JPH0424845B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more specifically, to leadless electronic components that are surface mounted on printed circuit boards and the like. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Structure of conventional example and its problems A conventional leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is structured as shown in FIG. That is, an anode foil formed by roughening aluminum foil and further forming a dielectric oxide film by anodizing and a cathode foil formed by roughening aluminum foil are wound through a separator.
A capacitor element 1 is formed by impregnating a driving electrolyte, and this capacitor element is housed in a bottomed cylindrical metal case 2, and the open end is sealed using an elastic sealing material 3 such as rubber. An aluminum electrolytic capacitor is constructed, and the lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically and mechanically connected to the comb-shaped terminal 5 by a method such as welding, and the entire part except the comb-shaped terminal 5 is molded. A resin exterior 6 was applied to the finished product.

This type of chip-type aluminum electrolytic capacitor is
In order to provide solder heat resistance when mounting on a printed circuit board, a molded resin exterior 6 is applied as described above, but in general, the molded exterior is
Pressure is applied at a temperature of 100℃ to 150℃ for about 5 minutes at a pressure of 10Kg/ ^cm2 , and under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates, causing damage.
This results in deterioration of characteristics such as a decrease in capacitance and an increase in tanδ, and because it is coated with molded resin,
This has the problem of being extremely expensive.

Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

On the other hand, an electrolytic capacitor as shown in Japanese Utility Model Application Publication No. 57-83737 has also been considered, but this capacitor houses a capacitor element in a bottomed cylindrical case whose outer surface can be soldered. An insulator with an anode metal plate is placed on the end face of the case sealed with an elastic sealant, and the cathode lead terminal of the capacitor element is connected to the case, and the anode lead wire is connected to the anode metal plate of the insulator. , a chip-type electrolytic capacitor. However, in this conventional technology, when mounted on a printed circuit board, etc., the outer surface of the case comes into contact with the printed circuit board, and the insulator placed on the end surface of the case does not connect the case as a cathode and the cathode metal plate. It is for electrical insulation, and because it is a horizontal type, it occupies a large area on the printed circuit board, making it unsuitable for the recent high-density packaging, and it also cannot accommodate the capacitor elements and electrolyte of electrolytic capacitors. The case will be directly exposed to high temperatures during soldering, which may deteriorate the characteristics of the electrolytic capacitor.

Moreover, the structure is such that the anode lead wire is first connected to the insulator anode metal plate, and then connected to the anode metal plate when mounted on a printed circuit board, etc.
The problem is that the anode lead wire needs to be connected to the anode metal plate, and care must be taken to ensure that there is no connection failure between the anode lead wire and the anode metal plate, making it very time-consuming to manufacture. It was hot.

Therefore, the present inventors have developed a chip-type electrolytic capacitor as shown in Japanese Patent Application No. 58-3838. This capacitor has heat-resistant insulation on the outer surface of the sealed body that has the same shape and size as the bottomed metal case. Place the board,
Then, the anode and cathode lead wires are passed through the heat-resistant insulating plate and bent on the top surface of the heat-resistant insulating plate to provide a flat external electrode.The heat-resistant insulating plate has the same shape and size as the case, and the electrode is on the outer surface. If the size of the capacitor body becomes small, it will become unstable and difficult to stand on its own, and if you try to mount the capacitor by aligning it with the wiring part of the printed circuit board, the directionality will be affected. There was a problem that it was difficult to implement using automatic machines because the only thing to be determined was a flat electrode.

OBJECTS OF THE INVENTION The present invention eliminates these conventional drawbacks, and aims to provide an inexpensive vertical type leadless electronic component without deterioration of characteristics.

Structure of the Invention In order to achieve the present invention, the present invention is constructed by housing a component element in a case and sealing the open end of the case with a sealing member having a multilayer structure of an elastic body and an inelastic body, and An electronic component body formed by passing a lead wire connected to a component element through a sealing member and drawn out from the same end surface, and an electronic component body arranged so as to come into contact with the end surface from which the lead wire is drawn out of the electronic component body, and the lead wire passing through the electronic component body. and a rectangular insulating plate having a size larger than that of the case, and recesses connected to the through holes are provided on the outer surface of the insulating plate that comes into contact with a printed circuit board, etc., separated from each other, and The tip of the lead wire passing through the through hole is bent so as to be disposed within the recess.

With this configuration, when electronic components are mounted on a printed circuit board, the tips of the lead wires are housed in the concave members provided on the insulating board, so there are no convex parts on the surface of the insulating board that comes into contact with the printed circuit board. state of not having,
In other words, since the lead wire is in a so-called tangential position with the insulating plate, there is no tilting or wobbling of the electronic component, and the electronic component is stable, making it possible to perform the mounting work extremely well and at high speed.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 and 3 regarding an aluminum electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one, with an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened aluminum foil. It is constructed by winding a cathode aluminum foil with an insulating paper interposed therebetween, and impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, a lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

The open end of the metal case 2 is connected to an elastic body 7a.
A sealing member 7 having a multilayer structure such as a double-layered structure of an inelastic body 7b and a non-elastic body 7b is attached and sealed by drawing, thereby forming an electronic component main body.

Further, the lead wire 4 connected to the capacitor element 1 passes through the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end surface from which the lead wire 4 of the electronic component body is drawn out, and this insulating plate 8 has a through hole 8 through which the lead wire 4 passes.
A is provided.

Further, on the outer surface of the insulating plate 8 that comes into contact with a printed circuit board, etc., there is a recess 8 that connects to the through hole 8a.
b are provided in a state that they are separated from each other, and the tip portion 4a of the lead wire 4 passing through the through hole 8a is bent so as to fit within the recess 8b.

That is, a wall formed by a part of the insulating plate 8 exists between the recesses 8b, and an insulating wall is interposed between the tip portions 4a of the lead wires 4 passing through the insulating plate 8. When surface-mounting and soldering to a printed circuit board or the like, it is possible to prevent the solder from flowing between the lead wires 4 and causing the lead wires 4 to be shot.

In this case, as shown in Fig. 3a and b, the round bar lead wire 4 may have its tip 4a flattened and bent, or it may remain as a round bar lead wire. good.

Effects of the Invention As described above, according to the electronic component of the present invention, the end surface from which the lead wire is drawn out of the electronic component body is provided with a through hole through which the lead wire passes, and a recess is provided on the outer surface of the side that comes into contact with a printed circuit board, etc. High-density mounting is possible by providing a rectangular insulating plate that is larger than the case and in contact with it, and bending the lead wire so that the tip of the lead wire is placed in the recess of the insulating plate. It can be a vertically mounted leadless electronic component, and when mounted on a printed circuit board, it can stand on its own with good stability without tilting or wobbling, making the mounting work extremely easy and fast. . Further, during mounting, the orientation can be easily determined by using the rectangular insulating plate, and mounting can also be achieved by performing positioning using an automatic machine. Moreover, since no mold resin exterior is used, it is possible to produce electronic components at low cost without deterioration of characteristics.

In addition, there is a wall formed by a part of the insulating plate between the recesses, and as a result, an insulating wall is interposed between the tips of the lead wires that penetrate the insulating plate. When surface-mounted and soldered, it is possible to prevent solder from flowing between the lead wires and causing the lead wires to be shot.

Furthermore, in the present invention, the lead wire is passed through a through hole provided in the insulating plate and bent to form a terminal portion for connection with an external circuit, without being coated with molded resin. Even if the printed circuit board bends or warps after soldering, there will be some looseness, or so-called "play," between the through holes in the insulating board and the lead wires, so defects such as cracks will not occur. It is also possible to obtain the effect that this does not occur.

In addition, since the sealing member has a multilayer structure consisting of an elastic material and an inelastic material, when the lead wire that has passed through the insulating plate is bent, the mechanical stress applied to the lead wire may cause damage to the connection between the internal element and the lead wire. This prevents deterioration of characteristics due to lead wire processing.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and FIG.
The figure is a partially sectional view showing one embodiment of the present invention.
The figure is a perspective view showing a lead shape according to an embodiment of the present invention. 1...Capacitor element, 2...Metal case, 4
... Lead wire, 7 ... Sealing member, 7a ... Elastic body, 7b ... Inelastic body, 8 ... Insulating plate, 8a ...
Through hole, 8b... recess.

Claims (1)

[Claims] 1. In a leadless electronic component that is surface-mounted on a printed circuit board, etc., the component element is housed in a cylindrical case with a bottom, and the open end of the case has a multilayer structure of an elastic material and an inelastic material. An electronic component body constructed by sealing with a sealing member consisting of a sealing member, in which a lead wire connected to the component element is passed through the sealing member and drawn out from the same end face, and an end face of the electronic component body from which the lead wire is drawn out. an insulating plate having a rectangular shape larger in size than the case, and having a through hole through which the lead wire passes through, the insulating plate having a through hole on the outer surface of the insulating plate that comes into contact with a printed circuit board, etc.; What is claimed is: 1. An electronic component characterized in that recesses connected to the holes are separated from each other, and a tip of a lead passing through the through hole is bent so as to be disposed within the recess. 2. The electronic component according to claim 1, wherein the tip of the lead wire accommodated in the recess is plate-shaped.