JPS60245120A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPS60245120A JPS60245120A JP10106984A JP10106984A JPS60245120A JP S60245120 A JPS60245120 A JP S60245120A JP 10106984 A JP10106984 A JP 10106984A JP 10106984 A JP10106984 A JP 10106984A JP S60245120 A JPS60245120 A JP S60245120A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- sealing member
- case
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品に関するものであり、さらに詳しく言
えば、いわゆるリードレスの電子部品に関するものであ
る。以下の説明においてはアルミ電解コンデンサについ
て詳細に説明するが、本発明はアルミ電解コンデンサに
限定されるものではなく他の電子部品についても全く同
様である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.
従来例の構成とその問題点
従来のこの種のいわゆるリードレス電子部品、例えばチ
ップ形アルミ電解コンデンサは第1図a。Structure of a conventional example and its problems A conventional so-called leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is shown in FIG. 1a.
bに示すように構成されている。すなわち、アルミニウ
ム箔を粗面化しさらに陽極酸化により誘電体酸化皮膜を
形成した陽極箔と、アルミニウム箔を粗面化して形成し
た陰極箔とをセパレ〜りを介して巻回し、駆動用電解液
を含浸してコンデンサ素子1を構成し、このコンデンサ
素子1を有底筒状の金属ケース2に収納するとともに、
開放端をゴムなどの弾性を有する封口材3を用いて封口
してアルミ電解コンデンサを構成し、そして前記アルミ
電解コンデンサから引出されているリード線4をコム状
端子6に溶接などの方法により電気的。It is configured as shown in b. That is, an anode foil formed by roughening an aluminum foil and forming a dielectric oxide film by anodizing and a cathode foil formed by roughening an aluminum foil are wound through a separator, and a driving electrolyte is applied. Impregnated to form a capacitor element 1, this capacitor element 1 is housed in a bottomed cylindrical metal case 2,
An aluminum electrolytic capacitor is constructed by sealing the open end with a sealing material 3 having elasticity such as rubber, and then the lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically connected to a comb-shaped terminal 6 by a method such as welding. Target.
機械的に接続し、さらにコム状端子5を除く全体にモー
ルド樹脂外装6を施して完成品としていた。After mechanical connection, a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminal 5, resulting in a completed product.
このようなチップ形アルミ電解コンデンサは、プリント
基板への実装に際して、半田耐熱性をもだせるだめに、
前述したようにモールド樹脂外装6を施し7ているが、
一般にモールド樹脂外装では、100℃〜150’Cの
温度で、6分間程度1o層の圧力で加圧しており、この
よう々過酷な条件下では、電解コンデンサの駆動用電解
液が蒸散して、静電容量の減少やtanδの増大などの
特性劣化をきだし、捷だモールド樹脂外装6を施してい
るため、極めて高価なものになるという問題点を有して
いた。さらに、横置きタイプであるため、プリント基板
に実装した場合に、プリント基板の面積を多く占領して
しまい、各種の機器の小形化を阻害する要因となってい
た。When mounting such chip-type aluminum electrolytic capacitors on a printed circuit board, in order to achieve soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied 7,
Generally, the molded resin exterior is pressurized at a temperature of 100°C to 150'C for about 6 minutes at a pressure of 1O layer, and under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates. This has resulted in deterioration of characteristics such as a decrease in capacitance and an increase in tan δ, and since the molded resin exterior 6 is applied with a shredded shape, the product is extremely expensive. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.
発明の目的
本発明はこのような従来の欠点を除去するもので、特性
劣化のない、半田耐熱性の向上した安価なたて形タイプ
のリードレスの電子部品を提供することを目的とするも
のである。OBJECT OF THE INVENTION The present invention eliminates such conventional drawbacks, and aims to provide an inexpensive vertical type leadless electronic component with improved soldering heat resistance and no deterioration of characteristics. It is.
発明の構成
この目的を達成するために本発明は、部品素子をケース
内に収納し、ケース開放端を封口部材にて前記封口部材
とケース開放端部との間に空間層を形成するように封口
することにより構成されかつ前記部品素子に接続したリ
ード線を同一端面より引出してなる電子部品本体と、こ
の電子部品本体のリード線を引出した端面に当接するよ
うに配設されかつ前記リード線が貫通する貫通孔を備え
た絶縁板とで構成し、前記絶縁板の外表面に前記貫通孔
につながる凹部を設け、かつ前記貫通孔を貫通したリー
ド線の先端部を前記凹部内に収まるように折曲したもの
である。Structure of the Invention In order to achieve this object, the present invention stores components in a case, and uses a sealing member at the open end of the case to form a space layer between the sealing member and the open end of the case. An electronic component body constructed by sealing and having a lead wire connected to the component element drawn out from the same end face, and a lead wire disposed so as to come into contact with the end face from which the lead wire of the electronic component body is drawn out. an insulating plate provided with a through hole through which the insulating plate passes, a recess connected to the through hole is provided on the outer surface of the insulating plate, and the tip of the lead wire passing through the through hole is accommodated in the recess. It is folded into.
この構成によって、電子部品をプリント基板に装着する
場合に、リード線の先端部が絶縁板に設けた凹部内に収
納されるため、絶縁板のプリント基板に当接する面にお
いて凸部が全くない状態。With this configuration, when electronic components are mounted on a printed circuit board, the tips of the lead wires are housed in the recesses provided in the insulating board, so there is no protrusion at all on the surface of the insulating board that comes into contact with the printed circuit board. .
つ捷り、リード線が絶縁板といわゆるつら位置であるだ
め、電子部品の傾きやぐらつきなどが全くなくなり、捷
だ安定しているため、実装作業が極めて良好かつ高速化
が可能なチップタイプの電子部品を提供することとなる
。さらに空間層を有しているため、半田耐熱性の向上し
7たチップタイプの電子部品が得られることとなる。Since the lead wire is in a so-called tangential position with the insulating plate, there is no tilting or wobbling of the electronic component, and the twisting is stable, making the mounting work extremely easy and fast. The company will provide electronic components. Furthermore, since it has a space layer, a chip-type electronic component with improved soldering heat resistance can be obtained.
実施例の説明
以下、本発明の一実施例をアルミ電解コンデンサについ
て第2図〜第4図の図面を用いて説明する。なお、図中
、第1図と同一部品については同一番号を付している。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 to 4 regarding an aluminum electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.
図において、1は従来と同様なコンデンサ素子であり、
高純度アルミニウム箔を電気化学的に粗面化し、その後
陽極酸化を行って誘電体酸化皮膜を形成してなる陽極箔
と、粗面化した陰極アルミニウム箔とを間に絶縁紙を介
して巻回し、そしてその巻回物に駆動用電解液を含浸す
ることにより6ノ\−−
構成されている。このコンデンサ素子1は有底筒状の金
属ケース2内に収納されている。また、前記コンデンサ
素子1の陽極箔と陰極箔とにはIJ −ド線4が接続さ
れている。In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, an IJ-domain wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.
そして、金属ケース2の開放端は、弾性体7aと非弾性
体7bとの二層構造からなる封口部材7を装着し、封口
部材7とケース開放端との間に空間層7Cが形成される
ように絞り加工を施こすことにより封口されており、こ
れにより電子部品本体が構成されている。まだ、前記コ
ンデンサ素子1に接続したリード線4は、封口部材7を
貫通して同一端面より外部に引出されている。The open end of the metal case 2 is fitted with a sealing member 7 having a two-layer structure of an elastic body 7a and an inelastic body 7b, and a space layer 7C is formed between the sealing member 7 and the open end of the case. It is sealed by drawing as shown in the drawing process, and the electronic component main body is constructed by this. The lead wire 4 connected to the capacitor element 1 still passes through the sealing member 7 and is drawn out from the same end surface.
8は電子部品本体のリード線4を引出した端面に当接す
るように配設した絶縁板であり、この絶縁板8には、前
記リード線4が貫通する貫通孔8aが設けられている。Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end face of the electronic component main body from which the lead wire 4 is drawn out, and this insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes.
また、この絶縁板8の外表面には、前記貫通孔8aにつ
ながる四部8bが設けられ、前記貫通孔8aを貫通した
リード線4の先端部4aは前記凹部8b内に収まるよう
に折曲されている。封口部材Yについては、前記した弾
性体と非弾性体から構成されたものの他に、弾性体と樹
脂層から構成されたものであっても、弾性体のみであっ
ても封口性はほぼ同等に保てる。Further, the outer surface of this insulating plate 8 is provided with four parts 8b that connect to the through hole 8a, and the tip part 4a of the lead wire 4 that has passed through the through hole 8a is bent so as to fit in the recess 8b. ing. Regarding the sealing member Y, in addition to the one composed of an elastic body and a non-elastic body as described above, whether it is composed of an elastic body and a resin layer or only an elastic body, the sealing properties are almost the same. I can keep it.
この場合、第4図a、bに示すように丸棒のIJ−ド線
4は先端部4aに偏平加工を施し折曲したものであって
も、丸棒のリード線の捷まの状態であっても良い。In this case, as shown in Fig. 4a and b, even if the round bar IJ lead wire 4 has its tip 4a flattened and bent, the round bar lead wire is in a twisted state. It's okay.
発明の効果
以上のように本発明の電子部品によれば、四部を有する
絶縁板を用い、との凹部にリード線を収納させるため、
プリント基板に実装する際に傾きやぐらつきがなくなる
ため、実装作業が極めて良好かつ高速化が可能となる。Effects of the Invention As described above, according to the electronic component of the present invention, an insulating plate having four parts is used, and the lead wire is accommodated in the recessed part of the board.
Since there is no inclination or wobbling when mounting on a printed circuit board, the mounting work can be performed extremely well and at high speed.
し、かもモールド樹脂外装を行っていないため、特性劣
化のない電子部品が安価に製造でき、さらには、ケース
開放端部に空間層を有しているため半田耐熱性の向上し
たチップ形電子部品が得られる。However, since there is no molded resin exterior, it is possible to manufacture electronic components at low cost with no deterioration of characteristics.Furthermore, since the open end of the case has a space layer, chip-type electronic components with improved solder heat resistance can be manufactured. is obtained.
第1図a、bは従来のチップ形アルミ電解コンデンサを
示す図、第2図は本発明のτ実施例によるリードレスア
ルミ電解コンデンザを示す斜視図、第3図は本発明の一
実施例を示す一部分断面正面図、第4図a、bは本発明
の一実施例によるリード形状を示す斜視図である。
1 ・・・・コンデンサ素子、2・・・・・金属ケース
、4・・・・・リード線、7・・・ 封口部材、7a・
・・・・弾性体、7b・・・・・非弾性体、7c・・・
・・・空間層、8・・・・・絶縁板、8a・・・・貫通
孔、8b・・用凹部。1A and 1B are diagrams showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to the τ embodiment of the present invention, and FIG. 3 is a diagram showing an embodiment of the present invention. 4A and 4B are perspective views showing a lead shape according to an embodiment of the present invention. 1... Capacitor element, 2... Metal case, 4... Lead wire, 7... Sealing member, 7a...
...Elastic body, 7b...Inelastic body, 7c...
... Spatial layer, 8 ... Insulating plate, 8a ... Through hole, 8b ... Recessed part.
Claims (4)
口部材にて前記封口部材とケース開放端部との間に空間
層を形成するように封口することにより構成され、かつ
前記部品素子に接続したリード線を同一端面より引出し
て々る電子部品本体と、この電子部品本体のリード線を
引出した端面に当接するように配設され、かつ前記リー
ド線が貫通する貫通孔を備えた絶縁板とで構成し、前記
絶縁板の外表面に前記貫通孔につながる凹部を設け、か
つ前記貫通孔を貫通したリード線の先端部を前記凹部内
に収まるように折曲したことを特徴とする電子部品。(1) The component element is housed in a case, and the open end of the case is sealed with a sealing member so as to form a space layer between the sealing member and the open end of the case, and the component element is An electronic component body through which a lead wire connected to the electronic component body is drawn out from the same end face, and a through hole arranged so as to come into contact with the end face of the electronic component body from which the lead wire is drawn out, and through which the lead wire passes through. an insulating plate, a recess connected to the through hole is provided on the outer surface of the insulating plate, and a tip of a lead wire passing through the through hole is bent so as to fit within the recess. electronic components.
1項記載の電子部品。(2) The electronic component according to claim 1, wherein the sealing member is a rubber-like elastic body.
ている特許請求の範囲第1項記載の電子部品。(3) The electronic component according to claim 1, wherein the sealing member is composed of a rubber-like elastic body and an inelastic body.
いる特許請求の範囲第1項記載の電子部品。(4) The electronic component according to claim 1, wherein the sealing member is composed of a rubber-like elastic body and a resin layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10106984A JPS60245120A (en) | 1984-05-18 | 1984-05-18 | Electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10106984A JPS60245120A (en) | 1984-05-18 | 1984-05-18 | Electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60245120A true JPS60245120A (en) | 1985-12-04 |
JPH0251245B2 JPH0251245B2 (en) | 1990-11-06 |
Family
ID=14290811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10106984A Granted JPS60245120A (en) | 1984-05-18 | 1984-05-18 | Electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60245120A (en) |
-
1984
- 1984-05-18 JP JP10106984A patent/JPS60245120A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0251245B2 (en) | 1990-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |