en) * | 2001-09-28 | 2012-07-19 | Taiyo Yuden Co Ltd | Electrochemical cell with terminal |
| DE10393769B4 (en) * | 2002-11-22 | 2012-09-27 | International Rectifier Corporation | Semiconductor device with terminals for connection to external elements |
| JP4570902B2 (en) * | 2004-04-30 | 2010-10-27 | セイコーインスツル株式会社 | Electrochemical cell with lead terminals |
| JP2005317850A (en) * | 2004-04-30 | 2005-11-10 | Sii Micro Parts Ltd | Electrochemical cell with lead terminal |
| JP2008147541A (en) * | 2006-12-13 | 2008-06-26 | Matsushita Electric Ind Co Ltd | Capacitor |
| JP2010251782A (en) * | 2010-06-14 | 2010-11-04 | Seiko Instruments Inc | Electrochemical cell with lead terminal |
| JP2013077783A (en) * | 2011-09-30 | 2013-04-25 | Nippon Chemicon Corp | Chip type capacitor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS637666B2 (en) | ||
| JP3815154B2 (en) | Electrical junction box | |
| JPH04159704A (en) | Electric double-layer condenser | |
| JPH06302950A (en) | Method for mounting hybrid circuit on printed wiring board | |
| JP2001196260A (en) | Electronic component with terminal | |
| JPH03156905A (en) | Electronic component using stacked capacitor | |
| JPH02134890A (en) | Circuit element mounting board | |
| JPH0419788Y2 (en) | ||
| JPH0246035Y2 (en) | ||
| JP2000223358A (en) | Surface packaging ceramic electronic component | |
| JPS6025872Y2 (en) | Multiple inductance element | |
| JPH0440267Y2 (en) | ||
| JPH0424845B2 (en) | ||
| JPH0349420Y2 (en) | ||
| JPH0410641Y2 (en) | ||
| JPH0132734Y2 (en) | ||
| JP2765068B2 (en) | Electronic components | |
| KR200210469Y1 (en) | Lead terminal for surface mounting of printed circuit board | |
| JPS61279052A (en) | Thin circuit | |
| JPH081585Y2 (en) | Surface mount connector | |
| JPS5925091Y2 (en) | connector | |
| JPS6041744Y2 (en) | Circuit board for leadless electronic components | |
| JPH0710516Y2 (en) | Hybrid integrated circuit board module | |
| JPH0121545Y2 (en) | ||
| JPS5927048Y2 (en) | silver mica capacitor |