JPH0251245B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more specifically, to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Conventional structure and its problems Conventional so-called leadless electronic components of this type,
For example, a chip-type aluminum electrolytic capacitor is constructed as shown in FIGS. 1a and 1b. That is,
An anode foil, which is made by roughening aluminum foil and forming a dielectric oxide film by anodizing, and a cathode foil, which is made by roughening aluminum foil, are wound through a separator and impregnated with a driving electrolyte to form a capacitor. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom, and the open end is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor. The lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically and mechanically connected to the comb-shaped terminal 5 by a method such as welding, and then a molded resin sheath 6 is applied to the entire body except for the comb-shaped terminal 5 to form a finished product. there was. When these chip-type aluminum electrolytic capacitors are mounted on a printed circuit board, they are coated with a molded resin exterior 6 as described above in order to provide solder heat resistance. 10Kg/ for about 5 minutes at a temperature of
cm ² pressure, and under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates, causing characteristic deterioration such as a decrease in capacitance and an increase in tanδ, and also causes the mold resin to deteriorate. Since it is provided with an exterior 6, it has the problem of being extremely expensive. Furthermore, since it is a horizontal type, when mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

Purpose of the Invention The present invention aims to eliminate such conventional drawbacks, and to provide an inexpensive vertical type leadless electronic component with improved soldering heat resistance without deterioration of characteristics. It is.

Structure of the Invention In order to achieve this object, the present invention stores components in a case, and uses a sealing member at the open end of the case to form a space layer between the sealing member and the open end of the case. An electronic component body constructed by sealing and having a lead wire connected to the component element drawn out from the same end face, and a lead wire disposed so as to come into contact with the end face from which the lead wire of the electronic component body is drawn out. and an insulating plate having a through hole passing through the insulating plate, and the tip of a lead wire passing through the through hole of the insulating plate is bent along the outer surface of the insulating plate.

With this configuration, it is possible to provide a chip-type electronic component that can be mounted on a printed circuit board very easily and at high speed. Furthermore, since it has a space layer, a chip-type electronic component with improved soldering heat resistance can be obtained.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 to 4 regarding an aluminum electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one, with an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened aluminum foil. It is constructed by winding a cathode aluminum foil with an insulating paper interposed therebetween, and impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, a lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

The open end of the metal case 2 is connected to an elastic body 7a.
and a non-elastic body 7b.
is attached and sealed by performing a drawing process so that a space layer 7c is formed between the sealing member 7 and the open end of the case, thereby forming an electronic component body. Further, the lead wire 4 connected to the capacitor element 1 passes through the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end surface from which the lead wire 4 of the electronic component body is drawn out, and this insulating plate 8 has a through hole 8 through which the lead wire 4 passes.
A is provided.

Further, a recess 8b connected to the through hole 8a is provided on the outer surface of the insulating plate 8, and the tip end 4a of the lead wire 4 passing through the front through hole 8a is bent so as to fit in the recess 8b. has been done. Regarding the sealing member 7, in addition to the one made of an elastic body and a non-elastic body as described above, the sealing performance is almost the same whether it is made of an elastic body and a resin layer or only an elastic body. I can keep it.

In this case, as shown in FIGS. 4a and 4b, the round bar lead wire 4 may have its tip 4a flattened and bent, or the round bar lead wire may remain as it is. good. With such a configuration, when mounted on a printed circuit board, the leadless electronic component 21 of the present invention can be mounted on a printed circuit board, as shown in FIG.
are arranged on the printed circuit board 22 so that the terminal parts made of lead wires are in contact with the conductive pattern 23, and are temporarily fixed with an adhesive 24, and then the electronic parts 21 are soldered with solder 25 using a soldering method such as reflow. What is necessary is to connect and fix the terminal portion to the conductive pattern 23 of the printed circuit board 22. Furthermore, if cream solder is used as the solder, temporary fixation is possible without using adhesive, and in this case, mounting is also facilitated.

Effects of the Invention As described above, according to the electronic component of the present invention, since an insulating plate is used, the mounting work can be carried out extremely well and at high speed. Furthermore, since there is no molded resin exterior, electronic components with no deterioration of characteristics can be produced at low cost.Furthermore, since the open end of the case has a space layer, chip-shaped electronic components with improved solder heat resistance can be manufactured. can get.

[Brief explanation of the drawing]

Figures 1a and b are views showing a conventional chip-type aluminum electrolytic capacitor, Figure 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and Figure 3 is a diagram showing an embodiment of the present invention. 4A and 4B are perspective views showing a lead shape according to an embodiment of the present invention, and FIG. 5 is a front view showing a state in which the capacitor is mounted on a printed circuit board. 1...Capacitor element, 2...Metal case, 4
... Lead wire, 7 ... Sealing member, 7a ... Elastic body, 7b ... Inelastic body, 7c ... Space layer, 8 ...
Insulating plate, 8a... through hole, 8b... recess.

Claims (1)

[Scope of Claims] 1. A component element is housed in a case, and the open end of the case is sealed with a sealing member so as to form a space layer between the sealing member and the open end of the case, and an electronic component body formed by pulling out lead wires connected to the component element from the same end surface;
an insulating plate disposed so as to come into contact with the end surface of the electronic component body through which the lead wire passes, and having a through hole through which the lead wire passes, and the lead wire passes through the through hole of the insulating plate. An electronic component characterized in that a tip portion of the insulating plate is bent along an outer surface of the insulating plate. 2. The electronic component according to claim 1, wherein the sealing member is a rubber-like elastic body. 3. The electronic component according to claim 1, wherein the sealing member is composed of a rubber-like elastic body and an inelastic body. 4. The electronic component according to claim 1, wherein the sealing member is composed of a rubber-like elastic body and a resin layer.