JPS60245120A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Structure of a conventional example and its problems A conventional so-called leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is shown in FIG. 1a.

It is configured as shown in b. That is, an anode foil formed by roughening an aluminum foil and forming a dielectric oxide film by anodizing and a cathode foil formed by roughening an aluminum foil are wound through a separator, and a driving electrolyte is applied. Impregnated to form a capacitor element 1, this capacitor element 1 is housed in a bottomed cylindrical metal case 2,
An aluminum electrolytic capacitor is constructed by sealing the open end with a sealing material 3 having elasticity such as rubber, and then the lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically connected to a comb-shaped terminal 6 by a method such as welding. Target.

After mechanical connection, a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminal 5, resulting in a completed product.

When mounting such chip-type aluminum electrolytic capacitors on a printed circuit board, in order to achieve soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied 7,
Generally, the molded resin exterior is pressurized at a temperature of 100°C to 150'C for about 6 minutes at a pressure of 1O layer, and under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates. This has resulted in deterioration of characteristics such as a decrease in capacitance and an increase in tan δ, and since the molded resin exterior 6 is applied with a shredded shape, the product is extremely expensive. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

OBJECT OF THE INVENTION The present invention eliminates such conventional drawbacks, and aims to provide an inexpensive vertical type leadless electronic component with improved soldering heat resistance and no deterioration of characteristics. It is.

Structure of the Invention In order to achieve this object, the present invention stores components in a case, and uses a sealing member at the open end of the case to form a space layer between the sealing member and the open end of the case. An electronic component body constructed by sealing and having a lead wire connected to the component element drawn out from the same end face, and a lead wire disposed so as to come into contact with the end face from which the lead wire of the electronic component body is drawn out. an insulating plate provided with a through hole through which the insulating plate passes, a recess connected to the through hole is provided on the outer surface of the insulating plate, and the tip of the lead wire passing through the through hole is accommodated in the recess. It is folded into.

With this configuration, when electronic components are mounted on a printed circuit board, the tips of the lead wires are housed in the recesses provided in the insulating board, so there is no protrusion at all on the surface of the insulating board that comes into contact with the printed circuit board. .

Since the lead wire is in a so-called tangential position with the insulating plate, there is no tilting or wobbling of the electronic component, and the twisting is stable, making the mounting work extremely easy and fast. The company will provide electronic components. Furthermore, since it has a space layer, a chip-type electronic component with improved soldering heat resistance can be obtained.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 to 4 regarding an aluminum electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, an IJ-domain wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

The open end of the metal case 2 is fitted with a sealing member 7 having a two-layer structure of an elastic body 7a and an inelastic body 7b, and a space layer 7C is formed between the sealing member 7 and the open end of the case. It is sealed by drawing as shown in the drawing process, and the electronic component main body is constructed by this. The lead wire 4 connected to the capacitor element 1 still passes through the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end face of the electronic component main body from which the lead wire 4 is drawn out, and this insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes.

Further, the outer surface of this insulating plate 8 is provided with four parts 8b that connect to the through hole 8a, and the tip part 4a of the lead wire 4 that has passed through the through hole 8a is bent so as to fit in the recess 8b. ing. Regarding the sealing member Y, in addition to the one composed of an elastic body and a non-elastic body as described above, whether it is composed of an elastic body and a resin layer or only an elastic body, the sealing properties are almost the same. I can keep it.

In this case, as shown in Fig. 4a and b, even if the round bar IJ lead wire 4 has its tip 4a flattened and bent, the round bar lead wire is in a twisted state. It's okay.

Effects of the Invention As described above, according to the electronic component of the present invention, an insulating plate having four parts is used, and the lead wire is accommodated in the recessed part of the board.
Since there is no inclination or wobbling when mounting on a printed circuit board, the mounting work can be performed extremely well and at high speed.

However, since there is no molded resin exterior, it is possible to manufacture electronic components at low cost with no deterioration of characteristics.Furthermore, since the open end of the case has a space layer, chip-type electronic components with improved solder heat resistance can be manufactured. is obtained.

[Brief explanation of the drawing]

1A and 1B are diagrams showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to the τ embodiment of the present invention, and FIG. 3 is a diagram showing an embodiment of the present invention. 4A and 4B are perspective views showing a lead shape according to an embodiment of the present invention. 1... Capacitor element, 2... Metal case, 4... Lead wire, 7... Sealing member, 7a...
...Elastic body, 7b...Inelastic body, 7c...
... Spatial layer, 8 ... Insulating plate, 8a ... Through hole, 8b ... Recessed part.

Claims (4)

[Claims] (1) The component element is housed in a case, and the open end of the case is sealed with a sealing member so as to form a space layer between the sealing member and the open end of the case, and the component element is An electronic component body through which a lead wire connected to the electronic component body is drawn out from the same end face, and a through hole arranged so as to come into contact with the end face of the electronic component body from which the lead wire is drawn out, and through which the lead wire passes through. an insulating plate, a recess connected to the through hole is provided on the outer surface of the insulating plate, and a tip of a lead wire passing through the through hole is bent so as to fit within the recess. electronic components. (2) The electronic component according to claim 1, wherein the sealing member is a rubber-like elastic body. (3) The electronic component according to claim 1, wherein the sealing member is composed of a rubber-like elastic body and an inelastic body. (4) The electronic component according to claim 1, wherein the sealing member is composed of a rubber-like elastic body and a resin layer.