JPS60245109A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Structure of a conventional example and its problems A conventional so-called leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is shown in FIG. 1a.

It is configured as shown in b. That is, an anode foil, which is formed by roughening aluminum foil and forming a dielectric oxide film by anodizing, and a cathode foil, which is formed by roughening aluminum foil, are wound through a separator, and a driving electrolyte is applied. Impregnated to form a capacitor element 1, this capacitor element 1 is housed in a bottomed cylindrical metal case 2,
An aluminum electrolytic capacitor is constructed by sealing the open end with a sealing material 3 having elasticity such as rubber, and then the lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically connected to a comb-shaped terminal 6 by a method such as welding. Target.

After mechanical connection, a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminal 6, resulting in a completed product.

When mounting such a tip-type aluminum electrolytic capacitor on a printed circuit board, in order to have soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied, but generally the molded resin exterior is pressurized at a temperature of 100'C to 150C for 6 minutes at a pressure of 10 degrees Celsius or more, and under such harsh conditions. Below, the problem is that the driving electrolyte of the electrolytic capacitor evaporates, causing characteristic deterioration such as a decrease in capacitance and an increase in tan δ, and also that the capacitor becomes extremely expensive due to the molded resin exterior 6. It had a point. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

OBJECTS OF THE INVENTION The present invention eliminates these conventional drawbacks, and aims to provide an inexpensive vertical type leadless electronic component that does not deteriorate in characteristics and can sufficiently withstand external shocks. It is something.

Structure of the Invention In order to achieve this object, the present invention provides an electronic component main body which is constructed by housing a component element in a case and has lead wires connected to the component element drawn out from the same end surface, and a main body of the electronic component. an elastic insulating plate provided with a through hole through which the lead wire passes and is disposed so as to come into contact with an end surface from which the lead wire is drawn out of the main body, and a recess connected to the through hole on the outer surface of the elastic insulating plate; is provided, and the tip of the lead wire passing through the through hole is bent so as to fit within the recess.

Due to this structure, when electronic components are mounted on a printed circuit board, the tips of the lead wires are housed in the recesses provided in the insulating board, so there are no protrusions on the surface of the insulating board that comes into contact with the printed circuit board. situation.

In other words, since the lead wire is in a so-called tangential position with the insulating plate, there is no tilting or wobbling of the electronic component, and since it is stable, the mounting work is extremely easy and can be done at high speed, and it has excellent impact resistance. It becomes something.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 to 4 regarding an aluminum electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, lead wires 4 are connected to the anode foil and the cathode foil of the capacitor element 1.
is connected.

The open end of the metal case 2 is sealed by attaching a sealing member 7 consisting of a two-layer structure of an elastic body 7a and an inelastic body 7b and performing a drawing process, thereby sealing the electronic component body. It is configured.

Further, the lead wire 4 connected to the capacitor element 1 is
It penetrates the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes a rubber-like elastic insulating plate disposed so as to come into contact with the end surface from which the lead wire 4 is drawn out of the electronic component body, and this elastic insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes. It is being Moreover, since the insulating plate 8 is made of an elastic material, if a mechanical shock is applied after being mounted on a printed circuit board, the elastic insulating plate 8 absorbs it, so that the electronic components will not be detached from the printed circuit board. .

The elastic insulating plate 8 can be made of isobutylpropylene rubber, ethylene propylene terpolymer, styrene butadiene rubber, isobutylene rubber, thermoplastic elastomer, or the like.

The through holes 8a are still formed on the outer surface of the elastic insulating plate 8.
A recess 8b connected to the through hole 8a is provided, and the tip end 4a of the lead wire 4 passing through the through hole 8a is bent so as to fit within the recess 8b.

In this case, as shown in Fig. 4a and b, the round bar lead wire 4
The tip portion 4a may be flattened and bent, or it may be in the state of being a round bar glued wire.

Effects of the Invention As described above, according to the electronic component of the present invention, since an elastic insulating plate having four parts is used and the lead wire is housed in the recess, there is no tilting or wobbling when mounting on a printed circuit board. Work becomes extremely efficient and can be done at high speed. Furthermore, by using an elastic body for the insulating plate, external impact on the main body is alleviated, and since there is no molded resin exterior, it is possible to produce electronic components at low cost without deterioration of characteristics.

[Brief explanation of the drawing]

FIGS. 1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and FIG. Partially sectioned front view showing one embodiment, FIG. 4a
, b are perspective views showing the shape of a lead according to an embodiment of the present invention. 1 ゛Par°゛Capacitor element, 2 ・°・Metal case, 4
... Lead wire, 7 ... Sealing member, 7a.
...Elastic body, 7b... Inelastic body, 8...
...Elastic insulating plate, 8a... -Through hole, 8b...
・Concavity. Name of agent: Patent attorney Toshio Nakao and one other person

Claims (4)

[Claims] (1) An electronic component body constructed by housing a component element in a case and having lead wires connected to the component element drawn out from the same end face, and an end face of the electronic component body from which the lead wire is drawn out. an elastic insulating plate that is arranged in contact with the lead wire and has a through hole through which the lead wire passes; a recess that connects to the through hole is provided on the outer surface of the elastic insulating plate; An electronic component characterized in that a tip of a lead wire is bent so as to fit within the recess. (2) The elastic insulation board is made of inbutyl isopropylene rubber.
The electronic component according to claim 1, which is any one of ethylene propylene terpolymer, styrene butadiene rubber, silicone rubber, fluororubber, inbutylene rubber, and thermoplastic elastomer. (3) The electronic component according to claim 1, wherein the tip of the lead wire accommodated in the recess is plate-shaped. (4) The electronic component according to claim 1, wherein the electronic component main body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.